Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Semiconductor module
    Patent number: D945384
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: March 8, 2022
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventor: Shigeki Yamauchi
  • Temporary protective film for manufacturing semiconductor devices
    Patent number: D946540
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: March 22, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventor: Naoki Tomori
  • Target profile for a physical vapor deposition chamber target
    Patent number: D946638
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 22, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Zheng Wang
  • Vibration element for a haptic actuator
    Patent number: D947144
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 29, 2022
    Assignee: TDK CORPORATION
    Inventors: Kazuki Saito, Kaoru Kijima
  • Integrated module
    Patent number: D947800
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: April 5, 2022
    Assignee: CACI, Inc.—Federal
    Inventors: James Andrew Cook, Eric David Nystrom, Renato M. Camarda
  • Printed circuit board
    Patent number: D947801
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: April 5, 2022
    Assignee: PHOENIX CONTACT GMBH & CO. KG
    Inventors: Frank Mueller, Klaus Wessling, Dominik Weiss, Florian Wolters
  • Replaceable substrate carrier interfacing film
    Patent number: D947802
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: April 5, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Clinton Sakata, Edward Golubovsky
  • Susceptor shaft
    Patent number: D947913
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: April 5, 2022
    Assignee: ASM IP Holding B.V.
    Inventors: Aniket Patil, Sam Kim
  • Base plate for a processing chamber substrate support
    Patent number: D947914
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: April 5, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni
  • Susceptor for semiconductor substrate supporting apparatus
    Patent number: D948463
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: April 12, 2022
    Assignee: ASM IP Holding B.V.
    Inventors: Seung Hwan Lee, Hak Yong Kwon, Jong Su Kim, Sung Bae Kim, Ju Hyuk Park
  • Flexible circuit board with connectors
    Patent number: D949116
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: April 19, 2022
    Assignee: LUMILEDS HOLDING B.V.
    Inventors: Frederic Stephane Diana, Michael Wasilko
  • Circuit board
    Patent number: D949117
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 19, 2022
    Assignee: THE NOCO COMPANY
    Inventors: James P. McBride, Matthew Michael Bosway
  • Semiconductor module
    Patent number: D949807
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: April 26, 2022
    Assignee: SANSHA ELECTRIC MANUFACTURING COMPANY, LIMITED
    Inventor: Norimasa Wada
  • Semiconductor device
    Patent number: D949808
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: April 26, 2022
    Assignee: SANSHA ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Kotaro Maeda
  • Head for an atmospheric pressure plasma equipment
    Patent number: D951194
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: May 10, 2022
    Assignee: FUJI CORPORATION
    Inventors: Toshiyuki Ikedo, Takuya Iwata
  • Semiconductor device
    Patent number: D951212
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 10, 2022
    Assignee: Panasonic Semiconductor Solutions Co., Ltd.
    Inventors: Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa, Toshikazu Imai
  • Semiconductor device
    Patent number: D951213
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 10, 2022
    Assignee: Panasonic Semiconductor Solutions Co., Ltd.
    Inventors: Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa, Toshikazu Imai
  • Semiconductor device
    Patent number: D951214
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 10, 2022
    Assignee: Panasonic Semiconductor Solutions Co., Ltd.
    Inventors: Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa, Toshikazu Imai
  • Semiconductor device
    Patent number: D951215
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 10, 2022
    Assignee: Panasonic Semiconductor Solutions Co., Ltd.
    Inventors: Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa, Toshikazu Imai
  • Microcircuit for smart card
    Patent number: D954006
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: June 7, 2022
    Inventor: Bram Van de Kamp
  • Measurement jig
    Patent number: D954567
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: June 14, 2022
    Assignee: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Flexible circuit board
    Patent number: D954665
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: June 14, 2022
    Assignee: LUMILEDS HOLDING B.V.
    Inventors: Frederic Stephane Diana, Michael Wasilko
  • Flexible circuit board
    Patent number: D954666
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: June 14, 2022
    Assignee: LUMILEDS HOLDING B.V.
    Inventors: Frederic Stephane Diana, Michael Wasilko
  • Shaped electrode
    Patent number: D956005
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: June 28, 2022
    Assignee: APPLIED Materials, Inc.
    Inventors: Robert C. Lindberg, Alexandre Likhanskii, Wayne LeBlanc, Frank Sinclair, Svetlana Radovanov
  • Cooling plate for a semiconductor processing apparatus
    Patent number: D956705
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: July 5, 2022
    Assignee: Lam Research Corporation
    Inventors: Bin Luo, Damien Slevin, Allan Matthew Jones
  • Circuit board
    Patent number: D956707
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: July 5, 2022
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventor: Shigeki Yamauchi
  • Boat of substrate processing apparatus
    Patent number: D958093
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: July 19, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Satoru Murata
  • Circuit board
    Patent number: D958762
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: July 26, 2022
    Assignee: THE NOCO COMPANY
    Inventors: James P. McBride, Matthew Michael Bosway
  • Piezoelectric element
    Patent number: D958763
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: July 26, 2022
    Assignee: TDK CORPORATION
    Inventors: Akira Satoh, Kaoru Kijima
  • Higher temperature vented susceptor
    Patent number: D958764
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: July 26, 2022
    Assignee: ASM IP HOLDING B.V.
    Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
  • Ceiling heater for substrate processing apparatus
    Patent number: D959393
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: August 2, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Yuya Yoshimura, Takuto Shoji
  • Base plate for a processing chamber substrate support
    Patent number: D960216
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: August 9, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni
  • Reticle pod connecting frame
    Patent number: D962182
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: August 30, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Hsiao-Chia Lo
  • Retainer plate of top heater for wafer processing furnace
    Patent number: D962183
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 30, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Retainer plate of top heater for wafer processing furnace
    Patent number: D962184
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 30, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Semiconductor wafer processing apparatus
    Patent number: D962881
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 6, 2022
    Assignee: Lam Research Corporation
    Inventor: Eller Y. Juco
  • Susceptor shaft
    Patent number: D965044
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: September 27, 2022
    Assignee: ASM IP Holding B.V.
    Inventors: Aniket Patil, Sam Kim, John DiSanto, Saket Rathi
  • Boat of substrate processing apparatus
    Patent number: D965542
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: October 4, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Satoshi Fujii
  • Target profile for a physical vapor deposition chamber target
    Patent number: D966357
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: October 11, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: David Gunther, Jiao Song, Kirankumar Neelasandra Savandaiah, Madan Kumar Shimoga Mylarappa
  • Circuit board
    Patent number: D968344
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: November 1, 2022
    Assignee: T-Worx Holdings, LLC
    Inventors: Joseph D. Ellena, Tyler J. Miller, Thomas Musman, Tho N. Nguyen, Benjamin F. Feldman
  • Leadframe
    Patent number: D969093
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: November 8, 2022
    Assignee: Diodes Incorported
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Power semiconductor module
    Patent number: D969761
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: November 15, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Kotaro Shibata, Hideki Sawada
  • Power semiconductor package
    Patent number: D969762
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: November 15, 2022
    Assignee: Wolfspeed, Inc.
    Inventor: Kuldeep Saxena
  • Leadframe
    Patent number: D969763
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: November 15, 2022
    Assignee: Diodes Incorporated
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Leadframe
    Patent number: D969764
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: November 15, 2022
    Assignee: Diodes Incorported
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Sputter target for a physical vapor deposition chamber
    Patent number: D970566
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 22, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Riker, William Fruchterman, Ilya Lavitsky, Srinivasa Rao Yedla, Kirankumar Neelasandra Savandaiah
  • Lower shield for a substrate processing chamber
    Patent number: D971167
    Type: Grant
    Filed: April 10, 2021
    Date of Patent: November 29, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sarath Babu, Ananthkrishna Jupudi, Yueh Sheng Ow, Junqi Wei, Kelvin Boh, Yuichi Wada, Kang Zhang
  • Semiconductor module
    Patent number: D971863
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: December 6, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Semiconductor module
    Patent number: D972516
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: December 13, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Light-emitting device
    Patent number: D972769
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: December 13, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Yao-Ning Chan, Yi-Tang Lai, Yun-Chung Chou, Shih-Chang Lee, Chen Ou