Abstract: An apparatus with a programmable response includes a semiconductor device with a junction formed thereon, the junction having a built-in potential, a quantum well element proximate to the junction that provides an energy well within a depletion region of the junction. The energy well comprises one or more donor energy states that support electron trapping, and/or one or more acceptor energy states that support hole trapping; thereby modulating the built-in potential of the junction. The semiconductor device may be a diode, a bipolar diode, a transistor, or the like. A corresponding method is also disclosed herein.

Abstract: A driving method of a nonvolatile memory device includes receiving a program command and an address. The method includes changing a number of adjacent zones of a plurality of zones formed of unselected word lines according to a location of a selected word line corresponding to the received address. The method further includes applying different zone voltages to the number of adjacent zones and remaining zones. The nonvolatile memory device includes a plurality of strings formed to penetrate word lines stacked on a substrate in a plate shape.

Abstract: An apparatus with a programmable response includes a semiconductor device with a junction formed thereon, the junction having a built-in potential, a quantum well element proximate to the junction that provides an energy well within a depletion region of the junction. The energy well comprises one or more donor energy states that support electron trapping, and/or one or more acceptor energy states that support hole trapping; thereby modulating the built-in potential of the junction. The semiconductor device may be a diode, a bipolar diode, a transistor, or the like. A corresponding method is also disclosed herein.

Abstract: A bitline regulator for use in a high speed flash memory system is disclosed. The bitline regulator is responsive to a set of trim bits that are generated by comparing the bias voltage of a bitline to a reference voltage.

Abstract: A non-volatile memory device comprises a semiconductor substrate of a first conductivity type. An array of non-volatile memory cells is located in the semiconductor substrate and arranged in a plurality of rows and columns. Each memory cell comprises a first region on a surface of the semiconductor substrate of a second conductivity type, and a second region on the surface of the semiconductor substrate of the second conductivity type. A channel region is between the first region and the second region. A word line overlies a first portion of the channel region and is insulated therefrom, and adjacent to the first region and having little or no overlap with the first region. A floating gate overlies a second portion of the channel region, is adjacent to the first portion, and is insulated therefrom and is adjacent to the second region. A coupling gate overlies the floating gate. A bit line is connected to the first region.

Abstract: When performing an erase on a flash type non-volatile memory with a NAND type of structure, techniques are presented for inhibiting erase on selected word lines, select lines of programmable select transistors, or some combination of these. The voltage along the selected control lines are initially ramped up by the level on a corresponding input line, but then have their voltage raised to an erase inhibit level by capacitive coupling with the well structure. The level of these input signals are ramped up with the erase voltage applied to the well structure, but with a delay based upon the coupling ratio between the control line and the well.

Abstract: A storage device includes non-volatile memory and a controller. A method performed in the data storage device includes receiving, at the controller, first data and second data to be stored at the non-volatile memory. The method further includes sending, from the controller, the first data, the second data, and dummy data to the non-volatile memory to be stored at respective logical pages of a single physical page in the non-volatile memory. The single physical page includes multiple storage elements that are programmable into multiple voltage states according to a mapping of bits to states. The dummy data prevents a storage element of the single physical page from being programmed to a particular voltage state of the multiple voltage states.

Abstract: A memory device comprises a first memory string and a second memory string. The first memory string is coupled to a first bit line and a plurality of word lines, and the second memory string is coupled to a second bit line and the word lines. When an erasing voltage is applied to the word lines, a first voltage is applied to the first bit line to erase data stored in the first memory string, and a second voltage is applied to the second bit line to set the second memory string to be floating.

Abstract: A boosted supply voltage generator is selectively activated and deactivated to allow operations that are sensitive to variations on the boosted voltage to be performed with a stable boosted voltage. Techniques for deactivating and reactivating the voltage generator are also disclosed that enable more rapid recovery from deactivation such that subsequent operations can be commenced sooner. Such techniques include storing state information corresponding to the voltage generator when deactivated, where the stored state information is used when reactivating the voltage generator. Stored state information can include a state of a clock signal provided to the voltage generator.

Abstract: A memory system performs a first sensing operation to sense whether multi-level cells assume an on-cell state or an off-cell state in response to a first read voltage applied to a selected word line. It then supplies a pre-charge voltage to bit lines corresponding to multi-level cells that have been sensed as assuming the off-cell state in response to the first read voltage, and it performs a second sensing operation with the supplied pre-charge voltage to sense whether each of the multi-level cells that have been sensed as assuming the off-cell state assumes an on-cell state or an off-cell state in response to a second read voltage applied to the selected word line.

Abstract: A method of programming a nonvolatile memory device is provided which includes applying a program voltage to selected ones of a plurality of memory cells; applying a selected one of a plurality of verification voltages after pre-charging bit lines connected to memory cells to which the program voltage is applied; sensing the memory cells to which the selected verification voltage is applied; selecting memory cells programmed to a target state referring to the sensing result and target state data; and determining whether programming of the selected memory cells is passed or failed.

Abstract: Methods, devices, modules, and systems for programming memory cells are disclosed. One method embodiment includes storing charges corresponding to a data state that represents an integer number of bits in a set of memory cells. The method also includes storing a charge in a cell of the set, where the charge corresponds to a programmed state, where the programmed state represents a fractional number of bits, and where the programmed state denotes a digit of the data state as expressed by a number in base N, where N is equal to 2B, rounded up to an integer, and where B is equal to the fractional number of bits represented by the programmed state.

Abstract: An apparatus comprising a memory and a controller. The memory may be configured to process a plurality of read/program operations. The memory may comprise a plurality of memory units each having a size less than a total size of the memory. The controller may be configured to perform a plurality of reads on a victim cell. The controller may be configured to store measured victim information from the plurality of reads on the victim cell. The controller may be configured to perform one or more reads on a plurality of aggressor cells. The controller may be configured to store measured aggressor information from the one or more reads on the plurality of aggressor cells. The controller may be configured to generate inter-cell interference parameters based on the measured victim information and the measured aggressor information. The controller may be configured to mitigate inter-cell interference based on the inter-cell interference parameters.

Abstract: In various embodiments, quench switches are utilized within a cross-point memory array to minimize parasitic coupling in lines proximate selected lines.

Abstract: Methods of operating a non-volatile solid state memory-based mass storage device having at least one non-volatile memory component. In one aspect of the invention, the one or more memory components define a memory space partitioned into user memory and over-provisioning pools based on a P/E cycle count stored in a block information record. The storage device transfers the P/E cycle count of erased blocks to a host and the host stores the P/E cycle count in a content addressable memory. During a host write to the storage device, the host issues a low P/E cycle count number as a primary address to the content addressable memory, which returns available block addresses of blocks within the over-provisioning pool as a first dimension in a multidimensional address space. Changed files are preferably updated in append mode and the previous version can be maintained for version control.

Abstract: A non-volatile memory includes a plurality of word lines, power supply units are provided for word line columns, a different unit voltage is applied for each of power supply units depending on whether a selected memory cell exists in the column, a switching mechanism in each power supply unit is switched by the word line depending on a voltage value on a control line, a charge storage gate voltage or inhibition gate voltage is applied for each of the word lines so that the inhibition gate voltage value and a bit line voltage value can be freely set for each of the word line columns to values at which occurrence of disturbance can be suppressed. A plurality of power supply units are connected to the control line in a common row direction, and a row-direction address decoder, which is independent for each of the word line columns is not required.

Abstract: A nonvolatile memory device utilizes a variable resistive element. The nonvolatile memory device includes a plurality of banks and first to third write global bit lines arranged to cross the plurality of banks. Each of the plurality of banks includes a plurality of nonvolatile memory cells using resistive material. The first, the second and the third write global bit lines are disposed directly adjacent to one another in order. When a write current is supplied to the first write global bit line during a write period, a fixed voltage is applied to the second write global bit line while the third global bit line floats.

Abstract: An erase operation for a 3D stacked memory device assigns storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.

Abstract: Techniques are presented to operate a greater number of dice in parallel while not exceeding peak current limits. The device can arbitrate between multiple dice and, when needed, suspend operations on one or more dice in a way to average the chance of performance penalty so that all chips will proceed with write at an equal probability. In other aspects, the suspension of operations can be weighted based on factors such as the relative speed of the different dice or differing loads.

Abstract: A structure with which the zero current of a field effect transistor using a conductor-semiconductor junction can be reduced is provided. A floating electrode (102) including a conductor or a semiconductor and being enclosed by an insulator (104) is formed between a semiconductor layer (101) and a gate (105) so as to cross the semiconductor layer (101) and the floating electrode (102) is charged, whereby carriers are prevented from flowing from a source electrode (103a) or a drain electrode (103b). Accordingly, a sufficiently low carrier concentration can be kept in the semiconductor layer (101) and thus the zero current can be reduced.

Abstract: A semiconductor memory device includes a memory cell array, a voltage generation circuit that generates a voltage applied to the memory cell array, the voltage generation circuit including a plurality of boosting circuits connected in series between an input terminal and an output terminal, and a switching circuit configured to short-circuit one or more of the boosting circuits to the input terminal, and a control circuit that controls a conduction state of the switching circuit to vary the number of boosting circuits that are driven to generate the voltage applied to the memory cell array.

Abstract: A high voltage step regulator, such as would be used to provide a regulated low voltage (on the order of a few volts) from a high voltage external supply (e.g. 12V), is presented. To protect the output transistor, through which the output is provided from the input, from breakdown, a depletion type device is connected between the supply and the output transistor. The control gate of the depletion device is then connected to the output level of the regulator. This reduces the voltage drop across the output transistor, helping to avoid violating design rules (EDR) on how great a voltage differential can be placed across the output transistor. Examples of applications for such a circuit are for various operating voltages on a non-volatile memory chip operating with a high voltage power supply.

Abstract: A semiconductor memory includes a substrate configured to include a plurality of active regions which are defined by isolation layers extending in a first direction and word lines extending in a second direction intersecting the first direction; source line contacts configured to be alternately disposed over the active regions arranged in the first and second directions and disposed over each of the active regions arranged in a third direction intersecting the first and second directions; source lines configured to extend in the third direction while being coupled to the source line contacts; contacts configured to be disposed over each of the active regions over which the source line contacts are not disposed; variable resistance elements configured to be disposed over each of the contacts; bit line contacts configured to be disposed over each of the variable resistance elements; and bit lines configured to extend in a fourth direction intersecting the first to third directions while being coupled to the bit

Abstract: Methods, systems, and apparatuses for down-converting a modulate earner signal to a demodulated baseband signal by sampling the energy of the carrier signal are described herein. Briefly stated, such methods systems, and apparatuses operate by receiving a modulated carrier signal and using pulses with apertures to control a switch so as to (a) transfer energy from the modulated carrier signal and accumulate the transferred energy in a capacitor when the switch is closed during the apertures of the pukes and (b) discharge some of the previously accumulated energy from the capacitor into load circuitry at least when the switch is open. The demodulated baseband signal is generated from (i) accumulating energy transferred to the capacitor each time the switch is closed during the apertures of the pulses, and (ii) discharging some of the previously accumulated energy into the load circuitry each time the switch is opened.

Abstract: A high-voltage switching device for a flash memory includes at least one pumping transistor which includes one junction terminal and another junction terminal which are commonly connected to a control signal, and a gate terminal connected to a select signal. The high-voltage switching device also includes at least one switching transistor that includes one junction terminal connected to an input signal, another junction terminal connected to an output signal, and a gate terminal connected to the select signal. A layout of the high-voltage switching device includes a pumping active area in which the one junction terminal and the another junction terminal of the pumping transistor are disposed; a control interconnection area in which an interconnection of the control signal is wired; and a select interconnection area in which an interconnection of the select signal is wired.

Abstract: Techniques are provided to improve long term data retention in a charge-trapping memory device. In addition to a primary charge-trapping layer in which most charges are stored, the memory device may include a tunneling layer comprising an engineered tunneling barrier such as oxide-nitride-oxide. The nitride in the tunneling layer may also store some charges after programming. After the programming, a data retention operation is performed which de-traps some electrons from the tunneling layer, in addition to injecting holes into the tunneling layer which form neutral electron-hole dipoles in place of electrons. These mechanisms tend to lower threshold voltage. Additionally, the data retention operation redistributes the electrons and the holes inside the charge-trapping layer, resulting in an increase in threshold voltage which roughly cancels out the decrease when the data retention operation is optimized.

Abstract: Control transistors and memory cells within 3D NAND Flash memory arrays may both be created using the same technology, such as charge trapping structures, to simplify the fabrication process. However, the resulting control transistors may initially have higher variability in threshold voltages, when compared to traditional gate-oxide-based control transistors. Provided are exemplary techniques to trim control transistors to provide increased reliability and performance during array operation.

Abstract: A method of estimating a deterioration state of a memory device comprises reading data from selected memory cells connected to a selected wordline of a memory cell array by applying to the selected wordline a plurality of distinct read voltages having values corresponding to at least one valley of threshold voltage distributions of the selected memory cells, generating quality estimation information indicating states of the threshold voltage distributions using the data read from the selected memory cells, and determining a deterioration state of a storage area including the selected memory cells based on the generated quality estimation information.

Abstract: A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines.

Abstract: A non-volatile memory cell and array structure is disclosed situated within a high voltage region of an integrated circuit. The cell utilizes capacitive coupling based on an overlap between a gate and a drift region to impart a programming voltage. Programming is effectuated using a drain extension which can act to inject hot electrons. The cell can be operated as a one-time programmable (OTP) or multiple-time programmable (MTP) device. The fabrication of the cell relies on processing steps associated with high voltage devices, thus avoiding the need for additional masks, manufacturing steps, etc.

Abstract: For one embodiment, a programming method includes programming one or more memory cells of a memory device during a programming operation, determining, internal to the memory device, a number of program pulses required to program a sample of the one or more memory cells of the memory device during the programming operation, and adjusting a program starting voltage level of one or more program pulses applied to the one or more memory cells during a subsequent programming operation in response, at least in part, to the number of program pulses required to program the sample of the one or more memory cells programed during the prior programming operation.

Abstract: A nonvolatile memory device includes: a plurality of cell strings disposed on a substrate, wherein at least one of the plurality of cell strings comprises a plurality of cell transistors and at least one ground select transistor stacked in a direction substantially perpendicular to the substrate, and the substrate and a channel region of the plurality of cell strings have a same conductivity type; a substrate bias circuit configured to provide an erase voltage to the substrate in an erase operation; and a ground select line voltage generator configured to provide a ground select line saturation voltage to the at least one ground select transistor in the erase operation.

Abstract: A memory string includes a pass transistor, first memory cells connected in series to a drain terminal of the pass transistor, and first to kth memory cell groups connected in parallel to a source terminal of the pass transistor and each including a plurality of second memory cells connected in series. Here, ‘k’ denotes an integer that is equal to or greater than ‘2’.

Abstract: A controller executes a first LBIST test on a device at a first shift frequency on a plurality of partitions and detects any voltage drop at sense points in each partition during the test. If a voltage drop is detected, then the test is re-run for those partitions that failed the first test. If failures are detected during the re-execution, then a further test at a lower shift frequency is performed. The partitions can be tested sequentially or in parallel and invention has the advantage of reducing the time taken for executing LBIST when the device is booted.

Abstract: A method of reading data at a data storage device that includes a non-volatile memory having a three-dimensional (3D) configuration includes identifying a first set of storage elements of a first word line of the non-volatile memory that satisfy a condition. The condition is based on one or more states of one or more storage elements. The method includes determining a first read voltage corresponding to the first set of storage elements of the first word line and determining a second read voltage corresponding to a second set of storage elements of the first word line that do not satisfy the condition. The method includes reading data from the first word line by applying the first read voltage to the first set of storage elements of the first word line and applying the second read voltage to the second set of storage elements of the first word line.

Abstract: In general, according to one embodiment, a semiconductor memory device includes a first transistor, a plurality of memory cells and a controller. One end of the first transistor is electrically connected to a first power supply. The plurality of memory cells are electrically connected between other end of the first transistor and a second power supply. The controller is configured to apply a first voltage to a gate of the first transistor when reading data from a selected memory cell. The controller is configured to make the first voltage progressively-increasing.

Abstract: A method of enhancing a thermal anneal of a flash memory in an integrated circuit (IC) chip package by addition of an electric field may include heating an integrated circuit (IC) chip, disposed within an IC chip package, to an elevated temperature that does not degrade the IC chip package, where the IC chip includes a flash memory that includes blocks of flash memory cells. A negative electric field may be applied to each of the blocks of flash memory cells at the elevated temperature. The application of the negative electric field and the heating of the IC chip may be terminated. Stored data for each of the blocks of flash memory cells may be retrieved from a storage device and rewritten into each of the blocks of flash memory cells.

Abstract: A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.

Abstract: A configuration for a bit-1 read-only memory (ROM) cell is provided. The bit-1 ROM cell comprises a first circuit connected to a second circuit. The first circuit comprises a first transistor and the second circuit comprises a second transistor. The second circuit is configured to receive a YMUX signal. The second circuit is connected to a word-line bar. The second circuit is configured to maintain a disconnection or connection between the first transistor and the word-line bar based upon the YMUX signal. The first circuit is located on a different physical layer than the second circuit.

Abstract: Integrated circuit memory systems and methods include comparing a number of erase cycles of a memory block corresponding to a read request to a first value and reading data stored in the memory block according to a first read condition corresponding to a first reliability improvement operation when the number of erase cycles of the memory block is less than the first value. An error of the data read according to the first read condition may be corrected using an error correction code (ECC) when the error of the data read according to the first read condition is correctable.

Abstract: Methods and apparatus for programming memory cells in a memory array are disclosed. A most recent programming time is determined, the most recent programming time being a time when a most recent programming operation was applied to a reference memory cell in the memory array. A programming signal is then applied to a target memory cell in the memory array, the programming signal having a programming parameter which depends at least in part on the most recent programming time.

Abstract: A data storage device includes a memory having a three-dimensional (3D) memory configuration. A method includes writing first data at a first physical page that is disposed within the memory at a first distance from a substrate of the memory. The first data is written at the first physical page using a first write technique. The method further includes writing second data at a second physical page that is disposed within the memory at a second distance from the substrate. The second distance is greater than the first distance. The second data is written at the second physical page using a second write technique that is different than the first write technique.

Abstract: Embodiments are provided that include a method including providing a first pulsed gate signal to a selected memory cell, wherein the pulsed gate signal alternates between a first voltage level and a second voltage level during a time period and sensing a data line response to determine data stored on the selected memory of cells. Further embodiments provide a system including a memory device, having a regulator circuit coupled to a plurality of access lines of a NAND memory cell, and a switching circuit configured to sequentially bias at least one of the plurality of the access lines between a first voltage level and a second voltage level based on an input signal.

Abstract: Devices, systems and methods of biasing in memory devices facilitate memory device programming and/or erase operations. In at least one embodiment, a first string of memory cells comprising a selected memory cell and a second string of memory cells are coupled to a common data line and a common source where the data line and the source are biased to substantially the same potential during a programming and/or erase operation performed on one or more of the strings of memory cells.

Abstract: Embodiments of the present disclosure include techniques and configurations for multi-pulse programming of a memory device. In one embodiment, a method includes applying multiple pulses to program one or more multi-level cells (MLCs) of a memory device, wherein individual pulses of the multiple pulses correspond with individual levels of the one or more MLCs and subsequent to applying the multiple pulses, verifying the programming of the individual levels of the one or more MLCs. Other embodiments may be described and/or claimed.

Abstract: A semiconductor device of the present invention has a first insulating film formed between a control gate electrode and a semiconductor substrate and a second insulating film formed between a memory gate electrode and the semiconductor substrate and between the control gate electrode and the memory gate electrode, the second insulating film having a charge accumulating part therein. The second insulating film has a first film, a second film serving as a charge accumulating part disposed on the first film, and a third film disposed on the second film. The third film has a sidewall film positioned between the control gate electrode and the memory gate electrode and a deposited film positioned between the memory gate electrode and the semiconductor substrate. In this structure, the distance at a corner part of the second insulating film can be increased, and electric-field concentration can be reduced.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for reduced level cell solid-state storage. A method includes determining that an erase block of a non-volatile storage device is to operate in a reduced level cell (RLC) mode. The non-volatile storage device may be configured to store at least three bits of data per storage cell. A method includes instructing the non-volatile storage device to program first and second pages of the erase block with data. A method includes instructing the non-volatile storage device to program a third page of the erase block with a predefined data pattern. Programming of a predefined data pattern may be configured to adjust which abodes of the erase block are available to represent stored user data values.

Abstract: A system including an interference module and a programming module. The interference module is configured to generate interference values based on (i) a state to which a memory cell is to be programmed and (ii) states of one or more memory cells located near the memory cell. The interference values indicate effects of the states of the one or more memory cells on the state to which the memory cell is to be programmed. The programming module is configured to determine a programming value to program the memory cell to the state based on one or more of the interference values. The one or more of the interference values are selected based on (i) the state to which the memory cell is to be programmed, and (ii) the states of the one or more memory cells.

Abstract: Techniques for providing floating body memory devices are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor device comprising a floating gate, a control gate disposed over the floating gate, a body region that is electrically floating, wherein the body region is configured so that material forming the body region is contained under at least one lateral boundary of the floating gate, and a source region and a drain region adjacent the body region.

Abstract: Three-dimensional semiconductor devices are provided. The three-dimensional semiconductor device includes a substrate, a buffer layer on the substrate. The buffer layer includes a material having an etching selectivity relative to that of the substrate. A multi-layer stack including alternating insulation patterns and conductive patterns is provided on the buffer layer opposite the substrate. One or more active patterns respectively extend through the alternating insulation patterns and conductive patterns of the multi-layer stack and into the buffer layer. Related fabrication methods are also discussed.