Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Reaction tube
    Patent number: D842824
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: March 12, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Akihiro Sato
  • Flexible printed circuits
    Patent number: D843334
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: March 19, 2019
    Assignee: NGK Insulators, Ltd.
    Inventors: Hiroshi Takebayashi, Rishun Kin
  • Reaction tube
    Patent number: D843958
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: March 26, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Hidenari Yoshida, Shuhei Saido, Takafumi Sasaki, Hidetoshi Mimura
  • Conductor pad
    Patent number: D844577
    Type: Grant
    Filed: November 12, 2016
    Date of Patent: April 2, 2019
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Sridharan Venk, Earl Alfred Picard, Jr., Qi Dai, Richard Garner
  • Semiconductor device
    Patent number: D845921
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: April 16, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Koshun Saito
  • Sheet heater for electrostatic chuck
    Patent number: D846513
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: April 23, 2019
    Assignee: NGK Insulators, Ltd.
    Inventors: Hiroshi Takebayashi, Rishun Kin
  • Boat of substrate processing apparatus
    Patent number: D846514
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: April 23, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hidenari Yoshida, Yusaku Okajima
  • Cage for shielding interference
    Patent number: D846547
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: April 23, 2019
    Assignee: Audio Precision, Inc.
    Inventors: William Bunnell, Fredrick Capell, Jr., William Noelcke
  • Power semiconductor module
    Patent number: D847103
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: April 30, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Hideki Sawada
  • Power semiconductor module
    Patent number: D847104
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 30, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Hideki Sawada
  • Boat of substrate processing apparatus
    Patent number: D847105
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: April 30, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Hidenari Yoshida
  • Heat exchanger base plate
    Patent number: D847982
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: May 7, 2019
    Assignee: Atos Medical AB
    Inventor: Richard Falkenberg
  • Non-contact type data carrier
    Patent number: D848382
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: May 14, 2019
    Assignee: SONY CORPORATION
    Inventor: Takuto Ishikawa
  • Printed circuit board
    Patent number: D848383
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: May 14, 2019
    Assignee: Fat Shark Technology SEZC
    Inventors: Jerome Meugnier, Gregory French, Allan Evans
  • Transistor
    Patent number: D848384
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: May 14, 2019
    Assignee: EPISTAR CORPORATION
    Inventor: Tien-Ching Feng
  • Ceramic heater
    Patent number: D849810
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: May 28, 2019
    Assignee: KSM Component Co., LTD
    Inventor: Joo Hwan Kim
  • Layout of contacts
    Patent number: D850309
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: June 4, 2019
    Assignee: Aehr Test Systems
    Inventors: Jovan Jovanovic, Scott E. Lindsey, Steven C. Steps, David S. Hendrickson
  • Semiconductor module
    Patent number: D851611
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: June 18, 2019
    Assignee: Infineon Technologies AG
    Inventor: Dorian Kurz
  • Electrical module
    Patent number: D851612
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: June 18, 2019
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Zhenshan Wang, Jian Hu, Kejia Pan, Xi Li, Bin Feng
  • Target profile for a physical vapor deposition chamber target
    Patent number: D851613
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 18, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Anthony Chih-Tang Chan, Siew Kit Hoi, Prashant Prabhakar Prabhu
  • Wafer carrier with a 14-pocket configuration
    Patent number: D852762
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: July 2, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, Raghu Chikkanayakanahalli Moorkannaiah
  • Circuit board
    Patent number: D852763
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: July 2, 2019
    Assignee: ebm-papst Lanshut GmbH
    Inventor: Sven Kneip
  • Circuit breaker board for a portable isolation power supply
    Patent number: D852764
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: July 2, 2019
    Inventor: David W. Cline
  • Semiconductor device
    Patent number: D852765
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: July 2, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Akinori Nii
  • Semiconductor module
    Patent number: D853341
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: July 9, 2019
    Assignee: Infineon Technologies AG
    Inventor: Dorian Kurz
  • High-performance semiconductor module
    Patent number: D853342
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: July 9, 2019
    Assignee: Infineon Technologies AG
    Inventors: Thomas Auer, Andras Bertalan, Jens Krugmann, Christoph Messelke
  • Semiconductor device
    Patent number: D853343
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: July 9, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Akinori Nii
  • High-performance semiconductor module
    Patent number: D853978
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: July 16, 2019
    Assignee: Infineon Technologies AG
    Inventors: Thomas Auer, Andras Bertalan, Jens Krugmann, Christoph Messelke
  • Reaction tube
    Patent number: D853979
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 16, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Toru Kagaya, Shinya Ebata, Yusaku Okajima, Hiroaki Hiramatsu
  • Chemical vapor deposition wafer carrier with thermal cover
    Patent number: D854506
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: July 23, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, Yuliy Rashkovsky, Alexander Gurary, Leo Chin, Mandar Deshpande
  • Cover of seal cap for reaction chamber of semiconductor
    Patent number: D855027
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 30, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Shuhei Saido, Hidenari Yoshida
  • Circuit board for electrical connector
    Patent number: D855577
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: August 6, 2019
    Assignee: TELEBOX INDUSTRIES CORP.
    Inventor: Ching-Yi Hsu
  • Semiconductor device
    Patent number: D856947
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: August 20, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Akinori Nii
  • Circuit board having arrangements of light-emitting diodes
    Patent number: D856948
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: August 20, 2019
    Assignee: ADURA LED SOLUTIONS LLC
    Inventors: Kalu K. Vasoya, Abdullah Aslami, Ghanshyambhai Ramani
  • Piezoelectric element
    Patent number: D857020
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: August 20, 2019
    Assignee: TDK CORPORATION
    Inventors: Yoshiki Ohta, Kazuo Nagata, Shuto Ono, Mio Hamashima
  • Piezoelectric element
    Patent number: D857021
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: August 20, 2019
    Assignee: TDK CORPORATION
    Inventors: Yoshiki Ohta, Kazuo Nagata, Shuto Ono, Mio Hamashima
  • Power semiconductor module
    Patent number: D858467
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: September 3, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Hideki Sawada
  • Collimator for a physical vapor deposition chamber
    Patent number: D858468
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 3, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Lanlan Zhong, Fuhong Zhang, Zheng Wang
  • Chemical vapor deposition wafer carrier with thermal cover
    Patent number: D858469
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: September 3, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, Yuliy Rashkovsky, Alexander Gurary, Leo Chin, Mandar Deshpande
  • Vacuum contact pad
    Patent number: D859331
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: September 10, 2019
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamamoto, Masayuki Nakanishi, Kenji Kodera
  • Elastic membrane for semiconductor wafer polishing
    Patent number: D859332
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: September 10, 2019
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamaki, Makoto Fukushima, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Tomoko Owada
  • Collimator for a physical vapor deposition chamber
    Patent number: D859333
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 10, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Lanlan Zhong, Fuhong Zhang, Zheng Wang
  • Semiconductor device
    Patent number: D859334
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: September 10, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Maki Hasegawa, Shigeru Mori
  • Electrode foil for capacitor
    Patent number: D860134
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 17, 2019
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Yoshiyuki Narita, Kazuhiro Nagahara, Atsushi Tanaka, Shoji Ono
  • Electrode foil for capacitor
    Patent number: D860135
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 17, 2019
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Yoshiyuki Narita, Kazuhiro Nagahara, Atsushi Tanaka, Shoji Ono
  • Wafer carrier with a 33-pocket configuration
    Patent number: D860146
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 17, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Yuliy Rashkovsky, Mandar Deshpande, Alexander Gurary, Sandeep Krishnan, Aniruddh Parekh
  • Chemical vapor deposition wafer carrier with thermal cover
    Patent number: D860147
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: September 17, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, Yuliy Rashkovsky, Alexander Gurary, Leo Chin, Mandar Deshpande
  • Sealing material ring for a semiconductor manufacturing apparatus
    Patent number: D862404
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: October 8, 2019
    Assignees: KOKUSAI ELECTRIC CORPORATION, TOHO KASEI CO., LTD.
    Inventors: Satoru Murata, Shinya Morita, Masashi Suzuki
  • Chemical vapor deposition wafer carrier with thermal cover
    Patent number: D863239
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 15, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, Yuliy Rashkovsky, Alexander Gurary, Leo Chin, Mandar Deshpande
  • Circuit board
    Patent number: D864133
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: October 22, 2019
    Inventors: Jason Kellenberger, David Hans Promnitz