Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Segmented vertical wafer boat
    Patent number: 10861727
    Abstract: A vertical wafer boat has an upper boat segment and a lower boat segment, with the upper boat segment configured to removably mount on the lower boat segment, and to receive one or more semiconductor substrates. The lower boat segment includes a top plate, a first set of adiabatic plates, and a second set of adiabatic plates. One or more posts connect the top plate, the first set of adiabatic plates, and the second set of adiabatic plates. The first set of adiabatic plates include a first set of gaps separating a first plurality of sections; the second set of adiabatic plates include a second set of gaps separating a second plurality of sections; and the first set of adiabatic plates and the second set of adiabatic plates are interleaved.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: December 8, 2020
    Inventor: Larry E. Vaughan
  • Plasma source liner
    Patent number: D882536
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: April 28, 2020
    Assignee: Applied Materials, Inc.
    Inventor: Eric Kihara Shono
  • Circuit cube
    Patent number: D882537
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 28, 2020
    Assignee: Tenka, Inc.
    Inventors: Nathaniel W. MacDonald, John F Schuster
  • Circuit cube
    Patent number: D882538
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 28, 2020
    Assignee: Tenka Inc.
    Inventors: Nathaniel W. MacDonald, John F Schuster
  • Printed circuit for an automatic transmission solenoid module
    Patent number: D883240
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: May 5, 2020
    Assignee: Advanced Powertrain Engineering, LLC
    Inventor: Paul Fathauer
  • Power module
    Patent number: D883241
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 5, 2020
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventors: Peter Beckedahl, Juergen Steger, Ingo Bogen, Sandro Bulovic
  • Semiconductor module
    Patent number: D884662
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: May 19, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Taichi Itoh, Hiroaki Ichikawa, Mitsuhiro Kakefu, Akio Yamano, Takuya Yamamoto
  • Circuit cube
    Patent number: D886072
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: June 2, 2020
    Assignee: Tenka Inc.
    Inventors: Nathaniel W. MacDonald, John F Schuster
  • Flexible printed circuit board
    Patent number: D886073
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: June 2, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Hee seok Jung
  • Chip
    Patent number: D887998
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 23, 2020
    Assignee: STAT PEEL AG
    Inventors: Krzysztof Krasnopolski, David Schmid, Fatma Burcu Celikkol Zijlstra, Joanna Alicja Borek-Donten, Ruedi Bieri
  • Circuit board with zigzag routes
    Patent number: D887999
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: June 23, 2020
    Assignee: OUPIIN ELECTRONIC (KUNSHAN) CO., LTD
    Inventor: Hsin Chih Chen
  • Semiconductor module
    Patent number: D888673
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: June 30, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Ryuichi Furutani
  • Circuit board with zigzag routes
    Patent number: D888674
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: June 30, 2020
    Assignee: OUPIIN ELECTRONIC (KUNSHAN) CO., LTD.
    Inventor: Hsin Chih Chen
  • Power module
    Patent number: D889423
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: July 7, 2020
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventors: Peter Beckedahl, Juergen Steger, Ingo Bogen, Sandro Bulovic
  • Case for a circuit board
    Patent number: D890709
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: July 21, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Gwangman Lim
  • Process shield for a substrate processing chamber
    Patent number: D891382
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: July 28, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Manjunatha P. Koppa, Aravind Kamath, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni, David Or
  • Power module
    Patent number: D892754
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: August 11, 2020
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventors: Peter Beckedahl, Juergen Steger, Ingo Bogen, Sandro Bulovic
  • Wafer boat
    Patent number: D893438
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: August 18, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Tomoya Hasegawa, Koichi Shimada
  • Circuit board having arrangements of light-emitting diodes
    Patent number: D893439
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: August 18, 2020
    Inventors: Kalu K. Vasoya, Abdullah Aslami, Ghanshyambhai Ramani
  • Conductive sticker
    Patent number: D897297
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: September 29, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Satoshi Ishii, Yoshimasa Takeda, Shuichi Kitano, Osamu Ono, Ami Inoue, Takeshi Kondo, Tatsuya Nakamura
  • Semiconductor wafer
    Patent number: D897974
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: October 6, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomoya Taguchi, Takeshi Sakamoto
  • Heater electrical connector and adapter
    Patent number: D900036
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: October 27, 2020
    Assignee: ASM IP Holding B.V.
    Inventors: Christopher Wuester, Raj Singu
  • Circuit board
    Patent number: D900044
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: October 27, 2020
    Assignee: SiFive, Inc.
    Inventors: Jack Kang, David Lee, Jeffrey Mulhausen
  • Semiconductor device
    Patent number: D900759
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: November 3, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Ryota Majima, Koshun Saito
  • Semiconductor device
    Patent number: D901405
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: November 10, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Koshun Saito, Keiichi Takahashi
  • Inner tube of reactor for semiconductor fabrication
    Patent number: D901406
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: November 10, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Toru Kagaya, Atsushi Umekawa
  • Integrated circuit card
    Patent number: D902164
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: November 17, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Atsushi Kondo, Taku Nishiyama, Katsuyoshi Watanabe
  • Target profile for a physical vapor deposition chamber target
    Patent number: D902165
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: November 17, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William R. Johanson, Kirankumar Neelasandra Savandaiah, Prashant Prabhakar Prabhu
  • Packaged semiconductor module
    Patent number: D902877
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: November 24, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Shigeru Hirata
  • Semiconductor device
    Patent number: D903611
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: December 1, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroya Sannai, Tatsuya Kawase, Seiichiro Inokuchi, Naoki Higashikawa
  • Semiconductor module
    Patent number: D903612
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: December 1, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Shin Soyano, Hiromichi Gohara
  • Semiconductor module
    Patent number: D903613
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: December 1, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Ryuichi Furutani
  • Circuit breaker board for a portable isolation power supply
    Patent number: D904324
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 8, 2020
    Inventor: David W. Cline
  • Semiconductor module
    Patent number: D904325
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 8, 2020
    Assignee: Sansha Electric Manufacturing Company, Limited
    Inventor: Takanori Omichi
  • Radio module
    Patent number: D904355
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: December 8, 2020
    Assignee: Gemalto M2M GmbH
    Inventor: Annette Horn
  • Conductive sticker
    Patent number: D904990
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: December 15, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Satoshi Ishii, Yoshimasa Takeda, Shuichi Kitano, Osamu Ono, Ami Inoue, Takeshi Kondo, Tatsuya Nakamura
  • Semiconductor element
    Patent number: D904991
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: December 15, 2020
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Kiyotaka Yoshida, Tomohiko Yoshino
  • Semiconductor module
    Patent number: D906271
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: December 29, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Takumi Kanda
  • Circuit breaker board for a portable isolation power supply
    Patent number: D906272
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 29, 2020
    Inventor: David W. Cline
  • Semiconductor device
    Patent number: D906273
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: December 29, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Ryota Majima, Koshun Saito
  • Transportable semiconductor wafer rack
    Patent number: D908102
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: January 19, 2021
    Assignee: Veeco Instruments Inc.
    Inventors: Michael W. Pacier, Michael J. Sershen, Adam F. Bertuch, Laurent Lecordier
  • Transportable semiconductor wafer rack
    Patent number: D908103
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: January 19, 2021
    Assignee: Veeco Instruments Inc.
    Inventors: Michael W. Pacier, Michael J. Sershen, Adam F. Bertuch, Laurent Lecordier
  • Sputtering target for a physical vapor deposition chamber
    Patent number: D908645
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: January 26, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kirankumar Neelasandra Savandaiah, David Gunther, Siew Kit Hoi
  • Semiconductor package
    Patent number: D908646
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: January 26, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Semiconductor package
    Patent number: D908647
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: January 26, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Adjustable fixture for aligning column grid array substrates
    Patent number: D908648
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: January 26, 2021
    Assignee: TopLine Corporation
    Inventors: Martin B. Hart, Robert H. Komrij
  • Semiconductor package
    Patent number: D909317
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: February 2, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Semiconductor package
    Patent number: D909318
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: February 2, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi
  • Circuit board
    Patent number: D909319
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: February 2, 2021
    Assignee: Impact IP, LLC
    Inventor: Taylor Nordeen
  • Chip
    Patent number: D911298
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: February 23, 2021
    Assignee: STAT PEEL AG
    Inventors: Krzysztof Krasnopolski, David Schmid, Fatma Burcu Celikkol Zijlstra, Joanna Alicja Borek-Donten, Ruedi Bieri