Abstract: A non-volatile memory device including: a page buffer configured to latch a plurality of page data constituting one bit page of a plurality of bit pages, and a control logic configured to compare results of a plurality of read operations performed in response to a high-priority read signal set to select one of a plurality of read signals included in the high-priority read signal set as a high-priority read signal, and determine a low-priority read signal corresponding to the high-priority read signal, wherein the high-priority read signal set is for reading high-priority page data, and the low-priority read signal is for reading low-priority page data.

Abstract: According to one embodiment, a memory system includes a memory controller configured to send a first command set including arithmetic operation target data and an address that designates a memory cell to store weight data; and a nonvolatile semiconductor memory configured to receive the first command set from the memory controller, read the weight data from the memory cell designated by the address, perform an arithmetic operation based on the arithmetic operation target data and the weight data, and send arithmetic operation result data to the memory controller.

Abstract: A method for compensating for a read error is disclosed, wherein each of n states are read from memory cells of a memory, the states being determined in a time domain. If the n states do not form a code word of a k-from-n code, a plurality of states from the n states, which were determined within a reading window, are provided with a first valid assignment and fed to an error processing stage. If the error processing does not indicate an error, the n states are further processed with the first valid assignment, and if the error processing indicates an error, the plurality of states that were determined within the reading window are provided with a second valid assignment and the n states are further processed with the second valid assignment. Accordingly, a device, a system and a computer program product are also disclosed.

Abstract: A data storage device is provided. The data storage device includes: a first function block of a device controller configured to receive user data and perform a first data processing; a first buffer memory connected to the first function block and configured to store user data subjected to the first data processing as first process data; a second function block of the device controller configured to receive a data write command determined based on the first process data; and a non-volatile memory connected to the second function block, and configured to receive and store data stored in the first buffer memory. The user data is provided to the first function block before the data write command is provided to the second function block.

Abstract: A non-volatile memory device includes a memory cell region including a first metal pad and a memory cell array including a plurality of memory cells, and a peripheral circuit region including a second metal pad and an output driver to output a data signal, and vertically connected to the memory cell region by the first metal pad and the second metal pad. The output driver includes a pull-up driver and a pull-down driver. The pull-up driver includes a first pull-up driver having a plurality of P-type transistors and a second pull-up driver having a plurality of N-type transistors. The pull-down driver includes a plurality of N-type transistors. One or more power supply voltages having different voltage levels are selectively applied to the pull-up driver. A first power supply voltage is applied to the first pull-up driver, and a second power supply voltage is applied to the second pull-up driver.

Abstract: A semiconductor system includes a first semiconductor device and a second semiconductor device. The first semiconductor device outputs a chip selection signal, a command/address signal and a clock signal. The first semiconductor device outputs first external data and a strobe signal during a write operation in a test mode and receives second external data to adjust an output moment of the strobe signal during a read operation in the test mode. The second semiconductor device is synchronized with the strobe signal to latch input data generated from the first external data during the write operation according to the chip selection signal and the command/address signal. The second semiconductor device generates output data from the input data and outputs the output data as the second external data during the read operation according to the chip selection signal and the command/address signal.

Abstract: Systems and methods for dynamically assigning memory array die to CMOS die of a plurality of stacked die during memory operations are described. The plurality of stacked die may be vertically stacked and connected together via one or more vertical through-silicon via (TSV) connections. The memory array die may only comprise memory cell structures (e.g., vertical NAND strings) without column decoders, row decoders, charge pumps, sense amplifiers, control circuitry, page registers, or state machines. The CMOS die may contain support circuitry necessary for performing the memory operations, such as read and write memory operations. The one or more vertical TSV connections may allow each memory array die of the plurality of stacked die to communicate with or be electrically connected to one or more CMOS die of the plurality of stacked die.

Abstract: The non-volatile memory device includes a memory cell array including a plurality of memory cells and a voltage generator configured to supply a voltage to the memory cell array. The voltage generator includes a charge pump circuit, a switching circuit, and a stage controller. The charge pump circuit includes a plurality of pump units and is configured to output a pump voltage and a pump current in accordance with a number of pump units that have received an input voltage among the plurality of pump units. The switching circuit is configured to output the pump voltage. The stage controller is configured to receive an input signal corresponding to the pump current and perform a stage control operation of generating a stage control signal for controlling the number of pump units to be driven.

Abstract: A semiconductor memory device includes a controller for sequentially activating first and second control signals and activating a third control signal during an amplification period, in a pseudo cryogenic temperature, a first driver for driving a first power source line with a first voltage during an initial period of the amplification period, based on the first control signal, a second driver for driving the first power source line with a second voltage during a later period of the amplification period, based on the second control signal, a third driver for driving a second power source line with a third voltage during the amplification period, based on the third control signal, and a sense amplifier for primarily amplifying a voltage difference between a data line pair using the first and third voltages during the initial period, and secondarily amplifying the difference using the second and third voltages during the later period.

Abstract: A memory circuit includes: memory cells each including a storage transistor having a first configuration; and a tracking circuit including: a tracking bit line having first and second intermediary nodes; a tracking word line; a first finger circuit (coupled between the first intermediary node and a reference voltage node) including: a first set of first tracking cells, each including a first shadow transistor having the first configuration; and a second finger circuit (coupled between the second intermediary node and the reference voltage node) including: a second set of second tracking cells, each including a second shadow transistor having the first configuration; gate terminals of the first and second shadow transistors being coupled with the tracking word line; and a switch configured to selectively couple the first intermediary node with the second intermediary node and thereby selectively couple the first and second finger circuits in parallel.

Abstract: Memory devices and systems with configurable die powerup delay, and associated methods, are disclosed herein. In one embodiment, a memory system includes two or more memory dies. At least one memory die has a powerup group terminal and powerup group detect circuitry. The powerup group detect circuitry is configured to detect a powerup group assigned to the at least one memory die. The at least one memory die is configured to delay its powerup operation by a time delay corresponding to the powerup group to which it is assigned. In this manner, powerup operations of the two or more memory dies can be staggered to reduce peak current demand of the memory system.

Abstract: The present disclosure generally relates to enhanced write performance by taking into consideration user write performance preferences as well as enhanced post write read (EPWR) scheduling. The user provides the write performance preferences to the data storage device. When a write operation happens, the data storage device checks the write performance preference for the current LBA as well as the write performance preference for the previous LBA. The data storage device will also check whether the current word line is scheduled for EPWR. Based upon the write performance preferences for the LBAs and the EPWR scheduling, the data can be written out of order to meet the user's write performance preferences. If the data is written out of order, the flash translation layer (FLT) is informed of the switch.

Abstract: A non-volatile memory device including: a page buffer configured to latch a plurality of page data constituting one bit page of a plurality of bit pages, and a control logic configured to compare results of a plurality of read operations performed in response to a high-priority read signal set to select one of a plurality of read signals included in the high-priority read signal set as a high-priority read signal, and determine a low-priority read signal corresponding to the high-priority read signal, wherein the high-priority read signal set is for reading high-priority page data, and the low-priority read signal is for reading low-priority page data.

Abstract: High-efficiency control technology for non-volatile memory. A controller allocates spare blocks of a non-volatile memory to provide an active block and writes data issued by a host to the active block. The controller further uses the active block as the destination for data transferred from a first source block when there are fewer spare blocks than the threshold amount. When a second source block meets the transfer requirements, the controller uses the active block as the destination for data transferred from the second source block.

Abstract: A processor semiconductor chip is described. The processor semiconductor chip includes at least one processing core. The processor semiconductor chip also includes a memory controller. The processor semiconductor chip also includes an embedded non flash non-volatile random access memory having a stack of storage cells disposed above the processor semiconductor chip's semiconductor substrate. The embedded non-volatile random access memory is to store boot up program code that, when executed by the processor semiconductor chip, is to analyze a subsequent module of program code so that a maliciously modified version of the subsequent module of program code can be identified. The embedded non-volatile random access memory to also store the subsequent module of program code.

Abstract: A data writing method, a memory control circuit unit, and a memory storage device are provided. The method includes: writing a first data and a second data to a first physical erasing unit; copying the first data from the first physical erasing unit to a second physical erasing unit; and copying the second data from the first physical erasing unit to a third physical erasing unit, wherein the memory sub-module to which the second physical erasing unit belongs is different from the memory sub-module to which the third physical erasing unit belongs.

Abstract: A main word line circuit provides a first and second row factor signals. The main word line circuit includes a pull-up circuit to drive a global word line to follow a first decoded address signal when the first row factor signal is at a first value. The main word line circuit includes an intermediate voltage circuit to drive the global word line to follow a value of the second row factor signal. A processing device drives the global word line to an active state by setting the first row factor signal to the first value when the first decoded address signal is at a high state, and drives the global word line to follow a value of the second row factor signal by setting the first row factor signal to the second value while the first decoded address signal is at the high state.

Abstract: Systems, apparatuses and methods related to subarray addressing for electronic memory and/or storage are described. Concurrent access to different rows within different subarrays may be enabled via independent subarray addressing such that each of the subarrays may serve as a “virtual bank.” Accessing the different rows as such may provide improved throughput of data values accessed from the respective rows being sent to a destination location. For instance, one such apparatus includes a plurality of subarrays within a bank of a memory device. Circuitry within the bank is coupled to the plurality of subarrays. The circuitry may be configured to activate a row at a particular ordinal position in a first subarray during a time period and a row at a different ordinal position in a second subarray of the plurality of subarrays during the same time period.

Abstract: Methods and apparatuses for single level cell caching are described. According to one example, a method includes receiving, at a memory device, a first set of data to be stored in a lower page of multilevel memory cells, storing the first set of data in a page of single level memory cells, storing the first set of data in the lower page of the multilevel memory cells, receiving, at the memory device, a second set of data to be stored in an upper page of the multilevel memory cells, and storing the second set of data directly in the upper page of the multilevel memory cells.

Abstract: The present disclosure includes apparatuses and methods for simultaneous in data path compute operations. An apparatus can include a memory device having an array of memory cells and sensing circuitry selectably coupled to the array. A plurality of shared I/O lines can be configured to move data from the array of memory cells to a first portion of logic stripes and a second portion of logic stripes for in data path compute operations associated with the array. The first portion of logic stripes can perform a first number of operations on a first portion of data moved from the array of memory cells to the first portion of logic stripes while the second portion of logic stripes perform a second number of operations on a second portion of data moved from the array of memory cells to the second portion of logic stripes during a first time period.

Abstract: A memory system comprises a first memory including physical blocks, a second memory storing a first correspondence table in which a logical cluster address corresponding to an address assigned to data received from a host is correlated with a logical group number corresponding to a block group and a logical cluster number corresponding to a location within the block group, and a second correspondence table in which first physical block numbers corresponding to first physical blocks are correlated with a first logical group number and second physical block numbers corresponding to second physical blocks are correlated with a second logical group number, and a controller circuit that updates the first correspondence table when new data is written to the first physical blocks, and the second correspondence table, without changing the first corresponding table, when data is moved from the first to the second physical blocks.

Abstract: A tunnel field-effect transistor (TFET) includes a fin, an insulator layer, and at least one gate. The fin has a doped first region, a doped second region, and an interior region between the first region and the second region. The interior region is undoped or is more lightly doped than the first region and the second region. At least the interior region of the fin formed as a type II superlattice, wherein materials of the superlattice alternate vertically. The insulator layer is formed around the interior region. The gate is formed on at least a portion of the insulator region. The insulator layer and the at least one gate are configured to generate an inhomogeneous electrostatic potential within the interior region.

Abstract: This non-volatile semiconductor memory device includes a memory cell array including NAND cell units formed in a first direction vertical to a surface of a semiconductor substrate. A local source line is electrically coupled to one end of the NAND cell unit formed on the surface of the substrate. The memory cell array includes: a laminated body where plural conductive films, which are to be control gate lines of memory cells or selection gate lines of selection transistors, are laminated sandwiching interlayer insulating films; a semiconductor layer that extends in the first direction; and an electric charge accumulating layer sandwiched between: the semiconductor layer and the conductive film. The local source line includes a silicide layer. The electric charge accumulating layer is continuously formed from the memory cell array to cover a peripheral area of the silicide layer.

Abstract: One or more control lines other than those used to activate a non-volatile memory cell may be used to sense a data value of the cell. For example, an apparatus may include a selection circuit that selects, based on an address corresponding to a non-volatile memory cell included an array of non-volatile memory cells, a word line coupled to the non-volatile memory cells to activate the non-volatile memory cell. An amplifier circuit may sense a data value stored in the non-volatile memory cell based on a sense signal having a voltage level based on voltage levels of one or more other word lines of the array of non-volatile memory cells. In another example, a data value of a non-volatile memory cell coupled to a word line may be sensed based on the voltage levels of one or more dummy sense lines within the array.

Abstract: In accordance with one embodiment, a computer-implemented method is provided, comprising: configuring code to cause at least part of hardware to operate as a double data rate (DDR) memory controller and to produce one or more capture clocks, where: a timing of at least one of the one or more capture clocks is based on a first clock signal of a first clock, the first clock signal is a core clock signal or a signal derived from at least the core clock signal, the at least one of the one or more capture clocks is used to time a read data path, the at least one of the one or more capture clocks is used to capture read data into a clock domain related to a second clock, the first clock and the second clock being related in timing such that at least one of: the second clock is derived from the first clock, or the first clock is derived from the second clock; and providing access to the code.

Abstract: A semiconductor memory device of one embodiment includes a p-type first semiconductor region, n word lines from the first to nth word lines stacked on the first semiconductor region in a first direction, an n-type second semiconductor region, a semiconductor layer between the first semiconductor region and the second semiconductor region, extending in the first direction, and intersecting with the n word lines, and a control circuit which, when verifying whether or not a kth memory cell provided in a region where a kth (4<k<n) word line and the semiconductor layer intersect with each other has reached a desired threshold voltage, executes a first verify operation of applying a first voltage between the first semiconductor region and the second semiconductor region and a second verify operation of applying a second voltage different from the first voltage, between the first semiconductor region and the second semiconductor region.

Abstract: An IC may include an array of memory cells formed in a semiconductor, including memory cells arranged in rows and columns, each memory cell may include a floating body region defining at least a portion of a surface of the memory cell, the floating body region having a first conductivity type; a buried region located within the memory cell and located adjacent to the floating body region, wherein the buried region has a second conductivity type, wherein the floating body region is bounded on a first side by a first insulating region having a first thickness and on a second side by a second insulating region having a second thickness, and a gate region above the floating body region and the second insulating region and is insulated from the floating body region by an insulating layer; and control circuitry configured to provide electrical signals to said buried region.

Abstract: Apparatuses and methods are provided for processing in memory. An example apparatus comprises a host and a processing in memory (PIM) capable device coupled to the host via an interface comprising a sideband channel. The PIM capable device comprises an array of memory cells coupled to sensing circuitry and is configured to perform bit vector operations on data stored in the array, and the host comprises a PIM control component to perform virtual address resolution for PIM operations prior to providing a number of corresponding bit vector operations to the PIM capable device via the sideband channel.

Abstract: An apparatus can have a memory comprising an array of resistance variable memory cells and a controller. The controller can be configured to receive to a dedicated command to write all cells in a number of groups of the resistance variable memory cells to a first state without transferring any host data corresponding to the first state to the number of groups. The controller can be configured to, in response to the dedicated command, perform a read operation on each respective group to determine states of the cells in each respective group, determine from the read operation any cells in each respective group programmed to a second state, and write only the cells determined to be in the second state to the first state.

Abstract: A method populates a parameter set for dynamically adjusting an operating condition in a memory block of a non-volatile memory circuit. A desired condition limit is identified, and a first parameter is computed as a function of a first memory operation to be performed on the memory block. The first parameter is included in a parameter set, and the memory block is cycled until the operating condition reaches the desired condition limit. After cycling, a second parameter is determined as a function of a second memory operation to be performed on the memory block, and the second parameter is included in the parameter set. The steps of cycling, and determining and the including the second parameter may be repeated until a desired number of cycles/parameters are reached. A retention bake may also be performed on the memory circuit, and a bit error rate resulting from a read operation verified.

Abstract: A non-volatile memory device includes a serial pipeline structure connected to an output stage of a First In, First Out (FIFO) memory. The FIFO memory is configured to store data transmitted through a data path having a wave pipeline structure based on a plurality of FIFO input clock signals and output the stored data based on a plurality of FIFO output clock signals. A serializer is configured to output data to an input/output pad based on a select clock signal. The serial pipeline structure is connected between the FIFO memory and the serializer and configured to compensate for a phase difference between the data output from the FIFO memory and the select clock signal.

Abstract: A programmable apparatus for executing a function is disclosed. The programmable apparatus includes a physical interface configured to be connected with an external apparatus. The programmable apparatus also includes a function logic circuit configured to execute the function on the programmable apparatus. The programmable apparatus further includes a plurality of peripheral logic circuits, each of which is configured to connect the function logic circuit with the physical interface using a respective protocol. The programmable apparatus also includes a selector circuit configured to select one from among the plurality of the peripheral logic circuits to activate.

Abstract: In accordance with one embodiment, an apparatus is provided, comprising: a double data rate (DDR) memory controller that, when in operation, causes the apparatus to: capture a data bit input signal in a first core domain register that is communicatively coupled to a second core domain register; clock the first core domain register utilizing a first clock; clock the second core domain register utilizing a second clock; maintain a difference in time between an active edge of the second clock and a next active edge of the first clock, such that the difference in time corresponds to a capture clock delay value; and set the capture clock delay value during a power-on initialization calibration operation.

Abstract: A voltage generator which generates an internal voltage based on a varying voltage derived from the internal voltage includes a feedback control circuit configured to variably transmit the varying voltage responsive to a control signal to generate a feedback voltage. A voltage generation circuit is configured to generate the internal voltage based on the feedback voltage.

Abstract: Some embodiments include a memory array which has a stack of alternating first and second levels. Channel material pillars extend through the stack, and vertically-stacked memory cell strings are along the channel material pillars. A common source is under the stack and electrically coupled to the channel material pillars. The common source has conductive protective material over and directly against metal silicide, with the conductive protective material being a composition other than metal silicide. Some embodiments include methods of fabricating integrated structures.

Abstract: Several embodiments of memory devices and systems with offset memory component automatic calibration error recovery are disclosed herein. In one embodiment, a system includes at least one memory region and calibration circuitry. The memory region has memory cells that read out data states in response to application of a current read level signal. The calibration circuitry is operably coupled to the at least one memory region and is configured to determine a read level offset value corresponding to one or more of a plurality of offset read level test signals, including a base offset read level test signal. The base offset read level test signal is offset from the current read level signal by a predetermined value. The calibration circuitry is further configured to output the determined read level offset value.

Abstract: The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry coupled to the array an array of memory cells via a sense line. The sensing circuitry is configured to sense, as a voltage associated with a second operand of a logical function, a voltage on the sense line corresponding to a first logical data value resulting in part from reading a first memory cell of the array of memory cells associated with a first operand of the logical function.

Abstract: A capacitor includes a first graphene structure having a first plurality of graphene layers. The capacitor further includes a dielectric layer over the first graphene structure. The capacitor further includes a second graphene structure over the dielectric layer, wherein the second graphene structure has a second plurality of graphene layers.

Abstract: Apparatuses and methods are provided for processing in memory. An example apparatus comprises a host and a processing in memory (PIM) capable device coupled to the host via an interface comprising a sideband channel. The PIM capable device comprises an array of memory cells coupled to sensing circuitry and is configured to perform bit vector operations on data stored in the array, and the host comprises a PIM control component to perform virtual address resolution for PIM operations prior to providing a number of corresponding bit vector operations to the PIM capable device via the sideband channel.

Abstract: A method of operating a semiconductor device that has a normal mode of operation and a test mode of operation, can include: generating at least one assist signal in the normal mode of operation wherein, when the at least one assist signal has a first assist logic level, the at least one assist signal alters a read operation or a write operation to a static random access memory (SRAM) cell as compared to operations without the assist signal, and inhibiting the generation of the at least one assist signal in the test mode of operation, the at least one assist signal has a second assist logic level when inhibited from being generated.

Abstract: The present disclosure relates to a structure which includes an assist circuit which is configured to add a boost voltage using a common boost logic device for both a read logic circuit and a write logic circuit of the assist circuit.

Abstract: According to one embodiment, a semiconductor memory device includes a nonvolatile memory, a read circuit array, a multiply-accumulate operator array, a first bus, an operation controller circuit, and a second bus. The read circuit array reads the data from the nonvolatile memory. The multiply-accumulate operator array receives the data read from the read circuit array. The first bus is connected between the read circuit array and the multiply-accumulate operator array and having a first bit width. The operation controller circuit is electrically connected to the multiply-accumulate operator array. The second bus is connected to the operation controller circuit and having a second bit width smaller than the first bit width.

Abstract: Example methods, systems, and apparatus to provide selective memory error protection and memory access granularity are disclosed herein. An example system includes a memory controller to determine a selected memory mode based on a request. The memory mode indicates that a memory page is to store a corresponding type of error protection information and is to store data for retrieval using a corresponding access granularity. The memory controller is to store the data and the error protection information in the memory page for retrieval using the error protection information and the access granularity.

Abstract: The present disclosure includes apparatuses and methods for simultaneous in data path compute operations. An apparatus can include a memory device having an array of memory cells and sensing circuitry selectably coupled to the array. A plurality of shared I/O lines can be configured to move data from the array of memory cells to a first portion of logic stripes and a second portion of logic stripes for in data path compute operations associated with the array. The first portion of logic stripes can perform a first number of operations on a first portion of data moved from the array of memory cells to the first portion of logic stripes while the second portion of logic stripes perform a second number of operations on a second portion of data moved from the array of memory cells to the second portion of logic stripes during a first time period.

Abstract: Apparatus and a corresponding method for controlling a transition between use of first processing circuitry and second processing circuitry to execute program instructions are provided. Transition monitoring storage selects an entry for a load program instruction executed during the transition in dependence on a memory address from which a value is to be loaded and stores a program order timestamp for the load program instruction, unless a valid previously stored program order timestamp in the entry precedes the program order timestamp. Thus the oldest timestamp of an load instruction executed in the transition is held. At either the start or end (or both) of the transition the content of the transition monitoring storage is cleared.

Abstract: Methods for improving channel boosting and reducing program disturb during programming of memory cells within a memory array are described. The memory array may comprise a NAND flash memory structure, such as a vertical NAND structure or a bit cost scalable (BiCS) NAND structure. In some cases, by applying continuous voltage ramping to unselected word lines during or throughout a programming operation, the boosting of channels associated with program inhibited memory cells may be improved. In one example, the slope and timing of a Vpass waveform applied to a group of unselected word lines (e.g., the neighboring word lines of the selected word line) during the programming operation may be set based on the location of the selected word line within the memory array and the locations of the group of unselected word lines within the memory array.

Abstract: In accordance with one embodiment, an apparatus is provided, comprising: a double data rate (DDR) memory controller that, when in operation, causes the apparatus to: capture a data bit input signal in a first core domain register that is communicatively coupled to a second core domain register; clock the first core domain register utilizing a first clock; clock the second core domain register utilizing a second clock; maintain a difference in time between an active edge of the second clock and a next active edge of the first clock, such that the difference in time corresponds to a capture clock delay value; and set the capture clock delay value during a power-on initialization calibration operation.

Abstract: In accordance with one embodiment, an apparatus is provided, comprising: a double data rate (DDR) memory controller that, when in operation, causes the apparatus to: generate a core clock; generate a capture clock; receive a data (DQ) signal that is driven by a DDR memory, or a signal derived from the DQ signal; clock a first core domain register, based, at least in part, on the capture clock; clock a second core domain register, based, at least in part, on the core clock; and set a delay of a core clock delay element, utilizing at least one of: the first core domain register, a signal derived from the first core domain register, the second core domain register, or a signal derived from the second core domain register; wherein the double data rate (DDR) memory controller is configured such that the delay of the core clock delay element is set during a power-on initialization calibration operation.

Abstract: Apparatuses, methods and storage media associated with single-ended sensing array design are disclosed herein. In embodiments, a memory device may include bitcell arrays, clipper circuitry, read merge circuitry, and a set dominant latch (SDL). The clipper circuitry may be coupled to a read port node of a first bitcell array of the bitcell arrays and a local bitline (LBL) node, the clipper circuitry to provide a voltage drop between the read port node and the LBL node. The read merge circuitry coupled to the clipper circuitry at the LBL node, the read merge circuitry to drive a value of a global bitline (GBL) node based on a value of the LBL node. The SDL coupled to the GBL node to sense the value of the GBL node. Other embodiments may be described and/or claimed.

Abstract: A three-dimensional integrated circuit non-volatile memory array includes a memory array of vertical channel NAND flash strings connected between a substrate source line and upper layer connection lines which each include n-type drain regions and p-type body line contact regions alternately disposed on each side of undoped or lightly doped string body regions so that each NAND flash string includes a vertical string body portion connected to a horizontal string body portion formed from the string body regions of the upper body connection lines.