Abstract: A method of performing an operation on a non-volatile memory (NVM) cell of a memory device is disclosed. The pass transistor of the NVM cell is an asymmetric transistor including a source with a halo implant. The source of the pass transistor is coupled to a common source line (CSL) that is shared among NVM cells of a sector of NVM cells. The operation may be performed by applying a first signal to a word line (WLS) coupled to a gate of a memory transistor of the NVM cell and applying a second signal to a bit line (BL) coupled to a drain of the memory transistor of the NVM cell.

Abstract: A nonvolatile memory device includes memory cells stacked in a direction perpendicular to a substrate and further includes a first memory cell string connected between a selected bit line and a selected string selection line, a second memory cell string connected between the selected bit line and an unselected string selection line, and a third memory cell string connected to an unselected bit line. During a bit line setup section of a program operation, a ground voltage is provided to the selected bit line and a power supply voltage provided to the unselected string selection line is changed to the ground voltage.

Abstract: Techniques are provided for avoiding over-programming which can occur on memory cells connected to a data word line at a source-side of a block of word lines. A gradient in the channel potential is created during a program voltage between the data word line and an adjacent dummy word line. This gradient generates electron-hole pairs which can contribute to over programming, where the over programming is worse at higher temperatures. In one aspect, pass voltages of unselected word lines are set to be relatively lower when the temperature is relatively higher, and when the selected word line is among a set of one or more source-side word lines. On the other hand, the pass voltages are set to be relatively higher when the temperature is relatively higher, and when the selected word line is not among the one or more source-side word lines.

Abstract: A plurality of flash memory wordlines of a flash storage device are divided into a plurality of wordline groups based on read error counts associated with the wordlines and a plurality of read level offsets. Each wordline group is associated with one of a plurality of read level offsets determined while dividing the plurality of flash memory wordlines, and associations between the plurality of read level offsets and the plurality of wordline groups are stored for use in connection with read levels to read the flash memory wordlines of the respective wordline groups.

Abstract: A method includes, in a plurality of memory cells that share a common isolation layer and store in the common isolation layer quantities of electrical charge representative of data values, assigning a first group of the memory cells for data storage, and assigning a second group of the memory cells for protecting the electrical charge stored in the first group from retention drift. Data is stored in the memory cells of the first group. Protective quantities of the electrical charge that protect from the retention drift in the memory cells of the first group are stored in the memory cells of the second group.

Abstract: A nonvolatile memory device comprises a cell array connected to a plurality of bit lines in an all bit line structure, a page buffer circuit connected to the plurality of bit lines, and control logic configured to control the page buffer circuit. The control logic controls the page buffer circuit to sense memory cells corresponding to both even-numbered and odd-numbered columns of a selected page in a first read mode and to sense memory cells corresponding to one of the even-numbered and odd-numbered columns of the selected page in a second read mode. A sensing operation is performed at least twice in the first read mode and once in the second read mode.

Abstract: Adaptive write operations for non-volatile memories select programming parameters according to monitored programming performance of individual memory cells. In one embodiment of the invention, programming voltage for a memory cell increases by an amount that depends on the time required to reach a predetermined voltage and then a jump in the programming voltage is added to the programming voltage required to reach the next predetermined voltage. The adaptive programming method is applied to the gate voltage of memory cells; alternatively, it can be applied to the drain voltage of memory cells along a common word line. A circuit combines the function of a program switch and drain voltage regulator, allowing independent control of drain voltage of selected memory cells for parallel and adaptive programming. Verify and adaptive read operations use variable word line voltages to provide optimal biasing of memory and reference cells during sensing.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: An internal voltage generation circuit includes a charging unit suitable for charging electrical charges for a time corresponding to a control signal; a charge control unit suitable for generating the control signal, which is activated for a time corresponding to temperature information, and controlling a charging operation of the charging unit; and an output unit suitable for generating an internal voltage based on charge amount by the charging operation.

Abstract: A data storage device includes a nonvolatile memory device including a target memory cell and one or more adjustment memory cells sharing bit lines with the target memory cell, one or more of the adjustment memory cell are adjacent memory cells adjacent to the target memory cells, and suitable for reading out data therefrom or storing data therein; and a controller suitable for adjusting threshold voltages of the adjustment memory cells based on threshold voltages it of the target memory cell and the adjacent memory cells.

Abstract: In a data transmission system, one or more signal supply voltages for generating the signaling voltage of a signal to be transmitted are generated in a first circuit and forwarded from the first circuit to a second circuit. The second circuit may use the forwarded signal supply voltages to generate another signal to be transmitted back from the second circuit to the first circuit, thereby obviating the need to generate signal supply voltages separately in the second circuit. The first circuit may also adjust the signal supply voltages based on the signal transmitted back from the second circuit to the first circuit. The data transmission system may employ a single-ended signaling system in which the signaling voltage is referenced to a reference voltage that is a power supply voltage such as ground, shared by the first circuit and the second circuit.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a control gate formed over the substrate. The semiconductor device structure further includes a memory gate formed over the substrate and a first spacer formed on a sidewall of the memory gate. The semiconductor device structure further includes a contact formed over the memory gate, wherein a portion of the contact extends into the first spacer.

Abstract: To maintain constant an output voltage of a boosted voltage circuit even when a program current of a nonvolatile memory increases; in a boosted voltage circuit provided in a semiconductor device, an output voltage of a charge pump is detected by a voltage dividing circuit, and on-off control is performed on an oscillation circuit for driving the charge pump so that the detected output voltage becomes constant. Further, an output current of the charge pump is detected, and a control current according to a magnitude of the detected output current is generated. The control current is fed into or drawn from a coupling node between a plurality of series-coupled resistance elements configuring the voltage dividing circuit.

Abstract: A semiconductor device may include gate structures spaced apart above a top surface of a substrate. The gate structures may include a horizontal electrode extending in a first direction parallel with the top surface of a substrate. An isolation insulating layer may be disposed between the gate structures. A plurality of cell pillars may penetrate the horizontal electrode and connect to the substrate. The plurality of cell pillars may include a minimum spacing defined by a shortest distance between any two of the plurality of cell pillars. The thickness of the horizontal electrode may be greater than the minimum spacing of the cell pillars.

Abstract: A semiconductor device that includes transistors with different threshold voltages is provided. Alternatively, a semiconductor device including a plurality of kinds of circuits and transistors whose electrical characteristics are different between the circuits is provided. The semiconductor device includes a first transistor and a second transistor. The first transistor includes an oxide semiconductor, a conductor, a first insulator, a second insulator, and a third insulator. The conductor has a region where the conductor and the oxide semiconductor overlap with each other. The first insulator is positioned between the conductor and the oxide semiconductor. The second insulator is positioned between the conductor and the first insulator. The third insulator is positioned between the conductor and the second insulator. The second insulator has a negatively charged region.

Abstract: A multistage read can dynamically change wordline capacitance as a function of threshold voltage of a memory cell being read. The multistage read can reduce current spikes and reduce the heating up of a memory cell during a read. A memory device includes a global wordline driver to connect a wordline of a selected memory cell to the sensing circuit, and a local wordline driver local to the memory cell. After the wordline is charged to a read voltage, control logic can selectively enable and disable a portion or all of the global wordline driver and the local wordline driver in conjunction with applying different discrete voltage levels to the bitline to perform a multistage read.

Abstract: A semiconductor device includes a plurality of electrically coupled memory cells in a generally vertical configuration extending in a generally perpendicular direction from a semiconductor substrate, a peripheral circuit configured to program the memory cells, and a control circuit configured to program a memory cell selected from the plurality of memory cells to trap charge in the selected memory cell, and to issue at least one command to the peripheral circuit to manage a dispersion of at least a portion of the trapped charge between memory cells adjacent to the selected memory cell.

Abstract: According to one embodiment, a memory device includes a substrate, a conductive wire provided above the substrate to extend in a first direction and including an end portion decreases in width toward a distal end, and a contact connected to the conductive wire at least a side surface of the end portion. The end portion includes, in the contact, a first portion having a shortest distance from an outer peripheral surface of the contact and a second portion extending from the first portion and having a distance from the outer peripheral surface of the contact longer than the shortest distance.

Abstract: Techniques that allow dynamic management of throughput in a memory device based on a power supply voltage are provided. In an example embodiment, a method of operating a memory device comprises monitoring on the power supply level applied to the device and determining a corresponding number of bitlines that the device can activate at the same time, generating a control signal based on the number of bitlines, and using the control signal to activate a portion of the memory device corresponding to the determined number of bitlines.

Abstract: A D/A conversion circuit includes a plurality of resistors that are connected to each other in series, and a plurality of MOS transistors that are connected to terminals of the plurality of resistors, respectively. The plurality of resistors and the plurality of MOS transistors are formed on a semiconductor substrate. Each of the plurality of resistors is constituted by a resistive element and a plurality of contacts provided in the resistive element. The plurality of MOS transistors are disposed so that a plurality of virtual straight lines that pass through each of the plurality of contacts and are perpendicular to a longitudinal direction of the resistive element pass between gate electrodes of two adjacent MOS transistors, when seen in a plan view of the semiconductor substrate.

Abstract: A circuit includes a memory cell having a first control line and a second control line, the first control line carrying a first control signal, the second control line carrying a second control signal. A first circuit is coupled to the first control line, the second control line, and a node, and a second circuit is coupled to the node and responds to a timing of the first control signal and the second control signal. The first circuit and the second circuit, based on the first control signal and the second control signal, are configured to generate a node signal on the node, and a logical value of the node signal indicates a write disturb condition of the memory cell.

Abstract: A method of operating a storage device may include receiving a read command and a read address, performing a read operation on selected memory cells corresponding to a selected string selection line and a selected word line based on the read address and performing a reliability verification read on unselected memory cells. Data read by the read operation may be output to an external device, and data read by the reliability verification read may be not output to the external device.

Abstract: A method is provided for programming a memory cell connected to a selected word line in a memory device. The method includes performing one programming pass of a multi-pass programming operation for the memory cell, wherein a first set of program pulses is applied to the selected word line during the one programming pass, determining a number of the program pulses applied to the selected word line during the one programming pass, determining a difference between the determined number of program pulses applied to the selected word line during the one programming pass and a predetermined number of program pulses, adjusting a parameter of a second set of program pulses for the another programming pass based on the determined difference, and performing the another programming pass for the set of memory cells, wherein the second set of program pulses is applied to the selected word line during the another programming pass.

Abstract: A method is provided for operating a NAND array that includes a plurality of blocks of memory cells. A block of memory cells includes a plurality of NAND strings having channel lines between first string select switches and second string select switches. The plurality of NAND strings shares a set of word lines between the first and second string select switches. A channel-side erase voltage is applied to the channel lines through the first string select switches in a selected block. Word line-side erase voltages are applied to a selected subset of the set of word lines in the selected block to induce tunneling in memory cells coupled to the selected subset. Word line-side inhibit voltages are applied to an unselected subset of the set of word lines in the selected block to inhibit tunneling in memory cells coupled to the unselected subset.

Abstract: A memory system includes a semiconductor memory device and a controller. The semiconductor memory device performs a writing operation with either a first writing method or a second writing method. The controller selects one of the first writing method and the second writing method upon receipt of a write instruction and output a write command indicating the selected writing method to the semiconductor memory device. The controller selects the writing method in accordance with a storage location in the semiconductor memory device targeted by the write instruction.

Abstract: Apparatuses, systems, and methods are disclosed for a read operation for a non-volatile memory. A method includes determining whether one or more non-volatile storage cells satisfy a predefined condition. A method includes preparing the one or more non-volatile storage cells for use prior to satisfying a read request from a storage client using the one or more non-volatile storage cells in response to determining that a predefined condition is satisfied.

Abstract: An apparatus including: a first switch configured to provide a feed-forward path at an input of a first amplifier of a plurality of amplifiers coupled together at a single port, the feed-forward path configured to substantially reduce a leakage current into an input of a second amplifier of the plurality of amplifiers.

Abstract: A nonvolatile semiconductor memory device according to one embodiment of the present invention includes: a memory cell array and a control circuit. The control circuit executes a first reading operation and a second reading operation. The first reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between a control gate electrode and source of the selected memory cell to a first value. The second reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between the control gate electrode and source of the selected memory cell to a second value lower than the first value. When executing the second reading operation, the control circuit keeps a voltage of the control gate electrode of the selected memory cell to 0 or a positive value.

Abstract: An operating method of a semiconductor device includes repeating an erase loop operable to lower threshold voltages of memory cells in a selected memory block by applying an erase voltage to the selected memory block and performing an erase verification to determine whether the threshold voltages of the memory cells in the selected memory block are less than or equal to a target level, wherein an erase voltage is increased by a voltage difference wherein the voltage difference is increased between successive applications of two or more of the erase loops, and repeating a program loop including applying a program voltage to a selected word line to increase threshold voltages of memory cells electrically coupled to the selected word line and performing a program verification to determine whether the threshold voltages are greater than or equal to a target level, wherein a program voltage is increased by a voltage difference wherein the voltage difference is increased between successive applications of two or mo

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cells, a peripheral circuit for applying a program voltage and verifying whether a program of the memory cell array has been completed, and a control logic for controlling the peripheral circuit to apply an increased program voltage to the memory cell array while applying a reprogram permission voltage to a bit line coupled to the memory cells that previously passed a program verification but has failed a program re-verification.

Abstract: A semiconductor apparatus includes a voltage supply circuit suitable for outputting a high voltage, a transfer circuit coupled between the voltage supply circuit and a peripheral circuit and suitable for transferring the high voltage to the peripheral circuit and a transfer control circuit suitable for outputting a transfer control signal to the transfer circuit to control the transfer of the high voltage to the peripheral circuit, wherein the transfer control circuit outputs the transfer control signal having a first positive voltage level to a gate of a transistor included in the transfer circuit when the voltage supply circuit outputs the high voltage to the transfer circuit.

Abstract: A method for determining a storing state of a flash memory is provided. The method includes the following steps. Firstly, plural first specific cell patterns are programmed into the flash memory. Then, plural second specific cell patterns are programmed into the flash memory. Then, a slicing voltage is adjusted to allow a distinguishable error percentage to be lower than a predetermined value. Afterwards, a first storing state and a second storing state of other cells of the flash memory are distinguished from each other according to the adjusted slicing voltage.

Abstract: A split gate NAND flash memory structure is formed on a semiconductor substrate of a first conductivity type. The NAND structure comprises a first region of a second conductivity type in the substrate with a second region of the second conductivity type in the substrate, spaced apart from the first region. A continuous first channel region is defined between the first region and the second region. A plurality of floating gates are spaced apart from one another with each positioned over a separate portion of the channel region. A plurality of control gates are provided with each associated with and adjacent to a floating gate. Each control gate has two portions: a first portion over a portion of the channel region and a second portion over the associated floating gate and capacitively coupled thereto.

Abstract: Provided is a storage control device including: a detection unit which detects a first timing for performing a first rewriting process of performing only a first operation from among the first operation and a second operation, in a memory cell array in which each bit transitions to a first storage state by the first operation and transitions to a second storage state by the second operation; and a request unit which makes a request for the first rewriting process with respect to the memory cell array, when the first timing is detected.

Abstract: An external power control method includes determining whether to apply a second external voltage to a first node according to a drop of a first external voltage; generating a flag signal according to a drop of the second external voltage when the second external voltage is applied to the first node; transferring a voltage of the first node to a second node in response to the flag signal; and discharging at least one voltage of an internal circuit connected to the second node in response to the flag signal.

Abstract: In one example, a current limited device is coupled between a source line of a memory cell array and a supply voltage, and configured to operate in a constant current mode during an access operation of a memory cell. An array control circuitry may be coupled to the memory cell array, and configured to control the constant current mode and supply an associated select bias voltage to the word line select transistor.

Abstract: In general, techniques are described for resource allocation and deallocation that facilitates power management. A device comprising one or more processors and a memory may be configured to perform the techniques. The processor may be configured to determine usage of a first non-zero subset of a plurality of resources, the plurality of resources allocated and released in accordance with a thermometer data structure. The processors may further be configured to compare the usage of the first non-zero subset of the plurality of resources to a threshold separating the first non-zero subset of the plurality of resources from a second non-zero subset of the plurality of resources, and power on the second non-zero subset of the plurality of resources based at least on the comparison. The memory may be configured to store the threshold.

Abstract: Methods and apparatuses for performing a disturb test on a memory are disclosed. Circuitry may be configured to store test data into one or more data storage cells. A regulation circuit may adjust a level of a power supply coupled to the one or more data storage cells from a first level to a second level. Once the voltage level of the power supply has reached the second level, the circuitry may perform a read operation on the one or more data storage cells. Upon completion of the read operation, the regulation circuit may return the voltage level of the power supply to the first level, and the circuitry may perform another read operation, the results of which, the circuitry may compare to the test data.

Abstract: A non-volatile memory device includes a first word line, a second word line, first memory cells, second memory cells, and an address decoder. The second word line is adjacent to the first word line. The first memory cells are connected to the first word line. The second memory cells are connected to the second word line. The second memory cells are connected to the first memory cells, respectively. The address decoder applies a first voltage to the first word line and applies a second voltage to the second word line in an over program period of the first memory cells. The first voltage is higher than a program voltage of the first and second memory cells. The second voltage is lower than a pass voltage of the first and second memory cells.

Abstract: According to one embodiment, a non-volatile memory device includes a first stacked electrode provided above a underlying layer, a second stacked electrode juxtaposed with the first stacked electrode above the underlying layer, a plurality of first semiconductor layers piercing the first stacked electrode in a direction perpendicular to the underlying layer, and a second semiconductor layer piercing the second stacked electrode in a direction perpendicular to the underlying layer. The device further includes a memory film provided between the first stacked electrode and the first semiconductor layers, and between the second stacked electrode and the second semiconductor layer, and a link part provided between the underlying layer and the first stacked electrode, and between the underlying layer and the second stacked electrode. The link part is electrically connected to one end of each of the first semiconductor layers and one end of the second semiconductor layer.

Abstract: A method of operating a nonvolatile memory device comprises applying a read current with a first level to a nonvolatile memory cell comprising a variable resistance material, determining read data based on the applied read current, checking a syndrome corresponding to the read data to determine whether the read data is pass or fail, changing the read current from the first level to a second level, which is different from the first level, according to the determination of whether the read data is pass or fail, and performing a read-retry operation comprising applying the read current of the second level to the nonvolatile memory cell.

Abstract: Provided is a method of manufacturing a semiconductor device. The method includes forming memory cells which share a data storage layer; performing a first strong program operation on first memory cells, arranged in a checker board pattern among the memory cells; performing a first annealing process after the first strong program operation; performing a second strong program operation on second memory cells arranged in a reverse checker board pattern among the memory cells, and performing a slight program operation on the first memory cells; and performing a second annealing process after the second strong program operation and the slight program operation.

Abstract: A NVDRAM includes a first NV element coupled to a first terminal of a second NV element at a transfer node. A volatile cell has a transfer transistor coupled to the transfer node and has a storage node. A first NV line is coupled to the second terminal of the first NV element. Circuitry applies an alternated signal to the transfer node, couples the second terminal of the second non-volatile element to a second NV line, and applies a program signal across the first and second NV lines during a program mode that establishes a logic state. The circuitry applies a read signal across the first and second NV lines, couples the second terminal of the second NV element to the second NV line, and replaces the alternated signal with floating during a restore mode that loads the logic state into the storage node.

Abstract: Memory, and erasing, programming and reading method thereof are provided. In the memory, a first isolation cell, a second isolation cell and a memory cell have same structure. A first doped region of the memory cell and a second doped region of the first isolation cell are connected with a first bit line, a second doped region of the memory cell and a first doped region of the second isolation cell are connected with a second bit line. A first doped region of the first isolation cell serves as a connection terminal thereof, first and second control gate structures of the first isolation cell are connected together to serve as a control terminal thereof, a second doped region of the second isolation cell serves as a connection terminal thereof, first and second control gate structures of the second isolation cell are connected together to serve as a control terminal thereof.

Abstract: A method and apparatus for conditional cancellation of a calibration procedure is performed. In one embodiment, a memory controller is coupled to memory. The memory controller is configured to convey data and a data strobe signal to the memory. The memory controller may conduct calibrations of a delay of the data strobe signal to ensure sufficient setup and hold time for the data. After an initial calibration, and at each of a number of periodic intervals, the memory controller may determine whether one or more parameters is within a specified range. If one of the one or more parameters is not within its respective specified range, another calibration of the data strobe delay may be performed. However, if each of the one or more parameters is within its respective specified range, the calibration may be canceled.

Abstract: A phase change memory (PCM), a writing method thereof and a reading method thereof are provided. The PCM has a plurality of memory cells. The writing method comprises the following steps. At least one stress pulse is applied for aging at least one of the memory cells. A starting pulse is applied to all of the memory cells of the PCM for decreasing a resistance of each memory cell. A detection pulse is applied to all of the memory cells of the PCM for detecting the resistance of each memory cell. A set pulse is applied to the aged memory cells. A reset pulse is applied to the non-aged memory cells.

Abstract: An erase method for a flash memory is provided. First memory cells of the flash memory are pre-programmed. The first memory cells are disposed in a memory array formed by a plurality of row and column lines. The programmed first memory cells are erased. The erased first memory cells are post-programmed, to repair the over-erased first memory cells. Second memory cells are programmed after the erased first memory cells are post-programmed. The second memory cells are disposed in a first specific column line of the memory array. The first specific column line is arranged after a last column line corresponding to a last valid column address. Third memory cells disposed in a second specific column line of the memory array. The second specific column line is arranged after the last column line and is adjacent to the first specific column line.

Abstract: A memory system includes a memory device, a plurality of memory blocks which include a plurality of memory cells electrically coupled to a plurality of word lines and store data requested from a host; and a controller suitable for programming first data in a first memory cell among the plurality of memory cells based on a write command received from the host, determining a read voltage of the first memory cell, and reading the first data programmed in the first memory cell based on the read voltage in response to a read command received from the host.

Abstract: A flash memory apparatus and data erasing method thereof. The data erasing method includes: setting a plurality of incremental erasing voltages sequentially, and operating a plurality of data erasing operations on memory cells according to the erasing voltages; recording a recoded erasing voltage corresponding to the last data erasing operation; setting a plurality of incremental reading voltage sequentially, operating a plurality of data reading operations on the memory cells, and recording a final reading voltage corresponding to the last reading operation; setting a final erasing voltage for operating a final erasing operation on the memory cells, wherein a voltage level of the final erasing voltage equals to a sum of voltage levels of an erasing verification voltage, the final reading voltage and the recorded erasing voltage.

Abstract: A multi-stage charge pump selects the number of active stages dynamically. In the exemplary embodiment, this is done by having a multi-stage master charge pump section in which the number of active stages is settable and a slave charge pump section that is of the same design as the master section. The master section is used to drive the external load, while the slave section drives an adjustable internal load. The adjustable internal load is set by control logic by comparing the operation of the two sections. The control logic then operates the slave section with a different number of active stages than the master stage in order to determine whether the master stage is using the optimal number of active stages. The control logic can then change the number of active stages accordingly.