Main body of a semiconductor wafer carrying container

Description

FIG. 1 is a front view of a main body of a semiconductor wafer carrying container showing my new design;

FIG. 2 is a back view of FIG. 1;

FIG. 3 is a right side view of FIG. 1;

FIG. 4 is a left side view of FIG. 1;

FIG. 5 is a top view of FIG. 1;

FIG. 6 is a bottom view of FIG. 1;

FIG. 7 is a perspective view of FIG. 1;

FIG. 8 is another perspective view of FIG. 1;

FIG. 9 is a cross-sectional view taken along lines 9-9 in FIG. 1;

FIG. 10 is a cross-sectional view taken along lines 10-10 in FIG. 3;

FIG. 11 is an enlarged view of an encircled portion, FIG. 11 in FIG. 5;

FIG. 12 is an enlarged view of an encircled portion, FIG. 12 in FIG. 7; and,

FIG. 13 is an enlarged view of an encircled portion, FIG. 13 in FIG. 8.

The dot-dashed broken lines shown in FIGS. 1, 3, 7, 8, 9, 10, 11, 12, and 13 illustrate the boundary lines of the claimed design and form no part of the claimed design. The dot-dashed lines that encircle the enlarged portion views of FIGS. 11, 12, and 13 in FIGS. 5, 7, and 8 illustrate the boundary lines of the enlarged portion views and form no part of the claimed design. The even dashed broken lines shown in the drawings represent portions of the main body of a semiconductor wafer carrying container that form no part of the claimed design.

Claims

The ornamental design for a main body of a semiconductor wafer carrying container as shown and described.