Abstract: A data compensating method for a flash memory is provided. Firstly, a first threshold voltage distribution curve of the cells of the flash memory with a first storing state is acquired. Then, a second threshold voltage distribution curve of the cells of the flash memory with a second storing state is acquired. Then, a first occurrence probability of a first type ICI pattern of the first storing state is calculated according to a statistic voltage range and the first threshold voltage distribution curve. A second occurrence probability of the first type ICI pattern of the second storing state is acquired according to the statistic voltage range and the second threshold voltage distribution curve. During a read cycle, storing states of central cells corresponding to the first type ICI pattern are compensated according to the first occurrence probability and the second occurrence probability.

Abstract: A device comprises an address storage device. A first circuit includes a first flash memory, configured to sequentially receive first and second addresses and store the first address in the address storage device. The first circuit has a first set of control inputs for causing the first circuit to perform a first operation from the group consisting of read, program and erase on a cell of the first flash memory corresponding to a selected one of the first and second addresses. A second circuit includes a second flash memory, configured to receive the second address. The second circuit has a second set of control inputs for causing the second circuit to read data from a cell of the second flash memory corresponding to the second address while the first operation is being performed.

Abstract: In a method of operating a nonvolatile memory device having a substrate and first through n-th word lines stacked in a direction perpendicular to the substrate, first through k-th word line voltages are applied to first through k-th word lines, respectively, which are formed adjacent to the substrate, among the first through n-th word lines. (k+1)-th through n-th word line voltages are applied to (k+1)-th through n-th word lines, respectively, which are formed above the first through k-th word lines, among the first through n-th word lines. An erase voltage, which is higher than the first through n-th word line voltages, is applied to the substrate, where n represents an integer equal to or greater than two, and k represents a positive integer smaller than n. Each of the (k+1)-th through n-th word line voltages is lower than each of the first through k-th word line voltages.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for controlling a read time of an electronic memory device. A method includes reading data from an integrated circuit of storage using a read time for the integrated circuit of storage. A method includes adjusting a read time for an integrated circuit of storage. A method includes reading data from a same integrated circuit of storage using an adjusted read time for the integrated circuit of storage.

Abstract: A memory includes an array of non-volatile memory cells. Each cell includes a select transistor in series connection with a floating gate transistor. The cells are configurable for operation in a programming mode and an erase mode. When in the programming mode, the gate terminal of the select transistor is driven with a negative bias voltage so as to bias that transistor in the accumulation region and eliminate sub-threshold leakage. When in the erase mode, the gate terminal of a pull-down transistor coupled to the memory cell is driven with a negative bias voltage so as to bias that transistor in the accumulation region and eliminate sub-threshold leakage.

Abstract: A non-volatile memory cell comprises a coupling device, a first and a second select transistor, and a first and a second floating gate transistor is disclosed. The coupling device is formed in a first conductivity region. The first select transistor is serially connected to the first floating gate transistor and the second select transistor. Moreover, the first select transistor, the first floating gate transistor, and the second select transistor are formed in a second conductivity region. The second floating gate transistor is formed in a third conductivity region, wherein the first conductivity region, the second conductivity region, and the third conductivity region are formed in a fourth conductivity region. The first conductivity region, the second conductivity region, and the third conductivity region are wells, and the fourth conductivity region is a deep well. The third conductivity region surrounds the first conductivity region and the second conductivity region.

Abstract: The present invention relates to a semiconductor memory device and a program method thereof. The program method according to an embodiment of the present invention includes: precharging a plurality of cell strings by providing a positive voltage to the plurality of cell strings through a common source line; and performing a program operation on selected memory cells by applying a program pulse to the selected memory cells.

Abstract: A system and method for storing data uses multiple flash memory dies. Each flash memory die includes multiple flash memory cells. A charge pump is adapted to supply charge at a predetermined voltage to each flash memory die of the flash memory dies, and an interface is adapted to receive instructions for controlling the charge pump.

Abstract: An integrated circuit includes a circuit block to utilize a load current at a load voltage from a power input and two or more charge pump arrays. The outputs of the charge pump arrays are coupled to the power input of the circuit block. The integrated circuit includes one or more modifiable elements to disable one or more of the two or more charge pump arrays.

Abstract: A data erasing method of a solid state drive is provided. The solid state drive includes a memory module. The memory module includes a block. A data to be erased is stored in the block. The data erasing method includes steps of performing a first erasing operation to erase the block, programming the block after the first erasing operation, and performing a second erasing operation to erase the block.

Abstract: A method for writing data in a semiconductor storage device and a semiconductor storage device are provided, that can reduce variations in readout current from a sub storage region which serves as a reference cell for the memory cells of the semiconductor storage device, thereby preventing an improper determination from being made when determining the readout current from a memory cell. In the method, data is written on a memory cell in two data write steps by applying voltages to the first and second impurity regions of the memory cell, the voltages being different in magnitude from each other.

Abstract: A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability.

Abstract: A system including a state set module to arrange states of a memory cell in three sets. The memory cell stores three bits when programmed to a state. Each set includes three rows of bits. In a set, a row includes one of the three bits of the states. The first, second, and third rows of the first, second, and third sets include a first number of state transitions. The second, third, and first rows of the first, second, and third sets include a second number of state transitions. The third, first, and second rows of the first, second, and third sets include a third number of state transitions. A write module writes first, second, and third portions of data to a plurality of memory cells, each memory cell storing the three bits when programmed to a state, using states selected respectively from the first, second, and third sets.

Abstract: An apparatus, system, and method are disclosed for managing erase operations for a data storage medium. A method includes determining whether a use threshold for one or more non-volatile storage cells is satisfied. A method includes performing a default erase operation for the one or more storage cells in response to determining that the use threshold is not satisfied. A method includes performing an extended erase operation for the one or more storage cells in response to determining that the use threshold is satisfied. An extended erase operation may include a greater number of erase pulse iterations than a default erase operation.

Abstract: An embedded Multi-Time-Read-Only-Memory having a (MOSFET) cells' array having an initial threshold voltage (VT0) including the MOSFETs arranged in a row and column matrix, having gates in each row coupled to a wordline (WL) running in a first direction and sources in each one of the columns coupled to a bitline (BL) running in a second direction; creating two dimensional meshed source line network running in the first and second directions, in a standby state, wherein BLs and MSLN are at a voltage (VDD), and the WLs are at ground; storing a data bit by trapping charges in a dielectric of a target MOSFET, VT0 of target MOSFET increasing to another voltage (VT1) by a predetermined amount (?VT); reading a data bit by using the MOSFET threshold voltage having one of VT0 or VT1 to determine a trapped or de-trapped charge state, and resetting the data bit to a de-trapped state by de-trapping the charge.

Abstract: A non-volatile memory device is provided. The non-volatile memory device includes a cell string including a plurality of non-volatile memory cells; and an operation control block configured to supply a program voltage to a word line connected to a selected non-volatile memory cell among the plurality of non-volatile memory cells during a program operation, configured to supply a first negative voltage to the word line during a detrapping operation, and configured to supply a second negative voltage as a verify voltage to the word line during a program verify operation.

Abstract: The present disclosure includes devices, methods, and systems including memory cell sensing using a boost voltage. One or more embodiments include pre-charging and/or floating a data line associated with a selected memory cell, boosting the pre-charged and/or floating data line, and determining a state of the selected memory cell based on a sensed discharge of the data line after boosting the data line.

Abstract: A nonvolatile semiconductor memory device according to an aspect includes a semiconductor substrate, a memory cell array, memory strings, drain side selection transistors, source side selection transistors, word lines, bit lines, a source line, a drain side selection gate line, a source side selection gate line, and a control circuit. The control circuit applies a first voltage to a selected bit line, thereby executing an erase operation on a selected memory string connected to the selected bit line, and the control circuit applies a second voltage to a non-selected bit line, thereby prohibiting the erase operation for the selected memory string connected to the non-selected bit line. The first voltage is more than the second voltage.

Abstract: A nonvolatile memory device including a memory cell arranged at a region where a word line and a bit line cross each other; a control signal generator configured to be enabled while the nonvolatile memory device operates in a test mode, and generate control signals which are not provided from an external device, based on a reference signal provided from the external device; and a control logic configured to control an operation for the memory cell according to the generated control signals.

Abstract: Data is programmed into and read from a set of target memory cells. When reading the data, temperature compensation is provided. The temperature compensation is based on temperature information and the state of one or more neighbor memory cells. In one embodiment, when data is read from set of target memory cells, the system senses the current temperature and determines the differences in temperature between the current temperature and the temperature at the time the data was programmed. If the difference in temperature is greater than a threshold, then the process of reading the data includes providing temperature compensation based on temperature information and neighbor state information. In one alternative, the decision to provide the temperature compensation can be triggered by conditions other than a temperature differential.

Abstract: A Y-decoder includes a selection unit and a Y-MUX. The selection unit is coupled to the memory array for selecting the column lines. The Y-MUX is coupled to the selection unit for supplying a voltage to the selected column line. The Y-MUX includes a first switch, a second switch, a third switch and a fourth switch coupled in parallel. The first switch and the second switch are respectively for receiving a first shielding voltage and a second shielding voltage. The third switch and the fourth switch are respectively for receiving a first sensing voltage and a second sensing voltage.

Abstract: A three-dimensional (3D) non-volatile memory includes a memory cell array and a merge driver configured to apply a merge voltage at the same level to a common source line and a bulk in the memory cell array.

Abstract: Disclosed are a semiconductor memory device and an operating method thereof. The semiconductor memory device includes a memory cell block including a plurality of memory cells, a voltage providing unit suitable for providing a pass voltage or a read voltage to word lines coupled with the memory cells and a control circuit suitable for controlling the voltage providing unit to adjust a pass voltage applied to the memory cells disposed at one side of a selected memory cell and a pass voltage applied to the memory cells disposed at the other side of the selected memory cell based on an address of a word line of the selected memory cell among the memory cells during a read operation or a verification operation.

Abstract: A method, apparatus, and manufacture for memory device startup is provided. Flash memory devices are configured such that, upon the power supply voltage reaching a pre-determined level, each flash memory is arranged to load the random access memory with instructions for the flash memory, and then execute a first portion of the instructions for the flash memory. After executing the first portion of the instructions for the flash memory, each separate subset of the flash memories waits for a separate, distinct delay period. For each flash memory, after the delay period expires for that flash memory, the flash memory executes a second portion of the instructions for the flash memory.

Abstract: A memory includes a cell string including a plurality of memory cells connected in series, a bit line connected to the cell string, a voltage transfer unit configured to electrically connect the bit line and a sensing node in response to a control signal, and a page buffer configured to sense a voltage of the bit line through the sensing node in a sensing period, wherein the page buffer decides a voltage level of the control signal based on a threshold voltage of the target memory cell, which corresponds to a verification target among the plurality of memory cells in the sensing period.

Abstract: Disclosed is an in-memory computing device including a memory array with non-volatile memory cells arranged in rows and columns; a multiple row decoder to activate at least two cells in a column of the memory array at the same time to generate a parametric change in a bit line connected to at least one cell in the column; and circuitry to write data associated with the parametric change into the memory array. Additionally disclosed is a method of computing inside a memory array including non-volatile memory cells arranged in rows and columns, the method includes activating at least two cells in a column of the memory array at the same time to generate a parametric change in a bit line connected to at least one cell in the column; and writing data associated with the parametric change into the memory array.

Abstract: A semiconductor storage device including a memory cell array including a memory cell and a circuit element including first wirings and a selection element, the first wirings having a wiring width smaller than a resolution limit of an exposure apparatus. The first wirings extend in a first direction and are aligned in a second direction crossing with the first direction. A second wiring, being one of the first wirings, is cut by at least one cut region. The first wiring adjacent to the second wiring in the second direction extends continuously in the first direction in a portion adjacent to the cut region in the second direction.

Abstract: According to one embodiment, a nonvolatile semiconductor storage device includes a memory cell array where memory cells are arranged in a cell well in a row direction and a column direction in a matrix; word lines which select the memory cell in the row direction; bit lines which select the memory cell in the column direction; a sense amplifier which determines a value stored in the memory cell based on a potential of the bit line; a peripheral transistor in the memory cell array which is arranged in the periphery of the memory cell array; and an enhancement type transistor which drives a gate of the peripheral transistor.

Abstract: A system and apparatus for adjusting threshold program and erase voltages in a memory array, such as a floating gate memory array, for example. One such method includes applying a first voltage level to a first edge word line of a memory block string and applying a second voltage level to a second edge word line of the memory block string. Such a method might also include applying a third voltage level to non-edge word lines of the memory block string.

Abstract: Threshold voltages in a charge storage memory are controlled by threshold voltage placement, such as to provide more reliable operation and to reduce the influence of factors such as neighboring charge storage elements and parasitic coupling. Pre-compensation or post-compensation of threshold voltage for neighboring programmed “aggressor” memory cells reduces the threshold voltage uncertainty in a flash memory system. Using a buffer having a data structure such as a lookup table provides for programmable threshold voltage distributions that enables the distribution of data states in a multi-level cell flash memory to be tailored, such as to provide more reliable operation.

Abstract: Methods of operating memory systems and nonvolatile memory devices include performing error checking and correction (ECC) operations on M pages of data read from a first “source” portion of M-bit nonvolatile memory cells within the nonvolatile memory device to thereby generate M pages of ECC-processed data, where M is a positive integer greater than two (2). A second “target” portion of M-bit nonvolatile memory cells within the nonvolatile memory device is then programmed with the M pages of ECC-processed data using, for example, an address-scrambled reprogramming technique.

Abstract: Methods of maintaining a state of a memory cell without interrupting access to the memory cell are provided, including applying a back bias to the cell to offset charge leakage out of a floating body of the cell, wherein a charge level of the floating body indicates a state of the memory cell; and accessing the cell.

Abstract: A non-volatile memory system that has junctionless transistors is provided that uses suppression of the formation of an inversion-layer source and drain in the junctionless transistors to cause a discontinuous channel in at least one string. The system may include NAND flash memory cells composed of junctionless transistors, and has a set of wordlines. During program operation, a selected wordline of the set of wordlines is biased at a program voltage, and wordline voltage low enough to suppress the formation of source/drains is applied on at least one word line on a source side of the selected wordline such that a channel isolation occurs thereby causing the discontinuous channel in the at least string.

Abstract: Some embodiments include an apparatus having data lines coupled to memory cell strings and a selector configured to selectively couple one of the data lines to a node. The memory cell strings and the selector can be formed in the same memory array of the apparatus. Other embodiments including additional apparatus and methods are described.

Abstract: A method for erasing a first sub-block of a plurality of sub-blocks included in a block of a non-volatile memory device, wherein the first sub-block includes at least one word line, includes applying an erase voltage to a substrate, applying a third voltage lower than the erase voltage to the word line of the first sub-block, applying a first voltage at least one word line adjacent to the word line of the first sub-block, and applying a second voltage that is the same as or similar to the erase voltage to the other word lines, where the first voltage has a level between the third voltage and the second voltage.

Abstract: A nonvolatile semiconductor memory device according to one embodiment of the present invention includes: a memory cell array and a control circuit. The control circuit executes a first reading operation and a second reading operation. The first reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between a control gate electrode and source of the selected memory cell to a first value. The second reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between the control gate electrode and source of the selected memory cell to a second value lower than the first value. When executing the second reading operation, the control circuit keeps a voltage of the control gate electrode of the selected memory cell to 0 or a positive value.

Abstract: A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines.

Abstract: An embedded Multi-Time-Read-Only-Memory having a (MOSFET) cells' array having an initial threshold voltage (VT0) including the MOSFETs arranged in a row and column matrix, having gates in each row coupled to a wordline (WL) running in a first direction and sources in each one of the columns coupled to a bitline (BL) running in a second direction; creating two dimensional meshed source line network running in the first and second directions, in a standby state, wherein BLs and MSLN are at a voltage (VDD), and the WLs are at ground; storing a data bit by trapping charges in a dielectric of a target MOSFET, VT0 of target MOSFET increasing to another voltage (VT1) by a predetermined amount (?VT); reading a data bit by using the MOSFET threshold voltage having one of VT0 or VT1 to determine a trapped or de-trapped charge state, and resetting the data bit to a de-trapped state by de-trapping the charge.

Abstract: This disclosure concerns memory kink compensation. One method embodiment includes applying a number of sequentially incrementing programming pulses to a memory cell, with the sequential programming pulses incrementing by a first programming pulse step voltage magnitude. A seeding voltage is applied after applying the number of sequentially incrementing programming pulses. A next programming pulse is applied after applying the seeding voltage, with the next programming pulse being adjusted relative to a preceding one of the sequentially incrementing programming pulses by a second programming pulse step voltage magnitude. The second programming pulse step voltage magnitude can be less than the first programming pulse step voltage magnitude.

Abstract: A method is provided for programming a nonvolatile memory device, which includes multiple memory cells connected in series in a direction substantially perpendicular to a substrate. The method includes programming a first memory cell of the multiple memory cells, and programming a second memory cell of the multiple memory cells after the first memory cell is programmed, the second memory cell being closer to the substrate than the first memory cell. A diameter of a channel hole of the first memory cell is larger than a diameter of a channel hole of the second memory cell.

Abstract: Voltage generation devices and methods are useful in determining a data state of a selected memory cell in a memory device. Voltages can be generated in response to a first current and a second current. The first current is responsive to a memory device operation and a memory cell data state associated with the memory device operation, while the second current is responsive to a temperature associated with the memory device and to the memory cell data state associated with the memory device operation.

Abstract: The present disclosure relates to a memory cell comprising a vertical selection gate extending in a trench made in a substrate, a floating gate extending above the substrate, and a horizontal control gate extending above the floating gate, wherein the floating gate also extends above a portion of the vertical selection gate over a non-zero overlap distance. Application mainly to the production of a split gate memory cell programmable by hot-electron injection.

Abstract: Apparatuses, systems, and methods are disclosed for a read operation for a non-volatile memory. A method includes determining whether one or more non-volatile storage cells satisfy a predefined condition. A method includes preparing the one or more non-volatile storage cells for use prior to satisfying a read request from a storage client using the one or more non-volatile storage cells in response to determining that a predefined condition is satisfied.

Abstract: Systems and methods are disclosed for reducing programming interference in solid-state memory using a program suspend command. A data storage system includes a non-volatile memory array including a plurality of non-volatile memory devices and a controller configured to partially program a first cell coupled to a first word line. When a programming criterion associated with the first cell is met, the controller executes a program suspend command after which a second cell coupled to the first word line is at least partially programmed. Programming of the first cell is resumed following said at least partial programming of the second cell.

Abstract: A method of updating a counter in a flash memory includes a first phase where a set of values capable of being taken by the counter are programmed in at least one page of the flash memory. A second phase of updating the counter programs a state zero in the flash memory each time the counter is incremented/decremented.

Abstract: During a phase of programming the cell, a first voltage is applied to the source region and a second voltage, higher than the first voltage, is applied to the drain region until the cell is put into conduction. The numerical value of the item of data to be written is controlled by the level of the control voltage applied to the control gate and the item of data is de facto written with the numerical value during the putting into conduction of the cell. The programming is then stopped.

Abstract: The present disclosure relates to a memory comprising at least one word line comprising a row of split gate memory cells each comprising a selection transistor section comprising a selection gate and a floating-gate transistor section comprising a floating gate and a control gate. According to the present disclosure, the memory comprises a source plane common to the memory cells of the word line, to collect programming currents passing through memory cells during their programming, and the selection transistor sections of the memory cells are connected to the source plane. A programming current control circuit is configured to control the programming current passing through the memory cells by acting on a selection voltage applied to a selection line.

Abstract: The inventive concept relates to a nonvolatile memory device and a method of detecting a defective word line. The method includes executing a defective word line detection operation using a program/erase voltage applied to a selected word line, wherein the defective word line detection operation determines whether or not the selected word line is defective in relation to respective word line voltage responses for the first and second segments during execution of the program/erase operation.

Abstract: A semiconductor device includes a memory cell array including a vertical channel layer, two or more selection transistors, and a plurality of memory cells formed along the vertical channel; a peripheral circuit suitable for programming the two or more selection transistors and the memory cells; and a control circuit suitable for controlling the peripheral circuit to decrease a pass voltage applied to one word line adjacent to two or more selection lines coupled to the respective selection transistors, during a program operation in which the peripheral circuit applies a program voltage to the two or more selection lines and applies the pass voltage to a plurality of word lines connected to the memory cells.

Abstract: In a programming operation, selected storage elements on a selected word line are programmed while unselected storage elements on the selected word line are inhibited from programming by channel boosting. To provide a sufficient but not excessive level of boosting, the amount of boosting can be set based on a data state of the unselected storage element. A greater amount of boosting can be provided for a lower data state which represents a lower threshold voltage and hence is more vulnerable to program disturb. A common boosting scheme can be used for groups of multiple data states. The amount of boosting can be set by adjusting the timing and magnitude of voltages used for a channel pre-charge operation and for pass voltages which are applied to word lines. In one approach, stepped pass voltages on unselected word lines can be used to adjust boosting for channels with selected data states.