Abstract: In a semiconductor memory device, the output of a regulator is coupled to the inputs of first and second switches, the output of the first switch is coupled to a path for supplying the drain voltage of a memory cell in the first mode, and the output of the second switch is coupled to a path for supplying the gate voltage of the memory cell in the second mode. A fourth switch is placed in parallel with the second switch: the output of the fourth switch is coupled to the output of the second switch, to supply the gate voltage of the memory cell in the first mode. Thus, one regulator is used as both the regulator for the drain voltage of the memory cell and the regulator for the gate voltage of the memory cell.

Abstract: A multi-level dynamic random-access memory (MLDRAM) represents an original bit combination of more than one bit using a cell voltage stored in a single memory cell. The cell voltage is in one of a number of discrete analog voltage ranges each corresponding to a respective one of the possible values of the bit combination. In reading a selected memory cell, stored charge is conveyed via a local bitline to a preamplifier. The preamplifier amplifies the signal on the local bitline and drives a global bitline with an analog signal representative of the stored voltage. A digitizer converts the analog signal on the global bitline into a read bit combination. The read bit combination is then moved to a data cache over the global bitline. The data cache writes an analog voltage back to the memory cell to write a new value or restore data destroyed in reading the cell.

Abstract: A semiconductor device includes a bit line, a memory cell, and a control circuit. The memory cell includes a switch circuit coupled to the bit line and a memory element configured to store either one of first and second data. The control circuit controls a voltage of the bit line to turn on the switch element in a first time period and to turn off the switch element in a second time period following the first time period when the control circuit writes the first data to the memory element. The control circuit controls the voltage of the bit line to turn on the switch element in the first time period and to maintain an on-state of the switch circuit in the second time period when the control circuit writes the second data to the memory element.

Abstract: Integrated circuits with multiport memory elements may be provided. A multiport memory element may include a latching circuit, a first set of address transistors, and a second set of address transistors. The latching circuit may include cross-coupled inverters, each of which includes a pull-up transistor and a pull-down transistor. The first set of address transistors may couple the latching circuit to a write port, whereas the second set of address transistors may couple the latching circuit to a read port. The pull-down transistors and the second set of address transistors may have body bias terminals that are controlled by a control signal. During data loading operations, the control signal may be temporarily elevated to weaken the pull-down transistors and the second set of address transistors to improve the write margin of the multiport memory element.

Abstract: Disclosed herein is a device that includes a clock generation circuit that generates an internal clock signal during a normal operation and stops generation of the internal clock signal during a wafer-level burn-in test, a clock tree line that transmits the internal clock signal, and a selector that supplies a dummy clock signal, which is different from the internal clock signal, to the clock tree line during the wafer-level burn-in test.

Abstract: Systems (100) and methods (600) for reading data from a memory device (106). The methods involve (606) receiving first read request signals (118, 120, 122, 126, 128) for first data stored in the memory device. In response to the first read request signals, (608) retrieving a first page of data from a cell array (268) of the memory device. The methods also involve (616) receiving second read request signals for second data stored in the memory device. (618) Next, a determination is made as to whether at least a portion of a memory address for the second data is the same as at least a respective portion of a memory address for the first data. (622) If it is determined that the respective portions of the memory addresses are the same, then a read access to the cell array is disabled.

Abstract: A technology is a semiconductor cell and a semiconductor device capable of reducing the coupling capacitance between adjacent bit lines by forming a bit line junction region in a separated island shape when forming a buried bit line, thereby improving characteristics of the semiconductor devices. The semiconductor cell includes a transistor including a gate and a gate junction region, a plurality of buried bit lines disposed to intersect the gate, and a plurality of bit line junction regions, each bit line junction region having an island shape formed between the buried bit lines and connected to the buried bit line.

Abstract: Memory devices and program methods thereof, the memory devices including a memory cell array with a three-dimensional structure, a voltage generator configured to supply a pass voltage and a program voltage to the memory cell array, and a control logic configured to make the rising slope of the pass voltage variable with a program loop during a program operation. The memory device may improve a program speed by adjusting the rising slope of the pass voltage according to the program loop.

Abstract: A random access memory cell including: two double-gate access transistors respectively arranged between a first bit line and a first storage node and between a second bit line and a second storage node, a word line, a first double-gate load transistor and a second double-gate load transistor, a first double-gate driver transistor and a second double-gate driver transistor, a mechanism to apply a given potential to at least one electrode of each of the load or driver transistors, and a mechanism to cause the given potential to vary.

Abstract: The present invention discloses a multi-chip module with master-slave analog signal transmission function. The multi-chip module comprises: a master chip having a first setting input pin for receiving an analog setting signal to generate an analog setting in the master chip, and the master chip duplicating the analog setting to output a first analog output; and a first slave chip for receiving the first analog output from the master chip to generate an internal setting of the first slave chip.

Abstract: An elapsed time with respect to a programming operation on a memory cell of a nonvolatile memory is determined, a read voltage is adjusted based on the determined elapsed time and a read operation is performed on the memory cell using the adjusted read voltage. Determining the elapsed time may be preceded by performing the programming operation in response to a first access request and determining the elapsed time may include determining the elapsed time in response to a second access request. Memory systems supporting such operations are also described.

Abstract: A semiconductor memory device includes a plurality of wordlines and a driver configured to, when an wordline of the plurality of wordlines is activated by an active command, drive at least one non-activated wordline neighboring the activated wordline and remaining non-activated wordlines with different wordline driving voltage levels during a period of time that the activated wordline is driven to a high voltage level.

Abstract: At least one example embodiment discloses a stacked memory device including a plurality of stacked memory chips, each of the memory chips including a memory array, a plurality of through silicon vias (TSVs) operatively connected to the plurality of stacked memory chips, micro channels configured to access the memory arrays and at least one circuit in each memory chip, the at least one circuit configured to vary a number of the micro channels accessing the memory array.

Abstract: A plurality of data lines and a plurality of bit lines may be used to write to and/or read from an array of memory cells. A switching element may select among different mappings between the plurality of data lines and the plurality of bit lines. The array may, for example, consist of N memory cells, the plurality of bit lines may consist of N bit lines, and the plurality of data lines may consist of N data lines, where N is an integer greater than 1. For a write operation in which a data block is to be written to the array, a configuration of the switching element may be controlled based, at least in part, on how sensitive the data block is to a faulty memory cell among the array of memory cells.

Abstract: A semiconductor memory device can include a first driver configured to generate a pair of first sense amplifier driving signals having an activation period at a predetermined level during command execution; and a second driver that can be configured to generate a pair of second sense amplifier driving signals for increasing a driving strength of a pair of sense amplifiers when logic values of a pair of bit lines are constant during the command execution and decreasing the driving strength of the pair of sense amplifiers when the logic values of the pair of bit lines change.

Abstract: An integrated circuit includes a plurality of memory cells on a substrate, in which a first set of memory cells uses a first memory material, and a second set of memory cells uses a second memory material. The first and second memory materials have different properties such that the first and second sets of memory cells have different operational memory characteristics, such as switching speeds, retention and endurance.

Abstract: Providing increased capacity in heterogeneous storage elements including a method for reading from memory. The method includes receiving a read word from a block of memory cells, where physical characteristics of the memory cells support different sets of data levels. The read word is separated into two or more virtual read vectors. For each of the virtual read vectors, the codebook that was utilized to generate the virtual read vector is identified and a partial read data vector is generated. The generating includes multiplying the virtual read vector by a matrix that represents the codebook. The partial read data vectors are combined into a read message and the read message is output.

Abstract: Methods of programming a memory, memory devices, and systems are disclosed, for example. In one such method, each data line of a memory to be programmed is biased differently depending upon whether one or more of the data lines adjacent the data line are inhibited. In one such system, a connection circuit provides data corresponding to the inhibit status of a target data line to page buffers associated with data lines adjacent to the target data line.

Abstract: A sense amplifier circuit senses and amplifies a signal read from memory cells arranged at intersections of word-lines and bit-lines. A write circuit reads first data held in a first memory cell of the memory cells, and writes second data corresponding to the first data in a second memory cell different from the first memory cell. A data latch circuit holds data read from the first memory cell. A logic operation circuit performs a logic operation using data read from the second memory cell and data held in the data latch circuit as input values and outputs third data as an operation value. A write-back circuit writes the third data back to the first memory cell.

Abstract: A thermally-assisted MRAM structure which is programmable at a writing mode operating temperature is presented and includes an anti-ferromagnet, an artificial anti-ferromagnet, a barrier layer, and a free magnetic layer. The anti-ferromagnet is composed of a material having a blocking temperature Tb which is lower than the writing mode operating temperature of the magnetic random access memory structure. The artificial anti-ferromagnet is magnetically coupled to the anti-ferromagnet, and includes first and second magnetic layers, and a coupling layer interposed therebetween, the first and second magnetic layers having different Curie point temperatures. The barrier layer is positioned to be between the second magnetic layer and the free magnetic layer.

Abstract: A semiconductor device including a plurality of memory cells arranged in a matrix pattern, a write amplifier which writes write data to the memory cell in synchronization with a clock, a sense amplifier which reads out the write data written in the memory cell in synchronization with the clock, a plurality of column select switches which connect the plurality of the memory cells with the sense amplifier and the write amplifier, a column address decoder which makes the column select switch corresponding to one column among the plurality of the memory cells a conductive state based on a column address, a row address decoder which activates the memory cell of one row based on a row address, and a test write circuit which writes data corresponding to a logical level of a test signal to the memory cell based on a test mode signal.

Abstract: A controller uses N dedicated ports to receive N signals from N non-volatile memories independent of each other, and uses a bus in a time shared manner to transfer data to and from the N non-volatile memories. The controller receives from a processor, multiple operations to perform data transfers, and stores the operations along with a valid bit set active by the processor. When a signal from a non-volatile memory is active indicating its readiness and when a corresponding operation has a valid bit active, the controller starts performance of the operation. When the readiness signal becomes inactive, the controller internally suspends the operation and starts performing another operation on another non-volatile memory whose readiness signal is active and for which an operation is valid. A suspended operation may be resumed any time after the corresponding readiness signal becomes active and on operation completion the valid bit is set inactive.

Abstract: According to the embodiments, a semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, and a row selector that multiply-selects the word lines, wherein the semiconductor storage device satisfies Ncell/NWL?(4×Cbl×VDD)/(Icell×Tcyc), where Ncell is number of memory cells connected to each of the bit lines, NWL is a unit of number of word lines multiply-selected by the row selector, Cbl is a value obtained by dividing a capacitance of the bit line by Ncell, VDD is a power supply voltage, Tcyc is an operating frequency of each of the memory cells, and Icell is a target value of current read out via each of the bit lines.

Abstract: “A method of operation within a memory device comprises receiving address information and corresponding enable information. The address information includes a row address that specifies a row of storage cells within a storage array of the memory device, and the enable information includes first and second enable values that correspond respectively to first and second storage locations within the row of storage cells. The method involves selectively transferring data between the first storage location and the sense amplifier circuitry if the first enable value is in an enable state and transferring data between the second storage location and the sense amplifier circuitry if the second enable value is in the enable state. The states of the first and second enable values may be separately controlled.

Abstract: A semiconductor memory device to an exemplary aspect of the present invention includes a plurality of memory cells, a plurality of word lines, a plurality of bit line pairs, a plurality of column selectors, a common signal line pair including one common line commonly connected to one of each of the plurality of bit line pairs, and the other common line commonly connected to the other of each of the plurality of bit line pairs, a sense amplifier amplifying the potential difference of the common signal line pair, and a plurality of capacitance adding circuits that balance with parasitic capacitances of the column selectors which are not selected, the capacitance adding circuits being provided respectively between the one of each of the bit line pairs and the other common line and between the other of each of the bit line pairs and the one common line.

Abstract: Methods, circuits, and systems for preventing data remanence in memory systems are provided. Original data is stored in a first memory, which may be a static random access memory (SRAM). Data is additionally stored in a second memory. Data in the first memory is periodically inverted, preventing data remanence in the first memory. The data in the second memory is periodically inverted concurrently with the data in the first memory. The data in the second memory is used to keep track of the inversion state of the data in the first memory. The original data in the first memory can be reconstructed performing a logical exclusive-OR operation between the data in the first memory and the data in the second memory.

Abstract: An integrated circuit having a static random access memory (SRAM) includes an array of SRAM cells arranged in rows and columns having a write word line and a read/write word line connected to provide row access to the array of SRAM cells. The SRAM also includes a coupling capacitance connected between the write word line and a detachable allocation of the read/write word line as well as an overdrive module connected to charge the coupling capacitance and provide an overdrive voltage on the detachable allocation of the read/write word line during activation of the write word line. A method of operating an integrated circuit having an SRAM includes providing an overdrive voltage on the detachable allocation of the read/write word line corresponding to a charge redistribution across the coupling capacitance during part of a write cycle.

Abstract: A semiconductor memory device includes: a data transferrer configured to transfer data; a main driver configured to apply the data to the data transferrer in response to a control signal; and a pre-driver configured to decrease a voltage level of the data transferrer when the voltage level of the data transferrer is higher than a logic threshold voltage, and to increase the voltage level of the data transferrer when the voltage level of the data transferrer is lower than the logic threshold voltage prior to activation of the control signal.

Abstract: A method for data storage includes predefining an order of programming a plurality of analog memory cells that are arranged in rows. The order specifies that for a given row having neighboring rows on first and second sides, the memory cells in the given row are programmed only while the memory cells in the neighboring rows on at least one of the sides are in an erased state, and that the memory cells in the given row are programmed to assume a highest programming level, which corresponds to a largest analog value among the programming levels of the cells, only after programming all the memory cells in the given row to assume the programming levels other than the highest level. Data is stored in the memory cells by programming the memory cells in accordance with the predefined order.

Abstract: A semiconductor memory device includes a memory cell array configured to include memory cells, peripheral circuits configured to read out data stored in a selected memory cell in a read operation, and a controller configured to control the peripheral circuits so that the peripheral circuits sense a voltage level of the bit line when a first read voltage of the read voltages is supplied to the word line and the peripheral circuits sense voltage levels of the bit line when a second read voltage lower than the first read voltage by a specific level and a third read voltage higher than the first read voltage by the specific level are supplied to the word line in order to determine whether a threshold voltage of the selected memory cell falls within a set voltage distribution in the read operation.

Abstract: Memory elements are provided that exhibit immunity to soft error upsets. The memory elements may have cross-coupled inverters. The inverters may be implemented using programmable Schmitt triggers. The memory elements may be locked and unlocked by providing appropriate power supply voltages to the Schmitt trigger. The memory elements may each have four inverter-like transistor pairs that form a bistable element, at least one address transistor, and at least one write enable transistor. The write enable transistor may bridge two of the four nodes. The memory elements may be locked and unlocked by turning the write enable transistor on and off. When a memory element is unlocked, the memory element is less resistant to changes in state, thereby facilitating write operations. When the memory element is locked, the memory element may exhibit enhanced immunity to soft error upsets.

Abstract: A method and system for forming reversible resistivity-switching elements is described herein. Forming refers to reducing the resistance of the reversible resistivity-switching element, and is generally understood to refer to reducing the resistance for the first time. Prior to forming the reversible resistivity-switching element it may be in a high-resistance state. A first voltage is applied to “partially form” the reversible resistivity-switching element. The first voltage has a first polarity. Partially forming the reversible resistivity-switching element lowers the resistance of the reversible resistivity-switching element. A second voltage that has the opposite polarity as the first is then applied to the reversible resistivity-switching element. Application of the second voltage may further lower the resistance of the reversible resistivity-switching element. Therefore, the second voltage could be considered as completing the forming of the reversible resistivity-switching element.

Abstract: Provided is a non-volatile memory device that may include a plurality of variable resistors, each of the variable resistors having first and second terminals, the plurality of variable resistors arranged as a first layer of a plurality of layers and having data storage capability, at least one common bit plane arranged as a second layer of the plurality of layers and coupled to the first terminal of each of the variable resistors of the first layer, and a plurality of bit lines coupled to the second terminal of each of the variable resistors of the first layer.

Abstract: A write circuit is adapted to provide a same logical bit to each of a multitude of memory cells for storage. Each of the multitude of memory cells stores either the bit or a complement of the bit in response to the write circuit. A read circuit is adapted to receive the bits stored in the multitude of memory cells and to generate an output value defined by the stored bits in accordance with a predefined rule. The predefined rule may be characterized by a statistical mode of the bits stored in the plurality of memory cells. Storage errors in a minority of the multitude of memory cells may be ignored at the cost of lower memory density. The predefined rule may be characterized by a first weight assigned to bits 1 and a second weight assigned to bits 0.

Abstract: Memory devices and methods are described, such as those that include a stack of memory dies and an attached logic die. Method and devices described provide for configuring bandwidth for selected portions of a stack of memory dies. Additional devices, systems, and methods are disclosed.

Abstract: A memory device whose speed at the time of operation such as writing or reading is high and whose number of semiconductor elements per memory cell is small is provided. The memory device includes a control unit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from a main memory device and/or the arithmetic unit, in accordance with an instruction from the control unit. The buffer memory device includes a plurality of memory cells. The memory cells each include a transistor including a channel formation region including an oxide semiconductor, and a memory element to which charge with an amount in accordance with a value of the data is supplied through the transistor. Further, a data retention time of the memory cell corresponding to a valid bit is shorter than a data retention time of the memory cell corresponding to a data field.

Abstract: A memory device comprises a memory array and a phase distribution circuit coupled to the memory array. In one aspect, the phase distribution circuit is operative to control respective durations of a precharge phase and an active phase of a memory cycle of the memory array based on relative transistor characteristics of a tracked precharge transistor of a first conductivity type and a tracked memory cell transistor of a second conductivity type different than the first conductivity type. For example, the phase distribution circuit may comprise a first tracking transistor of the first conductivity type for tracking the precharge transistor of the first conductivity type and a second tracking transistor of the second conductivity type for tracking the memory cell transistor of the second conductivity type. The relative transistor characteristics may comprise relative strengths of the tracked precharge and memory cell transistors.

Abstract: The semiconductor memory device executes, in address units, operation for inverting data stored in a memory cell designated by an internal address and writing the data in the memory cell and increments the internal address every time inversion writing operation for the memory cell is executed.

Abstract: A process is provided for fabricating a wafer including a plurality of chips separated by scribe lines. The method includes locking at least one chip on the wafer using a secret key, and writing the secret key into at least one memory present on the wafer.

Abstract: A semiconductor memory apparatus includes: a memory block including first and second planes; and a reset signal generator configured to generate a first reset signal by logically combining a first plane selection signal and a control pulse signal which pulses after a first programming setup pulse signal pulses during a first programming command cycle, and generate a second reset signal by logically combining a second plane selection signal and the control pulse signal which again pulses after a second programming setup pulse signal pulses during a second programming command cycle after the first programming command cycle. A plurality of first page buffers allocated to the first plane are reset in response to the first reset signal, and a plurality of second page buffers allocated to the second plane are reset in response to the second reset signal.

Abstract: A memory device, includes a recording medium; a probe to write a plurality of the signals; a first driving portion to vibratory drive the recording medium; a detecting unit which, when the first driving portion changes a frequency to vibratory drive the recording medium, detects a change in an amplitude of the resonance drive, detects the frequency at which the amplitude becomes maximum as a resonance frequency; and a calculating unit which calculates a timing when the probe writes a plurality of the signals using the resonance frequency; wherein, the first driving portion vibratory drives the recording medium and the probe writes a plurality of the signals.

Abstract: A magnetic shift register memory in stack structure includes magnetic shift registering layers for forming an unit of stack structure. Each registering layer has multiple magnetic domains and each domain has a magnetization direction corresponding to a stored data. The two adjacent magnetic shift registering layers respectively have an upper magnetic domain and a lower magnetic domain forming a coupling region. By a coupling structure, the lower magnetic domain and the upper magnetic domain have the same stored data. A driving current unit is coupled to the magnetic shift registering layers for respectively providing a driving current in a predetermined direction to the magnetic shift registering layers. As a result, the stored data in the magnetic domains of the magnetic shift registering layers is shifted in a direction from a foremost registering layer to a last registering layer of the magnetic shift registering layers via the coupling structure.

Abstract: In the disclosed technology, the device identification code of a memory integrated circuit is changeable. In some cases, multiple device identification codes are stored on the memory integrated circuit, and multiple device identification code selection data are stored on the memory integrated circuit.

Abstract: A control method for at least one memory cell. The memory cell includes a transistor and a resistor. The resistor is connected to the transistor in series between a first node and a second node. In a programming mode, the memory cell is programmed. When it is determined that the memory cell has been successfully programmed, impedance of the memory cell is in a first state. When it is determined that the memory cell has not been successfully programmed, a specific action is executed to reset the memory cell. The impedance of the memory cell is in a second state after the step resetting the memory cell. The impedance of the memory cell in the second state is higher than that of the memory cell in the first state.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes a circuit with first and second inputs and an output. The circuit is configured to combine (add or subtract) input signals. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the circuit, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the circuit.

Abstract: The output driver circuit includes a plurality of pull-up sub-drivers that pull up a voltage at the output terminal according to a pull-up signal based on the output data. The output driver circuit includes a plurality of pull-down sub-drivers that pull down the voltage at the output terminal according to a pull-down signal based on the output data. Selection from among the pull-up sub-drivers is made by an assigned pull-up calibration signal and selection from among the pull-down sub-drivers by an assigned pull-down calibration signal so as to make a pull-up current drivability and a pull-down current drivability for the voltage at the output terminal equal. A timing of turning on of the pull-up sub-drivers is calibrated by the pull-down calibration signal. A timing of turning on of the pull-down sub-drivers is calibrated by the pull-up calibration signal.

Abstract: A unit operator cell includes a plurality of SOI (Silicon on Insulator) transistors, write data is stored in a body region of at least two SOI transistors, and the storage SOI transistors are connected in series with each other to a read port or each of the storage SOI transistors is singly connected to the read port. Therefore, an AND operation result or a NOT operation result of data stored in the unit operator cells can be obtained, and operation processing can be performed only by writing and reading data. A semiconductor signal processing device that can perform logic operation processing and arithmetic operation processing at high speed is implemented with low power consumption and a small occupation area.

Abstract: One aspect of the present invention includes a Josephson magnetic random access memory (JMRAM) system. The system includes an array of memory cells arranged in rows and columns. Each of the memory cells includes an HMJJD that is configured to store a digital state corresponding to one of a binary logic-1 state and a binary logic-0 state in response to a word-write current that is provided on a word-write line and a bit-write current that is provided on a bit-write line. The HMJJD is also configured to output the respective digital state in response to a word-read current that is provided on a word-read line and a bit-read current that is provided on a bit-read line.

Abstract: An OTP memory array includes a bit line coupled to a plurality of memory banks. Each memory bank includes a plurality of memory cells, a footer, and a bias device, and is associated with a current mirror. When a memory cell is activated (e.g., for reading) the memory bank including the activated memory cell is referred to as an activated memory bank and other banks are referred to as deactivated memory banks. A current tracking device serves to compensate for bit line leakage current in deactivated memory cells in the activated memory bank. Further, footers and bias devices in deactivated memory banks and associated current mirrors are configured to reduce/eliminate bit line current leakage through deactivated memory cells in deactivated memory banks.

Abstract: A method is provided for altering distribution of a chosen characteristic of a plurality of memory cells forming a memory device. The method comprises identifying a subset of the memory cells whose value of the chosen characteristic is within a predetermined end region of the distribution, and then performing a burn-in process during which one or more operating parameters of the memory device are set to induce aging of the memory cells. During the burn-in process, for each memory cell in the subset, the value stored in that memory cell is fixed to a selected value which exposes that memory cell to a stress condition. In contrast, for each memory cell not in the subset, the value stored in that memory cell is alternated during the burn-in process in order to alleviate exposure of that memory cell to the stress condition. Such an approach allows a tightening of the distribution of the chosen characteristic, thus improving the worst case memory cells.