Abstract: An improved laser shock hardening method and apparatus which can eliminate spattering of a liquid and waving of the liquid surface upon laser irradiation, and can stably irradiate a workpiece with a laser beam. In a laser shock hardening method for carrying out surface processing of a workpiece in contact with a liquid by irradiating through the liquid the surface of the workpiece with a pulsed laser beam intermittently emitted from a laser irradiation device, the disclosed method provides a solid transparent to the wavelength of the laser, serving as an entrance window to the liquid surface; allowing the liquid to be present in the light path of the laser beam between the solid and the surface of the workpiece; and allowing the laser beam to enter through the solid and irradiating through the liquid the surface of the workpiece with the laser beam.

Abstract: A welding method of welding a cylindrical stiffening member to an outer circumference of a superconducting accelerator tube body uses a laser beam in a process of manufacturing a superconducting accelerator tube. The laser beam is configured such that a distribution profile of energy density on an irradiated face to which the laser beam is irradiated is a Gaussian distribution profile having a peak section, and the energy density of the peak section is 5.8×105 W/cm2 or more.

Abstract: In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

Abstract: A system and method are provided for marking valuable articles, particularly precious stones and here in particular cut diamonds (brilliants) and uncut diamonds. An identification marking that is invisible to the naked eye is applied to the article, and data associated with the identification marking is stored for subsequent use in determining the authenticity of the marking. The marking is applied by irradiating a surface of the article with laser light having a wavelength of less than 400 nm and applying ultrasonic oscillations during laser irradiation. A further laser light having a wavelength of more than 500 nm may also be applied to the surface. At least two interference images are generated using at least two different sounding radiation wavelengths for storage, along with an incidence angle of the sounding radiation. The stored data may subsequently be compared to authenticity-checking interference images to determine the authenticity of the identification marking.

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: A method for generating nanoparticles in a liquid comprises generating groups of ultrafast laser pulses, each pulse in a group having a pulse duration of from 10 femtoseconds to 200 picoseconds, and each group containing a plurality of pulses with a pulse separation of 1 to 100 nanoseconds and directing the groups of pulses at a target material in a liquid to ablate it. The multiple pulse group ablation produces nanoparticles with a reduced average size, a narrow size distribution, and improved production efficiency compared to prior pulsed ablation systems.

Abstract: A device for irradiating a laser beam onto an amorphous silicon thin film formed on a substrate. The device includes: a stage mounting the substrate; a laser oscillator for generating a laser beam; a projection lens for focusing and guiding the laser beam onto the thin film; a reflector for reflecting the laser beam guided onto the thin film; a controller for controlling a position of the reflector; and an absorber for absorbing the laser beam reflected by the reflector.

Abstract: Methods and apparatus for welding a component to fill a groove therein. The method entails simultaneously projecting an electric arc and at least first and second laser beams into the groove. The electric arc melts and deposits a filler material in the groove while the first and second laser beams are projected onto opposite first and second walls, respectively, of the groove. The axis of each of the first and second laser beams is oriented at an acute angle relative to the respective wall thereof.

Abstract: A pattern forming method includes: a modification treatment step of, in accordance with a pattern to be formed on a pattern forming surface of a base body, applying a light beam having a width smaller than a diameter of each of dots to constitute the pattern, onto a treatment target region including at least outer edges on both sides in a width direction of a region where the pattern is to be formed in the pattern forming surface, thereby carrying out modification treatment on the treatment target region; and a droplet deposition step of ejecting and depositing droplets of a functional liquid by an inkjet method onto the region where the pattern is to be formed including the treatment target region where the modification treatment has been carried out.

Abstract: A laser welding pressure unit comprises a housing, a rotating element, and a foot. The housing may attach to a laser head. The rotating element may include an outer ring rotatably coupled to an inner ring, wherein the outer ring is coupled to the housing. The foot may couple to the inner ring such that the foot rotates with respect to the housing. The foot may also be configured to contact an upper surface of a metal sheet and may be oriented such that while the metal sheet is being welded, the foot rotates about a central vertical axis and the laser welding pressure unit is able to move in any direction without the foot breaking contact with the surface.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece.

Abstract: A light-emission output of a flash lamp for performing a light-irradiation heat treatment on a substrate in which impurities are implanted is increased up to a target value L1 over a period of time from 1 to 100 milliseconds, is kept for 5 to 100 milliseconds within a fluctuation range of plus or minus 30% from the target value L1, and is then attenuated from the target value L1 to zero over a period of time from 1 to 100 milliseconds. That is, compared with conventional flash lamp annealing, the light-emission output of the flash lamp is increased more gradually, is kept to be constant for a certain period of time, and is then decreased more gradually. As a result, a total heat amount of a surface of the substrate increases compared with the conventional case, but a surface temperature thereof rises more gradually and then drops more gradually compared with the conventional case.

Abstract: A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by laser welding is provided with a monolithic connector body with a bore. A sidewall of the bore is provided with an inward annular projection angled toward a cable end of the bore. A sidewall of the inward annular projection and the sidewall of the bore form an annular laser groove open to a cable end of the bore. The annular laser groove is dimensioned with a taper at a connector end of the laser groove less than a thickness of a leading end of the outer conductor. The taper provides an annular material chamber between the leading end of the outer conductor, when seated in the laser groove, and the connector end of the laser groove.

Abstract: A laser protective wall element for a housing in laser machining stations with which increased protection, in particular for the eyes of living beings, can be achieved. In a laser protective wall element for a housing at laser machining stations, an intermediate layer is present which has hot conductor properties. The intermediate layer can be formed between electrically conductive plate-like elements, an electrically conductive plate-like element and an electrically conductive coating or also two electrically conductive layers or can be arranged there. The electrically conductive plate-like elements, the coating and/or the layers are connected to an electrical voltage source as well as a measuring instrument which detects electrical current, electrical resistance and/or electrical capacity and whose measured signal change can be used for the condition monitoring of the laser protective wall element.

Abstract: A system and process for production of nanometric or sub-micrometric powders in continuous flux under the action of laser pyrolysis in at least one interaction zone between a beam emitted by a laser and a flux of reagents emitted by an injector, in which the laser is followed by optical means for distributing the energy of the beam emitted by the latter according to an axis perpendicular to the axis of each flux of reagents, in an elongated cross-section having adjustable dimensions at the level of this at least one interaction zone.

Abstract: In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam.

Abstract: A processing system includes a rotary stage, at least one shaft, a rotation driver, a plurality of loading platforms, and a plurality of processing devices. The rotary stage includes two opposite end surfaces and a plurality of loading surfaces between the end surfaces. The shaft connects the end surfaces of the rotary stage. The rotation driver connects the shaft. The loading platforms are respectively disposed on the loading surfaces of the rotary stage. The processing devices are respectively disposed corresponding to the loading platforms.

Abstract: An upper housing assembly includes a pivot arm having an upper cam surface adjacent a distal end. A cam follower is coupled to a laser head to move up and down with a laser head. The cam follower exerts a downward force on the upper cam surface during normal operation. Thus, as the pivot arm rotates back and forth, the laser head moves up and down. A assist gas hose can be coupled between the upper housing and the laser head which has a spiral configuration permitting relative axial movement between the upper housing and the laser head. Upon an upward axial force being exerted on the laser head, the cam follower moves upwardly away from the upper cam surface.

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber, and methods of fabricated said apparatus, are provided herein. The apparatus may include a substrate having a plurality of electrical terminals disposed on one or more surfaces of the substrate, a plurality of solid state sources grown on top of the plurality of electrical terminals, the plurality of solid state sources providing pulsed or continuous energy when electrically powered, and one or more cooling channels formed in one or more areas of the substrate.

Abstract: Systems and methods for processing a material layer supported by a substrate using a light-source assembly that includes LED light sources each formed from an array of LEDs. The material layer is capable of undergoing a photo-process having a temperature-dependent reaction rate. Some of the LEDs emit light of a first wavelength that initiate the photo-process while some of the LEDs emit light of a second wavelength that heats the substrate. The heat from the substrate then heats the material layer, which increases the temperature-dependent reaction rate of the photo-process.

Abstract: A lid (2) for closing a cup (1) along a peripheral sealing edge (10) and a method for producing such a lid. The lid includes at least one aluminum film and an optionally multi-layered plastic layer which is co-extruded onto the aluminum film and has a closed predetermined tearing line (3). The plastic layer is made of plastic based on polyethylene (PE) or plastic based on polypropylene (PP), and the predetermined tearing line is introduced into the plastic layer preferably by means of a CO2 laser. The predetermined tearing line (3) may be provided directly in the region of the sealing edge (10).

Abstract: A system for determining accessibility of a tool to an object is provided. The system provides for selecting one or more sections on the object to be laser shock peened, selecting a region of interest on the one or more sections and determining a set of feasible solutions to access the selected region of interest on each of the one or more sections via use of an accessibility system.

Abstract: Crystallization of thin films using pulsed irradiation The method includes continuously irradiating a film having an x-axis and a y-axis, in a first scan in the x-direction of the film with a plurality of line beam laser pulses to form a first set of irradiated regions, translating the film a distance in the y-direction of the film, wherein the distance is less than the length of the line beam, and continuously irradiating the film in a second scan in the negative x-direction of the film with a sequence of line beam laser pulses to form a second set of irradiated regions, wherein each of the second set of irradiated regions overlaps with a portion of the first set of irradiated regions, and wherein each of the first and the second set of irradiated regions upon cooling forms one or more crystallized regions.

Abstract: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.

Abstract: A method including introducing a species into a substrate including semiconductor material; and translating linearly focused electromagnetic radiation across a surface of the substrate, the electromagnetic radiation being sufficient to thermally influence the species. An apparatus including an electromagnetic radiation source; a stage having dimensions suitable for accommodating a semiconductor substrate within a chamber; an optical element disposed between the electromagnetic radiation source and the stage to focus radiation from the electromagnetic radiation source into a line having a length determined by the diameter of a substrate to be placed on the stage; and a controller coupled to the electromagnetic radiation source including machine readable program instructions that allow the controller to control the depth into which a substrate is exposed to the radiation.

Abstract: A laser welding apparatus includes a laser welding unit including a first lens adapted to focus a laser beam; a second lens adapted to diffuse the laser beam to the first lens; and a third lens adapted to guide the laser beam to the second lens. The relative positions of the first lens, the second lens, and the third lens, are adjusted to adjust a diffusion angle and a beam width of the laser beam entering the first lens. The laser welding apparatus performs: actuating the laser welding unit to travel at a predetermined speed along a predetermined trajectory; directing the laser beam at a first welding spot; adjusting the focal length to focus the laser beam at the first welding spot; holding the laser focal spot size substantially constant; and directing the laser beam at a second welding spot after completion of welding for the first welding spot.

Abstract: The invention relates to a machine for material processing with a laser beam, in particular laser welding. It is comprised of a machine guided protective housing with an outlet opening surrounding the laser beam that is pointed at the material during processing. To create a machine for laser beam welding which ensures improved operator and personal safety without completely enclosing the machine, it is suggested that the protective housing contains at least one sensor which measures certain chemical or physical properties. The sensor is connected to the machines control unit which compares the current values with reference values for a measure and, depending on current/reference value comparison, interrupts the laser beam or prevents laser beam activation. In addition a method and arrangement for improved operator and personal safety for operation of such a machine is presented.

Abstract: To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.

Abstract: Compact high brightness light sources for the mid and far IR spectral region, and exemplary applications are disclosed based on passively mode locked Tm fiber comb lasers. In at least one embodiment the coherence of the comb sources is increased in a system utilizing an amplified single-frequency laser to pump the Tm fiber comb laser. The optical bandwidth generated by the passively mode locked Tm fiber comb laser is further decreased by using simultaneous 2nd and 3rd order dispersion compensation using either appropriate chirped fiber Bragg gratings for dispersion compensation, or fibers with appropriately selected values of 2nd and 3rd order dispersion. Fibers with large anomalous values of third order dispersion, or fibers with large numerical apertures, for example fibers having air-holes formed in the fiber cladding may be utilized.

Abstract: The present invention aims to rapidly and easily create processed data for scan controlling a laser light beam, and to create the processed data for the laser processing apparatus at high precision. A setting plane corresponding to a scanning region of a laser marker is displayed on a processed data generating device. A user operates the processed data generating device to arrange the processing pattern on the setting plane. Here, a marker head coincides an optical axis of the laser light beam L on a position corresponding to the reference point of the processing pattern, and photographs a work W with a camera which light receiving axis is coaxial with the optical axis of the laser light beam L. A photographed image monitor displays the photographed image along with a symbol indicating the position of the light receiving axis of the camera.

Abstract: An object of the present invention is to provide a method and a device for constantly setting the energy distribution of a laser beam on an irradiating face, and uniformly irradiating the laser beam to the entire irradiating face. Further, another object of the present invention is to provide a manufacturing method of a semiconductor device including this laser irradiating method in a process. Therefore, the present invention is characterized in that the shapes of plural laser beams on the irradiating face are formed by an optical system in an elliptical shape or a rectangular shape, and the plural laser beams are irradiated while the irradiating face is moved in a first direction, and the plural laser beams are irradiated while the irradiating face is moved in a second direction and is moved in a direction reverse to the first direction.

Abstract: To provide a conveying unit that holds a workpiece and conveys the workpiece at a constant rate in one direction, a laser oscillator that emits a pulsed laser beam, a splitter that splits a pulsed laser beam into a pattern having a predetermined geometric pitch, a first deflector that scans the split pulsed laser beam in the other direction substantially orthogonal to the one direction, a second deflector that adjusts and deflects the split pulsed laser beam deflected by the first deflector on the surface to be processed in the one direction so as to scan the resultant pulsed laser beam onto the surface to be processed at a constant rate equal to a rate at which the workpiece is conveyed, and a condenser that condenses the split pulsed laser beam deflected by the second deflector onto the surface to be processed.

Abstract: A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.

Abstract: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.

Abstract: A movable microchamber system with a gas curtain is disclosed. The microchamber system has a top member with a light-access feature and a stage assembly that supports a substrate to be processed. The stage assembly is disposed relative to the top member to define a microchamber and a peripheral microchamber gap. An inert gas is flowed into the peripheral microchamber gap to form the gas curtain just outside of the microchamber. The gas curtain substantially prevents reactive gas in the ambient environment from entering the microchamber when the stage assembly moves relative to the top member.

Abstract: A laser processing method which can reduce the chipping generated when a plate-like object to be processed formed with a modified region is turned into small pieces in steps other than its dividing step. In a part extending along a line to cut in an object to be processed, laser light is oscillated in a pulsing fashion in an intermediate portion including an effective part, and is continuously oscillated in one end portion and the other end portion on both sides of the intermediate portion. Since the laser light intensity becomes lower in continuous oscillation than in pulse oscillation, modified regions can be formed in the intermediate portion but not in one end portion and the other end portion. This keeps the modified regions from reaching the outer face of the substrate, thus making it possible to prevent particles from occurring when forming the modified regions.

Abstract: A method of welding a joint includes directing a first output from a high energy density heat source, such as a laser, against a first side of the joint. The method further includes directing a second output from an arc welding heat source, such as a gas metal arc welding torch, against a second side of the joint. The first output produces a keyhole surrounded by a molten metal pool which extends from the first side of the joint toward the second side of the joint. In some embodiments a third output from a second arc welding heat source may also be directed at the first side of the joint. A second molten metal pool produced by the arc welding heat source joins with the first molten metal pool and the third molten metal pool to form a common molten metal pool which solidifies to form the weld.

Abstract: An upper housing assembly includes a pivot arm having an upper cam surface adjacent a distal end. A cam follower is coupled to a laser head to move up and down with a laser head. The cam follower exerts a downward force on the upper cam surface during normal operation. Thus, as the pivot arm rotates back and forth, the laser head moves up and down. A assist gas hose can be coupled between the upper housing and the laser head which has a spiral configuration permitting relative axial movement between the upper housing and the laser head. Upon an upward axial force being exerted on the laser head, the cam follower moves upwardly away from the upper cam surface.

Abstract: A head for the continuous precision machining on three-dimensional bodies includes a fastening means to a flange of a machining equipment, having a first mechanical rotation axis, an intermediate means having a second mechanical rotation axis in series to the first mechanical rotation axis. The second mechanical rotation axis is orthogonal to the first mechanical rotation axis which intersects at a point of intersection. A terminal processing means has in series with the first and second mechanical rotation axes a third mechanical translating axis. The intermediate means has an arc configuration of a circumference with its centre at the point of intersection. The first mechanical rotation axis and the third mechanical translating axis are radially oriented to the arc.

Abstract: Gradient-index (GRIN) lens fabrication employing laser pulse width duration control, and related components, systems, and methods are disclosed. GRIN lenses can be fabricated from GRIN rods by controlling the pulse width emission duration of a laser beam emitted by a laser to laser cut the GRIN rod, as the GRIN rod is disposed in rotational relation to the laser beam. Controlling laser pulse width emission duration can prevent or reduce heat accumulation in the GRIN rod during GRIN lens fabrication. It is desired that the end faces of GRIN lenses are planar to facilitate light collimation, easy bonding or fusing of the GRIN lens to optical fibers to reduce optical losses, polishing to avoid spherical aberrations, and/or cleaning the end faces when disposed in a fiber optic connector, as non-limiting examples.

Abstract: A method for manufacturing a semiconductor thin film is provided which can form its crystal grains having a uniform direction of crystal growth and being large in size and a manufacturing equipment using the above method, and a method for manufacturing a thin film transistor. In the above method, by applying an energy beam partially intercepted by a light shielding element, melt and re-crystallization occur with a light-shielded region as a starting point. The irradiation of the beam gives energy to the light-shielded region of the silicon thin film so that melt and re-crystallization occur with the light-shielded region as the starting point and so that a local temperature gradient in the light-shielded region is made to be 1200° C./?m or more. In the manufacturing method, a resolution of an optical system used to apply the energy beam is preferably 4 ?m or less.

Abstract: A laser processing machine has an expanded operating space so that larger workpieces can be processed and/or the spatial requirement for the laser processing machine is reduced.

Abstract: A connecting piece for a tool of a multi-axis machining center has a support on the machining center side, a holder at the tool side and a pushing device which elastically pushes the holder into a defined position against the support. The pushing force of the pushing device can be varied during the operation of the machining center.

Abstract: A method and an arrangement for a firm bonding of a first material with a second material by means of soldering through focused laser radiation impacting on the first material, with the output controlled in dependence on the temperature measured in the area of the impacting focused laser radiation. To assure that surface properties will not lead to a noticeable distortion of the material temperature to be measured so that a reproducible, high quality soldering will be possible, it is provided for the temperature to be measured in an area of the first material that is adjacent to that in which the focused laser radiation impacts on the first material, with the area in which the temperature is measured and the area of impact of the laser radiation lying within the area of the soldering spot.

Abstract: A laser energy delivery system includes a relay imaging system. Input optics arranged to receive the laser energy, a transmitting mirror having adjustable angle of incidence relative to the input optics, and a robot mounted optical assembly are configured to direct laser energy toward the movable target image plane. The laser energy follows an optical path including an essentially straight segment from the transmitting mirror to the receiving mirror, having a variable length and a variable angle relative to the input optics through air. Diagnostics on the processing head facilitate operation.

Abstract: A method and apparatus for targeting a beam of radiation is provided. A beam steering mirror and a beam capture mirror are movably disposed along an optical pathway. A controller moves the beam steering mirror and the beam capture mirror in an x-y plane, and rotates the mirrors, to target the beam to a target location on a surface, while keeping the optical path length substantially constant for all target locations on the surface. The surface is rotated by a rotational actuator to bring all target locations to positions accessible by the beam targeting optics. Imprecision in targeting and optical path length may be compensated by providing an actuated aperture at the beam entry point and/or a variable focus lens with an optical range finding detector, all in communication with the controller.

Abstract: Disclosed is a slit width adjusting device comprising: a pair of slit members parallel to each other, which is moved to approach each other or to be separated from each other to adjust a slit width; a driving section to move the pair of slit members; an absolute position original point detection section to detect an arbitrary absolute position of the slit members as an original point; and an adjustment section to adjust the slit width, wherein the adjustment section comprises: a storage unit to store a slit width table in which a displacement amount of the slit width from the original point, and a drive instruction value corresponding to the displacement amount, are corresponding to each other; and a drive control unit to extract the drive instruction value corresponding to a specified slit width, to drive the driving section according to the extracted drive instruction value.

Abstract: A device on a supporting substrate is provided including a semiconductor film, having two or more rectangular crystalline regions spaced from each other, wherein each of the two or more rectangular crystalline regions comprises one single crystal region. The device can further include two or more thin-film transistors, wherein each of the two or more thin-film transistors comprises one or more active-channel regions. Each of the one or more active-channel regions can comprise at least one of said two or more rectangular crystalline regions. The device can further include an integrated circuit which comprises of the two or more thin-film transistors.