Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Circuit cube
    Patent number: D864131
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: October 22, 2019
    Assignee: Tenka Inc.
    Inventors: Nathaniel W. MacDonald, John F. Schuster
  • Power semiconductor module
    Patent number: D864132
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: October 22, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Hideki Sawada
  • Susceptor
    Patent number: D864134
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: October 22, 2019
    Assignee: ASM IP Holding B.V.
    Inventors: Toshiharu Watarai, Yozo Ikedo, Takuya Suguri
  • Semiconductor device
    Patent number: D864135
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: October 22, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Maki Hasegawa, Shigeru Mori
  • Printed circuit board
    Patent number: D864881
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: October 29, 2019
    Assignee: MSA Technology, LLC
    Inventors: Michael Klixbull, Thomas Trautzsch, Mark Hall
  • Part for semiconductor device
    Patent number: D864882
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 29, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Takeshi Sakamoto
  • Part for semiconductor device
    Patent number: D864883
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 29, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Takeshi Sakamoto
  • Semiconductor device
    Patent number: D864884
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: October 29, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Nobuchika Aoki, Hideki Tsukamoto, Akihiko Yamashita, Masayuki Ando
  • Electrical module
    Patent number: D865689
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: November 5, 2019
    Assignee: MICRODUINO INC.
    Inventors: Zhenshan Wang, Kejia Pan, Bin Feng
  • Part for semiconductor device
    Patent number: D865690
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 5, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Takeshi Sakamoto
  • Electrical module
    Patent number: D866469
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: November 12, 2019
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Bin Feng
  • Chemical vapor deposition wafer carrier with thermal cover
    Patent number: D866491
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 12, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Sandeep Krishnan, Yuliy Rashkovsky, Alexander Gurary, Leo Chin, Mandar Deshpande
  • Cassette receiving tool for semiconductor manufacturing apparatus
    Patent number: D868012
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: November 26, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Tadayoshi Karasawa
  • Cassette receiving tool for semiconductor manufacturing apparatus
    Patent number: D868013
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: November 26, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Tadayoshi Karasawa
  • Target profile for a physical vapor deposition chamber target
    Patent number: D868124
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: November 26, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Zheng Wang
  • Target profile for a physical vapor deposition chamber target
    Patent number: D869409
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: December 10, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Xiaodong Wang
  • Serrated light engine and circuit board
    Patent number: D871357
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: December 31, 2019
    Assignee: Osram Sylvania Inc.
    Inventors: Ty Rock, Chaim Becerra, Biju Antony
  • Cover of seal cap for reaction chamber for semiconductor manufacturing
    Patent number: D872037
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 7, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Hidenari Yoshida, Shuhei Saido, Takafumi Sasaki
  • LED chips on a printed circuit board
    Patent number: D872038
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: January 7, 2020
    Inventors: Jianxin Pan, Lian Wu, Hongbo Li
  • Semiconductor module
    Patent number: D873226
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: January 21, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Takumi Kanda, Masashi Hayashiguchi
  • Semiconductor device
    Patent number: D873227
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: January 21, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Nobuchika Aoki, Hideki Tsukamoto, Akihiko Yamashita, Masayuki Ando
  • Component carrier plate
    Patent number: D873782
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: January 28, 2020
    Assignee: ELECTRO SCIENTIFIC INDUSTRIES, INC
    Inventor: Douglas J. Garcia
  • LED chip
    Patent number: D873783
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: January 28, 2020
    Inventors: Jianxin Pan, Lian Wu, Hongbo Li
  • Semiconductor module
    Patent number: D874411
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: February 4, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Takumi Kanda, Yoshitoki Inami
  • Semiconductor module
    Patent number: D874412
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: February 4, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Takumi Kanda, Masashi Hayashiguchi
  • Fixture for delivering 1752 solder columns onto a substrate
    Patent number: D874413
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: February 4, 2020
    Assignee: TopLine Corporation
    Inventor: Martin B. Hart
  • Plasma connector liner
    Patent number: D875053
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: February 11, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Eric Kihara Shono
  • Plasma connector liner
    Patent number: D875054
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: February 11, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Eric Kihara Shono
  • Plasma connector liner
    Patent number: D875055
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: February 11, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Eric Kihara Shono
  • Flexible printed circuit board
    Patent number: D875056
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: February 11, 2020
    Inventor: Jie Qi
  • Modular circuit board
    Patent number: D875057
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: February 11, 2020
    Assignee: TINY PCB, Inc.
    Inventor: Edward Podubni
  • Power semiconductor module
    Patent number: D875058
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: February 11, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Hideki Sawada
  • Layout of contacts
    Patent number: D875579
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: February 18, 2020
    Assignee: AEHR TEST SYSTEMS
    Inventors: Jovan Jovanovic, Scott E. Lindsey, Steven C. Steps, David S. Hendrickson
  • Serrated light engine and circuit board
    Patent number: D876373
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: February 25, 2020
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Ty Rock, Chaim Becerra, Biju Antony
  • Serrated light engine and circuit board
    Patent number: D876374
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: February 25, 2020
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Ty Rock, Chaim Becerra, Biju Antony
  • Flexible printed wiring board for a module
    Patent number: D877099
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 3, 2020
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kazumasa Toya, Kenji Saito, Youichi Nagai, Takashi Iwasaki
  • Jig for attaching flexible printed wiring board
    Patent number: D877100
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 3, 2020
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kazumasa Toya, Kenji Saito, Youichi Nagai, Takashi Iwasaki, Makoto Inagaki, Kazushi Iyatani
  • Target profile for a physical vapor deposition chamber target
    Patent number: D877101
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: March 3, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William R. Johanson, Kirankumar Neelasandra Savandaiah, Prashant Prabhakar Prabhu
  • Semiconductor module
    Patent number: D877102
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 3, 2020
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Yoshihiro Kamiyama
  • Conductor pad
    Patent number: D877103
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: March 3, 2020
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Sridharan Venk, Earl Alfred Picard, Jr., Qi Dai, Richard Garner
  • Cassette displacement prevention jig of semiconductor manufacturing apparatus
    Patent number: D877706
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: March 10, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Tadayoshi Karasawa
  • Semiconductor package
    Patent number: D877707
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: March 10, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Electrical terminal
    Patent number: D877708
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: March 10, 2020
    Assignee: VLT, Inc.
    Inventors: Patrizio Vinciarelli, Michael B. LaFleur
  • Electrical module
    Patent number: D879729
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: March 31, 2020
    Assignees: Microduino Inc., Meike Technology (Beijing) Ltd.
    Inventors: Zhenshan Wang, Jian Hu, Kejia Pan, Xi Li, Bin Feng
  • Circuit board
    Patent number: D879730
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: March 31, 2020
    Assignee: SiFive, Inc.
    Inventors: Jack Kang, David Lee, Jeffrey Mulhausen
  • Data processing equipment
    Patent number: D879787
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 31, 2020
    Assignee: HANGZHOU CHIPJET TECHNOLOGY CO., LTD.
    Inventor: Shan Luo
  • Gas supply plate for semiconductor manufacturing apparatus
    Patent number: D880437
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: April 7, 2020
    Assignee: ASM IP Holding B.V.
    Inventors: Hak Joo Lee, Jeong Jun Woo, Jong Hyun Ahn, Yoon Ki Min
  • Data processing equipment
    Patent number: D880484
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: April 7, 2020
    Assignee: HANGZHOU CHIPJET TECHNOLOGY CO., LTD.
    Inventors: Zhengyang Li, Heng Zhang, Kouliu Lu, Jiamin Wang
  • Coil for wireless charger
    Patent number: D881126
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: April 14, 2020
    Assignee: HOLYGO CORPORATION
    Inventor: Chien-Te Wu
  • Microfluidic chip
    Patent number: D878622
    Type: Grant
    Filed: April 7, 2018
    Date of Patent: March 17, 2020
    Assignee: Precision NanoSystems Inc.
    Inventors: Andre Wild, Rodney Paul Bucknell