From 1,2-epoxy-containing Phenolic Reactant Or With 1,2-epoxy-containing Reactant Patents (Class 528/87)
  • Publication number: 20120149863
    Abstract: Provided herein are isosorbide-based bisphenol polymer structural units and methods of making the same. These structural units may be polymerized with one or more other types of structural units to form polymers, such as polycarbonates.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 14, 2012
    Inventor: Jean Francois Morizur
  • Patent number: 8198342
    Abstract: An aluminum chelate latent curing agent includes an aluminum chelate curing agent, and a porous resin that holds the aluminum chelate curing agent and is obtained by subjecting a polyfunctional isocyanate compound to interfacial polymerization while simultaneously subjecting a polyfunctional radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator. In the aluminum chelate latent curing agent, a silanol compound of the formula (A) is further held in the porous resin. (Ar)mSi(OH)n??(A) In the formula, m is 2 or 3, and the sum of m and n is 4. Ar represents an optionally-substituted aryl group.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: June 12, 2012
    Assignee: Sony Chemical and Information Device Corporation
    Inventor: Kazunobu Kamiya
  • Patent number: 8110614
    Abstract: Adamantane derivatives are provided including a phenolic hydroxyl group-containing adamantane derivative, a glycidyloxy group-containing adamantane derivative, and an adamantyl group-containing epoxy modified acrylate, which exhibit excellent transparency, light resistance, and heat resistance properties. Also provided are resin compositions containing the adamantane derivatives. Further provided are corresponding methods for producing the adamantane derivatives, as well as the resin compositions containing the same.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: February 7, 2012
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Katsuki Ito, Yasunari Okada, Hideki Yamane, Akio Kojima
  • Publication number: 20120024477
    Abstract: Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.
    Type: Application
    Filed: February 3, 2010
    Publication date: February 2, 2012
    Inventor: Michael A. Kropp
  • Patent number: 8084567
    Abstract: The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: December 27, 2011
    Assignee: Dainippon Ink & Chemicals, Inc.
    Inventors: Ichirou Ogura, Kunihiro Morinaga, Kazuo Arita, Yutaka Sato
  • Patent number: 8053031
    Abstract: A two-part epoxy composition is provided that comprises a first part having a mixture of an epoxy resin and an anhydride, and a second part having a curing agent. Also provided is a method for making a substantially bis-?-glycol free epoxy resin for two-part epoxy compositions, and a method for applying a two-part epoxy composition to a system of water piping.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: November 8, 2011
    Assignee: Raven Lining Systems Inc.
    Inventors: David L. Stanley, David J. Dunn
  • Publication number: 20110245434
    Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).
    Type: Application
    Filed: November 23, 2009
    Publication date: October 6, 2011
    Inventor: Maurice J. Marks
  • Patent number: 8017562
    Abstract: Phosphate esters useful for gelling hydrocarbons in combination with a metal source are disclosed along with methods of preparation of the phosphate esters. Fouling in oil refinery towers has been attributed due to distillation of impurities present in phosphate esters used to gel hydrocarbons for oil well fracturing. The improved method of preparation of the phosphate ester results in a product that substantially reduces or eliminates volatile phosphorus, which is phosphorus impurities that distill up to 250° C., and increases the high temperature viscosity of the hydrocarbon gels formed using the phosphate esters.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: September 13, 2011
    Assignee: Brine-Add Fluids Ltd.
    Inventors: David P. Horton, Ioan Ghesner
  • Publication number: 20110213052
    Abstract: The invention relates to a method for producing mono-carboxyfunctionalized dialkylphosphinic acids and esters and salts thereof, characterized in that a) a phosphinic acid source (I) is reacted with olefins (IV) to yield an alkylphosphonic acid, salt or ester (II) thereof in the presence of a catalyst A, b) the alkylphosphonic acid thus obtained, salt or ester (II) thereof is reacted with an ?,?-unsaturated carboxylic acid derivative (V) to yield a mono-carboxyfunctionalized dialkylphosphinic acid derivative (III) in the presence of a catalyst B, wherein R1, R2, R3, R4, R5, R6, R7 are the same or different and stand independently of each other, among other things, for H, C1-C18 alkyl, C6-C18 aryl, C6-C18 aralkyl, C6-C18 alkylaryl, and X and Y are the same or different and stand independently of each other for H, C1-C18 alkyl, C6-C18 aryl, C6-C18 aralkyl, C6-C18 alkylaryl, Mg, Ca, Al, Sb, Sn, Ge, Ti, Fe, Zr, Zn, Ce, Bi, Sr, Mn, Cu, Ni, Li, Na, K and/or a protonized nitrogen base, and the catalyst A is formed b
    Type: Application
    Filed: October 6, 2009
    Publication date: September 1, 2011
    Applicant: CLARIANT FINANCE (BVI) LIMITED
    Inventors: Michael Hill, Harald Bauer, Werner Krause, Martin Sicken
  • Patent number: 7985822
    Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: July 26, 2011
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Kunihiro Morinaga, Yutaka Satou
  • Publication number: 20110168657
    Abstract: The present invention describes plastic materials and food additives that are free or substantially free from endocrine disruptive chemicals. The plastic materials may be used in products which are exposed to individuals in which endocrine disruptive activity is particularly disadvantageous, such as baby bottles, baby toys, food containers, medical containers, animal cages and medical products. The food additives may be used in food products that are ingested by individuals in which endocrine disruptive activity is particularly disadvantageous, such as newborns or the physically infirm. The present invention also describes a series of assays which, when performed in combination, provide a novel method for determining the presence of endocrine disruptive activity.
    Type: Application
    Filed: February 23, 2011
    Publication date: July 14, 2011
    Inventor: George D. Bittner
  • Publication number: 20110118385
    Abstract: A process is for preparing a self-healing composite material including a matrix of epoxy polymer in which a catalyst of ring opening metathesis reaction and vessels containing at least one monomer able to polymerize due to a ring opening metathesis reaction are dispersed. The process includes the preliminary step of dispersing at molecular level the catalyst in a mixture containing at least one precursor of the epoxy polymer, and then the steps of dispersing, in the mixture, the vessels and a tertiary amine acting as curing agent of the precursor, and the step of curing the mixture by at least a first heating stage performed at a temperature between 70 and 90° C. for a time between 1 and 5 hours, and a second heating stage performed at a temperature between 90 and 170° C. for a time between 2 and 3 hours.
    Type: Application
    Filed: November 11, 2010
    Publication date: May 19, 2011
    Applicant: Alenia Aeronautica S.p.A.
    Inventors: Liberata Guadagno, Marialuigia Raimondo, Carlo Naddeo, Annaluisa Mariconda, Raffaele Corvino, Pasquale Longo, Vittoria Vittoria, Salvatore Russo, Generoso Iannuzzo
  • Patent number: 7935775
    Abstract: Disclosed are novel Mannich bases which are produced by using at least one phenolic compound of formula (I): formaldehyde, and at least one polyamine. Also disclosed is a two-step method for producing Mannich bases, by means of which low viscous Mannich bases are obtained.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: May 3, 2011
    Assignee: Sika Technology AG
    Inventors: Ulrich Gerber, Thomas Wigger
  • Patent number: 7935739
    Abstract: An object of the present invention is to provide a cationic curable composition which has low viscosity, can be rapidly photo-cured even in the air, has good adhesion to a substrate such as glass or resin, and is excellent in glass cleaner resistance and water resistance; an ink jet ink, a gravure ink and a hard coating material which comprise the composition; and cured products thereof. A cationic curable composition comprising: (A) 1 to 100 parts by weight of a phenol derivative having 3 or more aromatic rings per molecule, wherein the aromatic ring has a structure in which some or all of hydrogen atoms of phenolic hydroxyl groups of the aromatic ring are substituted by polymerizable functional groups; (B) 1 to 500 parts by weight of a cationic polymerizable compound; and (C) 0.05 to 20 parts by weight of a photo- and/or thermo-cationic initiator is provided.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: May 3, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Atsushi Shimizu, Masao Kondo, Kuon Miyazaki
  • Patent number: 7910181
    Abstract: Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manufacture to induce desired orientations of precursors, subunits, and/or molecular subassemblies. The applied magnetic field steers the precursors, subunits, and/or molecular subassemblies into desirable orientations while the precursors, subunits, and/or molecular subassemblies are assembled or self-assemble into a complex, anisotropic material. One embodiment of the present invention is a class of new, complex, well-ordered, network-like materials that include a ferromagnetic-material-based framework in which organic and/or organometallic compounds are organized.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: March 22, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patricia A. Beck, Sean Zhang
  • Publication number: 20110060076
    Abstract: An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one seed oil based alkanolamide; wherein the seed oil based alkanolamide is derived from the reaction of (i) at least one of a fatty acid ester, a fatty acid and a fatty acid triglyceride; and (ii) at least one alkanolamine; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.
    Type: Application
    Filed: May 18, 2009
    Publication date: March 10, 2011
    Inventors: Robert E. Hefner, JR., Jim D. Earls, Jerry E. White
  • Patent number: 7879951
    Abstract: An organic insulator composition according to example embodiments may include an organic insulating polymer and an epoxy-based crosslinking agent. The epoxy-based crosslinking agent may have an alkyl group or a fluorine-based side chain. The organic insulator composition may be used to form an organic insulating layer having increased chemical resistance. The organic insulating layer may be used in an organic thin film transistor as a gate insulating layer. Consequently, the occurrence of hysteresis may be reduced or prevented during the operation of the organic thin film transistor, thus resulting in relatively homogeneous properties.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: February 1, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun Kyung Lee, Joo Young Kim, Jong Baek Seon
  • Publication number: 20110020555
    Abstract: Two-component epoxy resin compositions are disclosed. The polyepoxide component comprises one or more oligomers having at least one aromatic ring substituent R4X1—in which R4 represents a substituted or unsubstituted aliphatic group having at least 4 carbon atoms, a substituted or unsubstituted cycloaliphatic group having at least 5 carbon atoms, a poly(oxyalkylene) group wherein the average number of carbon atoms per oxyalkylene unit is at least 3, or a aryl group having one or more of the foregoing substituents, bonded directly to the aryl group via a covalent bond or bonded to the aryl group via an oxy, a thio, or a carbonyloxy divalent linking group, or a combination thereof, and X1 represents a covalent bond or a divalent moiety selected from oxy, thio, carbonyloxy, and —X2C(R2)2C(R1)(OH)C(R2)2O—, in which X2 represents a covalent bond or a divalent moiety selected from oxy, thio, and carbonyloxy, R1 represents —H or —C1-14 alkyl, and each R independently represents —H or —CH3.
    Type: Application
    Filed: March 10, 2009
    Publication date: January 27, 2011
    Inventors: Jean C. Wothke, Manuela Ehreiser, Herold Ulrich
  • Publication number: 20110003962
    Abstract: A poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst has a monomodal molecular weight distribution with a reduced content of very high molecular weight species. It also exhibits increased morpholine incorporation in the high molecular weight fraction. Compared to commercially available poly(2,6-dimethyl-1,4-phenylene ether) prepared using a di-n-butylamine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits reduced odor. Compared to other poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits improved molecular weight build during compounding and improved compatibilization with polyamides.
    Type: Application
    Filed: July 1, 2009
    Publication date: January 6, 2011
    Inventors: Alvaro Carrillo, Stephen M. Farnell, Hua Guo
  • Patent number: 7816482
    Abstract: An epoxy-crosslinked sulfonated poly(phenylene) copolymer composition used as proton exchange membranes, methods of making the same, and their use as proton exchange membranes (PEM) in hydrogen fuel cells, direct methanol fuel cell, in electrode casting solutions and electrodes, and in sulfur dioxide electrolyzers. These improved membranes are tougher, have higher temperature capability, and lower SO2 crossover rates.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: October 19, 2010
    Assignee: Sandia Corporation
    Inventors: Michael Hibbs, Cy H. Fujimoto, Kirsten Norman, Michael A. Hickner
  • Publication number: 20100167088
    Abstract: A coating layer prepared from an aqueous electrodeposition coating composition comprising an electrodepositable binder, the binder comprising a tridentate amine ligand-containing resin, and optionally further comprising a metal oxide selected from the group consisting of bismuth oxide, vanadium oxide, manganese oxide, cobalt oxide, zinc oxide, strontium oxide, yttrium oxide, molybdenum oxide, zirconium oxide, lanthanum oxide, and oxides of the lanthanide series of elements provides corrosion protection to a metallic substrate.
    Type: Application
    Filed: December 29, 2008
    Publication date: July 1, 2010
    Applicant: BASF CORPORATION
    Inventors: Abdellatif Chouai, Timothy S. December
  • Publication number: 20100168368
    Abstract: An epoxy resin represented by general formula (I), which satisfies numerical formula (1) mentioned below and comprises hydrolytic halogen of 0.05 wt. % or less, said epoxy resin being produced by the procedure as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. wherein n is an integer of 0 or more; A1 and A2 are residue of divalent phenol, and can be same or different; both R1 and R2 are H or wherein, X: epoxy equivalent (g/eq); Y: phenolic hydroxyl group equivalent (g/eq).
    Type: Application
    Filed: June 25, 2009
    Publication date: July 1, 2010
    Applicant: KUKDO CHEMICAL CO., LTD. (KOREAN CORPORATION)
    Inventors: Masayoshi HANAFUSA, Shuya SHINOHARA
  • Patent number: 7718741
    Abstract: The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.
    Type: Grant
    Filed: March 16, 2006
    Date of Patent: May 18, 2010
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichirou Ogura, Kunihiro Morinaga, Kazuo Arita, Yutaka Sato
  • Patent number: 7718714
    Abstract: An actinic energy ray-curable resin is obtained by reacting an unsaturated monocarboxylic acid (c) with a terminal epoxy group of an epoxy resin having an unsaturated group and a hydroxyl group in its side chains and an epoxy group in its terminal and further reacting a polybasic acid anhydride (d) with the hydroxyl group of the above-mentioned epoxy resin, wherein the above-mentioned epoxy resin is a product of the polyaddition reaction of a reaction product (I) of a polybasic acid anhydride (a) and a compound (b) having at least one unsaturated double bond and one alcoholic hydroxyl group in its molecule, a compound (II) having at least two carboxyl groups in its molecule, and a bifunctional epoxy compound (III), wherein at least either one of the carboxyl group-containing compound (II) and the bifunctional epoxy compound (III) is a compound containing no aromatic ring.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: May 18, 2010
    Assignee: Taiyo Ink Mfg. Co., Ltd.
    Inventor: Shoji Minegishi
  • Publication number: 20100105856
    Abstract: The preparation of epoxy resin compositions which comprise glycidyl ethers comprising cyclohexyl groups and have a low oligomer content is carried out by distillation of compositions which are obtainable by ring hydrogenation of compounds of the general formula (I) where -X- is —CR2—, —CO—, —O, —S—, —SO2—, the radicals R are each, independently of one another, H, C1-6-alkyl, C3-6-cycloalkyl, in which one or more H atoms can be replaced by halogen, the radicals R? are each, independently of one another, C1-4-alkyl, halogen, the indices n are each, independently of one another, 0, 1, 2 or 3, and subsequent reaction of the hydroxyl groups with epichlorohydrin, in thin film evaporators or short path evaporators at a temperature in the range from 150 to 270° C. and a pressure in the range from 0.001 to 1 mbar.
    Type: Application
    Filed: November 30, 2007
    Publication date: April 29, 2010
    Applicant: BASF SE
    Inventors: Michael Henningsen, Lars Wittenbecher
  • Publication number: 20100056747
    Abstract: The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.
    Type: Application
    Filed: November 10, 2009
    Publication date: March 4, 2010
    Applicant: DAINIPPON INK AND CHEMICALS, INC.
    Inventors: Ichirou OGURA, Kunihiro MORINAGA, Kazuo ARITA, Yutaka SATO
  • Publication number: 20100056663
    Abstract: The present invention is an adamantane derivative which provides optical characteristics such as transparency, (long term) light resistance and the like, long term heat resistance, electric characteristics such as dielectric constant and the like, and good mechanical properties; a production method thereof; and a resin composition containing the above-mentioned adamantane derivative that is an adamantane derivative represented by general formulae (I) to (III); for example, a production method of an adamantane derivative represented by the general formula (III) by reacting an adamantane derivative represented by the general formula (II) with acrylates, a resin composition containing an adamantane derivative represented by the general formula (II) and an epoxy resin curing agent, and a resin composition containing an adamantane derivative represented by the general formula (III) and a thermopolymerization initiator or a photopolymerization initiator.
    Type: Application
    Filed: November 21, 2007
    Publication date: March 4, 2010
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Katsuki Ito, Yasunari Okada, Hideki Yamane, Akio Kojima
  • Publication number: 20100048828
    Abstract: Viscosifiers, especially terminated polymers that have functional terminal groups, the polymers being pre-extended by polyols and being reacted to give polymers that are terminated by other functional groups, are produced. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. The formation of high-molecular addition products is considerably reduced or even excluded so that the products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.
    Type: Application
    Filed: December 21, 2007
    Publication date: February 25, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Andreas Kramer, Jan Olaf Schulenburg
  • Patent number: 7666974
    Abstract: Disclosed is a method for production of polyphenylene by means of polymerization of phenols. The method comprises using hydroquinone as a phenol, which is predissolved in water or in alcoholic solution, adding hydrogen peroxide in the presence of transition metals aquo-ions, and controlling temperature during polymerization keeping it not higher than the boiling point, and controlling pH in the range of 2-7. In on example embodiment, Cr, Mn, Fe, Cu, Ni, Co, Zn aquo-ions or a combination thereof may be used as transition metal aquo-ions.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: February 23, 2010
    Inventors: Andrei Leonidovich Zagorsky, Dmitry Kirillovich Toropov
  • Publication number: 20100035049
    Abstract: One exemplary embodiment of the invention includes grafting a thermoplastic hot melt adhesive material to a shape memory polymer surface.
    Type: Application
    Filed: April 29, 2009
    Publication date: February 11, 2010
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventor: Tao Xie
  • Publication number: 20100016473
    Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
    Type: Application
    Filed: November 8, 2007
    Publication date: January 21, 2010
    Applicant: NIPPON STEEL CHEMICAL CO., LTD
    Inventors: Masashi Kaji, Koichiro Ogami, Kazuhiko Nakahara, Tomomi Fukunaga
  • Publication number: 20090286951
    Abstract: The invention relates to epoxy resins having an extremely low content of chlorine, particularly a low content of organically bound chlorine. The invention also relates to a production method during which total chlorine contents of less than 100 ppm in the epoxy resin are achieved by extracting solid epoxy resin particles, optionally after a prior comminution and/or reprecipitation. The use of these low-chlorine epoxy resins in the fields of electronics and/or electrical engineering considerably reduces the components' susceptibility to corrosion.
    Type: Application
    Filed: July 29, 2009
    Publication date: November 19, 2009
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Peter GRÖPPEL
  • Patent number: 7608676
    Abstract: Coatings comprising the reaction product of a terpene, an acrylic monomer and a phenolic compound containing at least one unsubstituted carbon atom ortho or para to a phenolic group and/or the reaction product of a phenolic compound containing at least one unsubstituted carbon atom ortho or para to a phenolic group and a compound containing a phenolic reactive group and an epoxy group are disclosed.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: October 27, 2009
    Assignee: PPG Industries Ohio, Inc.
    Inventors: David R. Fenn, Simion Coca
  • Patent number: 7582706
    Abstract: The invention relates to epoxy resins having an extremely low content of chlorine, particularly a low content of organically bound chlorine. The invention also relates to a production method during which total chlorine contents of less than 100 ppm in the epoxy resin are achieved by extracting solid epoxy resin particles, optionally after a prior comminution and/or reprecipitation. The use of these low-chlorine epoxy resins in the fields of electronics and/or electrical engineering considerably reduces the components' susceptibility to corrosion.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: September 1, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventor: Peter Gröppel
  • Publication number: 20090200071
    Abstract: To provide a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, a prepreg, a laminate, and a wiring board. A resin composition for use in production of a laminate, the resin composition comprising an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.
    Type: Application
    Filed: April 26, 2007
    Publication date: August 13, 2009
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Koji Morita, Shin Takanezawa, Kazunaga Sakai, Yuusuke Kondou
  • Patent number: 7569654
    Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.
    Type: Grant
    Filed: June 19, 2006
    Date of Patent: August 4, 2009
    Assignee: DIC Corporation
    Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
  • Publication number: 20090131622
    Abstract: A method for producing a branched-polyether resin composition of the present invention includes a first step of obtaining a reaction mixture including: (1-A) a branched-polyether resin (X) containing a hydroxyl group, an acryloyl group, and an epoxy group and (1-B) at least one resin component selected from the group consisting of (1-B-1) a diacrylate (A2) of an aromatic difunctional epoxy resin, (1-B-2) a monoacrylate (A1) of an aromatic difunctional epoxy resin, and (1-B-3) an aromatic difunctional epoxy resin (B) other than (A1) and (A2); and a second step of mixing the reaction mixture and an unsaturated monocarboxylic acid, and reacting the epoxy group in the reaction mixture and a carboxyl group in the unsaturated monocarboxylic acid.
    Type: Application
    Filed: December 20, 2005
    Publication date: May 21, 2009
    Applicant: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Hideyuki Ishida, Masatoshi Motomura
  • Patent number: 7527863
    Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: May 5, 2009
    Assignee: Asahi Kasei Chemicals Corporation
    Inventor: Tetsuji Tokiwa
  • Patent number: 7521100
    Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.
    Type: Grant
    Filed: April 6, 2004
    Date of Patent: April 21, 2009
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masahiro Imaizumi, Toyofumi Asano, Naoyuki Ochi, Masahiro Hirano, Sumio Ichimura, Masaru Kudo, Katsuhiko Oshimi, Masataka Nakanishi, Yasumasa Akatsuka, Eiichi Nishihara, Masayuki Itai
  • Publication number: 20090069490
    Abstract: The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.
    Type: Application
    Filed: March 16, 2006
    Publication date: March 12, 2009
    Applicant: DAINIPPON INK AND CHEMICALS, INC.
    Inventors: Ichirou Ogura, Kunihiro Morinaga, Kazuo Arita, Yutaka Sato
  • Publication number: 20090048422
    Abstract: A resin composition for composite material parts includes a main agent composed of an epoxy resin and a reactive diluent, and a curing agent. The reactive diluent, which is monomer or oligomer of acrylate or methacrylate having one or more vinyl (unsaturated double bond) functional groups and has low viscosity at room temperature, is used in an amount of 5 to 30 parts by weight based on 100 parts by weight of the main agent such that the main agent has a viscosity of 700 to 3000 cps at 25° C. The resin composition of the present invention is very suitable for being used to manufacture composite material parts used in wind blade, boat, automobile and aircraft by the manufacturing process such as vacuum infusion and hand lay-up vacuum assisted resin infusion process.
    Type: Application
    Filed: August 14, 2008
    Publication date: February 19, 2009
    Applicant: SWANCOR INDUSTRIAL CO., LTD.
    Inventors: Jau-Yang TSAI, Shih-Wen Yur, Ching-Yuan Chen
  • Publication number: 20090036631
    Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.
    Type: Application
    Filed: January 10, 2007
    Publication date: February 5, 2009
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Publication number: 20090012203
    Abstract: [PROBLEMS] The present invention relates to a crystalline epoxy resin, which gives a cured object excellent in various properties including flame retardancy, low water absorption, and impact resistance. The object of the present invention is to provide epoxy resin which is useful as an optical material, an epoxy resin composition containing crystals of the epoxy resin having excellent storage stability and a cured object obtained from the composition. [MEANS FOR SOLVING PROBLEMS] The crystalline epoxy resin obtained by the glycidylation of the compound represented by the following formula (1).
    Type: Application
    Filed: April 28, 2006
    Publication date: January 8, 2009
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Masataka Nakanishi, Ryutaro Tanaka
  • Patent number: 7468454
    Abstract: The present invention relates to a process for preparing amino-functional polyurethane prepolymers by a) preparing an NCO-functional polyurethane prepolymer by reacting an excess of one or more di- and/or polyisocyanates with at least one isocyanate-reactive compound having a functionality of at least 1.5, b) reacting the free NCO groups of the resulting polyurethane prepolymer with at least one compound containing one or more silanol groups to obtain the corresponding silylurethanes, and then c) converting the silylurethanes to amino-functional polyurethane prepolymers by hydrolysis and/or alcoholysis with decarboxylation. The present invention also relates coatings, adhesives, sealants, casting compounds or moldings obtained from these amino-functional polyurethene prepolymers.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: December 23, 2008
    Assignee: Bayer MaterialScience AG
    Inventor: Michael Mager
  • Publication number: 20080312404
    Abstract: The present invention relates to novel diepoxides having the formulas I. and II. R*SO2N(A)RN(A)SO2R* where A=2,3-epoxypropyl, R* is a monovalent hydrocarbon radical or an inertly substituted hydrocarbon radical and R is a divalent hydrocarbon radical or an inertly substituted divalent hydrocarbon radical. The epoxies are useful in preparing novel epoxide resins.
    Type: Application
    Filed: August 14, 2008
    Publication date: December 18, 2008
    Inventor: R. Garth Pews
  • Patent number: 7462658
    Abstract: Curable compositions are provided which contain a curable component and particular m-hydroxybenzene derivatives, wherein such derivatives function as aging inhibitors. Such curable compositions are useful as coating agents and adhesives having improved aging resistance.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: December 9, 2008
    Assignee: Henkel AG & Co. KGaA
    Inventors: Olaf Lammerschop, Steve Doering, Michael Kux, Andreas Ferencz, Stefan Kreiling
  • Publication number: 20080254300
    Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.
    Type: Application
    Filed: March 23, 2005
    Publication date: October 16, 2008
    Inventors: Masataka Arai, Takeshi Hosomi, Hiroaki Wakabayashi
  • Publication number: 20080177023
    Abstract: The present invention provides a curable composition selected from the group consisting of adhesives, sealants and coatings.
    Type: Application
    Filed: February 5, 2008
    Publication date: July 24, 2008
    Applicant: Loctite (R&D) Ltd.
    Inventors: Barry N. Burns, Jonathan P. Wigham
  • Patent number: 7394965
    Abstract: A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portion 5 of an optical waveguide 1, and the like. In the composition, component (A) is represented by the following general formula (1). (In the formula, R1 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group; and n is an integer from 0 to 10.) The composition is excellent in patterning properties and the like in curing process, and is also excellent in heat resistance, transmission characteristics, and long-term reliability after the optical waveguide has been formed.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: July 1, 2008
    Assignee: JSR Corporation
    Inventors: Tomohiro Utaka, Hideaki Takase, Yuuichi Eriyama
  • Publication number: 20080153976
    Abstract: An object of the present invention is to provide an epoxy resin that can be easily produced, can easily achieve a molecule-aligned state, and can be cured to provide a cured material with optical anisotropy and excellent toughness and thermal conductivity. The epoxy resin of the present invention is represented by the following formula (1): (wherein n is 0.1 to 20 (the number is an average). The epoxy resin of the present invention can be produced by extending the chain of an epoxide of 4,4?-bisphenol F with 4,4?-biphenol.
    Type: Application
    Filed: December 21, 2005
    Publication date: June 26, 2008
    Applicant: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Katsuhiko Oshimi, Masataka Nakanishi, Shigeru Moteki