Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Circuit board
    Patent number: D958762
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: July 26, 2022
    Assignee: THE NOCO COMPANY
    Inventors: James P. McBride, Matthew Michael Bosway
  • Piezoelectric element
    Patent number: D958763
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: July 26, 2022
    Assignee: TDK CORPORATION
    Inventors: Akira Satoh, Kaoru Kijima
  • Ceiling heater for substrate processing apparatus
    Patent number: D959393
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: August 2, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Yuya Yoshimura, Takuto Shoji
  • Base plate for a processing chamber substrate support
    Patent number: D960216
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: August 9, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni
  • Reticle pod connecting frame
    Patent number: D962182
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: August 30, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Hsiao-Chia Lo
  • Retainer plate of top heater for wafer processing furnace
    Patent number: D962183
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 30, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Retainer plate of top heater for wafer processing furnace
    Patent number: D962184
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 30, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Semiconductor wafer processing apparatus
    Patent number: D962881
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 6, 2022
    Assignee: Lam Research Corporation
    Inventor: Eller Y. Juco
  • Susceptor shaft
    Patent number: D965044
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: September 27, 2022
    Assignee: ASM IP Holding B.V.
    Inventors: Aniket Patil, Sam Kim, John DiSanto, Saket Rathi
  • Boat of substrate processing apparatus
    Patent number: D965542
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: October 4, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Satoshi Fujii
  • Target profile for a physical vapor deposition chamber target
    Patent number: D966357
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: October 11, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: David Gunther, Jiao Song, Kirankumar Neelasandra Savandaiah, Madan Kumar Shimoga Mylarappa
  • Circuit board
    Patent number: D968344
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: November 1, 2022
    Assignee: T-Worx Holdings, LLC
    Inventors: Joseph D. Ellena, Tyler J. Miller, Thomas Musman, Tho N. Nguyen, Benjamin F. Feldman
  • Leadframe
    Patent number: D969093
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: November 8, 2022
    Assignee: Diodes Incorported
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Power semiconductor module
    Patent number: D969761
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: November 15, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Kotaro Shibata, Hideki Sawada
  • Power semiconductor package
    Patent number: D969762
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: November 15, 2022
    Assignee: Wolfspeed, Inc.
    Inventor: Kuldeep Saxena
  • Leadframe
    Patent number: D969763
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: November 15, 2022
    Assignee: Diodes Incorporated
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Leadframe
    Patent number: D969764
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: November 15, 2022
    Assignee: Diodes Incorported
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Sputter target for a physical vapor deposition chamber
    Patent number: D970566
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 22, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Riker, William Fruchterman, Ilya Lavitsky, Srinivasa Rao Yedla, Kirankumar Neelasandra Savandaiah
  • Lower shield for a substrate processing chamber
    Patent number: D971167
    Type: Grant
    Filed: April 10, 2021
    Date of Patent: November 29, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sarath Babu, Ananthkrishna Jupudi, Yueh Sheng Ow, Junqi Wei, Kelvin Boh, Yuichi Wada, Kang Zhang
  • Semiconductor module
    Patent number: D971863
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: December 6, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Semiconductor module
    Patent number: D972516
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: December 13, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Light-emitting device
    Patent number: D972769
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: December 13, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Yao-Ning Chan, Yi-Tang Lai, Yun-Chung Chou, Shih-Chang Lee, Chen Ou
  • Semiconductor device
    Patent number: D973029
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: December 20, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Kohei Tanikawa, Takumi Kanda, Kenji Hayashi
  • Semiconductor device
    Patent number: D973030
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: December 20, 2022
    Assignee: DONG WOON ANATECH CO., LTD
    Inventors: Yu-Hwang Lee, Jung-Hyun Eum, Ho-Cheol Jang
  • Upper shield with showerhead for a process chamber
    Patent number: D973609
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: December 27, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sarath Babu, Ananthkrishna Jupudi, Yueh Sheng Ow, Junqi Wei, Kelvin Tai Ming Boh, Kang Zhang, Yuichi Wada
  • Semiconductor module
    Patent number: D974311
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: January 3, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Okimoto Kondo, Yusuke Nakakohara
  • Susceptor shaft
    Patent number: D975665
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: January 17, 2023
    Assignee: ASM IP Holding B.V.
    Inventors: Aniket Patil, Sam Kim
  • Semiconductor module
    Patent number: D975666
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: January 17, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Okimoto Kondo, Yusuke Nakakohara
  • Power module
    Patent number: D976852
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: January 31, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Tsai Wu, Hsin-Han Lin, Yuan-Yin Lo, Kuo-Shu Kao, Tai-Jyun Yu, Han-Lin Wu, Yen-Ting Lin
  • Fuse
    Patent number: D976215
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: January 24, 2023
    Assignee: Dexerials Corporation
    Inventors: Koichi Mukai, Yoshihiro Yoneda
  • Fuse
    Patent number: D976216
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: January 24, 2023
    Assignee: Dexerials Corporation
    Inventors: Koichi Mukai, Yoshihiro Yoneda
  • Semiconductor module
    Patent number: D978809
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 21, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Takumi Kanda, Masashi Hayashiguchi
  • Confinement liner for a substrate processing chamber
    Patent number: D979524
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: February 28, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Joseph Perry
  • Substrate processing system carrier
    Patent number: D980176
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: March 7, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Aaron Green, Nicholas Michael Bergantz
  • Ceiling heater for substrate processing apparatus
    Patent number: D980177
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 7, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Yuya Yoshimura, Takuto Shoji
  • Integrated circuit card
    Patent number: D980810
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: March 14, 2023
    Assignee: KIOXIA Corporation
    Inventors: Atsushi Kondo, Katsuyoshi Watanabe
  • Leadframe
    Patent number: D980811
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: March 14, 2023
    Assignee: DIODES INCORPORATED
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Power semiconductor module
    Patent number: D981354
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: March 21, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Kotaro Shibata, Hideki Sawada
  • Power semiconductor module
    Patent number: D981355
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: March 21, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Kotaro Shibata, Hideki Sawada
  • Semiconductor module
    Patent number: D981356
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: March 21, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Retaining ring for substrate
    Patent number: D981459
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: March 21, 2023
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Akazawa, Osamu Nabeya
  • Fuse
    Patent number: D981966
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: March 28, 2023
    Assignee: Dexerials Corporation
    Inventors: Koichi Mukai, Yoshihiro Yoneda
  • Elastic membrane for semiconductor wafer polishing apparatus
    Patent number: D981969
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: March 28, 2023
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Akazawa, Tomoko Owada, Osamu Nabeya, Makoto Fukushima, Yuichi Kato
  • Substrate mounting plate for substrate processing apparatus
    Patent number: D981970
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: March 28, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuaki Inada, Takeshi Yasui
  • Boat of substrate processing apparatus
    Patent number: D981971
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: March 28, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Daiki Taniguchi
  • Adiabatic plate for substrate processing appratus
    Patent number: D981972
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: March 28, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya Morita, Seiyo Nakashima, Satoru Murata
  • Separator of substrate processing apparatus
    Patent number: D982537
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: April 4, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya Morita, Seiyo Nakashima, Satoru Murata
  • Exhaust liner for reaction tube
    Patent number: D983151
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 11, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Satoru Murata
  • Semiconductor module
    Patent number: D983759
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: April 18, 2023
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Daiki Yoshida, Hiromichi Gohara, Shin Soyano
  • Light emitting diode
    Patent number: D984001
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: April 18, 2023
    Assignee: Shangyou Jiayi Lighting Product Co., Ltd.
    Inventor: Yaowen He