Abstract: A device on a supporting substrate is provided including a semiconductor film, having two or more rectangular crystalline regions spaced from each other, wherein each of the two or more rectangular crystalline regions comprises one single crystal region. The device can further include two or more thin-film transistors, wherein each of the two or more thin-film transistors comprises one or more active-channel regions. Each of the one or more active-channel regions can comprise at least one of said two or more rectangular crystalline regions. The device can further include an integrated circuit which comprises of the two or more thin-film transistors.

Abstract: Disclosed is a slit width adjusting device comprising: a pair of slit members parallel to each other, which is moved to approach each other or to be separated from each other to adjust a slit width; a driving section to move the pair of slit members; an absolute position original point detection section to detect an arbitrary absolute position of the slit members as an original point; and an adjustment section to adjust the slit width, wherein the adjustment section comprises: a storage unit to store a slit width table in which a displacement amount of the slit width from the original point, and a drive instruction value corresponding to the displacement amount, are corresponding to each other; and a drive control unit to extract the drive instruction value corresponding to a specified slit width, to drive the driving section according to the extracted drive instruction value.

Abstract: The present invention provides a method of manufacturing a core shroud for a nuclear plant and a nuclear power plant structure in which a groove portion is easily assembled in the case of manufacturing the core shroud having a weld structure of a nuclear power plant by a laser welding, and it is possible to obtain a weld joint portion in which a plastic distortion region and a residual stress are as small as possible, going with a solidification shrinkage of the weld portion. At a time of welding butted portions of a plurality of members constructing a core shroud, a root face is provided in the butted portion, a length of the root face is set to 25% to 95% of a thickness of the thinner one of the butted portions of a plurality of members, a narrow groove is provided in the other than the root face, and the butted portions are welded by a laser welding using a weld wire.

Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When a cylindrical tubular body (2) is improved in its residual stress by locally irradiating an outer-circumferential surface of a welded portion (C) of the tubular body (2) with laser beams (5a) and by moving an irradiation area (s) in an circumferential direction, a plurality thermocouples (9) are installed on the tubular body (2) to be improved, a temperature history of the outer surface of the tubular body (2) by the irradiation of the laser beam (5a) is managed by measuring the temperature history itself.

Abstract: An approach is provided for fabricating a light emitting diode using a laser lift-off apparatus. The approach includes growing an epitaxial layer including a first conductive-type compound semiconductor layer, an active layer and a second conductive-type compound semiconductor layer on a first substrate, bonding a second substrate, having a different thermal expansion coefficient from that of the first substrate, to the epitaxial layers at a first temperature of the first substrate higher than a room temperature, and separating the first substrate from the epitaxial layer by irradiating a laser beam through the first substrate at a second temperature of the first substrate higher than the room temperature but not more than the first temperature.

Abstract: Provided are a method of heating a composition which is applicable to a substrate provided with a material having low heat resistance and a method of forming a glass pattern which leads to reduction of cracks. A composition formed over a substrate is irradiated with a laser beam to bake the paste through local heating. Scan with the laser beam is performed so that there can be no difference in the laser beam irradiation period between the middle portion and the perimeter portion of the composition. Specifically, irradiation with the laser beam is performed so that the width of the beam spot overlapping with the composition in the scanning direction is substantially uniform.

Abstract: Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.

Abstract: Systems and methods are disclosed for performing laser annealing in a manner that reduces or minimizes wafer surface temperature variations during the laser annealing process. The systems and methods include annealing the wafer surface with first and second laser beams that represent preheat and anneal laser beams having respective first and second intensities. The preheat laser beam brings the wafer surface temperate close to the annealing temperature and the anneal laser beam brings the wafer surface temperature up to the annealing temperature. The anneal laser beam can have a different wavelength, or the same wavelength but different orientation relative to the wafer surface. Reflectivity maps of the wafer surface at the preheat and anneal wavelengths are measured and used to select the first and second intensities that ensure good anneal temperature uniformity as a function of wafer position. The first and second intensities can also be selected to minimize edge damage or slip generation.

Abstract: A bonding head 6 is provided with a tool base 8 in a housing 6A and transmitting laser beam L is configured such that the laser beam L transmitted through this tool base 8 can heat an electronic component 3 and bond the same to a substrate 2. A surface of a heat radiating member 15 is provided in contact with a surface of the tool base 8 on which the laser beam L impinges. This heat radiating member 15 has light transmittance for transmitting the laser beam L and also has thermal conductivity larger than the thermal conductivity of the tool base 8. The tool base 8 is heated during bonding treatment, but heat transmitted to the tool base 8 rapidly escapes to the heat radiating member 15 having larger thermal conductivity.

Abstract: A process to mark a multilayered article having a release layer and an adhesive layer, using a laser to produce markings within more than one layer of the article. The process includes providing a multilayered article including a laser-markable release liner having a release layer, and a laser-markable adhesive film; and marking the laser-markable release liner and the laser-markable adhesive film by directing laser radiation from at least a first source of laser radiation into the multilayered article through at least the first release layer to induce an interaction between a first light-sensitive pigment and a first organic polymer in the laser-markable release liner, and a second light-sensitive pigment and a second organic polymer in the laser-markable adhesive film, to form at least one visually perceptible marking in each of the laser-markable release liner and the laser-markable adhesive film. The release layer is substantially transparent to the laser radiation.

Abstract: A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis at the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal

Abstract: The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.

Abstract: The present invention relates to an improved laser annealing device, which includes a laser beam, a housing, a laser beam output window formed in a top of the housing, a substrate located at a bottom of the housing for carrying a material to be annealed, and a movable mask arranged between the laser beam output window and the substrate. The mask is set in inclination with respect to a horizontal direction. The mask forms a slit extending through upper and lower surfaces thereof. The laser beam travels vertically down through the laser beam output window and then passes through the slit to irradiate the substrate. The improved laser annealing device of the present invention includes a mask set in inclination with respect to the horizontal direction to prevent scraps from affecting the laser head, reduce replacement of the laser head, and lower down the cost.

Abstract: An apparatus can include a first beam cropper configured to crop a portion of a radiation pulse having a first spot size to form an intermediate cropped radiation pulse having an intermediate cropped spot with an intermediate cropped spot size less than the first spot size; and a second beam cropper configured to crop the intermediate cropped spot to form a second cropped radiation pulse having a second cropped spot with a second cropped spot size less the intermediate cropped spot size.

Abstract: The invention provides a method of laser processing that includes the steps of: generating a sequence of RF pulses corresponding to a sequence of laser pulses having a laser pulse repetition rate, the RF pulses including transmitting RF pulses at transmitting RF frequencies and non-transmitting RF pulses at non-transmitting RF frequencies for causing the sequence of laser pulses to be deflected in respective transmitting and non-transmitting directions, each RF pulse comprising an RF frequency, an RF amplitude and a duration; controlling each RF pulse such that the sequence of RF pulses provides a modulated RF drive signal that is modulated to provide a balanced thermal loading on the acousto-optic deflector; applying the modulated RF drive signal to the acousto-optic deflector; and deflecting at least one laser pulse with the acousto-optic deflector using the modulated RF drive signal to irradiate a selected target position with a predetermined pulse energy.

Abstract: A method comprises spatially selectively irradiating in a predetermined pattern with an output beam of a laser system an interface between a polymer substrate and a metal film on the polymer substrate. The polymer substrate is substantially transparent to the output beam of the laser system; the metal film absorbs a substantial fraction of the output beam. Laser system output comprises a sequence of pulses. Beam size at the polymer/metal interface, pulse energy, and pulse duration are selected so that each pulse from the laser system that irradiates an area of the polymer/metal interface substantially completely removes by ablation the metal film from at least a portion of the irradiated area without substantially altering the surfaces or bulk of the polymer substrate and without leaving on the polymer substrate or on remaining areas of the metal film substantial residue of metal that resolidified after being melted by the laser irradiation.

Abstract: A modified layer forming method of applying a pulsed laser beam having a transmission wavelength to a workpiece through a predetermined beam entrance surface in the condition where the focal point of the pulsed laser beam is set inside the workpiece, thereby forming a desired modified layer inside the workpiece. The modified layer forming method includes the step of reducing the power of the pulsed laser beam to a power that cannot process the workpiece when a surface adjacent to the beam entrance surface of the workpiece is located at the beam entrance position of the pulsed laser beam.

Abstract: A method for cutting a sheet of material having a thickness of at most 400 ?m using an electromagnetic wave beam (EWB) such as a laser. The method comprises forming a surface initiation defect and irradiating the sheet along a predetermined path within a short distance from the initiation defect a scanning EWB, such that the sheet is heated and cooled to allow for the propagation of the initiation defect into the predetermined path, and further along the predetermined path to result in a separation of the sheet along the predetermined irradiation path. This method can be advantageously used to cut glass sheets having a thin thickness to result in high-quality edge substantially free of major defects carried over from the initiation defect.

Abstract: A laser machining apparatus comprising jet liquid, a laser beam, and a laminar flow forming channel for supplying jet liquid to a nozzle. The channel includes a distribution channel formed by a cavity, an interconnecting channel disposed to communicate with said channel downstream in an axial direction of the nozzle and formed by an annular cavity around the axis of the nozzle to provide a narrower flow passage, and a liquid reservoir chamber. Said chamber has an outer peripheral edge communicating with the interconnecting channel over an entire circumference of the annular shape. An outer peripheral surface and an outer peripheral surface of the chamber form a continuous surface and an inner peripheral wall surface and an inner peripheral surface of the channel are both formed as an inclined inward surface that is downstream, the inner peripheral surface and the inner peripheral wall surface forming a planar continuous surface.

Abstract: The present invention provides a method of marking or inscribing a workpiece (3) with high-energy radiation, more particularly with a laser beam (1), the workpiece (3) being transparent for the radiation wavelength, and a polymer matrix (7) being disposed in the vicinity of the workpiece (3) in such a way that the radiation passes through the workpiece (3) before it impinges on the polymer matrix (7), characterized in that disposed between the polymer matrix (7) and the workpiece (3) is a film (15) of liquid which is in contact with the polymer matrix (7) and with the workpiece (3).

Abstract: A method and apparatus for laser engraving a three-dimensional pattern on a surface. A moveable laser head having a plurality of laser beams is provided. Preferably, the number of laser beams is four. Each beam is capable of being individually adjustably controllable.

Abstract: A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

Abstract: A system for determining accessibility of a tool to an object is provided. The system provides for selecting one or more sections on the object to be laser shock peened, selecting a region of interest on the one or more sections and determining a set of feasible solutions to access the selected region of interest on each of the one or more sections via use of an accessibility system.

Abstract: Apparatus and methods for measuring the temperature of a substrate are disclosed. The apparatus includes a source of temperature-indicating radiation, a detector for the temperature-indicating radiation, and a decorrelator disposed in an optical path between the source of temperature-indicating radiation and the detector for the temperature-indicating radiation. The decorrelator may be a broadband amplifier and/or a mode scrambler. A broadband amplifier may be a broadband laser, Bragg grating, a fiber Bragg grating, a Raman amplifier, a Brillouin amplifier, or combinations thereof. The decorrelator is selected to emit radiation that is transmitted, at least in part, by the substrate being monitored. The source is matched to the decorrelator such that the emission spectrum of the source is within the gain bandwidth of the decorrelator, if the decorrelator is a gain-driven device.

Abstract: The invention provides methods and systems for the application and reading of micro markings for coding of information for placement on the surfaces of individual very small devices. In preferred embodiments, a two dimensional micro matrix of markings or dots is realized on a scale of a 25 um cell size and smaller.

Abstract: The invention relates to a method for joining objects made of metal, plastic, hybrid structures or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles as heat is being applied to the joint.

Abstract: An optical instrument for light incoming along a principal optical axis includes a glass block and a subsurface object within the glass block. The subsurface object includes an arrangement of object marks. Each object mark includes a plurality of scattering layers stacked against the principal optical axis of the incoming light. First and second scattering layers of the plurality of scattering layers have different polarization responses.

Abstract: A tack welding method for use with a hybrid laser arc welding process. The method provides a recess on an edge of a first piece. The edge of the first piece is configured to cooperate with a second piece. The method positions the first piece relative to the second piece so as to provide a gap between the first piece and the second piece. Subsequently, the method provides a tack weld within the recess of the first piece. The recess is configured to accommodate placing the tack weld at a root of the gap.

Abstract: A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface.

Abstract: A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.

Abstract: A laser processing machine is provided which has a machine frame and a laser generator fastened to the machine frame. The laser generator is movable relative to the machine frame.

Abstract: A body structure for rolling stock is disclosed. The body structure may include an outside sheathing of a side construction, and a plurality of reinforcement members joined to said outside sheathing interiorly of said outside sheathing. Each of said plurality of reinforcement members may include a U-shaped part which is substantially U-shaped in cross-section and two fitting flange parts extending continuously from end edges of the U-shaped part in opposite directions. The fitting flange parts may be joined to said outside sheathing by laser welding, and the U-shaped part of at least one of said plurality of reinforcement members may be smaller in width than the U-shaped part of another of said plurality of reinforcement members provided on another part of said outside sheathing.

Abstract: An processing apparatus comprises a laser oscillator, an overall control device which controls an operation of the laser oscillator, and a plurality of processing units. The processing unit comprises a holding part which movably holds a processed object, an optical system which guides the laser beam, oscillated from the laser oscillator, toward the processed object, a shutter which selectively prevents the laser beam from reaching the processed object, and an individual control device which controls an operation of the holding part, and transmits a laser request signal to the overall control device. When at least one of the plurality of individual control devices transmits the request signal, the overall control device controls the shutter of the processing unit, which has transmitted the laser request signal, to enable the laser beam to reach the processed object, and drives the laser oscillator to allow the laser oscillator to oscillate the laser beam.

Abstract: An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample.

Abstract: A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.

Abstract: An apparatus for reducing resources for selecting seed to be produced in commercial quantities or for research is disclosed. Samples of seed which are candidates for selection are collected and given an identifier. Specific tissue or structure from candidate seed is removed. A test or analysis is performed on the candidate seed or the removed tissue or structure. Results of the test or analysis are recorded and correlated to the seed's identifier. The results are evaluated and a decision is made whether to select a candidate seed for commercial production or for research. Time, space, and labor associated with growing plants in an experimental plot or greenhouse and taking tissue samples from growing plants is saved.

Abstract: A laser processing machine for processing workpieces, in particular metal sheets, includes a workpiece support and a beam receiver for the laser beam used as a processing tool. The distance between a workpiece lying on the workpiece support and the beam receiver is variable, owing to the fact that the workpiece support and the beam receiver are positionable relative to one another along the beam axis of the laser beam by means of an adjusting drive of an adjusting device with a positioning movement of a variably definable magnitude. A method for processing workpieces, in particular metal sheets, is also provided.

Abstract: A laser processing method of applying a laser beam to a workpiece having a plurality of members, thereby forming a laser processed groove on the workpiece. The laser processing method includes the steps of setting a plurality of processing conditions respectively corresponding to a plurality of different materials forming the plurality of members constituting the workpiece, detecting the wavelengths of plasma lights generated by applying the laser beam to the plurality of members constituting the workpiece, selecting any suitable one of the processing conditions corresponding to any one of the members corresponding to the wavelength of plasma lights detected above, and applying the laser beam under the processing condition selected above.

Abstract: In manufacturing a resin mold assembly, a first weld region of a light transmitting resin member and a second weld region of a light absorbing resin member are disposed facing each other, the first weld region of the light transmitting resin member and the second weld region of the light absorbing resin member are brought into pressed state in mutually facing direction, and a laser beam is scanned to make the laser beam be incident upon the light transmitting resin member, and repetitively radiated on the second weld region to heat and melt a whole of the first and second weld regions simultaneously, thereby welding the light transmitting resin member and the light absorbing resin member.

Abstract: A method of building up an aluminum alloy part by welding is disclosed. The method includes the steps of manually depositing a layer of aluminum alloy powder on the part in a build-up zone and welding the powder layer onto the part by laser welding. A mask having an opening of dimensions corresponding to the dimensions of the build-up zone is positioned on the part and the layer of powder is deposited on the part both in the build-up zone and overlaps onto the mask around the build-up zone. The height of the powder layer relative to the surface of the part is calibrated prior to the welding step.

Abstract: The invention relates to a laser machining head for a laser machining machine, comprising a mount (2) for a sensor part (3) formed from electrically conductive material, an outer insulation part (4) made from electrically insulating material, preferably made from plastic, for electrical shielding and an inner insulation part (5) inserted within the outer insulation part (4) as radiation shield, wherein the inner insulation part (5) is formed from metal and is electrically insulated from the sensor part (3).

Abstract: A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done.

Abstract: A rotatable workpiece holder for holding a hollow cylindrical workpiece thereon functions as a chiller for cooling the hollow cylindrical workpiece. A coolant, e.g., water, is supplied to the hollow cylindrical workpiece through second coolant passages and branch passageways defined in the workpiece holder, thereby cooling the hollow cylindrical workpiece. The coolant forms a film in a clearance between the outer surface of an annular side wall of the workpiece holder and the inner circumferential surface of the hollow cylindrical workpiece.

Abstract: A welding apparatus and a welding method are employed for laser narrow groove welding which performs welding scanning a laser beam in the welding direction while feeding a solid filler metal into a narrow groove. The welding apparatus includes a laser beam irradiation head having a mechanism periodically oscillating an irradiation point of the laser beam with a predetermined amplitude in the bottom of the groove, and a filler metal control device having a solid filler metal feeder feeding the solid filler metal to the molten pool formed in the bottom of the groove by the laser beam and adjusting the feeding position independent of a motion of the laser beam irradiation head so that the tip position of the solid filler metal detected is constantly positioned in the center of the groove.

Abstract: A device for pretreating an exterior surface of an aircraft coated with an aircraft-specific base material so as to prepare the surface for a final painting with aircraft paint includes a pretreating tool. The pretreating tool has a laser head configured to activate the aircraft-specific base material using a laser. The device also includes a support construction including a robot device and a control unit configured to control and move the laser head over the surface using the robot device.

Abstract: Electronic devices may be provided with display structures such as glass and polymer layers in a liquid crystal display. The glass layers may serve as substrates for components such as a color filter layer and thin-film transistor layer. The polymer layers may include films such as a polarizer film and other optical films. During fabrication of a display, the polymer layers and glass layers may be laminated to one another. Portions of the polymer layers may extend past the edges of the glass layers. Laser cutting techniques may be used to trim away excess portions of the polymer layer that do not overlap underlying portions of the glass layers. Laser cutting may involve application of an adjustable infrared laser beam.

Abstract: A device reduces dust for safely preventing laser-irradiation capacity from decreasing due to contamination and reliably reducing iron loss of a grain oriented electrical steel sheet. The device improves iron loss properties of a grain oriented electrical steel sheet by irradiating its surface with laser to reduce iron loss, wherein, distance between a laser beam emission port and a laser irradiation point is L (mm); laser irradiation angle formed by a line linking the emission port and the irradiation point with respect to a direction vertical to the sheet is ? (°); and L?50, the emission port is positioned such that L and ? satisfy: 60?0.3L???60 when L?100 40?0.1L???60 when 100<L?400 ??60 when L>400.

Abstract: A device for recontouring a gas turbine blade includes at least one support configured to rest on an edge of the gas turbine blade during the recontouring, at least one side bearing configured to rest on an intake side or an outlet side of the gas turbine blade during the recontouring and a machining unit for machining the gas turbine blade. The machining unit is configured to fuse at least one partial area of the edge of the gas turbine blade using a beam of energy that is targeted such that material of the blade solidifies into a new contour, substantially without the addition of supplementary material.

Abstract: A method of selectively eliminating electrical shorts and other electrical defects from specific layers of a multilayer electronic device without damaging underlying layers. The method is based on a combination of an automated detection of the defects and selective laser ablation patterning (SLAP).

Abstract: Provided is a laser processing apparatus for a light guide plate capable of providing a high-quality light guide plate by maintaining a light path at a constant level. The laser processing apparatus includes a plurality of reflecting mirrors that reflect a laser mirror; and a path adjustment block transported in a direction a distance of the light path is reduced when a laser emitting unit is transported in a direction in which the distance of the light path is increased, wherein at least one of the plurality of reflecting mirrors is installed in the path adjustment block, thereby maintaining the distance of the entire light path on which the laser beam propagates at a constant level.