Abstract: An electromagnetic shield includes a base layer, a wire mesh, and two ground wires. The wire mesh is embedded in the base layer, and includes a number of first wires and a number of second wires intersecting with the first wires to form a number of cells. The first and second wires are made of conductive material. The ground wires are respectively arranged on two opposite sides of the wire mesh and connected to the first and second wires.

Abstract: Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.

Abstract: A method of preventing EMI for a fastening hole in a circuit board includes the steps of providing a circuit board which includes a plurality of fastening holes extending through opposite first and second surfaces thereof and a plurality of solder pads disposed on the second surface, each fastening hole being surrounded by the solder pads; disposing an electronic component on the first surface; positioning the circuit board on a fixture such that the solder pads are not covered by the fixture; and wave soldering the circuit board so that the electronic component is fixed to the circuit board and the solder pads are attached with solder materials.

Abstract: A pressure sensitive adhesive for sticking together an electromagnetic wave-shielding film and optically functional film, wherein a storage elastic modulus at 70° C. is 7.00×104 Pa or more; and a display panel filter element comprising (1) an electromagnetic wave-shielding film, the film being a laminate of a transparent substrate film, an adhesive for a metal foil, which is applied on one surface of the transparent substrate film, and a metal foil mesh formed on the adhesive for a metal foil, (2) a layer of the pressure sensitive adhesive according to (1), which is applied so as to cover the metal foil mesh of the electromagnetic wave-shielding film, and (3) an optically functional film provided on the pressure sensitive adhesive, are provided. The pressure sensitive adhesive exhibits sufficient adhesive strength, can be filled into the inside of the pores of the metal foil mesh, and does not generate bubbles in a heating treatment.

Abstract: The invention relates to a contact means (100) for attaching an end of a cable (110). The contact means (100) has a casing (300) with an inner chamber (320) for receiving a section of the cable (110) in the region of the cable end, and a pull relief element (200, 201, 202, 203) which can be fastened to the casing (300) in the inner chamber (320), with a pull relief section (220, 221, 222, 223) and at least one contacting section (240, 241). The pull relief section (220, 221, 222, 223) is formed to fix a cable sheath (120) of the cable (110). The contacting section (240, 241) is formed to contact a shield (130) of the cable (110).

Abstract: The present invention provides a magnetic composite capable of enhancing the effect of shielding against electromagnetic noise and the like (magnetic shielding effect) while inhibiting a possible eddy current, and a method for producing the magnetic composite, and a shielding structure comprising the magnetic composite. A shielding member 10 as a magnetic composite contains a resin 12 which is an insulator and serves as a matrix material and into which fine powders of an amorphous metal magnetic substance 10a containing Fe, Si, and B are mixed. In the shielding member 10, a plurality of the amorphous metal magnetic substances 10a are contained in the resin 12 at a volume fraction less than a percolation threshold. The type of the amorphous metal magnetic substance 10a is not particularly limited provided that the amorphous metal contains Fe, Si, and B.

Abstract: Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh, where each conductive member of a cell is separated from conductive members of adjacent cells by a gap and a cavity is defined in the non-conductive substrate at a location of each gap.

Abstract: A printed circuit board includes signal layers, ground layers, and a power layer, which are superposed. A closed trace is set along edges of each of the signal layers and the power layers. A number of vias are defined in each trace at intervals. Each via extends through the signal layers, the ground layers, and the power layer. Each via is electrically connected to the traces of the signal layers and the power layer, and electrically connected to the ground layers.

Abstract: Embodiments of the present disclosure provide for flexible graphene-coated pyrolytic carbon materials or structures, methods of making, methods of use, materials including the graphene-coated pyrolytic carbon material or structure, structures including the graphene-coated pyrolytic carbon material or structure, and the like.

Abstract: A shield conducting path of the present invention includes a plurality of electric wires which is formed by enclosing electric conductors with insulation coatings, and a metallic pipe which protects and shields the electric wires by inserting them therethrough. The pipe has a tube main body which has a tubular shape and through which the electric wires are inserted, and a partition wall which is extended from an inner wall of the tube main body and partitions an inner portion of the tube main body. The present invention is characterized in that the partition wall has a cross section of a curved shape or a bent shape when cut in a direction orthogonal to an axial direction of the tube main body.

Abstract: The invention describes an image reading device having a housing, a transparent panel, an image sensor, a carriage, and an electric cable. The housing has a first, second, and third surface. The transparent panel defines a portion of the first surface. The image sensor extends in a first direction, and is mounted to the carriage and optically reads a document through the transparent panel while the carriage reciprocates in a second direction. The electric cable is electrically connected to the image sensor, and includes a band surface portion having a band surface and extending in a third direction intersecting the first and second direction. The electric cable also has a first end portion attached to the carriage; and a second end portion attached to the second surface. At least a portion of the electric cable is twisted such that the band surface and the third surface are not parallel.

Abstract: An electrical ribbon cable includes at least one conductor set having at least two elongated conductors extending from end-to-end of the cable. Each of the conductors are encompassed along a length of the cable by respective first dielectrics. A first and second film extend from end-to-end of the cable and are disposed on opposite sides of the cable The conductors are fixably coupled to the first and second films such that a consistent spacing is maintained between the first dielectrics of the conductors of each conductor set along the length of the cable. A second dielectric disposed within the spacing between the first dielectrics of the wires of each conductor set.

Abstract: An apparatus for exposing a region of interest of an object, animal or person to an alternating magnetic field has a source of radio-frequency electromagnetic radiation arranged to provide the alternating magnetic field in an exposure volume defined by the apparatus, and a shield arranged between the source of radio-frequency electromagnetic radiation and the exposure volume. The shield includes a material that has a sufficient thickness and arrangement to reduce power deposition to at least regions outside of the region of interest of the object, animal or person during exposure in the exposure volume.

Abstract: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on the inside of the doors. The doors are connected, by one of the vertical sides thereof, to a frame of the control box in question by hinges in an articulated manner, and can be closed by a closing mechanism on the opposite vertical side. A first hinge section is fixed to a vertical section of the frame by a fixing section, and the door is mounted on an articulated section of the first hinge section in an articulated manner by a second hinge section applied thereto.

Abstract: A shield casing, which is configured to surround an electronic component mounted on a circuit board, includes a frame body including an engagement recess and a lid body including a hook unit configured to engage with the engagement recess. The lid body is fitted to the frame body to cover the frame body. The hook unit is elastically deformable in a second direction that is opposite to a first direction in which the lid body is fitted to the frame body as the lid body is fitted to the frame body, and then snaps into mating engagement in the engagement recess.

Abstract: A circuit board (100) includes a first shielding layer (20) extending horizontally, an accessorial shielding layer, a signal circuit layer (3) positioned between the first shielding layer and the accessorial shielding layer, and a circumferential shielding layer (6) surrounding the circuit board and electrically connecting with the first shielding layer and the accessorial shielding layer to improve shielding effect.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.

Abstract: A flexible conductive material includes an elastomer, a conductive agent filled in the elastomer, and an adsorbent fixed inside the elastomer and able to adsorb ionic material. With the flexible conductive material, ionized impurities are unlikely to transfer to an adherend such as a dielectric film. Thus, leakage current during application of voltage decreases. Accordingly, by forming an electrode and a wiring with the flexible conductive material, leakage current can be reduced, and a transducer and a flexible wiring board having excellent durability can be produced. In addition, using the flexible conductive material, an electromagnetic shield can be produced having a small leakage current.

Abstract: A wafer-level electromagnetic interference (EMI) shielding structure, which includes: a wafer, an exposed circuit unit, and an EMI shielding unit. The exposed circuit unit is disposed on the top surface of the wafer. At least one conductor is disposed on the exposed circuit unit. The EMI shielding unit has a first EMI shielding layer set around the surrounding surface of the wafer, and a second EMI shielding layer coated to the bottom surface of the wafer. Based on the wafer-level manufacturing process of the instant disclosure, the EMI shielding structure is miniaturized, and each individual wafer is protected against the EMI effect.

Abstract: An apparatus having a reduced reflection from its surface includes a dielectric material and a capacitive circuit analog sheet buried within the dielectric material and configured to produce a reflection that adds out of phase with a reflection from an incident side of the dielectric material. The capacitive circuit analog sheet comprises conductive patches configured to have high impedance for transverse magnetic (TM) polarization.

Abstract: An exemplary embodiment of a method of making an electromagnetic interference (EMI) absorber includes stretching a material that includes EMI absorbing particles along at least a first axis to align at least some EMI absorbing particles.

Abstract: A conductive chassis plate faces a printed circuit board at a distance. One end of the conductive chassis plate is aligned with one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a ground wiring pattern provided on one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a conductive member that extends from one end of the conductive chassis plate toward the other end. As a result, in transmitting or receiving a signal with respect to external equipment attached to a connector, an influence of electrostatic discharge is reduced with a simple configuration.

Abstract: An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Abstract: An metal housing comprising an electrical device includes electrical pins that protrude from the metal housing, and the metal housing formed with a compressible protrusion around the pins.

Abstract: A foam mount has a shape of an enclosed frame surrounding an open area, the frame in cross section having a peripheral surface; an inside surface opposite to the peripheral surface, the inside surface defining the open area. The inside surface includes a groove having an open end and the open end of the groove faces the open area of the foam mount. A coating is applied over selected surfaces of the foam mount, wherein the coating has a visible light transmission of less than 15%. Also disclosed is a method of coating an electric conductive coating over the visible light blocking coating and a decorative coating over selected surfaces of the foam mount.

Abstract: A shielding assembly comprises a pair of covers. Each cover comprises a body, an overlapping portion, and a plurality of sidewalls. The body comprises a first engaging portion, a second engaging portion and a slot defined at one end of the second engaging portion neighboring to the first engaging portion. The overlapping portion comprises a joint portion extending from the first engaging portion, a extending portion extending from the joint portion and parallel to the body, and a latching portion shaped on one end of the extending portion neighboring to the second engaging portion. The extending portion of one of the covers overlaps the second engaging portion of another one of the covers, and the latching portion of one of the covers is latched in the slot in another one of the covers.

Abstract: A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 ?f/Sq to 1000 ?/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.

Abstract: A PCB assembly, includes a shield-can and a PCB, the shield-can forms resisting portions and hook members; The PCB has a top surface and an opposite bottom surface, and the PCB defines engaging holes through the top surface and bottom surface; The shield-can be detachably assembled on the PCB, the resisting portions resist against the top surface of the PCB, and the hook members pass through the engaging holes, the distal ends of the hook members resist against the bottom surface of the PCB.

Abstract: An input/output cable port assembly and electromagnetic interference (EMI) attenuation method are provided. The port assembly includes a cable port structure for an electronics rack with an opening for input/output cables to pass therethrough, and a first and a second partition. The first and second partitions couple to the cable port structure and reside within the opening. The first partition includes at least one ferrite inductor portion and the second partition includes at least one second ferrite inductor portion. The partitions are configured to be disposed adjacent to each other as adjoining partitions within the cable port structure, and when disposed as adjoining partitions, the first and second ferrite inductor portions mate and define a ferrite inductor with a central opening for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state currents on the cable(s) passing therethrough.

Abstract: An input/output cable port assembly and electromagnetic interference attenuation method are provided. The cable port assembly includes a cable port structure mounted to an electronics rack with an opening for input/output cables to pass therethrough, and multiple bottom ferrite inductor portions and multiple top ferrite inductor portions. The bottom and top ferrite inductor portions include first and second surfaces, respectively. The inductor portions are configured to be stacked within the cable port structure with their first and second surfaces in opposing relation to define at least one ferrite inductor with a central opening defined by the first and second surfaces for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state current on the cable(s) passing therethrough.

Abstract: An electronic circuit having a circuit board, a shield frame and a shield cover is provided. The shield frame is provided on the circuit board along a fringe of an area of the circuit board. The shield frame is discontinuous at a portion on the fringe. The shield cover is fastened to the shield frame so as to cover the area having the fringe along which the shield frame is provided.

Abstract: An electronic device includes a case, a board module, and an electrostatic discharging module. The case has a conductive area. The board module is disposed in the case and has a ground end. The electrostatic discharging module is disposed on the case. Besides, the electrostatic discharging module includes a first discharging element and a second discharging element. The first discharging element is electrically connected to the ground end, and the second discharging element is electrically connected to the conductive area. There exists a gap between the first discharging element and the second discharging element, so that leak current generated by the board module can be prevented from being transmitted to the case, and that an electrostatic charge can be transmitted from the case to the ground end.

Abstract: A printed circuit board having a generally box-like carrier plate with a top side and an underside. The board has at least first and second conductor track plane separated by a first distance and an electrical circuit which occupies at least one section of the carrier plate. The section contains a screen for protecting the circuit from electromagnetic interference. The screen has a first screening conductor track which is arranged on the first conductor track plane and surrounds the section, and a second screening conductor track which is arranged on the second conductor track plane and also surrounds the section. The first and second screening conductor tracks are congruent at least in a circumferential region which surrounds the circuit. The screen has, in the circumferential region, a plurality of plated-through holes which penetrate the carrier plate and connect the first and second screening conductor tracks.

Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.

Abstract: An electromagnetic-wave suppressing material is provided. The electromagnetic-wave suppressing material includes an ionic liquid and nanometer-order particles mixed with the ionic liquid, where 10 wt % or more of the nanometer-order particles is mixed with respect to 100 wt % of the ionic liquid.

Abstract: When manufacturing an electronic component having a flip chip or a surface mount component mounted on a sheet substrate and being covered with a shield cover, the above shield cover is dipped into cream solder and placed on the above sheet substrate after the above cream solder is attached to the peripheral edge sides of the above shield cover, and then the shield cover is fixed to the sheet substrate by reflow process. With such manufacturing, it becomes possible to efficiently fix the shield cover to the sheet substrate. Also, the shield cover can securely be fixed against the bend of the sheet substrate produced during the reflow.

Abstract: A protective electrode structure comprises a middle protective electrode which resides between an outer protective electrode and the skin electrodes during a measurement. The middle protective electrode and the outer protective electrode are insulated from each other. Additionally, the middle protective electrode may be coupled to a virtual ground of the user-specific performance monitor system.

Abstract: A shield case is configured for supporting a memory card. The shield case includes a recessed portion, and a first edge, a second edge, and a third edge arranged around the recessed portion. The first edge forms a first support plate. The second edge forms a second support plate. The first support plate and the second support plate cooperatively support the memory card.

Abstract: An electromagnetic shielding article includes a plastic substrate, a silicon dioxide layer deposited on the plastic substrate, an electromagnetic shielding layer deposited on the plastic substrate, and a protection layer deposited on the electromagnetic shielding layer.

Abstract: An electromagnetic shielding article includes a plastic substrate; a nickel vanadium layer deposited on the plastic substrate; an electromagnetic shielding layer deposited on the plastic substrate; and a protection layer deposited on the electromagnetic shielding layer. A method for manufacturing the electromagnetic shielding article comprising steps of: providing a plastic substrate; depositing a nickel vanadium layer on the plastic substrate by radio-frequency induction plasma spraying process; depositing an electromagnetic shielding layer on the nickel vanadium layer; and depositing a protection layer on the electromagnetic shielding layer.

Abstract: A system for protecting an electronic device from cosmic rays includes a frame in which the circuit is disposed, a cosmic ray detection circuit and a protection circuit. The cosmic ray detection circuit is supported by the frame and is spaced apart from the circuit. The cosmic ray detection circuit is configured to assert an incoming cosmic ray signal when a cosmic ray interacts with the cosmic ray detection device. The protection circuit is coupled to the incoming cosmic ray signal and is configured to cause the electronic device to enter a protected state when the cosmic ray signal is asserted.

Abstract: A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.

Abstract: A shielding for a cable component that comprises a base material that is non-conductive and a plurality of conductive particles suspended in or disposed on an outer surface of the base material. The conductive particles are at least one of substantially the same size, the same shape, the same conductive material, different sizes, different shapes, and different conductive materials, such that selection of the conductive particles tunes the frequency bandwidth for effective shielding.

Abstract: There is provided a printed circuit board for reducing crosstalk, having a capacitive impedance component connected between signal and ground patterns, the printed circuit board including: signal patterns including a first signal pattern transferring low frequency signals and a second signal pattern transferring high frequency signals; ground patterns including a first ground pattern connected to the first signal pattern and a second ground pattern connected to the second signal pattern which are separated from each other; and a conductive shielding film connected between the first and second ground patterns and shielding electromagnetic waves generated from the printed circuit board. Accordingly, crosstalk between the low and high frequency signals may be reduced.

Abstract: Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

Abstract: A radiation level reducing device, including: a metal plate for covering surface of an electromagnetic wave generation source for radiating an electromagnetic wave; a cover region, set within a plane of the metal plate, for covering the surface; and a plurality of slits formed to a band-shape in the cover region, and spaced apart from each other, wherein each of the plurality of slits includes, a drawing slit extending towards a central part of the cover region from an intense electric field position where an electric field generated in between the electromagnetic wave generation source by the electromagnetic wave is stronger than other positions at an outer periphery of the cover region, and a coupling slit extending so as to line in parallel to another slit from an end in the central part direction of the cover region in the drawing slit.

Abstract: An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).

Abstract: A storage system and devices are provided for containing items and shielding the items from electromagnetic radiation, in particular, RF radiation, and holding the items in a waterproof environment. The storage system includes a first storage component which is constructed from a fabric having shieldable properties and is configured to envelope contents held therein in a shielded environment, and a second storage component which is constructed to receive the first storage component therein and provide waterproof storage for the contents. The storage system protects contents from unauthorized or surreptitious reads of stored data that may be carried on the content items by readers. The storage components of the storage system may be used independently of each other or together, as needed or desired.

Abstract: An improved container configured to store a wireless-enabled device therein and also configured to prevent the wireless-enabled device from being activated by an external wireless signal.

Abstract: A housing for use in a monitoring system having at least one monitoring module includes a shell defining an interior cavity. At least one opening is defined in the shell, and the at least one opening is in flow communication with the interior cavity. The housing includes at least one gasket coupled to the shell about an outer perimeter of the at least one opening. The at least one gasket facilitates insulating the interior cavity from electromagnetic radiation when the at least one monitoring module is positioned within the housing.