Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure.

Abstract: An expansion apparatus includes a first connector having first power pins and first signal pins, and a second connector having second power pins and second signal pins. A power circuit is connected to the first and second power pins. A serial advanced technology attachment (SATA) expansion controller is connected to the first and second signal pins. First control chips are connected to the SATA expansion controller and the power circuit. First storage chips are connected to the first control chips and the power circuit. A third connector has third power pins corresponding to second power pins, and third signal pins corresponding to second signal pins. Second control chips are connected to the third power pins and the third signal pins. Second storage chips are connected to the second control chips and the third power pins.

Abstract: The present invention relates to a flexible modular assembly (100) comprising at least two flexible electronic modules (110 and 111) supported by a textile support (130). The two flexible electronic modules and the textile support each comprise a set of electrical conductors. The flexible modular assembly further comprises flexible connectors (140) for interconnecting two sets of electrical conductors. The flexible modular assembly of the invention is a modular textile assembly for use in large-area applications of electronic textiles.

Abstract: A high-density low power computer cluster enables high bandwidth video streaming within a small physical footprint. A plurality of low power motherboards are densely arranged in a chassis compatible with a standard server rack. The motherboards are oriented vertically within the chassis and arranged into rows. Each motherboard serves as a node in live streaming network. External ports and indicators on the chassis enable convenient access and control of the motherboards from outside the chassis. Furthermore, a fan-based cooling system provides simultaneous cooling to the plurality of motherboards in the computing cluster.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.

Abstract: Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.

Abstract: An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and the top die. The molding compound contacts edges of the top die. The edges of the bottom die are vertically aligned to respective edges of the molding compound.

Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.

Abstract: Protection structures may be provided to protect connectors, printed circuits, and other internal device components from damage. Components may shift within a device if the device is unexpectedly dropped. Protection structures can shield printed circuit connectors and other structures so that component movement during a drop event does not dislodge a printed circuit connector or otherwise damage a device. A cowling can be used to hold a board-to-board connector or other connector together. The cowling may have a protruding portion that is bent to form a protective wall. Plastic structures may be molded onto the cowling to form protective walls. Protection structures for printed circuit connectors and other internal device components may be formed from spring-based structures that clip onto the edge of a printed circuit board.

Abstract: A mounting apparatus for fixing circuit boards includes a position member configured to mount first circuit board, and a switch member configured to mount a second circuit board. The position member includes a first positioning hole. The switch member includes an enclosure and a rotating axle rotatably mounted in the enclosure. A spring is positioned on the rotating axle. A first engaging portion and a second engaging portion extend from the rotating axle. Two second supporting portions are located in the enclosure. The rotating axle resists against the spring and compresses the spring. The second engaging portion passes through the first positioning hole and resists against the position member. The second circuit board is attached to the first circuit board by the first engaging portion resisting against the two second supporting portions.

Abstract: A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.

Abstract: A substantially transparent touch sensor panel having co-planar single-layer touch sensors and traces fabricated on a single side of a substrate for detecting single or multi-touch events. The touch sensor elements can be fabricated in columns and rows, with each sensor element in a row adjacent to a sensor element in a column. By using a board as the dielectric to connect traces from multiple sensor elements in each row, rather than using a dielectric layer on the substrate upon which the sensor elements and traces are formed, the sensor elements and traces on the substrate can be formed by simply patterning a single layer of conductive material on the substrate, which can simplify the manufacturing process of the substrate from a complexity and cost perspective.

Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.

Abstract: A circuit board includes an insulating film extending from an active area for displaying images to a peripheral area surrounding the active area. A circumference wiring is arranged in an aperture penetrating the insulating film and extending from the aperture to the active area on the insulating film so as to cross an edge of the aperture. The shape of the edge of the aperture which the circumference wiring crosses includes at least one concave portion and one convex portion, respectively.

Abstract: An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.

Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

Abstract: On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems.

Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.

Abstract: An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.

Abstract: An electronic device includes an integrated circuit, a connector, and a circuit board. The integrated circuit includes a first signal processing circuit, a second signal processing circuit, and an interface multiplexer having a first input port electrically connected to the first signal processing circuit, a second input port electrically connected to the second signal processing circuit, and an output port arranged to be electrically connected to the first input port or the second input port. The circuit board carries the integrated circuit and has a plurality of connector placement sites, including at least a first connector placement site each dedicated to the first signal processing circuit and at least a second connector placement site each dedicated to the second signal processing circuit. The connector placement sites and the output port of the interface multiplexer are electrically connected in series. The connector is installed on one of the connector placement sites.

Abstract: A substrate structure and a package structure using the same are provided. The substrate structure includes a number of traces, a substrate core and a number of first metal tiles. The substrate core has a first surface and a second surface opposite to the first surface. The first metal tiles are disposed on one of the first surface and the second surface, the minimum pitch between adjacent two of the first metal tiles is the minimum process pitch.

Abstract: In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.

Abstract: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality of additional transducer modules comprises a transducer array having multiple transducer elements and an electronic circuitry coupled to the transducer array. The plurality of transducer modules and the plurality of additional transducer modules are mounted relative to each other whereby the plurality of additional transducer modules substantially cover any dead zones of the plurality of transducer modules.

Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

Abstract: A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.

Abstract: A substrate having a circuit component mounting area includes source wiring and a redundant pattern. A substrate is formed by cutting a part of a substrate disposed opposite to the substrate along a cutting line for exposing the circuit component mounting area. The source wiring is extended from an inner part of a display area to the circuit component mounting area. The redundant pattern is formed in a position corresponding to the cutting line and in the vicinity of the source wiring.

Abstract: An assembly carrying a radioisotope power source for attaching to a printed circuit board.

Abstract: A power transforming circuit board includes a substrate and at least one power output structure. The substrate has at least one power transforming circuit and at least one pair of power input holes. The power output structure is disposed on the substrate. Each power output structure is electrically connected with one corresponding power transforming circuit. Each power output structure has at least one cable connecting hole. The normal direction of each power output structure is oriented at an angle with respect to the normal direction of the substrate.

Abstract: A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board has a layout for connecting the switches. The layout is adapted for locating the switches substantially at or symmetrically with respect to the endpoints of a right-angle cross. The right-angle cross is formed from two line segments intersecting with a ninety degree angle. The circuit board may offsets the switches perpendicularly to the line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction.

Abstract: There is provided a semiconductor device in which a wiring inductance of a DC/DC converter formed on a multi-layered wiring substrate can be reduced and the characteristics can be improved. In the semiconductor device, in an input-side capacitor, one capacitor electrode is electrically connected to a power-supply pattern between a control power MOSFET and a synchronous power MOSFET, and the other capacitor electrode is electrically connected to a ground pattern therebetween. The multi-layered wiring substrate includes: a via conductor arranged at a position of the one capacitor electrode for electrically connecting among a plurality of power-supply patterns in a thickness direction; and a via conductor arranged at a position of the other capacitor electrode for electrically connecting among a plurality of ground patterns in a thickness direction.

Abstract: The invention relates to a backplane configuration for use in an electronic crate system, said backplane configuration comprising a first-type backplane and a second-type backplane; wherein the first-type backplane is coupled to the second-type backplane by mechanical connection means; wherein the first-type backplane and the second-type backplane are spatially separated from each other by a distance which is sufficient such that electromagnetic interferences between the first-type backplane and the second-type backplane are eliminated or at least minimized; and wherein the first-type backplane is adapted to be electrically coupled with at least one first-type module, and the second-type backplane is adapted to be electrically coupled with at least one second-type module.

Abstract: According to one embodiment, an electronic apparatus includes a case, a main circuit board in the case, a connector on the main circuit board, an auxiliary circuit board includes one end portion connected to the connector and an extending portion extending outside the main circuit board, and a spring supporting mechanism between the case and the extending portion of the auxiliary circuit board. The spring supporting mechanism includes a spring portion configured to support the extending portion elastically deformable in a direction across a surface of the auxiliary circuit board, and is fixed to the extending portion to prevent the auxiliary circuit board from moving along the surface thereof.

Abstract: A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure.

Abstract: A manufacturing method of identifiable print circuit board includes a step of “disposing an identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board.

Abstract: A printed circuit board (PCB) prevents damage to tabs of the PCB and pins of a slot by reducing insertion force when the PCB is inserted in the slot. The PCB includes a body portion including a first surface and a second surface and a metal interconnection layer formed on at least one of the first and second surfaces. The metal interconnecting layer includes tabs formed along a first edge of the body portion. An insertion force alleviation portion in which at least a portion of the body portion is removed is formed in the first edge to reduce the insertion force required to seat the PCB within the slot.

Abstract: Tamper secure circuitry including a first printed circuit board having mounted thereon circuit components and a slotted anti-tamper grid containing printed circuit board mounted onto the first printed circuit board defining at least one slot and arranged to overlie at least some of the circuit components, which are located in a volume defined by the at least one slot and the first printed circuit board.

Abstract: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled to the first substrate.

Abstract: A method for producing a number of chip cards includes a step for preparing a supporting film comprising a number of locations each of which constituting a card support and being provided with a cavity capable of receiving an integrated circuit, a step for processing this supporting film carried out, in part, by a multi-head tool, one of the heads of this tool being provided for carrying out an operation on a location of the film essentially at the same time as another head of this tool carries out the same operation on another location of this film, and a step for separating the locations after the processing step.

Abstract: An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

Abstract: Methods and apparatus for memory systems with memory chips are described. In an embodiment, a system includes a memory controller chip, memory chips, and a module connector each on a first substrate and at least two groups of conductors to provide read data signals from at least some of the memory chips to the memory controller chip and to provide read data signals from the connector to the memory controller chip. Furthermore, a memory module is inserted in the module connector and including memory chips on a second substrate at least some of which are to receive signals from at least some for the memory chips on the first substrate and at least some of which are to provide the read data signals to be provided to the second group of conductors. Other embodiments are described.

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

Abstract: A display device in the present invention includes a display panel which is provided with a display screen, a T-substrate which is arranged in a predetermined range narrower than the display panel at the back side of the display panel, first flexible printed circuit substrates which extend downward from the upper end of the display panel and are connected to the T-substrate, and second flexible printed circuit substrates which extend upward from the lower end of the display panel and are connected to the T-substrate in order to achieve more reduction in thickness when the display panel and the circuit substrate are arranged together.

Abstract: An electronic device includes a conductor plate, a circuit board placed with a distance to a surface of the conductor plate, a connector provided on the circuit board, a flexible cable having one end connected to the connector and laid down along the surface of the conductor plate, and a cable holding member which includes a sloped holding surface for holding at least part of a portion of the flexible cable ranging from the connector to the surface of the conductor plate and which is electrically connected to the conductor plate.

Abstract: A PCB according to an exemplary embodiment of the present disclosure includes a plurality of unit PCBs arrayed on the PCB, and a sawing line formed among the plurality of unit PCBs.

Abstract: A motherboard is disclosed, which allows an expansion circuit board to be electrically connected to it. The motherboard includes a primary circuit board and an adapter component. The primary circuit board includes an expansion slot. The adapter component is connected to the expansion slot. The adapter component is used for being electrically connected to the expansion circuit board, such that the primary circuit board and the expansion circuit board can perform signal transmission via the adapter component. The expansion circuit board and the primary circuit board are not located on the same plane.

Abstract: A serial advanced technology attachment (SATA) DIMM device includes a board body. A control chip is arranged on the board body. First and second extending boards extend from an end of the board body and a space is defined between the first and the second extending boards. A first edge connector is set on the first extending board and a second edge connector is set on the bottom edges of the second extending board and the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.

Abstract: An electronic device includes a motherboard, a riser card, and a securing structure. The riser card connects to the motherboard, and includes a first surface with a second socket thereon for connecting with an expansion card. The securing structure is for securing the expansion card, and includes a first fixing plate, a second fixing plate, and a fixing member for fixing the expansion card. The first fixing plate is arranged on the first surface of the riser card, and includes a number of first latching portions corresponding to the second socket, the first latching portions are arranged on a line parallel to the second socket. The second fixing plate faces the first surface of the riser card, and includes a second latching portion corresponding to each first latching portion. The fixing member includes a first and second end portion latchable with each first and second latching portion respectively.

Abstract: A method for laying out a printed circuit board for use in a gigabit-capable passive optical network includes the steps of providing a printed circuit board and laying out an analog circuit module, an analog-to-digital conversion module, a signal processing module, an optoelectronic transmitting and receiving module, and a power module on the printed circuit board. The printed circuit board has a first periphery and an opposing second periphery. The analog circuit module and the optoelectronic transmitting and receiving module are laid out at the first periphery of the printed circuit board. The power module is laid out at the second periphery of the printed circuit board. Electromagnectic wave generated by a power IC inserted in the power module does not interfere with data transmission taking place at the optoelectronic transmitting and receiving module. Furthermore, a printed circuit board for use with the method is proposed.

Abstract: A driver device includes a circuit board, a number of sockets, a number of driver chips, a control switch, and a signal output element. The sockets are positioned on the circuit board. Each driver chip is received in and electrically connected to a corresponding socket. The control switch includes a number of switches. An input of each switch is electrically connected to a corresponding socket. An output of each switch is electrically connected to the computer motherboard through the signal output element.