Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Universal process kit
    Patent number: 11049760
    Abstract: The implementations described herein generally relate to a process kit suitable for use in a semiconductor process chamber, which reduces edge effects and widens the processing window with a single edge ring as compared to conventional process kits. The process kit generally includes an edge ring disposed adjacent to and surrounding a perimeter of a semiconductor substrate in a plasma chamber. A dimension of a gap between the substrate and the edge ring is less than about 1000 ?m, and a height difference between the substrate and the edge ring is less than about (+/?) 300 ?m. The resistivity of the ring is less than about 50 Ohm-cm.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: June 29, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Olivier Joubert, Jason A. Kenney, Sunil Srinivasan, James Rogers, Rajinder Dhindsa, Vedapuram S. Achutharaman, Olivier Luere
  • Gas introduction plate for plasma etching apparatus for etching semiconductor wafer
    Patent number: D911985
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: March 2, 2021
    Assignee: Tokyo Electron Limited
    Inventors: Takaaki Nezu, Yoshitaka Tamura
  • Handheld semiconductor wafer handling tool
    Patent number: D911986
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: March 2, 2021
    Assignee: Raytheon Company
    Inventors: Heather D. Leifeste, Ron C. Stevens
  • Semiconductor element
    Patent number: D911987
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: March 2, 2021
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Kiyotaka Yoshida, Tomohiko Yoshino
  • Antenna pattern for a semiconductive substrate carrier
    Patent number: D913256
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 16, 2021
    Inventor: Eryn Smith
  • Elastic membrane for semiconductor wafer polishing
    Patent number: D913977
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: March 23, 2021
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamaki, Makoto Fukushima, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Tomoko Owada, Masahiko Kishimoto
  • Semiconductor module
    Patent number: D913978
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: March 23, 2021
    Assignee: ROHM CO., LTD.
    Inventor: Ryuichi Furutani
  • Inner shield for a substrate processing chamber
    Patent number: D913979
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: March 23, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sarath Babu, Ananthkrishna Jupudi, Yueh Sheng Ow, Junqi Wei, Kelvin Boh, Yuichi Wada, Kang Zhang
  • Gas supply plate for semiconductor manufacturing apparatus
    Patent number: D913980
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: March 23, 2021
    Assignee: ASM IP Holding B.V.
    Inventors: Hak Joo Lee, Jeong Jun Woo, Jong Hyun Ahn, Yoon Ki Min
  • Vented susceptor
    Patent number: D914620
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: March 30, 2021
    Assignee: ASM IP Holding B.V.
    Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
  • Packaged semiconductor module
    Patent number: D914621
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: March 30, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Makoto Hirata, Shingo Matsumaru, Satoru Nate
  • Circuit board
    Patent number: D915310
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: April 6, 2021
    Assignee: ANALOG DEVICES, INC.
    Inventor: Tony Pirc
  • Cover of seal cap for reaction chamber for semiconductor
    Patent number: D916037
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: April 13, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Shuhei Saido, Hidenari Yoshida, Takafumi Sasaki
  • Grounded electrode for a plasma processing apparatus
    Patent number: D916038
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: April 13, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventor: Taku Watanabe
  • Semiconductor device
    Patent number: D916039
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: April 13, 2021
    Assignee: SANSHA ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Tomohiro Yamanaka, Yoichi Makimoto
  • Elastic membrane
    Patent number: D918161
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: May 4, 2021
    Assignee: EBARA CORPORATION
    Inventors: Shingo Togashi, Makoto Fukushima, Keisuke Namiki, Osamu Nabeya, Satoru Yamaki, Tomoko Owada, Yoshikazu Kato
  • Retainer of ceiling heater for semiconductor fabrication apparatus
    Patent number: D918848
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 11, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Mortarboard with electronic tube display
    Patent number: D919583
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: May 18, 2021
    Inventor: Mahdi Al-Husseini
  • Semiconductor device
    Patent number: D920264
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 25, 2021
    Assignee: THE NOCO COMPANY
    Inventors: James P. McBride, James Richard Stanfield
  • Integrated circuit package
    Patent number: D920265
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: May 25, 2021
    Inventor: YiWei Huang
  • Integrated circuit package
    Patent number: D920266
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: May 25, 2021
    Inventor: Jian Wei Yang
  • Boat for substrate processing apparatus
    Patent number: D920935
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 1, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Makoto Sambu, Makoto Tsuri
  • Higher temperature vented susceptor
    Patent number: D920936
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: June 1, 2021
    Assignee: ASM IP Holding B.V.
    Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
  • Power module device containing semiconductor elements
    Patent number: D920937
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 1, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Atsushi Kyutoku
  • Electromagnetic interference shield
    Patent number: D922337
    Type: Grant
    Filed: January 25, 2020
    Date of Patent: June 15, 2021
    Assignee: Veea Inc.
    Inventors: Bob Migliorino, Michael Liccone, Shaun Greaney, Dave Doyle, Michael Mirabella, Perry Wintner, Theodore Lubbe
  • Electromagnetic interference shield
    Patent number: D922338
    Type: Grant
    Filed: January 25, 2020
    Date of Patent: June 15, 2021
    Assignee: Veea Inc.
    Inventors: Bob Migliorino, Michael Liccone, Shaun Greaney, Dave Doyle, Michael Mirabella, Perry Wintner, Theodore Lubbe
  • Semiconductor device
    Patent number: D922970
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: June 22, 2021
    Assignee: ROHM CO., LTD.
    Inventor: Koshun Saito
  • Semiconductor driving circuit module
    Patent number: D923591
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 29, 2021
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Kiyotaka Yoshida, Tomohiko Yoshino
  • Adiabatic plate for substrate processing apparatus
    Patent number: D924823
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: July 13, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Koji Saiki, Makoto Tsuri
  • Ion shield plate base for semiconductor manufacturing apparatus
    Patent number: D924824
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 13, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yutaka Kouzuma, Kazuyuki Hirozane, Michiaki Kobayashi, Yoshifumi Ogawa
  • Gas inlet attachment for substrate processing apparatus
    Patent number: D924953
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: July 13, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Hironori Shimada
  • Electrostatic atomized water particles generating module
    Patent number: D925480
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 20, 2021
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Jumpei Oe, Youhei Ishigami, Kana Shimizu, Takafumi Omori, Tetsunori Aono, Takayuki Nakada
  • Inlet liner for substrate processing apparatus
    Patent number: D925481
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: July 20, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Toru Kagaya, Shinya Ebata
  • Support for a wafer for fabricating a semiconductor
    Patent number: D926715
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: August 3, 2021
    Assignee: EPICREW CORPORATION
    Inventors: Akira Okabe, Yukio Takenaga
  • Antenna pattern for a semiconductive substrate carrier
    Patent number: D926716
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: August 3, 2021
    Inventor: Eryn Smith
  • Plurality of contact fields for a printed circuit board
    Patent number: D927429
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 10, 2021
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Power semiconductor module
    Patent number: D927437
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: August 10, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Kotaro Shibata, Hideki Sawada
  • Semiconductor device
    Patent number: D928105
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: August 17, 2021
    Assignee: ROHM CO., LTD.
    Inventor: Koshun Saito
  • Electrical circuit component
    Patent number: D928722
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: August 24, 2021
    Inventor: Johann Kok
  • Bezel for attaching sensor to a printed circuit board in a security key
    Patent number: D928732
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: August 24, 2021
    Assignee: Yubico AB
    Inventor: Jakob Ehrensvärd
  • Circuit board
    Patent number: D930601
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: September 14, 2021
    Assignee: THE NOCO COMPANY
    Inventors: James P. McBride, Matthew Michael Bosway
  • Substrate support pedestal
    Patent number: D931240
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: September 21, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Changhun Lee, Michael D. Willwerth, Jeffrey Ludwig
  • Lower shield for a substrate processing chamber
    Patent number: D931241
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: September 21, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sarath Babu, Ananthkrishna Jupudi, Yueh Sheng Ow, Junqi Wei, Kelvin Boh, Yuichi Wada, Kang Zhang
  • Reaction tube
    Patent number: D931823
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: September 28, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Satoru Murata
  • Non-contact type data carrier
    Patent number: D932450
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 5, 2021
    Assignee: SONY CORPORATION
    Inventor: Takuto Ishikawa
  • Discharge device
    Patent number: D932451
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: October 5, 2021
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yohei Ishigami, Takafumi Omori, Tetsunori Aono
  • Semiconductor device
    Patent number: D932452
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: October 5, 2021
    Assignee: THE NOCO COMPANY
    Inventors: James P. McBride, James Richard Stanfield
  • Seal member for semiconductor production apparatus
    Patent number: D933032
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: October 12, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Seal member for semiconductor production apparatus
    Patent number: D933033
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 12, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Gene amplification chip for medical and laboratory use
    Patent number: D933257
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: October 12, 2021
    Assignee: Nippon Sheet Glass Company, Limited
    Inventors: Takashi Fukuzawa, Hidemitsu Takeuchi, Osamu Kawaguchi