Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Universal process kit
    Patent number: 11049760
    Abstract: The implementations described herein generally relate to a process kit suitable for use in a semiconductor process chamber, which reduces edge effects and widens the processing window with a single edge ring as compared to conventional process kits. The process kit generally includes an edge ring disposed adjacent to and surrounding a perimeter of a semiconductor substrate in a plasma chamber. A dimension of a gap between the substrate and the edge ring is less than about 1000 ?m, and a height difference between the substrate and the edge ring is less than about (+/?) 300 ?m. The resistivity of the ring is less than about 50 Ohm-cm.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: June 29, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Olivier Joubert, Jason A. Kenney, Sunil Srinivasan, James Rogers, Rajinder Dhindsa, Vedapuram S. Achutharaman, Olivier Luere
  • Segmented vertical wafer boat
    Patent number: 10861727
    Abstract: A vertical wafer boat has an upper boat segment and a lower boat segment, with the upper boat segment configured to removably mount on the lower boat segment, and to receive one or more semiconductor substrates. The lower boat segment includes a top plate, a first set of adiabatic plates, and a second set of adiabatic plates. One or more posts connect the top plate, the first set of adiabatic plates, and the second set of adiabatic plates. The first set of adiabatic plates include a first set of gaps separating a first plurality of sections; the second set of adiabatic plates include a second set of gaps separating a second plurality of sections; and the first set of adiabatic plates and the second set of adiabatic plates are interleaved.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: December 8, 2020
    Inventor: Larry E. Vaughan
  • Semiconductor device
    Patent number: D903611
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: December 1, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroya Sannai, Tatsuya Kawase, Seiichiro Inokuchi, Naoki Higashikawa
  • Semiconductor module
    Patent number: D903612
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: December 1, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Shin Soyano, Hiromichi Gohara
  • Semiconductor module
    Patent number: D903613
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: December 1, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Ryuichi Furutani
  • Circuit breaker board for a portable isolation power supply
    Patent number: D904324
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 8, 2020
    Inventor: David W. Cline
  • Semiconductor module
    Patent number: D904325
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 8, 2020
    Assignee: Sansha Electric Manufacturing Company, Limited
    Inventor: Takanori Omichi
  • Radio module
    Patent number: D904355
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: December 8, 2020
    Assignee: Gemalto M2M GmbH
    Inventor: Annette Horn
  • Conductive sticker
    Patent number: D904990
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: December 15, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Satoshi Ishii, Yoshimasa Takeda, Shuichi Kitano, Osamu Ono, Ami Inoue, Takeshi Kondo, Tatsuya Nakamura
  • Semiconductor element
    Patent number: D904991
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: December 15, 2020
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Kiyotaka Yoshida, Tomohiko Yoshino
  • Semiconductor module
    Patent number: D906271
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: December 29, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Takumi Kanda
  • Circuit breaker board for a portable isolation power supply
    Patent number: D906272
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 29, 2020
    Inventor: David W. Cline
  • Semiconductor device
    Patent number: D906273
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: December 29, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Ryota Majima, Koshun Saito
  • Transportable semiconductor wafer rack
    Patent number: D908102
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: January 19, 2021
    Assignee: Veeco Instruments Inc.
    Inventors: Michael W. Pacier, Michael J. Sershen, Adam F. Bertuch, Laurent Lecordier
  • Transportable semiconductor wafer rack
    Patent number: D908103
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: January 19, 2021
    Assignee: Veeco Instruments Inc.
    Inventors: Michael W. Pacier, Michael J. Sershen, Adam F. Bertuch, Laurent Lecordier
  • Sputtering target for a physical vapor deposition chamber
    Patent number: D908645
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: January 26, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kirankumar Neelasandra Savandaiah, David Gunther, Siew Kit Hoi
  • Semiconductor package
    Patent number: D908646
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: January 26, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Semiconductor package
    Patent number: D908647
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: January 26, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Adjustable fixture for aligning column grid array substrates
    Patent number: D908648
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: January 26, 2021
    Assignee: TopLine Corporation
    Inventors: Martin B. Hart, Robert H. Komrij
  • Semiconductor package
    Patent number: D909317
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: February 2, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Semiconductor package
    Patent number: D909318
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: February 2, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Circuit board
    Patent number: D909319
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: February 2, 2021
    Assignee: Impact IP, LLC
    Inventor: Taylor Nordeen
  • Chip
    Patent number: D911298
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: February 23, 2021
    Assignee: STAT PEEL AG
    Inventors: Krzysztof Krasnopolski, David Schmid, Fatma Burcu Celikkol Zijlstra, Joanna Alicja Borek-Donten, Ruedi Bieri
  • Gas introduction plate for plasma etching apparatus for etching semiconductor wafer
    Patent number: D911985
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: March 2, 2021
    Assignee: Tokyo Electron Limited
    Inventors: Takaaki Nezu, Yoshitaka Tamura
  • Handheld semiconductor wafer handling tool
    Patent number: D911986
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: March 2, 2021
    Assignee: Raytheon Company
    Inventors: Heather D. Leifeste, Ron C. Stevens
  • Semiconductor element
    Patent number: D911987
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: March 2, 2021
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Kiyotaka Yoshida, Tomohiko Yoshino
  • Antenna pattern for a semiconductive substrate carrier
    Patent number: D913256
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 16, 2021
    Inventor: Eryn Smith
  • Elastic membrane for semiconductor wafer polishing
    Patent number: D913977
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: March 23, 2021
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamaki, Makoto Fukushima, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Tomoko Owada, Masahiko Kishimoto
  • Semiconductor module
    Patent number: D913978
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: March 23, 2021
    Assignee: ROHM CO., LTD.
    Inventor: Ryuichi Furutani
  • Inner shield for a substrate processing chamber
    Patent number: D913979
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: March 23, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sarath Babu, Ananthkrishna Jupudi, Yueh Sheng Ow, Junqi Wei, Kelvin Boh, Yuichi Wada, Kang Zhang
  • Gas supply plate for semiconductor manufacturing apparatus
    Patent number: D913980
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: March 23, 2021
    Assignee: ASM IP Holding B.V.
    Inventors: Hak Joo Lee, Jeong Jun Woo, Jong Hyun Ahn, Yoon Ki Min
  • Vented susceptor
    Patent number: D914620
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: March 30, 2021
    Assignee: ASM IP Holding B.V.
    Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
  • Packaged semiconductor module
    Patent number: D914621
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: March 30, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Makoto Hirata, Shingo Matsumaru, Satoru Nate
  • Circuit board
    Patent number: D915310
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: April 6, 2021
    Assignee: ANALOG DEVICES, INC.
    Inventor: Tony Pirc
  • Cover of seal cap for reaction chamber for semiconductor
    Patent number: D916037
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: April 13, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Shuhei Saido, Hidenari Yoshida, Takafumi Sasaki
  • Grounded electrode for a plasma processing apparatus
    Patent number: D916038
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: April 13, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventor: Taku Watanabe
  • Semiconductor device
    Patent number: D916039
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: April 13, 2021
    Assignee: SANSHA ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Tomohiro Yamanaka, Yoichi Makimoto
  • Elastic membrane
    Patent number: D918161
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: May 4, 2021
    Assignee: EBARA CORPORATION
    Inventors: Shingo Togashi, Makoto Fukushima, Keisuke Namiki, Osamu Nabeya, Satoru Yamaki, Tomoko Owada, Yoshikazu Kato
  • Retainer of ceiling heater for semiconductor fabrication apparatus
    Patent number: D918848
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 11, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Mortarboard with electronic tube display
    Patent number: D919583
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: May 18, 2021
    Inventor: Mahdi Al-Husseini
  • Semiconductor device
    Patent number: D920264
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 25, 2021
    Assignee: THE NOCO COMPANY
    Inventors: James P. McBride, James Richard Stanfield
  • Integrated circuit package
    Patent number: D920265
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: May 25, 2021
    Inventor: YiWei Huang
  • Integrated circuit package
    Patent number: D920266
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: May 25, 2021
    Inventor: Jian Wei Yang
  • Boat for substrate processing apparatus
    Patent number: D920935
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 1, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Makoto Sambu, Makoto Tsuri
  • Higher temperature vented susceptor
    Patent number: D920936
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: June 1, 2021
    Assignee: ASM IP Holding B.V.
    Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
  • Power module device containing semiconductor elements
    Patent number: D920937
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 1, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Atsushi Kyutoku
  • Electromagnetic interference shield
    Patent number: D922337
    Type: Grant
    Filed: January 25, 2020
    Date of Patent: June 15, 2021
    Assignee: Veea Inc.
    Inventors: Bob Migliorino, Michael Liccone, Shaun Greaney, Dave Doyle, Michael Mirabella, Perry Wintner, Theodore Lubbe
  • Electromagnetic interference shield
    Patent number: D922338
    Type: Grant
    Filed: January 25, 2020
    Date of Patent: June 15, 2021
    Assignee: Veea Inc.
    Inventors: Bob Migliorino, Michael Liccone, Shaun Greaney, Dave Doyle, Michael Mirabella, Perry Wintner, Theodore Lubbe
  • Semiconductor device
    Patent number: D922970
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: June 22, 2021
    Assignee: ROHM CO., LTD.
    Inventor: Koshun Saito
  • Semiconductor driving circuit module
    Patent number: D923591
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 29, 2021
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Kiyotaka Yoshida, Tomohiko Yoshino