Abstract: A 3D phase change memory device can store multiple bits per cell represented by a plurality of non-overlapping ranges of resistance all of which are established by different resistance ranges corresponding to respective amorphous phase thickness of the phase change memory material. An array of access devices can underlie a plurality of conductive layers, separated from each other and from the array of access devices by insulating layers. An array of pillars extending through the plurality of conductive layers contact corresponding access devices. The phase memory material is between the pillars and conductive layers. Circuitry is configured to program data in the memory cells using programming pulses having shapes that depend on the resistance range of the cell before programming and the data values to be stored.

Abstract: A circuit arrangement comprising a plurality of electronic components; a plurality of first access lines and second access lines, wherein each electronic component is coupled with at least one first access line and second access lines, the second access lines comprising at least two bit-lines; an access controller controlling access to at least one of the electronic components via the at least one first access line and the second access lines; and a first group of switches, wherein each switch comprises at least one control terminal and at least two controlled terminals. Each switch of the first group is connected to one of the at least two bit-lines via its control terminal and in a path between one first access line and a sense amplifier via its controlled terminals, and adjacent switches are connected via their control terminals to different bit-lines of the at least two bit-lines.

Abstract: A nonvolatile memory apparatus includes a memory cell array including a plurality of sub arrays. A plurality of analog-to-digital converters (ADCs) configured to sense sensing voltages outputted from memory cells of the plurality of sub arrays and a path selection unit configured to electrically couple the plurality of sub arrays with the plurality of ADCs in one-to-one correspondence in a first operation mode, and electrically couple the plurality of ADCs with a terminal of a power supply voltage in a second operation mode.

Abstract: A thin gate-oxide dual-mode PMOS transistor is disclosed that has a first mode of operation in which a switched n-well for the dual-mode PMOS transistor is biased to a high voltage. The dual-mode PMOS transistor has a second mode of operation in which the switched n-well is biased to a low voltage that is lower than the high voltage. The dual-mode PMOS transistor has a size and gate-oxide thickness each having a magnitude that cannot accommodate a permanent tie to the high voltage. An n-well voltage switching circuit is configured to bias the switched n-well to prevent voltage damage to the dual-mode PMOS transistor without the use of native transistors.

Abstract: A semiconductor memory device includes a program and read unit suitable for programming program data in a memory cell array and for reading read data stored in the memory cell array, and a control unit suitable for generating a control signal for controlling the program and read unit in response to a command input from the outside of the semiconductor memory device, in which the control unit controls the program and read unit to read the read data in a state of storing a first bit data of the program data when a read command is input while programming the program data.

Abstract: The present disclosure relates to a semiconductor device and a method of operating the semiconductor device. The semiconductor device includes a ROM for storing a program algorithm, an erase algorithm, a reading algorithm, and a reset algorithm and outputting ROM data corresponding to a selected algorithm, a program counter for outputting a ROM address to the ROM so as to sequentially operate the selected algorithm, an internal circuit for performing an operation corresponding to the selected algorithm in response to a plurality of internal circuit control signals in response to the ROM data, and a reset circuit for stopping progress of a running algorithm by initializing the program counter in response to a reset command input from an outside, and performing the reset algorithm.

Abstract: According to one embodiment, a semiconductor memory device includes n (n being a natural number of 2 or more) data retention circuits connected to a data input/output terminal; n buses connected respectively to the n data retention circuits; m×n data latch circuits connected to the buses, with m (m being a natural number of 2 or more) data latch circuits being connected per one of the buses; and a selection circuit configured to simultaneously perform data transfer from/to the data retention circuits for a plurality of the data latch circuits in units of a group including the plurality of the data latch circuits, the data latch circuits being divided into the groups so that not all the data latch circuits connected to the same bus are included in the same group.

Abstract: In accordance with an embodiment of the present invention, a method of operating a resistive switching device includes applying a signal including a pulse on a first access terminal of an access device having the first access terminal and a second access terminal. The second access terminal is coupled to a first terminal of a two terminal resistive switching device. The resistive switching device has the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period, a second ramp from the second voltage to a third voltage over a second time period, and a third ramp from the third voltage to a fourth voltage over a third time period. The second ramp and the third ramp have an opposite slope to the first ramp. The sum of the first time period and the second time period is less than the third time period.

Abstract: A memory circuit, including a memory array (such as a cross-point array), may include circuit elements that may function both as selection elements/drivers and de-selection elements/drivers. A selection/de-selection driver may be used to provide both a selection function as well as an operation function. The operation function may include providing sufficient currents and voltages for WRITE and/or READ operations in the memory array. When the de-selection path is used for providing the operation function, highly efficient cross-point implementations can be achieved. The operation function may be accomplished by circuit manipulation of a de-selection supply and/or de-selection elements.

Abstract: A semiconductor device includes a command combination circuit suitable for generating a combined level signal driven in synchronization with a write command and an internal write command; and a column selection circuit suitable for generating a pulse signal which includes a pulse generated at a level transition time of the combined level signal, and a column select signal.

Abstract: Apparatuses, global and local wordline drivers, and methods for driving a wordline voltage in a memory is described. An example apparatus includes a memory array including a plurality of sub-arrays. The plurality of sub arrays are coupled to a wordline. The memory array further including a plurality of local wordline drivers coupled between a global wordline and the wordline. The plurality of local wordline drivers are configured to selectively couple the wordline to the global wordline during a memory access operation. The example apparatus further includes a global wordline driver configured to selectively couple the wordline to the global wordline during the memory access operation.

Abstract: A current generation circuit includes a mirroring circuit suitable for being charged by using a bias voltage, wherein a voltage level of the charged voltage varies corresponding to changes in a voltage level of a power voltage, a comparison circuit suitable for comparing the charged voltage with a feedback voltage, and a current driving circuit suitable for generating a current based on a voltage output from the comparison circuit.

Abstract: An integrated circuit device can include a plurality of memory cells, each including at least one element programmable between different impedance states by application of a voltage or current; a plurality of bit line groups, each bit line group including multiple bit lines, each bit line being coupled to multiple memory cells; a plurality of current source circuits coupled to the bit line groups, each current source circuit configured to couple the bit lines of its respective group to at least a first bias node or a second bias node.

Abstract: Methods for performing parallel voltage and current compensation during reading and/or writing of memory cells in a memory array are described. In some embodiments, the compensation may include adjusting a bit line voltage and/or bit line reference current applied to a memory cell based on a memory array zone, a bit line layer, and a memory cell direction associated with the memory cell. The compensation may include adjusting the bit line voltage and/or bit line reference current on a per memory cell basis depending on memory cell specific characteristics. In some embodiments, a read/write circuit for reading and/or writing a memory cell may select a bit line voltage from a plurality of bit line voltage options to be applied to the memory cell based on whether the memory cell has been characterized as a strong, weak, or typical memory cell.

Abstract: One of a source and a drain of a first oxide semiconductor (OS) transistor is connected to a gate of a second OS transistor and one electrode of a first capacitor. One of a source and a drain of the second OS transistor is connected to one electrode of a second capacitor and one of a source and a drain of a Si transistor. The gate of the second OS transistor serves as a charge retention node. Charge injection and retention at this node is controlled by the first OS transistor. The other of the source and the drain of the second OS transistor is connected to a wiring applying a high potential, and a potential of the second capacitor that corresponds to the write data is maintained. A signal corresponding to the write data is read by the Si transistor.

Abstract: Method and apparatus for managing data in a memory, such as a flash memory array. In accordance with some embodiments, data are written to a set of solid-state non-volatile memory cells so that each memory cell in the set is written to an associated initial programmed state. Drift in the programmed state of a selected memory cell in the set is detected, and the selected memory cell is partially reprogrammed to return the selected memory cell to the associated initial programmed state.

Abstract: A memory device includes a memory array, a plurality of input/output pins, a mask signal generator, an input/output block. The memory array is configured to output read data including a plurality of data bits. The mask signal generator is configured to generate at least one data mask signal. The input/output block is configured to mask bits having a logic level among the plurality of data bits in the read data to output the masked read data to the plurality of input/output pins.

Abstract: A low-power programmable LSI that can perform configuration (dynamic configuration) at high speed and can quickly start is provided. The programmable LSI includes a plurality of logic elements and a memory element for storing configuration data to be input to the plurality of logic elements. The plurality of logic elements each include a configuration memory. Each of the plurality of logic elements performs different arithmetic processing and changes an electrical connection between the logic elements in accordance with the configuration data stored in the configuration memory. The memory element is formed using a storage element including a transistor whose channel is formed in an oxide semiconductor layer and a node set in a floating state when the transistor is turned off.

Abstract: A latency control device and a semiconductor device including the same are disclosed. The latency control device includes: a code setting unit configured to output a plurality of coding signals by setting a code value having a specific delay amount in response to a code signal; a latch unit configured to latch a command signal for a predetermined time; a period control unit configured to control a delay amount of a period signal in response to an output signal of the latch unit; a selection unit configured to output an oscillation signal synchronized with the clock signal in response to the selection signal, or synchronize the oscillation signal with an output signal of the period control unit; a register unit configured to output a plurality of period signals by dividing the oscillation signal; and a comparator configured to compare the plurality of coding signals with the plurality of period signals so as to output the self-latency signal.

Abstract: A method of retiming a circuit that includes a RAM having data stored therein, a register following the RAM, and registers preceding the RAM for registering input, address and enable signals of the RAM includes pushing a value in the register following the RAM back into a memory location in the RAM, pushing back data stored in the RAM and initial values in the registers preceding the RAM to accommodate the value pushed back from the register following the RAM, and setting new values in the registers preceding the RAM so that, on a first clock cycle after retiming, the circuit assumes a condition before retiming. The method also may be used to configure a programmable logic device with a user logic design.

Abstract: A semiconductor memory device includes memory cells for storing data, page buffers each configured to comprise a dynamic latch and a static latch on which data to be programmed in to the memory cells or data read from the memory cells are latched, and a control logic configured to store a plurality of refresh mode select codes corresponding to various refresh cycles, and refresh the dynamic latch by exchanging data between the static latch and the dynamic latch according to a refresh cycle corresponding to a selected refresh mode select code.

Abstract: A semiconductor memory device includes; a memory cell array comprising a first sub-memory cell array storing first data having a first characteristic and a second sub-memory cell array storing second data having a second characteristic different from the first characteristic, a first peripheral circuit operatively associated with only the first sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the first sub-memory cell array, and a second peripheral circuit operatively associated with only the second sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the second sub-memory cell array.

Abstract: A memory device includes a first bank group, a second bank group, where the first and second bank groups are each configured to output multi-bit data in parallel in response to a read command, a data transferor configured to receive the multi-bit data outputted in parallel from the first bank group or the second bank group and output the multi-bit data at a time interval corresponding to an operation mode, first global data buses configured to transfer the multi-bit data outputted from the first bank group to the data transferor, second global data buses configured to transfer the multi-bit data outputted from the second bank group to the data transferor, and a parallel-to-serial converter configured to convert the multi-bit data outputted from the data transferor into serial data according to the operation mode.

Abstract: The present invention aims to improve the performance of accessing flash memory used as a storage medium in a storage device. In the storage device in accordance with the present invention, a storage controller, before accessing the flash memory, queries a flash controller as to whether the flash memory is accessible.

Abstract: Methods and apparatus are provided for use with data storage elements. A ring oscillator is coupled to a selected element within an array such that a feedback loop is defined. A period at oscillation for the ring oscillator is compared to a reference value. A data value stored within the selected element is determined accordingly. Stored data values remain essentially unaltered when accessed and read by way of the ring oscillator. Memory arrays having memristor or other storage elements can be used according to the present teachings.

Abstract: A next read threshold is determined by determining a first number of solid state storage cells having a stored voltage which falls into a first voltage range and determining a second number of solid state storage cells having a stored voltage which falls into a second voltage range. A gradient is determine by taking a difference between the first number of solid state storage cells and the second number of solid state storage cells. The next read threshold is determined based at least in part on the gradient.

Abstract: There is provided an electromagnetic wave signal processor configured to process an input pulse signal corresponding to an electromagnetic wave, comprising a signal processing unit including: a peak detecting circuit to detect peak values of each amplitude of the input pulse signal; an AD converter to convert the peak values into digital signals; a memory device comprising memory cells each having an address assigned in accordance with each of values capable of being taken by the digital signals of the peak values, and being able to have any one of a plurality of internal states representing detection frequencies of the peak values; and a writing circuit to change the internal state in the memory cell that has the address corresponding to the value of each digital signal converted by the AD converter, so as to increment the detection frequency represented by the internal state.

Abstract: Selecting an array from among a plurality of arrays in a memory as a reference array. An exemplary method includes evaluating memory cells within the reference array to select a first reference cell associated with a first operation of the memory, and repeating the evaluating and the selecting to select a second reference cell from within the reference array, the second reference cell being associated with a second operation of the memory.

Abstract: Memories containing command decoder, chip enable, and signal truncation circuits are disclosed. One such command decoder circuit may include command decoder logic configured to receive command signals and output a decoded command to an interconnect bus responsive to a chip select signal having an active state. Decoder circuits may also prevent coupling commands to the interconnect bus based on the receipt of chip select signals having inactive states. The memory further may include chip enable circuits having control logic configured to receive chip select signals and provide the chip select signals to an interconnect bus responsive to receiving a valid command. Chip enable circuits may also prevent coupling chip select signals to the interconnect bus from chip enable signals based on the receipt of invalid command signals. Signal truncation circuits may be used to shorten and/or shift chip select signals to increase timing margins and improve the reliability of command execution by memories.

Abstract: A semiconductor memory device of the present invention includes a memory cell array with cell strings having word lines stacked on a substrate and a vertical channel layer formed through the word lines, a peripheral circuit configured to select one of the word lines and perform a program operation on the selected word line, and a control circuit configured to control the peripheral circuit to perform the program operation by applying a program voltage to a word line selected for the program operation, applying a ground voltage to a word line of which a program operation has been completed and applying a pass voltage to the other word lines.

Abstract: A memory circuit, including a memory array (such as a cross-point array), may include circuit elements that may function both as selection elements/drivers and de-selection elements/drivers. A selection/de-selection driver may be used to provide both a selection function as well as an operation function. The operation function may include providing sufficient currents and voltages for WRITE and/or READ operations in the memory array. When the de-selection path is used for providing the operation function, highly efficient cross-point implementations can be achieved. The operation function may be accomplished by circuit manipulation of a de-selection supply and/or de-selection elements.

Abstract: An elapsed time with respect to a programming operation on a memory cell of a nonvolatile memory is determined, a read voltage is adjusted based on the determined elapsed time and a read operation is performed on the memory cell using the adjusted read voltage. Determining the elapsed time may be preceded by performing the programming operation in response to a first access request and determining the elapsed time may include determining the elapsed time in response to a second access request. Memory systems supporting such operations are also described.

Abstract: A memory cell array includes memory cells disposed at intersections of first lines and second lines, and each having a rectifying element and a variable resistance element connected in series. A control circuit, when performing an operation to change retained data, applies a first voltage to a selected first line and applies a second voltage to a selected second line; furthermore, applies a third voltage to a non-selected first line; and, moreover, applies a fourth voltage larger than the third voltage to a non-selected second line. An absolute value of a difference between the third voltage and the fourth voltage is set smaller than an absolute value of a difference between the first voltage and the second voltage by an amount of an offset voltage. A value of the offset voltage increases as the absolute value of the difference between the first and second voltages increases.

Abstract: A memory includes a plurality of blocks in which each block includes a plurality of memory cells. The memory includes a set of charge pumps which apply voltages to the plurality of blocks. A method includes selecting a block of the plurality of memory blocks; determining an array size of the selected block; determining a set of program/erase voltages based on the array size and temperature from a temperature sensor; and programming/erasing the selected block, wherein the set of program/erase voltages are applied by the set of charge pumps during the programming/erasing of the selected block.

Abstract: A circuit in dynamic random access memory devices includes a command extension circuit. The command extension circuit is configured to generate at least one multiple-cycle command signal by lengthening a single-cycle clock command signal from a command decoding circuit. Control logic extends and reduces the multiple-cycle command signal to provide additional functions such as burst length and burst chop. Additional control logic is configured to determine whether a clock signal is enabled in output control logic circuitry according to the multiple-cycle command and logic level generated in the output logic circuitry.

Abstract: A semiconductor memory device includes a memory cell array configured to include memory cells, peripheral circuits configured to read out data stored in a selected memory cell in a read operation, and a controller configured to control the peripheral circuits so that the peripheral circuits sense a voltage level of the bit line when a first read voltage of the read voltages is supplied to the word line and the peripheral circuits sense voltage levels of the bit line when a second read voltage lower than the first read voltage by a specific level and a third read voltage higher than the first read voltage by the specific level are supplied to the word line in order to determine whether a threshold voltage of the selected memory cell falls within a set voltage distribution in the read operation.

Abstract: A resistive memory device and a sensing margin trimming method are provided. The resistive memory device includes a memory cell array and a trimming circuit. The memory cell array has a plurality of resistive memory cells. The trimming circuit generates a trimming signal according to a characteristic distribution shift value of the resistive memory cells. With the inventive concept, although a characteristic distribution of memory cells is varied, an erroneous read operation is minimized or reduced by securing a sensing margin stably. Accordingly, a fabrication yield of the resistive memory device is bettered.

Abstract: An integrated circuit device comprises a semiconductor substrate, a first memory block on the substrate comprising NAND memory cells, a second memory block on the substrate comprising NAND memory cells, and controller circuitry. The first and second memory blocks are configurable to store data for a first pattern of data usage in response to a first operation algorithm to read, program and erase data, and for a second pattern of data usage in response to a second operation algorithm to read, program and erase data, respectively. The controller circuitry is coupled to the first and second memory blocks, and is configured to execute the first and second operation algorithms, wherein a word line pass voltage for read operations applied in the first operation algorithm is at a lower voltage level than a second word line pass voltage for read operations applied in the second operation algorithm.

Abstract: Writing data to a thermally sensitive memory device, including: receiving a physical layout of the thermally sensitive memory device; receiving the direction of airflow across the thermally sensitive memory device; selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device; and writing data to the selected address of the thermally sensitive memory device.

Abstract: Methods of maintaining a state of a memory cell without interrupting access to the memory cell are provided, including applying a back bias to the cell to offset charge leakage out of a floating body of the cell, wherein a charge level of the floating body indicates a state of the memory cell; and accessing the cell.

Abstract: A nonvolatile memory device is provided comprising a memory cell array including first and second memory cells. Data is stored at the first memory cell. The device further comprises an access control circuit configured to read the data stored at the first memory cell and to subsequently perform a data processing operation on the second memory cell contemporaneously with a reprogramming operation performed on the first memory cell. The reprogramming operation on the first memory cell is selectively performed based on a determination whether a state of the first memory cell is changed while the data stored at the first memory cell is read.

Abstract: The present disclosure includes methods, devices, and systems for outputting data particular quantization of data from memory devices and systems. Outputting data particular quantization of data can include enabling a particular one of a plurality of different quantizations of data. The particular one of the plurality of quantizations of data can then be output.

Abstract: An integrated circuit with SRAM cells containing dual passgate transistors and a read buffer, all connected to one word line is disclosed. The read buffer and one passgate transistor may be variously configured to a separate read data line and write data line, or a combined data line, in different embodiments. The read buffer in addressed SRAM cells may be biased during read operations. The read buffer in half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line. The read buffer in addressed and half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line.

Abstract: A volatile memory including volatile memory cells adapted to the performing of data write and read operations. The memory cells are arranged in rows and in columns and, further, are distributed in separate groups of memory cells for each row. The memory includes a first memory cell selection circuit configured to perform write operations and a second memory cell selection circuit, different from the first circuit, configured to perform read operations. The first circuit is capable of selecting, for each row, memory cells from one of the group of memory cells for a write operation. The second circuit is capable of selecting, for each row, memory cells from one of the groups of memory cells for a read operation.

Abstract: Example subject matter disclosed herein relates to apparatuses and/or devices, and/or various methods for use therein, in which an application of an electric potential to a circuit may be initiated and subsequently changed in response to a determination that a snapback event has occurred in a circuit. For example, a circuit may comprise a memory cell that may experience a snapback event as a result of an applied electric potential. In certain example implementations, a sense circuit may be provided which is responsive to a snapback event occurring in a memory cell to generate a feed back signal to initiate a change in an electric potential applied to the memory cell.

Abstract: An apparatus includes a terminal, a first plurality of driver lines, and a first phase mixer. The driver lines drive the terminal to a first logic state responsive to a first enable signal. The first phase mixer is coupled to a first one of the first plurality of driver lines. The first phase mixer is operable to receive the first enable signal and a first delayed enable signal derived from the first enable signal and generate a first signal on the first driver line having a first configurable delay with respect to the first enable signal by mixing the first enable signal and the first delayed enable signal.

Abstract: A system including a read module to perform a first read operation to determine a state of a memory cell, and in response to a first failure to decode data read from the memory cell, perform second and third read operations to determine the state of the memory cell. The memory cell has first and second threshold voltages when programmed to first and second states, respectively. A shift detection module detects, in response to a second failure to decode data read from the memory cell in the second and third read operations, a shift in a distribution of at least one of the first and second threshold voltages. A binning module divides the distribution into a plurality of bins. A log-likelihood ratio (LLR) module generates LLRs for the plurality of bins based on a variance of the distribution and adjusts the LLRs based on an amount of the shift.

Abstract: A voltage source controller for a memory array includes an input coupled to a voltage source, an output coupled to one or more memory cells of a memory array, where the output is configured to provide a cell source voltage to the memory cells. The controller also includes a switch circuit configured to: receive a retention enable signal, a write assist enable signal, and a standard mode enable signal; and based on the retention enable signal, write assist enable signal, and standard mode enable signal, selectively set the cell source voltage for one or more of the memory cells to one of: a retention voltage, a write assist voltage, or a standard mode voltage, where the retention voltage and the write assist voltage are less than the standard mode voltage.

Abstract: A memory device includes: a plurality of nonvolatile memory sections configured to allow one memory cell to record data of a plurality of bits, and to include a corresponding number of pages to the plurality of bits in accordance with a plurality of the memory cells as a write control unit; and a control section configured to control writing and reading data to and from the plurality of nonvolatile memory sections, wherein among the plurality of nonvolatile memory sections, if data is written into one of the nonvolatile memory sections, the data is written for each page in sequence from a low-order page to a high-order page, and when the data is written into the low-order page, control is performed such that the data to be written into the low-order page is written into any area of the other of the nonvolatile memory sections at same timing.

Abstract: A method includes selecting a word line for programming in an array of analog memory cells that are arranged in rows associated with respective word lines and columns associated with respective bit lines. Word-line voltages, which program the memory cells in the selected word line, are applied to the respective word lines. Bit-line voltages, which cause one or more additional memory cells outside the selected word line to be programmed as a result of programming the selected word line, are applied to the respective bit lines. Using the applied word-line and bit-line voltages, data is stored in the memory cells in the selected word line and the additional memory cells are simultaneously programmed.