Abstract: A method includes selecting a word line for programming in an array of analog memory cells that are arranged in rows associated with respective word lines and columns associated with respective bit lines. Word-line voltages, which program the memory cells in the selected word line, are applied to the respective word lines. Bit-line voltages, which cause one or more additional memory cells outside the selected word line to be programmed as a result of programming the selected word line, are applied to the respective bit lines. Using the applied word-line and bit-line voltages, data is stored in the memory cells in the selected word line and the additional memory cells are simultaneously programmed.

Abstract: A semiconductor device avoids the disturb problem and the collision between write and read operations in a DP-SRAM cell or a 2P-SRAM cell. The semiconductor device 1 includes a write word line WLA and a read word line WLB each coupled to memory cells 3. A read operation activates the read word line WLB corresponding to the selected memory cell 3. A write operation activates the write word line WLA corresponding to the selected memory cell 3. The selected write word line WLA is activated after activation of the selected read word line WLB in an operation cycle that performs both read and write operations.

Abstract: A flash memory controller, a non-transitory computer readable medium and a method for reading flash memory cells of a flash memory module. The method may include calculating a group of read thresholds to be applied during a reading operation of a set of flash memory cells that belong to a certain row of the flash memory module based upon a compressed representation of reference read thresholds associated with multiple reference rows of the flash memory module; and reading the set of flash memory cells by applying the group of reference read thresholds to provide read results.

Abstract: A dynamic random access memory (DRAM) is selectively operable in a sleep mode and another mode. The DRAM has data storage cells that are refreshed in the refresh mode. A boosted voltage is provided for the operation of the DRAM. A boosted voltage provider includes a group of charge pump circuits that are selectively activated by a pump control circuit based on a refresh time for refreshing data in the DRAM cells in the sleep mode.

Abstract: A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.

Abstract: A method for storing data. The method includes providing an addressable memory including a memory space, wherein the memory space includes a plurality of memory cells. The method includes configuring the addressable memory such that a majority of the plurality of memory cells in the memory space stores internal data values in a preferred bias condition when a first external data state of one or more external data states is written to the memory space, wherein the first external data state is opposite the preferred bias condition.

Abstract: A testing method for a chip with an embedded non-volatile memory and the chip is provided. A remapping circuit and the non-volatile memory are connected to a processor. The non-volatile memory has a test area and an area under test. The test area stores a test program, and the area under test stores data under test. When the processor tests the chip, the processor outputs an original instruction address, and the remapping circuit remaps the original instruction address to generate a remapped instruction address. The processor reads the test program in the test area, and executes the test program to read the data under test in the area under test and to perform a test of toggling the logic circuit.

Abstract: A method of accessing a non-volatile memory is disclosed. Original bits of data are duplicated on a bit level to generate a plurality of duplicated bits corresponding to each original bit. At least one shielding bit is provided between the duplicated bits corresponding to different original bits. The duplicated bits and the at least one shielding bit are programmed to the non-volatile memory. The original bits are generated or determined according to the duplicated bits.

Abstract: In a memory cell array, memory cells each including a variable resistance element are arranged at crossing portions between a plurality of first wiring and a plurality of second wirings. A control circuit executes a set operation, a reset operation, and a training operation. In the set operation, a set pulse is applied to the variable resistance element to change the variable resistance element from a high resistance state to a low resistance state. In the reset operation, a reset pulse having an opposite polarity to the polarity of the set pulse is applied to the variable resistance element to change the variable resistance element from the low resistance state to the high resistance state. In the training operation, the set pulse and the reset pulse are continuously applied to the variable resistance element.

Abstract: A semiconductor memory device includes a memory cell unit including a plurality of memory cells coupled between a plurality of word lines and a plurality of bit lines, and configured to provide a read value in response to an activated word line, a reference value generating unit including a plurality of reference value generating cells coupled between the plurality of word lines and a reference bit line, and configured to provide a single reference value in response to the activated word line, and a sense circuit configured to provide a sense output signal based on the single reference value and the read value.

Abstract: An operating method of a memory device includes entering a repair mode, receiving an active command and a fail address, and temporarily storing the received command and address, receiving a write command, and determining whether to perform a program operation, when the program operation is determined to be performed, programming the temporarily-stored fail address into a programmable storage unit, and receiving a precharge command before the programming of the temporarily-stored fail address is completed.

Abstract: A system on chip (SoC) includes one or more core logic blocks that are configured to operate on a lower supply voltage and a memory array configured to operate on a higher supply voltage. Each bitcell in the memory has two ferroelectric capacitors connected in series between a first plate line and a second plate line to form a node Q. A data bit voltage is transferred to the node Q by activating a write driver to provide the data bit voltage responsive to the lower supply voltage. The data bit voltage is boosted on the node Q by activating a sense amp coupled to node Q of the selected bit cell, such that the sense amp senses the data bit voltage on the node Q and in response increases the data bit voltage on the node Q to the higher supply voltage.

Abstract: Apparatus and methods for signal margin centering for single-ended eDRAM sense amplifier. A plurality of DRAM cells is connected to an input side of a multiplexer by a first bitline. A single-ended sense amplifier is connected to an output side of the multiplexer by a second bitline. The single-ended sense amplifier has a switch voltage. The second bitline is precharged to a selected voltage level. The multiplexer passes a signal voltage from a selected one of the plurality of DRAM cells to the second bitline. The selected voltage level is selected such that reception of the signal voltage of a first type adjusts a voltage of the second bitline in a first direction and reception of the signal voltage of a second type adjusts the voltage of the second bitline in a second direction opposite from the first direction, centering the signal voltage around the switch voltage.

Abstract: The first circuit has a function of retaining data in a first period during which a power supply voltage is supplied. The second circuit has functions of saving the data retained in the first circuit in the first period and retaining the data saved from the first circuit in a second period during which application of the power supply voltage is stopped. The third circuit has functions of saving the data retained in the second circuit in the second period and retaining the data saved from the second circuit in a third period during which application of the power supply voltage is stopped. The second circuit is capable of being written with the data for a shorter time than the third circuit. The third circuit is capable of maintaining the data for a longer time than the second circuit.

Abstract: Disclosed are a memory system and an associated operating method. In the system, a first memory array comprises first memory cells requiring a range of time delays between wordline activating and bitline sensing. A delay signal generator delays an input signal by a selected time delay (i.e., a long time delay corresponding to statistically slow memory cells) and outputs a delay signal for read operation timing to ensure read functionality for statistically slow and faster memory cells. To accomplish this, the delay signal generator comprises a second memory array having second memory cells with the same design as the first memory cells. Transistors within the second memory cells are controlled by a lower gate voltage than transistors within the first memory cells in order to mimic the effect of higher threshold voltages, which result in longer time delays and which can be associated with the statistically slow first memory cells.

Abstract: A variable resistance nonvolatile memory device includes a memory cell array, a memory cell selection circuit, a write circuit, and a read circuit. The read circuit determines that a selected memory cell has a short-circuit fault when a current higher than or equal to a predetermined current passes through the selected memory cell. The write circuit sets another memory cell different from the faulty memory cell and located on at least a bit or word line including the faulty memory cell to a second high resistance state where a resistance value is higher than a resistance value in the first high resistance state, by applying a second high-resistance write pulse to the other memory cell.

Abstract: A memory circuit in which a level of a first data input appears promptly at an output in response to a clock pulse received. The circuit includes a flip-flop triggered by the clock pulse and configured to receive the first data input and drive a second data input. The circuit also includes a first control input driven by the clock pulse, a second control input driven by the flip-flop and selection logic configured to receive the first and second data inputs and the first and second control inputs. The selection logic is configured to drive the output of the memory circuit to the level of the first data input or of the second data input depending on the first and second control inputs.

Abstract: To provide a semiconductor device which can write and read a desired potential. The semiconductor device includes a first transistor (Tr), a second Tr, and a capacitor. In the semiconductor device, operation of writing data is performed by a first step and a second step. In the first step, a low voltage is applied to a bit line and a first wiring to turn on the first Tr and the second Tr. In the second step, a first voltage is applied to the first wiring, and application of the low voltage to the bit line is stopped. Operation of reading the data is performed by a third step and a fourth step. In the third step, a high voltage is applied to the first wiring. In the fourth step, application of the high voltage to the first wiring is stopped, and a low voltage is applied to a capacitor line.

Abstract: Systems, methods and fabrication processes relating to memory devices involving data bus inversion are disclosed. According to one illustrative implementation, a memory device may comprise a memory core, circuitry that receives a data bus inversion (DBI) bit associated with a data signal as input directly, without transmission through DBI logic associated with an input buffer, and circuitry that stores the DBI bit into the memory core, reads the DBI bit from the memory core, and provides the DBI bit as output. In further implementations, memory devices herein may store and process the DBI bit on an internal data bus as a regular data bit.

Abstract: A nonvolatile semiconductor memory device includes a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time.

Abstract: Methods and non-volatile storage systems are provided for determining erratically programmed storage elements, including under-programmed and over-programmed storage elements. Techniques do not require any additional data latches. A set of data latches may be used to store program data for a given memory element. This program data may be maintained after the programming is over for use in erratic program detection. In one embodiment, lockout status is kept in a data latch that is used to serially receive program data to be programmed into the storage element. Therefore, no extra data latches are required to program the storage elements and to maintain the program data afterwards.

Abstract: A memory includes a plurality of blocks in which each block includes a plurality of memory cells. The memory includes a set of charge pumps which apply voltages to the plurality of blocks. A method includes selecting a block of the plurality of memory blocks; determining an array size of the selected block; determining a set of program/erase voltages based on the array size and temperature from a temperature sensor; and programming/erasing the selected block, wherein the set of program/erase voltages are applied by the set of charge pumps during the programming/erasing of the selected block.

Abstract: A register file device includes: a multi-port latch; and a write circuit that generates a signal to be written in the multi-port latch, the write circuit generating the signal on the basis of a plurality of data groups each including a write control signal, a write address, and a piece of write data, wherein the write circuit includes: a detection circuit that detects at least two write control signals occurred simultaneously among write control signals, and a changing circuit that changes write data corresponding to one of the write control signal to become same as write data corresponding to another of the write control signal.

Abstract: A method is provided for programming a memory cell having a first terminal coupled to a word line and a second terminal coupled to a bit line. During a first predetermined time interval, the word line is switched from a first standby voltage to a first voltage, the bit line is switched from a second standby voltage to a predetermined voltage, and a voltage drop across the first and second terminals is a safe voltage that does not program the memory cell. During a second predetermined time interval, the word line is switched from the first voltage to a second voltage, and a voltage drop across the first and second terminals is a programming voltage that is sufficient to program the memory cell. Numerous other aspects are provided.

Abstract: A semiconductor apparatus includes a clock frequency change block configured to output a plurality of internal clocks with different frequencies by dividing a frequency of an external clock in response to a mode register set signal and a setting command to enable the plurality of internal clocks to be outputted, and generate a flag signal to designate the completion of the output, and a command generation block configured to receive a command and generate the setting command in response to the flag signal and the mode register to set signal.

Abstract: A semiconductor memory storage device comprises an array of storage devices including a plurality of rows of the storage devices and a plurality of columns of the storage devices, a first plurality of write ports, a write select signal coupled to the write ports, a plurality of write port address lines coupled as input to each of the write ports, and a first plurality of word line select circuits coupled to receive an address signal and the write select signal for each of the write ports and to provide a single selected write word line signal to a respective one of the rows of the storage devices for one of the first plurality of write ports activated by the write select signal.

Abstract: An exemplary semiconductor memory cell is provided to include: a floating body region configured to be charged to a level indicative of a state of the memory cell; a first region in electrical contact with the floating body region; a second region in electrical contact with the floating body region and spaced apart from the first region; a gate positioned between the first and second regions; a buried layer region in electrical contact with the floating body region, below the first and second regions, spaced apart from the first and second regions; and a substrate region configured to inject charge into the floating body region to maintain the state of the memory cell; wherein an amount of charge injected into the floating body region is a function of a charge stored in the floating body region.

Abstract: A circuit includes a first plurality of memory cells coupled with a first data line and a first data transfer circuit coupled with the first data line and a second data line. In a first operation mode of the circuit, the first data line is left floating and is caused to have a first logical value by a current in at least one memory cell of the first plurality of memory cells. In a second operation mode of the circuit, the first data line is configured to reflect data stored in a memory cell of the plurality of memory cells, and the second data line is configured to reflect the data on the first data line through the first data transfer circuit.

Abstract: A Static Random Access Memory (SRAM) cell includes a first long boundary and a second long boundary parallel to a first direction, and a first short boundary and a second short boundary parallel to a second direction perpendicular to the first direction. The first and the second long boundaries are longer than, and form a rectangle with, the first and the second short boundaries. A CVss line carrying a VSS power supply voltage crosses the first long boundary and the second long boundary. The CVss line is parallel to the second direction. A bit-line and a bit-line bar are on opposite sides of the CVss line. The bit-line and the bit-line bar are configured to carry complementary bit-line signals.

Abstract: Methods, apparatuses, and systems for providing a body connection to a vertical access device. The vertical access device may include a digit line extending along a substrate to a digit line contact pillar, a body connection line extending along the substrate to a body connection line contact pillar, a body region disposed on the body connection line, an electrode disposed on the body region, and a word line extending to form a gate to the body region. A method for operation includes applying a first voltage to the body connection line, and applying a second voltage to the word line to cause a conductive channel to form through the body region. A memory cell array may include a plurality of vertical access devices.

Abstract: A static RAM includes: a plurality of word lines; a plurality of pairs of local bit lines; a plurality of memory cells arranged in correspondence with intersections of the plurality of pairs of local bit lines and the plurality of word lines; a capacitance shared circuit arranged for each of the plurality of pairs of local bit lines; a common connection line connecting the plurality of capacitance shared circuits; and a pair of global bit lines connected to the plurality of pairs of local bit lines, wherein the capacitance shared circuit includes two N-channel transistors connected between the pair of local bit lines and the common connection line corresponding to each other.

Abstract: A memory access control device including: a bit position information storage unit storing bit position information indicating one or more bit positions in a bit sequence of a predetermined length; a reading unit configured to attempt to read a bit sequence from the range specified by the logical address received by the logical address receiving unit, thereby receiving a first bit sequence from the external memory in units of the predetermined length, the first bit sequence being composed of bits that are larger in number than bits stored in the range specified by the logical address; a bit sequence extracting unit configured to extract one or more bit sequences from the first bit sequence at the one or more bit positions indicated by the bit position information in units of the predetermined length.

Abstract: A method includes selecting a word line for programming in an array of analog memory cells that are arranged in rows associated with respective word lines and columns associated with respective bit lines. Word-line voltages, which program the memory cells in the selected word line, are applied to the respective word lines. Bit-line voltages, which cause one or more additional memory cells outside the selected word line to be programmed as a result of programming the selected word line, are applied to the respective bit lines. Using the applied word-line and bit-line voltages, data is stored in the memory cells in the selected word line and the additional memory cells are simultaneously programmed.

Abstract: A current flowing through a voltage line and/or a data line in a column of a tracking circuit is determined. A threshold tracking time delay of the tracking circuit is determined. Based on the determined current handled by the voltage line and/or the data line and the determined threshold tracking time delay, a plurality of columns in the tracking circuit, a number of first cells in each column of the plurality of columns, and a number of second cells in the each column of the plurality of columns are determined.

Abstract: This document discusses, among other things, a reference voltage generator circuit coupled to a plurality of fuse read circuits. The reference voltage generator circuit can be configured to mirror a reference current to produce a reference voltage and a gate bias voltage. The plurality of fuse read circuits can each be coupled to the reference voltage generator circuit and can also be coupled to a fuse of a plurality of fuses. Each fuse read circuit of the plurality of fuse read circuits can be configured to mirror the reference current using the gate bias voltage to produce a fuse read voltage across each fuse coupled to the plurality of fuse read circuits. Each fuse read circuit of the plurality of fuse read circuits can compare the fuse read voltage of each fuse and the reference voltage and can indicate a state of each fuse coupled to each fuse read circuit using the comparison.

Abstract: Apparatuses and methods including a plurality of memory units are disclosed. An example apparatus includes a plurality of memory units. Each of the plurality of memory units include a master/slave identification (ID) node coupled to a first voltage source node via a resistive element. Each of the plurality of memory units further include a master/slave ID circuit configured to determine whether a memory unit is a master memory unit or a slave memory unit based on a voltage level detected at the master/slave ID node. The master/slave ID node of each of the plurality of memory units other than a first memory unit is further coupled to a respective second voltage source node via a through-substrate via (TSV) of a respective adjacent memory unit of the plurality of memory units.

Abstract: Systems, methods and computer program products for minimizing floating gate coupling interference and threshold voltage drift associated with flash memory cells are described. In some implementations, the memory cells can be programmed in a predetermined sequence that allows pages with the most-significant bit (MSB) and central significant bit (CSB) to be programmed first prior to programming pages with the least-significant bit (LSB). This sequence allows neighboring cells (e.g., cells neighboring a target cell) to be programmed first so as to reduce the floating gate coupling interference and threshold voltage drift on the target cell that is to be programmed in the subsequent stage. To accommodate the programming sequence (e.g., at the device level), additional buffer memories can be added.

Abstract: A method for performing a holding operation to a semiconductor memory array having rows and columns of memory cells, includes: applying an electrical signal to buried regions of the memory cells, wherein each of the memory cells comprises a floating body region defining at least a portion of a surface of the memory cell, the floating body region having a first conductivity type; and wherein the buried region of each memory cell is located within the memory cell and located adjacent to the floating body region, the buried region having a second conductivity type.

Abstract: Methods for performing parallel voltage and current compensation during reading and/or writing of memory cells in a memory array are described. In some embodiments, the compensation may include adjusting a bit line voltage and/or bit line reference current applied to a memory cell based on a memory array zone, a bit line layer, and a memory cell direction associated with the memory cell. The compensation may include adjusting the bit line voltage and/or bit line reference current on a per memory cell basis depending on memory cell specific characteristics. In some embodiments, a read/write circuit for reading and/or writing a memory cell may select a bit line voltage from a plurality of bit line voltage options to be applied to the memory cell based on whether the memory cell has been characterized as a strong, weak, or typical memory cell.

Abstract: Methods for performing parallel voltage and current compensation during reading and/or writing of memory cells in a memory array are described. In some embodiments, the compensation may include adjusting a bit line voltage and/or bit line reference current applied to a memory cell based on a memory array zone, a bit line layer, and a memory cell direction associated with the memory cell. The compensation may include adjusting the bit line voltage and/or bit line reference current on a per memory cell basis depending on memory cell specific characteristics. In some embodiments, a read/write circuit for reading and/or writing a memory cell may select a bit line voltage from a plurality of bit line voltage options to be applied to the memory cell based on whether the memory cell has been characterized as a strong, weak, or typical memory cell.

Abstract: A semiconductor device may comprise a first bit line, a second bit line, a memory cell connected to the first bit line, a bit line sense amplifier circuit and a control circuit. The bit line sense amplifier circuit may be coupled to the memory cell. The bit line sense amplifier circuit may include a first inverter having an input node coupled to the first bit line and an output node coupled to the second bit line, and a second inverter having an input node coupled to the second bit line and an output node coupled to the first bit line. The control circuit may be configured to activate the first inverter without activating the second inverter during a first time period and to activate the first inverter and the second inverter at the same time during a second time period after the first time period.

Abstract: Memory devices and bulk storage devices configured to program a memory cell to a target threshold voltage representing a data pattern of more than one bit and read the data pattern of more than one bit of the memory cell in a single read operation by generating a signal that is representative of an actual threshold voltage of the memory cell.

Abstract: A memory circuit is provided comprising a plurality of bit cells coupled to a bit line that permits accessing information from each of the plurality of bit cells. A sense inverter is coupled to an output of the bit line. A keeper circuit has an output coupled to the bit line to compensate for current leakage from the plurality of bit cells. The keeper circuit may comprise an n-channel metal-oxide-silicon (NMOS) transistor in series with a p- channel metal-oxide-silicon (PMOS) transistor.

Abstract: Methods for monitoring one or more load currents corresponding with one or more voltage regulators used during operation of a semiconductor memory are described. The one or more load currents may be due to the biasing of memory cells within a memory array or due to the presence of shorts between lines in the memory array. In some embodiments, a plurality of load currents corresponding with a plurality of voltage regulators may be monitored in real-time before and during biasing of one or more memory arrays. The plurality of load currents may be monitored using a configurable load current monitoring circuit that uses a current summation technique. The ability to monitor the plurality of load currents before performing a programming operation on a memory array allows for remapping of defective portions of the memory array and modification of programming bandwidth prior to the programming operation.

Abstract: A method includes selectively creating a first breakdown condition and a second breakdown condition at a semiconductor transistor structure. The first breakdown condition is between a source overlap region of the semiconductor transistor structure and a gate of the semiconductor transistor structure. The second breakdown condition is between ad rain overlap region of the semiconductor transistor structure and the gate.

Abstract: A semiconductor device includes: a non-volatile memory unit; a data bus configured to transfer data outputted from the non-volatile memory unit; a selection signal generation unit configured to generate a plurality of selection signals based on a clock; and a plurality of latch sets configured to each be enabled in response to a selection signal that corresponds to the latch set among the selection signals and store the data transferred through the data bus.

Abstract: A memory bit cell includes a latch, a write port coupled to the latch, and a read port coupled to the latch. The write port includes a first set of devices having a first threshold voltage and a second set of devices having a second threshold voltage that is greater than the first threshold voltage. The read port includes a third set of devices having a third threshold voltage that is less than the first threshold voltage.

Abstract: At least one example embodiment discloses a semiconductor device. The semiconductor device includes a first sense amplifier selectively connected between a first bit line and a second bit line, a second sense amplifier selectively connected between the first bit line and the second bit line, a first power supply circuit configured to provide a power supply voltage to the first sense amplifier in response to a first control signal, a second power supply circuit configured to provide a ground voltage to the second sense amplifier in response to a second control signal, and a switching circuit configured to selectively connect the first power supply circuit with the second power supply circuit in response to a third control signal.

Abstract: Methods for monitoring one or more load currents corresponding with one or more voltage regulators used during operation of a semiconductor memory are described. The one or more load currents may be due to the biasing of memory cells within a memory array or due to the presence of shorts between lines in the memory array. In some embodiments, a plurality of load currents corresponding with a plurality of voltage regulators may be monitored in real-time before and during biasing of one or more memory arrays. The plurality of load currents may be monitored using a configurable load current monitoring circuit that uses a current summation technique. The ability to monitor the plurality of load currents before performing a programming operation on a memory array allows for remapping of defective portions of the memory array and modification of programming bandwidth prior to the programming operation.

Abstract: A method of operating a semiconductor memory device is disclosed. The method may include receiving an access command, applying a first voltage to a selected word line of the semiconductor memory device for a period of time in response to receiving the access command, applying a second voltage to word lines adjacent to the selected word line before and after the period of time, and applying a third voltage to the word lines adjacent to the selected word line for the period of time, a voltage level of the third voltage greater than the second voltage. The applying the third voltage may occur when the semiconductor memory device is operated at a temperature below the predetermined temperature.