Shielded Patents (Class 174/350)
  • Publication number: 20150107890
    Abstract: A cable having a conducting member made from a nanostructure-based material, and a shielding layer made of nanostructure-based material. The shielding layer can be circumferentially situated about the conducting member so as to enhance conductivity along the conducting member. A coupling mechanism may be situated between the shielding layer and the conducting member so as to secure the shielding layer in its position on the conducting member. A method of making the cable is also disclosed.
    Type: Application
    Filed: August 29, 2014
    Publication date: April 23, 2015
    Inventors: Jennifer Mann, David S. Lashmore, Brian White, Peter L. Antoinette
  • Patent number: 9006581
    Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Hiroyuki Yasuda
  • Patent number: 8993886
    Abstract: Disclosed is a hard-framed housing that provides a cover for electronic hardware components. According to one example, the housing may include a front cover portion that includes at least two spring loaded friction inducing side arms extending from a faceplate portion of the front cover portion at approximately a 90 degree angle. The housing may also include a rear cover portion that includes at least two receiving plates which provide a planar surface for the at least two spring loaded friction inducing side arms to rest when the front cover portion is engaged with the rear cover portion.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: March 31, 2015
    Assignee: AMX LLC
    Inventor: Phong Le
  • Patent number: 8995146
    Abstract: An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: March 31, 2015
    Assignee: Semblant Limited
    Inventors: Andrew Simon Hall Brooks, Timothy Allan Von Werne
  • Publication number: 20150083481
    Abstract: Seal assemblies in which a seal member having an energizer located in a seal body groove is positioned inside a housing cavity of a housing are disclosed. The sealing member and the energizer, which can be an O-ring or a spring energizer, can be retained inside the housing cavity by positioning a portion of the energizer in a groove in the housing cavity in a locking or latching engagement. Methods of making and using seal assemblies are also disclosed.
    Type: Application
    Filed: September 24, 2014
    Publication date: March 26, 2015
    Inventor: Mike Foster
  • Patent number: 8988897
    Abstract: An apparatus for distributing electromagnetic waves comprising a first plurality of plates coupled to a first rod. A second plurality of plates coupled to a second rod, wherein at least one of either the first or the second plurality of plates is capable of reflecting an electromagnetic wave. A portion of the second rod is situated inside the first rod. A first motor mechanically connected to the first rod, such that the first motor is capable of rotating the first rod. A second motor mechanically connected to the second rod, such that the second motor is capable of rotating the second rod, wherein rotational direction and speed of the second rod, when rotated by the second motor is independent of rotational direction and speed of the first rod, when rotated by the first motor.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Edward C. Gillard, Don A. Gilliland, John S. Maas
  • Patent number: 8988896
    Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG
    Inventors: Detlev Wittmer, Ulrich Kaiser
  • Patent number: 8975517
    Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: March 10, 2015
    Assignee: Daishinku Corporation
    Inventors: Naoki Kohda, Hiroki Yoshioka
  • Patent number: 8976540
    Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: March 10, 2015
    Assignee: LG Electronics Inc.
    Inventor: Mansung Yoo
  • Patent number: 8976539
    Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 10, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Phillip J. Edwards, Jignesh H. Shah, Lance R. Thompson, Nhan Huynh
  • Patent number: 8969737
    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: March 3, 2015
    Assignee: Apple Inc.
    Inventors: Andrew B. Just, Trent Weber, Shigefumi Honjo
  • Publication number: 20150044906
    Abstract: An HDMI cable, an HDMI connector and an HDMI interface for a high-definition video/audio apparatus are provided. The HDMI interface includes the HDMI connector and the HDMI cable. The HDMI connector includes a connecting terminal having an extending cable terminal arranged in parallel in a main body. The HDMI cable includes at least one connecting unit consisting of a plurality of parallel metal wires. An insulating unit covers an outside of a face of the connecting unit, in such a manner that the metal wires are parallel and isolated from each other. The present invention is using design of single row of the connector terminal and single row of the HDMI cable, to simplify an HDMI interface structure and reduce size and weight, and manual identification is not required for pin bit definitions, which simplifies production process, reduces the manual work, and greatly improves production efficiency.
    Type: Application
    Filed: May 15, 2014
    Publication date: February 12, 2015
    Inventors: Nanlv Tian, Jianyun Tang, Minhua Lu, Shijun Liu, Ming Wang
  • Publication number: 20150027771
    Abstract: A composite electromagnetic-wave-absorbing sheet comprising (a) a first electromagnetic-wave-absorbing film 10a comprising a plastic film 11, and a single- or multi-layer thin metal film formed on at least one surface of the plastic film 12, the thin metal film 12 being provided with large numbers of substantially parallel, intermittent, linear scratches 122 with irregular widths and irregular intervals in plural directions, and (b) a second electromagnetic-wave-absorbing film 20 composed of a resin or a rubber in which magnetic particles or non-magnetic, conductive particles are dispersed.
    Type: Application
    Filed: November 29, 2012
    Publication date: January 29, 2015
    Inventor: Seiji KAGAWA
  • Publication number: 20150014047
    Abstract: A method and apparatus for EMI protection is disclosed. Particularly, the present invention is directed to an article of manufacture for electromagnetic interference shielding comprising a cylindrically-shaped sleeve constructed of a conductive fabric adapted to provide electromagnetic interference shielding by conducting at least a portion of electromagnetic radiation, wherein the cylindrically-shaped sleeve is made by rolling a piece of conductive fabric into a cylindrical shape such that opposing sides of the piece of conductive fabric are joined together resulting in the cylindrically-shaped sleeve having a seam at a junction of the opposing sides. In one embodiment, opposing sides of the piece of conductive fabric are sewn together.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 15, 2015
    Inventors: Sheldon Hutchison, Greg Halstead
  • Publication number: 20150014048
    Abstract: An electromagnetic interference shield used in room construction materials for the protection from satellite surveillance that has a first surface, a second surface where the first surface and the second surface are configured to attach to each other and where the first surface and the second surface are separable from each; a third surface where the second surface and the third surface are configured to attach to each other and where the second surface and third surface are separable from each other; a fourth surface where the third surface and fourth surface are configured to attach to each other and where the third surface and fourth surface are separable from each other.
    Type: Application
    Filed: July 14, 2014
    Publication date: January 15, 2015
    Inventor: Kelvin Berrman Harrison
  • Patent number: 8895874
    Abstract: Thin indium-less “optically porous” layers adapted to replace traditional ITO layers are provided herein. A thin metalized film adapted to carry an electrical charge can include a dense pattern of small openings to allow the transmission of light to or from an underlying semiconductor material. The pattern of openings can create a regular or irregular grid pattern of low aspect ratio fine-line metal conductors. Creation of this optically porous metalized film can include the printing of a catalytic precursor material, such as palladium in solution in a pattern on a substrate, drying or curing the catalytic precursor, and the deposition of a thin layer of metal, such as copper on the dried precursor to form the final conductive and optically porous film.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: November 25, 2014
    Assignee: Averatek Corp.
    Inventors: Sunity Kumar Sharma, Alex Newsom Beavers, Jr., Thomas Furst
  • Publication number: 20140326484
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Application
    Filed: October 12, 2012
    Publication date: November 6, 2014
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Publication number: 20140327510
    Abstract: An electronic device includes a structure. The structure includes a first set of through glass vias (TGVs) and a second set of TGVs. The first set of TGVs includes a first via and the second set of TGVs includes a second via. The first via has a different cross-sectional shape than the second via.
    Type: Application
    Filed: May 6, 2013
    Publication date: November 6, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Daeik D. Kim, David F. Berdy, Chengjie Zuo, Mario Francisco Velez, Changhan Yun, Robert P. Mikulka, Jonghae Kim, Je-Hsiung Lan
  • Publication number: 20140318852
    Abstract: A shield structure and a wire harness are provided which can improve a working property, reduce the number of parts and lower a cost when a shield member is fixed and integrally formed. In the shield structure, a tubular electromagnetic shield member 40 is fixed to and formed integrally with a motor side connecting part 42 and an inverter side connecting part 43 by a resin molding. Specifically, the motor side connecting part 42 and the inverter side connecting part 43 are formed as electrically conductive molded products and an integral molding operation is carried out when a terminal part of the electromagnetic shield member 40 is integrally formed with the electrically conductive molded products respectively.
    Type: Application
    Filed: November 21, 2012
    Publication date: October 30, 2014
    Applicant: Yazaki Corporation
    Inventors: Hideomi Adachi, Yoshiaki Ozaki
  • Publication number: 20140318851
    Abstract: A shield reinforcing apparatus is provided. The shield reinforcing apparatus includes a printed circuit board, a shield member that covers the printed circuit board, and at least one shield reinforcing part provided in the printed circuit board and configured to contact the shield member to be pressed.
    Type: Application
    Filed: April 24, 2014
    Publication date: October 30, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Won-Jea JANG, Dong-In HA, Jin-Young KWAK, Gi-Heung KIM, Jung-Yoon SEO, Jae-Joon YOO, Byoung-Hee LEE, Sung-Jin CHOI
  • Patent number: 8853562
    Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: October 7, 2014
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventors: Koichi Izawa, Yumi Ogura
  • Publication number: 20140291009
    Abstract: The invention discloses an insulating body (1) which is provided for receiving and/or electrically contacting at least one conductor of a cable to be connected or for fitting onto a printed circuit board, the insulating body (1) being adapted to be introduced into a dedicated chamber of a plug connector housing and having at least one recess (11) for at least one contact element (13) which can be connected to the individual conductor of the cable to be connected or to a conductor track of the printed circuit board, and including a shielding element (20) by which the contact element is electromagnetically shielded, the insulating body (1) being formed of at least one first component (2) and one second component (10), the first component (2) containing a doping so that the surface of the first component (2) can be provided with a conducting coating (6) by an electroplating process, the shielding element (20) being formed from the conducting coating of the first component (2).
    Type: Application
    Filed: June 26, 2012
    Publication date: October 2, 2014
    Applicant: HARTING ELECTRONICS GMBH
    Inventors: Stephan Schreier, Melanie Genau, Dirk Peter Post
  • Patent number: 8830697
    Abstract: A ground apparatus for connecting components for a portable terminal suppresses the occurrence of noise by grounding a connector. The ground apparatus includes a connector engaging portion at one side of a main board. A connector that includes a grounding portion is inserted into the connector engaging portion. A shield can is disposed to cover at least at part of the main board. The shield can includes a ground structure formed at the connector engaging portion area to enclose the connector and electrically couple the ground structure with the ground portion of the connector.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: September 9, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Wook Kim, Byung Kuk Ko
  • Publication number: 20140247564
    Abstract: The invention provides an electromagnetic shielding for electronic device. The electromagnetic shielding comprises: an opening provided at a position corresponding to the electronic device, through which a heat sink passes to be in contact directly with the electronic device; and at least one elastic arm made of conductive material provided at the circumference of the opening which are extending in a direction away from the shielding to be in a conductive contact with the side surface of the heat sink when the heat sink is mounted in position.
    Type: Application
    Filed: October 31, 2011
    Publication date: September 4, 2014
    Inventors: Jiwei Shi, Yingjie Hu, WenXin Huang
  • Publication number: 20140240079
    Abstract: A method for manufacturing a thin metal wire electromagnetic shield includes the steps of preparing a thin metal wire bundle unified by bundling a plurality of thin metal wires each having a surface coated with an insulating material, and compression-molding the thin metal wire bundle by press working.
    Type: Application
    Filed: November 22, 2011
    Publication date: August 28, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenichi Mino, Ryuichi Nishiura
  • Publication number: 20140238734
    Abstract: A cloak is provided for concealing an object to an electromagnetic field. A first vane encloses the object and a second vane encloses the first vane. The distance between the first and second vanes varies relative to the object, so as to conceal the object to the electromagnetic field.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 28, 2014
    Applicant: United States Government, as represented by the Secretary of the Navy
    Inventor: United States Government, as represented by the Secretary of the Navy
  • Patent number: 8804322
    Abstract: A display device includes a display panel including a front substrate and a back substrate, a back cover disposed in the rear of the display panel, and a transparent cover including a portion disposed in the front of the front substrate of the display panel. The transparent cover contains a resin material having transmission capable of transmitting light. The transparent cover is separated from a front surface of the front substrate by a predetermined distance, and an air layer is formed between the transparent cover and the front surface of the front substrate.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: August 12, 2014
    Assignee: LG Electronics Inc.
    Inventors: Yunjoo Kim, Soonhyung Kwon, Jonghyun Byeon, Moungyoub Lee, Deogjin Lee, Sangdon Park
  • Publication number: 20140216805
    Abstract: A braid for a wire harness includes a plurality of element wire bundles, each of which is formed of a plurality of element wires, and the plurality of element wire bundles being braided into a tubular shape. Each of the plurality of element wire bundles includes a metal element wire that has electrical conductivity, a plurality of resin element wires that have abrasion resistance and that are disposed to surround the metal element wire, and a drain metal element wire that has electrical conductivity and that is disposed with the resin element wires and contacts with the metal element wire. The drain metal element wires in the plurality of element wire bundles contact to each other.
    Type: Application
    Filed: April 11, 2014
    Publication date: August 7, 2014
    Applicant: YAZAKI CORPORATION
    Inventors: Hideomi ADACHI, Yoshiaki OZAKI
  • Publication number: 20140209373
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding structures including one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 31, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: John Song, Paul Francis Dixon
  • Publication number: 20140209374
    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals.
    Type: Application
    Filed: March 29, 2013
    Publication date: July 31, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: John Song, Paul Francis Dixon, Yoeri Ariën
  • Publication number: 20140209372
    Abstract: An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.
    Type: Application
    Filed: January 29, 2013
    Publication date: July 31, 2014
    Applicant: St. Jude Medical, Atrial Fibrillation Division, Inc.
    Inventor: St. Jude Medical, Atrial Fibrillation Division, Inc.
  • Patent number: 8787038
    Abstract: A chassis for an electronic device includes a main housing and a removable cover. The main housing includes a base plate and two opposite side plates integrally formed together. The removable cover includes a main portion and two opposite side portions. The side portions are latched on the side plates. A space is defined between each side portion of the cover and each side plates of the main housing. A waveguide is formed between each side portion and each side plate to attenuate electromagnetic radiation in the space.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: July 22, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jun-Wei Wang, Qiang Chai
  • Publication number: 20140196942
    Abstract: An electromagnetic wave shielding member includes a dielectric layer, first conductor plates arranged on one surface of the dielectric layer, and second conductor plates arranged opposed to the first conductor plates on the other surface of the dielectric layer, wherein the first and second conductor plates are arranged at regular intervals to have three or more-fold rotational symmetry about an optional reference point on the one surface of the dielectric layer on which the first conductor plates are arranged, and are arranged independent from each other.
    Type: Application
    Filed: January 13, 2014
    Publication date: July 17, 2014
    Applicant: Panasonic Corporation
    Inventors: Atsushi SUWA, Masakazu ADACHI
  • Publication number: 20140182922
    Abstract: A wire harness includes a plurality of electric wires, a first wire holding portion for holding one of both end portions of the plurality of electric wires, a second wire holding portion for holding another of the both end portions, and an annular electromagnetic wave absorption component arranged between the first and second wire holding portions so as to absorb electromagnetic wave radiated from the plurality of electric wires. The electromagnetic wave absorption component includes a through-hole for inserting collectively the plurality of electric wires such that the plurality of electric wires are inserted through the though-hole and are thereby bundled together.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 3, 2014
    Applicant: Hitachi Metals, Ltd.
    Inventors: Masaaki IMAHORI, Takahiro FUTATSUMORI, Shinya HAYASHI
  • Publication number: 20140182921
    Abstract: A wire harness includes an electric wire, a braided shield covering the electric wire, an annular electromagnetic wave absorption component that includes a through-hole for inserting electric wire and absorbs electromagnetic wave emitted from the electric wire, and a movement-restricting member for restricting the electromagnetic wave absorption component from moving in a direction of inserting the electric wire in the through-hole.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 3, 2014
    Applicant: HITACHI METALS, LTD.
    Inventor: Masaaki IMAHORI
  • Publication number: 20140174812
    Abstract: A method of reducing crosstalk. The method may include forming a first contact over a first vertical conductor. The method may include forming a second contact over a second vertical conductor. The method may include forming a third contact over a third vertical conductor. The method may include forming a capacitive coupler between the first contact, the second contact, and the third contact, wherein the capacitive coupler is to cancel crosstalk received at the second vertical conductor and third vertical conductor from the first vertical conductor.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Inventors: Raul Enriquez Shibayama, Kai Xiao, Nicte A. Zavala Castro, Mauro Lai, Yanjie Zhu
  • Patent number: 8748754
    Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: June 10, 2014
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, Donald Paul Cunningham
  • Patent number: 8728959
    Abstract: The present invention relates to a textile digital band which is capable of providing a high-speed communication path with surrounding computing devices, through easy and convenient attachment thereof to a conventional garment, and a fabrication method thereof. For this purpose, disclosed herein is a textile digital band comprising a plurality of warps formed parallel to each other in the first direction, and a plurality of wefts formed parallel to each other in the second direction perpendicular to the first direction, wherein the warp includes at least one digital yarn through which electrical currents can flow.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: May 20, 2014
    Assignee: Korea Institute of Industrial Technology
    Inventors: Gi Soo Chung, Dae Hoon Lee, Jae Sang An
  • Publication number: 20140124258
    Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 8, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Dong Hwan Lee, Jin Gu Kim, Chang Bae Lee, Christian Romero
  • Publication number: 20140124257
    Abstract: Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.
    Type: Application
    Filed: March 6, 2012
    Publication date: May 8, 2014
    Applicant: Nippon Mektron, Ltd.
    Inventors: Hidekazu Yoshihara, Akihiko Matsumaru, Taisuke Kimura, Atsushi Kajiya
  • Patent number: 8717778
    Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: May 6, 2014
    Assignee: Fujitsu Limited
    Inventors: Tadanori Tachikawa, Masuo Ohnishi
  • Patent number: 8691393
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: April 8, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, Jr.
  • Publication number: 20140090883
    Abstract: The disclosure generally relates to nested shielded ribbon cables that form an electrical cable assembly (200). The electrical cable assembly (200) includes features that can facilitate bending and movement of the cable.
    Type: Application
    Filed: May 31, 2012
    Publication date: April 3, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Douglas B. Gundel
  • Patent number: 8681507
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: March 25, 2014
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Publication number: 20140070763
    Abstract: A shielding arrangement for preventing AM radio interference when a wireless charger is used in a vehicle has a plurality of parallel conductors arranged at a distance from one another responsive to a frequency desired to be attenuated. An interconnection arrangement includes a solid conductive junction and connects the conductors to one another without forming loops, and to ground. The conductors are traces disposed on a PCB. Additional parallel conducts are disposed on the other side of the PCB at an orthogonal orientation with respect to the first conductors. The spacing between the conductors is determined in response to the frequency desired to be attenuated, as well as frequencies thereabove that are desired to be propagated therethrough, such as mobile telephone signals. The solid conductive junction that is disposed on the printed circuit board is electrically and thermally conductive, such as copper.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 13, 2014
    Applicant: VISTEON GLOBAL TECHNOLOGIES, INC
    Inventors: Karen Lee Chiles, John Robert Balint, III, Kevin Grady, Oola Greenwald, Gary O'Brien
  • Publication number: 20140071635
    Abstract: This is directed to systems and methods for shielding circuitry from interference with a shield assembly. In some embodiments, a shield assembly may include a shield fence having a fence body, at least one fence finger extending from the bottom of the fence body for coupling to a circuit board, and a tab extending from the fence body. The tab is configured to be removed from the shield fence after the shield fence is coupled to the circuit board.
    Type: Application
    Filed: September 10, 2012
    Publication date: March 13, 2014
    Applicant: APPLE INC.
    Inventors: Christopher M. Werner, Jared Mitchell Kole
  • Patent number: 8670236
    Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: March 11, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: David Szczesny, Michael Eugene Shirk
  • Patent number: 8669483
    Abstract: A flexible cable is provided in which a transmission characteristic can be ensured in a high frequency band, and electromagnetic noises can be suppressed. A flexible cable 11 includes a sheet-like base member (dielectric substance) 1; an adhesive (dielectric substance) 2 which bonds the base member 1 to a cover member (dielectric substance) 3; a shield member 4 which covers the cover member 3 and is bonded or printed to the cover member 3 to suppress electromagnetic noises to be radiated; and a top coating member 5 which covers the shield member 4 to protect the shield member 4.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: March 11, 2014
    Assignee: Panasonic Corporation
    Inventors: Takuma Shimura, Takashi Akita, Osamu Shibata
  • Publication number: 20140060913
    Abstract: A cable includes a jacket surrounding a cable core. The cable core includes four twisted pairs. An S-shaped separator separates two of the twisted pairs from the other two twisted pairs. The S-Shaped separator may be formed with two layers or three layers, wherein at least one layer is conductive. In alternative embodiments, one or both ends of the S-shaped separator make electrical contact to mid-portions of the separator to create one or two shielding cambers within the cable.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 6, 2014
    Inventors: Wayne Hopkinson, Trent Hayes, Daniel Parke, Douglas Brake, David Wiebelhaus
  • Publication number: 20140054081
    Abstract: A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film on the electromagnetic-shielding conductive film (A); and (C) a wiring-pattern-equipped film on the insulator film (B), the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.
    Type: Application
    Filed: April 26, 2012
    Publication date: February 27, 2014
    Applicant: KANEKA CORPORATION
    Inventors: Masayoshi Kido, Yoshihide Sekito