Shielded Patents (Class 174/350)
  • Patent number: 8657066
    Abstract: A noise dampening enclosure includes a first insulating layer, a second insulating layer, a carbon material layer disposed between the first and second insulating layers, a metal shield layer disposed between the first and second insulating layers, and a third insulating layer disposed between the carbon material layer and the metal shield layer. The carbon material layer can include resin-impregnated woven carbon fiber fabric. Strands of the carbon material can be orientated in various configurations, including layering the strands at different angles. Noise dampening bulkhead material provides additional shielding between circuit boards or other electronic components contained within the enclosure. In addition, a noise dampening boot can be placed over cable connections and assemblies to decrease the influences of unwanted electromagnetic noise.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: February 25, 2014
    Assignee: Tangitek, LLC
    Inventors: Robert L. Doneker, Kent G. R. Thompson
  • Patent number: 8641928
    Abstract: An exemplary embodiment of a method of making an electromagnetic interference (EMI) absorber includes stretching a material that includes EMI absorbing particles along at least a first axis to align at least some EMI absorbing particles.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: February 4, 2014
    Assignee: Laird Technologies, Inc.
    Inventor: Douglas S. McBain
  • Publication number: 20140014406
    Abstract: Various high speed shielded cables are used in combination with a connector assembly. The connector assembly includes a plurality of electrical terminations in electrical contact with the conductor sets of the cable at a first end of the cable, the electrical terminations configured to make electrical contact with corresponding mating electrical terminations of a mating connector and at least one housing configured to retain the plurality of electrical terminations in a planar, spaced apart configuration.
    Type: Application
    Filed: September 5, 2013
    Publication date: January 16, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Douglas B. Gundel, William V. Ballard, Alexander W. Barr, Joseph N. Castiglione, William J. Lee, Mark M. Lettang, Jesse A. Mann, Richard J. Scherer, Charles F. Staley
  • Publication number: 20140014405
    Abstract: The present invention provides a device for suppressing common-mode radiation comprising: at least one resonator embedded into a plate, wherein the at least one resonator defines a plane having a normal direction parallel and perpendicular, respectively, to a longitudinal direction and a thickness direction of the plate. The embedment of the resonator into the plate enables a magnetic field, which is generated by a cable conductor when the device for suppressing common-mode radiation wraps the cable conductor therein, to perpendicularly pass through the plane so that the magnetic field and the resonator resonate together to generate a strong diamagnetism and thereby to suppress the common-mode radiation.
    Type: Application
    Filed: September 6, 2012
    Publication date: January 16, 2014
    Applicant: National Taiwan University
    Inventors: Tzong-Lin Wu, Chung-Hao Tsai, Hui-Ling Ting
  • Publication number: 20130335275
    Abstract: An electronic device may be provided with a conductive housing. An antenna window structure may be formed in an opening in the housing. The antenna window structure may have an antenna support structure that is attached to the conductive housing and that supports antenna structures. An antenna window cap may be mounted in the opening and attached to the antenna support structure with liquid adhesive. Alignment structures may be provided in the antenna support structure. An antenna support plate with mating alignment structures may be used in attaching the antenna structures to the antenna support structures. Metal shielding structures may be used to provide electromagnetic shielding. A shielding wall may be formed from a sheet metal structure supported by a plastic support structure. A flexible metal shielding foil layer may be welded to the shielding wall using a sacrificial plate.
    Type: Application
    Filed: June 15, 2012
    Publication date: December 19, 2013
    Inventors: Emery A. Sanford, Qingxiang Li, Lijun Zhang, Anthony S. Montevirgen, Teodor Dabov, Erik G.P. de Jong, Wey-Jiun Lin
  • Publication number: 20130333936
    Abstract: A shielded electrical cable includes one or more conductor sets extending along a length of the cable and being spaced apart from each other along a width of the cable. Each conductor set has one or more conductors having a size no greater than 24 AWG and each conductor set has an insertion loss of less than about ?20 dB/meter over a frequency range of 0 to 20 GHz. First and second shielding films are disposed on opposite sides of the cable, the first and second films including cover portions and pinched portions arranged such that, in transverse cross section, the cover portions of the first and second films in combination substantially surround each conductor set, and the pinched portions of the first and second films in combination form pinched portions of the cable on each side of each conductor.
    Type: Application
    Filed: August 16, 2013
    Publication date: December 19, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Douglas B. Gundel
  • Patent number: 8567459
    Abstract: An electromagnetic shielding carrying case comprising a front panel hingedly connected to a middle and rear panel. The front and middle panels each comprise an electromagnetic shielding member with a card holding means affixed to each. The carrying case has a closed position wherein upstanding walls of the front and rear panels are brought into engagement with one another so as to form an enclosure around the middle panel, thus shielding contactless smartcards contained within from being scanned by an RFID reader. A releasable locking means holds the front panel closed against the rear panel, and can be unlocked so the front panel pivots open, creating a first open position wherein contactless smartcards can be accessed in both card holding means. The middle panel can also be pivoted open to reveal a receptacle within the rear shell that holds paper currency or one additional card.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: October 29, 2013
    Inventor: Michael William Kitchen
  • Publication number: 20130269997
    Abstract: A wire defining a repeating pattern is removably joined to a flange having apertures defined therein. The wire includes contact portions to make electrically-conductive contact with a device supported by a chassis. The device can be cooled by air flow through the apertures of the flange while being protected against electromagnetic interference (EMI). The wire and the flange can be respectively formed from various metals and are separable from each other for recycling or other purposes.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 17, 2013
    Inventors: Glenn C. Simon, David G. Rohrer, David L. Mallery
  • Publication number: 20130257366
    Abstract: A comb-structured shielding layer and a wireless charging transmitter thereof are provided. The wireless charging module is connected to a power source, has at least one wireless charging coil and at least one comb-structured shielding layer, and is configured to convert alternative current power from the power source to H-field electromagnetic radiations, and wirelessly charges an electronic device. The comb-structured shielding layer is disposed between the wireless charging module and the target electronic device and configured to allow the H-field electromagnetic radiations pass through. The comb-structured shielding layer includes a first area and a second area. The first area is electrically connected to a reference electric potential. The second area is electrically connected to the reference electric potential through the first area, and is configured to shield the E-field electromagnetic radiations but allow the H-field electromagnetic radiations pass through the comb-structured shielding layer.
    Type: Application
    Filed: November 27, 2012
    Publication date: October 3, 2013
    Inventors: Frank Scholz, Stefan Graf, Andre Waldschmidt, Lars Lindenstruth, Marco Jung
  • Publication number: 20130248239
    Abstract: Provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electro-conductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that, for at least 30% of the entire surface area of the transparent substrate, when a straight line is drawn intersecting the electroconductive pattern, the ratio of the standard deviation to the mean value of the distances between adjacent points of intersection between the straight line and the electroconductive pattern (the distance distribution ratio) is at least 2%.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 26, 2013
    Applicant: LG CHEM, LTD.
    Inventors: Dong-Wook LEE, In-Seok HWANG, Sang-Ki CHUN, Ji-Young HWANG, Hyeon CHOI, Young-Jun HONG, Su-Jin KIM, Ki-Hwan KIM
  • Patent number: 8537568
    Abstract: An electronic device includes a housing, a fixed frame, a plurality of conductive foam pieces, and a display panel. The fixed frame is assembled and received within the housing. The fixed frame defines a plurality of fixing grooves adjacent to a periphery of the fixed frame. The conductive foam pieces are assembled within the fixing grooves of the fixed frame, respectively, and are coplanar with the fixed frame. The display panel is flatly mounted on the fixed frame and received within the housing together with the fixed frame. The periphery of the display panel tightly contacts with the conductive foam pieces.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: September 17, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Zi-Ming Tang
  • Patent number: 8520880
    Abstract: A boundary microphone is provided to effectively reduce noises caused by external electromagnetic waves by providing electrostatic shielding, including on the portion of lead wires from a microphone unit to a circuit board. The boundary microphone has a base plate, a cover, a circuit board, and a microphone unit mounted in the opening with a metallic holder. A shield pattern for electrostatically shielding inside of the recess with the base plate is formed on the circuit board. The holder is configured to include a cylindrical section into which a rear end side of the microphone unit is fitted, and a D-cut section in which a part of a circumferential surface and a base surface of a cylinder with a base integral with the cylindrical section are cut away in parallel to a board surface of the circuit board, and the lead wire is routed within the D-cut section.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: August 27, 2013
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 8513540
    Abstract: A shielding assembly comprises a pair of covers. Each cover comprises a body, an overlapping portion, and a plurality of sidewalls. The body comprises a first engaging portion, a second engaging portion and a slot defined at one end of the second engaging portion neighboring to the first engaging portion. The overlapping portion comprises a joint portion extending from the first engaging portion, a extending portion extending from the joint portion and parallel to the body, and a latching portion shaped on one end of the extending portion neighboring to the second engaging portion. The extending portion of one of the covers overlaps the second engaging portion of another one of the covers, and the latching portion of one of the covers is latched in the slot in another one of the covers.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: August 20, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chang-Ming Kuan
  • Patent number: 8507808
    Abstract: A shielding assembly includes a frame including a main body, the main body defining at least one retaining hole; and a cover including a main board, the main panel including retaining elements and rims. The number of the retaining elements is the same as the number of the retaining holes, each rim protruding outwardly from a distal end of one of retaining elements. Each retaining element passes through one of the retaining holes, and each rim is latched with the portions of the frame surrounding the retaining holes.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: August 13, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Li-Zhi Xiong, Liang Su, Wen-Jun Liu, Cheng-Rui Liu, Jun-Sheng Qiao, Pei-Chin Kuo
  • Publication number: 20130201643
    Abstract: An electronics card comprising a stack of printed circuit layers, each comprising an electrically insulating support having at least one conductive track extending thereon, and two electromagnetic shields extending respectively over a top face and over a bottom face of the stack, each shield comprising a grid and a plate that are superposed and electrically conductive, each extending over an electrically insulating support, and the conductive tracks being obtained by solid copper type etching. The invention also provides a device including such a card, and a method of protecting such a card of such a device against a lightning strike and against electromagnetic radiation.
    Type: Application
    Filed: October 19, 2011
    Publication date: August 8, 2013
    Applicant: SAGEM DEFENSE SECURITE
    Inventors: Jérôme Pierson, Philippe Elie
  • Publication number: 20130194772
    Abstract: Protective containers for electronic equipment, and methods of testing, use, and/or manufacture thereof, are provided. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.
    Type: Application
    Filed: February 22, 2013
    Publication date: August 1, 2013
    Applicant: CENTURYLINK INTELLECTUAL PROPERTY LLC
    Inventor: CENTURYLINK INTELLECTUAL PROPERTY LLC
  • Publication number: 20130192888
    Abstract: A device for absorption of electrical noise on lines contains a housing which is formed from two half-shells, which are connected to one another with the aid of a film hinge and, in the area of their opposite edges, have a locking device, which locks the two half-shells. A ferrite element is held in each half-shell. An aperture or a window is formed in the wall of one half-shell, through which the locking device can be seen, which locking device acts per se in a depression within the wall. Through this aperture it is possible to check and to inspect whether two elements which form the locking device are correctly seated.
    Type: Application
    Filed: October 13, 2011
    Publication date: August 1, 2013
    Inventor: Oliver Konz
  • Patent number: 8495815
    Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: July 30, 2013
    Assignee: Sony Mobile Communications, Inc.
    Inventors: Koichi Izawa, Yumi Ogura
  • Publication number: 20130175087
    Abstract: There is provided a wiring structure of wire harness capable of reducing an influence due to the swing and heat even in the case where the wire harness is subjected to the countermeasure against electromagnetic shield, and a shielding cover used for the wiring structure. In the wiring structure, a conducting path of a harness body of the wire harness and a conductive shielding cover that covers the wire harness are partly put into at least one of a contact state and a holding state directly or indirectly.
    Type: Application
    Filed: September 16, 2011
    Publication date: July 11, 2013
    Applicant: YAZAKI CORPORATION
    Inventors: Hideomi Adachi, Hidehiko Kuboshima
  • Publication number: 20130175079
    Abstract: A shield member capable of preventing the break of a metallic foil due to the bend of the metallic foil and bringing the shielding capability is provided. The shield member includes a metallic foil formed in a tubular shape, to be provided for covering and surrounding one or more conducting paths. At least one of a wrinkled part and an axially-uneven part is formed in the metallic foil at least in correspondence with a bent position of the one or more conducting paths. At least one of the wrinkled part and the axially-uneven part is formed over one loop of the metallic foil.
    Type: Application
    Filed: September 16, 2011
    Publication date: July 11, 2013
    Applicant: YAZAKI CORPORATION
    Inventors: Hideomi Adachi, Hidehiko Kuboshima
  • Publication number: 20130175081
    Abstract: A differential signal transmission cable includes a pair of differential signal lines arranged in parallel to each other, an insulation for bundle-covering the pair of differential signal lines, and a shield conductor wound around an outer periphery of the insulation The insulation is configured such that an outer circumference thereof in a cross section perpendicular to a longitudinal direction thereof has an oval shape formed with a continuous convex arc-curve The oval shape has a width in a first direction along the arrangement direction of the pair of differential signal lines being larger than a width in a second direction orthogonal to the first direction
    Type: Application
    Filed: July 16, 2012
    Publication date: July 11, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Haruyuki WATANABE, Takahiro SUGIYAMA, Akinari NAKAYAMA, Masafumi KAGA, Sohei KODAMA
  • Publication number: 20130176693
    Abstract: A display circuit board is provided with at least one section being configured as flexible circuit board, wherein the at least one flexible section of the display circuit board has at least one electrode being coupleable with a capacitive sensor device. Furthermore, a display module is provided with a display and a display circuit board. In addition, a method for the production of a display module is provided, wherein the display circuit board is inserted in a module housing together with the display in such a way that the flexible section is at least partially arranged between a side wall of the display and a side wall of the module housing. Finally, an electrical hand-held device, such as a cell phone or the like, is provided with a display module.
    Type: Application
    Filed: May 4, 2011
    Publication date: July 11, 2013
    Inventor: Andreas Güte
  • Publication number: 20130168149
    Abstract: A shielded electrical cable (2202) includes a plurality of conductor sets (2204a, 2204b) that extend along the length of the cable and are spaced apart from each other along the width of the cable. Each conductor set (2204a, 2204b) includes one or more insulated conductors (2206a, 2206b), and first and second shielding films (2208) that are disposed on opposite first and second sides of the cable. The first and second films (2208) include cover portions (2207) and pinched portions (2209). The cable (2202) also includes an EMI absorbine layer (2250). The maximum separation between the first cover portions of the first and second shielding films is D. The minimum separation between the first pinched portions (2209) of the first and second shielding films (2208) is d1. d1/D is less then 0.25. The minimum separation between the first cover portion (2207) of the first and second shielding films (2208) in a region between the first and second insulated conductors (2206a, 2206b) is d2. d2/D is greater than 0.33.
    Type: Application
    Filed: December 16, 2010
    Publication date: July 4, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Douglas B. Gundel
  • Publication number: 20130163192
    Abstract: Systems are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.
    Type: Application
    Filed: June 26, 2012
    Publication date: June 27, 2013
    Applicant: Bloom Energy Corporation
    Inventors: Arne Ballantine, KR Sridhar, Jon Christopher Motta, Peter Light, Carl Cottuli, Jessica Mahler
  • Patent number: 8470123
    Abstract: A pressure sensitive adhesive for sticking together an electromagnetic wave-shielding film and optically functional film, wherein a storage elastic modulus at 70° C. is 7.00×104 Pa or more; and a display panel filter element comprising (1) an electromagnetic wave-shielding film, the film being a laminate of a transparent substrate film, an adhesive for a metal foil, which is applied on one surface of the transparent substrate film, and a metal foil mesh formed on the adhesive for a metal foil, (2) a layer of the pressure sensitive adhesive according to (1), which is applied so as to cover the metal foil mesh of the electromagnetic wave-shielding film, and (3) an optically functional film provided on the pressure sensitive adhesive, are provided. The pressure sensitive adhesive exhibits sufficient adhesive strength, can be filled into the inside of the pores of the metal foil mesh, and does not generate bubbles in a heating treatment.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: June 25, 2013
    Assignee: Lintec Corporation
    Inventors: Tadashi Matano, Shin Koizumi, Mikihiro Kashio
  • Publication number: 20130154411
    Abstract: An electromagnetic compatibility (EMC) shielding printed circuit board (PCB) has at least a routing layer and a ground layer. The shielding PCB has an opening that receives a motor bushing and at least one opening that receives motor terminals.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
    Inventors: Nicholas Lee Mawhinney, Andrew Malcolm Haig, Michael Zaitz
  • Publication number: 20130153283
    Abstract: A plurality of linear conductors arranged in parallel with each other are covered from the upper and lower sides thereof by first and second insulator layers. On the upper side of the first insulator layer, a first adjustment material layer is formed with forming a predetermined gap relative to an end of the flat cable. And, at this gap, a reinforcement plate is provided. A shield member is provided for covering the upper side of the reinforcement plate and a portion of the upper side of the first adjustment material layer. From the upper side of the shield member to the upper side of the first adjustment material layer, a first shield layer is provided in such a manner to expose the upper side of the portion of the shield member where the reinforcement plate is present. A second insulator layer is configured to expose the conductors at the end of the flat cable. The shield member includes an impedance adjusting arrangement.
    Type: Application
    Filed: September 27, 2012
    Publication date: June 20, 2013
    Applicant: Hosiden Corporation
    Inventor: Hosiden Corporation
  • Patent number: 8461667
    Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: June 11, 2013
    Assignee: Sumitomo Electric Device Innovations, Inc.
    Inventors: Takeshi Hishida, Tsutomu Igarashi
  • Publication number: 20130133941
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Application
    Filed: January 22, 2013
    Publication date: May 30, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, JR.
  • Publication number: 20130133940
    Abstract: A system in package module and a method of fabricating the system in package module are disclosed. A substrate is provided, including circuit layers, solder pads and dielectric layers. Cutting lines are formed on the substrate. Grounded buried vias are formed in at least one dielectric layer and the circuit layers adjacent to the dielectric layer corresponding to the cutting lines. Electronic elements are disposed on the substrate. An encapsulant is formed on the substrate to encapsulate the electronic elements. The substrate is cut along the cutting lines to expose the grounded buried via. A shielding layer is formed enclosing the encapsulant and sidewalls of the substrate to obtain the system in package module. Therefore, the interference of electromagnetic radiation is diminished and less spaces on the top and bottom of the substrate are occupied.
    Type: Application
    Filed: January 5, 2012
    Publication date: May 30, 2013
    Applicants: ASKEY COMPUTER CORPORATION, ASKEY TECHNOLOGY (JIANGSU) LTD.
    Inventors: Chi-Sheng Chen, Ching-Feng Hsieh
  • Publication number: 20130126227
    Abstract: Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate (1) includes a multilayered wiring layer, a structure (8) of a conductor, and an electromagnetic wave absorber (5). An electronic component (2) which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (1). The electronic component (2) has a high-frequency circuit. The structure (8) is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component (2) in plan view with an opening (4) in the enclosure. The electromagnetic wave absorber (5) is arranged so as to cover the opening (4).
    Type: Application
    Filed: July 7, 2011
    Publication date: May 23, 2013
    Inventor: Hisashi Ishida
  • Publication number: 20130118795
    Abstract: A method and apparatus is provided for reducing interference in circuits. A management strategy is provided to reduce reference spurs and interference in circuits. The management strategy uses a combination of one or more techniques which reduce the digital current, minimize mutual inductance, utilize field cancellation, prevent leakage current, and/or manage impedance. These techniques may be used alone, or preferably, used on combination with one another.
    Type: Application
    Filed: December 31, 2012
    Publication date: May 16, 2013
    Applicant: SILICON LABORATORIES INC.
    Inventor: SILICON LABORATORIES INC.
  • Publication number: 20130112473
    Abstract: A shield member includes a metal foil layer and a base layer which have flexibility and are sheet-like or band-like, a bonding layer which bonds the metal foil layer and the base layer, and a cylindrical portion and an overlapping portion which are made by winding and folding the metal foil layer and the base layer so that the metal foil layer is on an inside. The overlapping portion is in a state of being brought down and arranged along the cylindrical portion.
    Type: Application
    Filed: July 14, 2011
    Publication date: May 9, 2013
    Applicant: YAZAKI CORPORATION
    Inventors: Eiichi Toyama, Shigemi Hashizawa
  • Publication number: 20130112472
    Abstract: A method and apparatus is provided for reducing interference in circuits. A management strategy is provided to reduce reference spurs and interference in circuits. The management strategy uses a combination of one or more techniques which reduce the digital current, minimize mutual inductance, utilize field cancellation, prevent leakage current, and/or manage impedance. These techniques may be used alone, or preferably, used on combination with one another.
    Type: Application
    Filed: December 30, 2012
    Publication date: May 9, 2013
    Applicant: SILICON LABORATORIES INC.
    Inventor: Silicon Laboratories Inc.
  • Publication number: 20130105215
    Abstract: An electromagnetic shielded sleeve containing a multilayer composite material formed in such a way as to define at least one longitudinal channel configured to enclose and carry a cable. The multilayer composite material contains a first textile, an electromagnetic shielding material, and a second textile, where the electromagnetic shielding material is located between the first textile and the second textile.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 2, 2013
    Inventors: David Drew Morris, Cheryl J. Brickey
  • Patent number: 8432706
    Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: April 30, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Chang-Sup Ryu
  • Publication number: 20130098672
    Abstract: A safety net system for blocking electromagnetic field (EMF) exposure from electronic devices is provided. The safety net system comprises a hair net for covering at least a portion of a head and a body net having a back portion for covering an upper back and shoulders, a first front portion for covering a right breast, and a second front portion covering a left breast. A first anti-EMF chip is mounted to the hair net, a second anti-EMF chip is mounted to the back portion, a third anti-EMF chip is mounted to the first front portion, and a fourth anti-EMF chip mounted to the second front portion. Upon positioning the hair net over the at least a portion of the head and upon draping the body net over the shoulders thereby covering the upper back and breasts, the anti-EMF chips block and shield EMF radiation from reaching the body part.
    Type: Application
    Filed: August 15, 2012
    Publication date: April 25, 2013
    Inventor: Norma Francois
  • Publication number: 20130099589
    Abstract: Disclosed are a shielding apparatus and a wireless power transmission apparatus. The shielding apparatus included in a wireless power transmission apparatus for transmitting power to a wireless power reception apparatus in wireless includes a first shielding unit changing a transmission path of a portion of a magnetic field generated from a transmission coil of the wireless power transmission apparatus, and a second shielding unit shielding the portion of the magnetic field which has passed through the first shielding unit. The second shielding unit is placed on the first shielding unit. A real component value of permeability of the first shielding unit is greater than an imaginary component value of the permeability of the first shielding unit, and an imaginary component value of permeability of the second shielding unit is greater than a real component value of the permeability of the second shielding unit.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 25, 2013
    Applicant: LG INNOTEK CO., LTD.
    Inventor: LG INNOTEK CO., LTD.
  • Publication number: 20130092430
    Abstract: A magnetically shielded cable arrangement, comprising at least two AC cables (201-203) comprising a spaced portion extending between two close portions of parallel cables, such spaced portion sequentially including a diverging portion, a widely spaced portion and a converging portion, and an EMF shielding system (1) laid over said at least two AC cables (201-203), said EMF shielding system (1) comprising a conductor (2, 3, 11, 12) having two branches (2, 3) forming a median portion (4, 5) and end portions (7-10), the median portion width being equal to or larger than the AC cables distance in the widely spaced portion and the width at the extremities of the end portions (7-10) being larger than the AC cables distance in the close portions and smaller than the AC cables distance in the widely spaced portion, said conductor (2, 3, 11, 12) comprising an inner electrical path (2a, 3a) and an outer electrical path (2e, 3e) connected together (11, 12) at relevant longitudinal ends.
    Type: Application
    Filed: April 23, 2010
    Publication date: April 18, 2013
    Applicant: PRYSMIAN S.P.A.
    Inventor: Paolo Maioli
  • Patent number: 8422234
    Abstract: A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: April 16, 2013
    Assignee: Sierra Wireless
    Inventors: Jacques Goriaux, Alain Bironneau, Jean-Pierre Mauclerc
  • Publication number: 20130077095
    Abstract: Present embodiments include a bandage sensor having an electrically conductive adhesive transfer tape layer as a Faraday shield. The electrically conductive transfer tape layer may be used in lieu of a fully metallic Faraday shield. The present embodiments also include a sensor cable having one or more conductive polymer EMI/RFI shields in place of a fully metallic EMI/RFI shield. Methods for manufacturing and remanufacturing such sensors and cables are also disclosed.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 28, 2013
    Applicant: Nellcor Puritan Bennett LLC
    Inventor: David P. Besko
  • Publication number: 20130068518
    Abstract: Provided are a braided shield member, a manufacturing method of a braided shield member and a wire harness which make it possible to demonstrate shielding performance sufficiently. The braided shield member constituting the wire harness includes a tubular body part and a tubular terminal part. The braided shield member is formed so that the terminal part is formed in a two-folded structure of an outside terminal part and an inside terminal part. Further, the braided shield member is formed so that metal wires are in a loose state inside stitches of the outside terminal part.
    Type: Application
    Filed: May 31, 2011
    Publication date: March 21, 2013
    Applicant: YAZAKI CORPORATION
    Inventors: Takashi Kato, Hidehiro Ichikawa
  • Patent number: 8399764
    Abstract: A water resistant case is provided for a mobile electronic device. The case includes a buoyancy feature, and is sized and configured so that the case is buoyant in water when containing the mobile electronic device. A closure portion of the case is movable between an extended position for receiving the mobile electronic device, to a folded position when the case contains the mobile electronic device. In the folded position the closure portion is provided adjacent to the rest of the case. The configuration of the case is such that the case can be relatively form fitting to the mobile electronic device.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: March 19, 2013
    Inventor: Justin Klosky
  • Publication number: 20130056258
    Abstract: The invention provides an electromagnetic shielding adhesive tape, comprising: a resin film layer; and an electromagnetic interference shielding layer with a sandwiched structure, which is laminated with the resin film layer and comprises: a first adhesive layer bonded to one side of the resin film layer; a second adhesive layer; and a conductive metal layer provided between the first adhesive layer and the second adhesive layer.
    Type: Application
    Filed: May 10, 2011
    Publication date: March 7, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Wen Jie Zhang, Rong Wu
  • Patent number: 8390994
    Abstract: In an electronic apparatus, a flexible wiring board is connected with a display unit and a cutout portion is formed at a part of a rear cover adjacent to the wiring board. A grip member is fixed on the rear cover so as to cover the cutout portion. A discharge member is electrically connected with the rear cover and provided at the cutout portion exposing its surface.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: March 5, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventor: Teruaki Ikezawa
  • Publication number: 20130048368
    Abstract: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
    Type: Application
    Filed: February 10, 2012
    Publication date: February 28, 2013
    Applicant: Apple Inc.
    Inventors: Shayan Malek, Benjamin John Pope, Daniel William Jarvis, Tang Tan, Richard Hung Minh Dinh, Robert Steinfeld, Ramachandran Chundru
  • Publication number: 20130048366
    Abstract: Disclosed is a split conduit for separating line and low voltage wiring, wherein two wire or cable types are supported and do not interfere with one another along the conduit length. The conduit comprises a rounded outer wall forming an enclosed cross section, wherein a partition is provided within the interior of the conduit that runs along its length to create a first and second pathway. The outer surface of the conduit is discretely marked based on line or low voltage, allowing a user to distinguish what wire type is in each pathway and to locate the partition without inspecting the wires or looking into the interior of the conduit. The split conduit is adapted to be connected to a split meter socket box having a divider for separating connection types, wherein wires from corresponding conduit chambers can be oriented appropriately to establish electrical connectivity within the meter box.
    Type: Application
    Filed: August 27, 2012
    Publication date: February 28, 2013
    Inventor: Ryan O'Neil
  • Publication number: 20130048365
    Abstract: An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on one surface thereof; and a second area placed on a lateral side of the first area and having unit structures arranged repeatedly therein, the unit structures configured for inhibiting EMI noise from being radiated to an outside through the lateral side of the first area. The unit structure can include: a top conductive plate and a bottom conductive plate, formed, respectively, on the top layer and the bottom layer of the second area to face each other in a pair; and a via, connecting the top conductive plate with the bottom conductive plate.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 28, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han KIM, Dae-Hyun PARK, Young-Min Ban
  • Publication number: 20130033821
    Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.
    Type: Application
    Filed: August 3, 2011
    Publication date: February 7, 2013
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: David Szczesny, Michael Eugene Shirk
  • Publication number: 20130020122
    Abstract: A cable bundling structure is provided for being set in slidable engagement with a target cable. The cable bundling structure includes a helical wrap member, which wraps around a wrapped section of the target cable. The helical wrap member is selectively composed of one or more sections of wrapping turns and each section is made in a one-piece form having a predetermined wrap width, a predetermined helix angle, and a predetermined wrap diameter and extending a predetermined length in a wrapping direction. The helical wrap member helically wraps around the target cable in such a way that the helical wrap member is in slidable engagement with the target cable and serves as an external protection for the cable.
    Type: Application
    Filed: September 28, 2012
    Publication date: January 24, 2013
    Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
    Inventor: ADVANCED FLEXIBLE CIRCUITS CO., LTD.