Abstract: The memory building blocks can be used in conjunction with ASIC automatic design tools to generate a memory macro (e.g., a memory array) using a known ASIC design flow including, for example, register transfer level (RTL), synthesis, automatic place and route (APR) and timing analysis.

Abstract: Techniques for refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region coupled to a source line and a second region coupled to a carrier injection line. Each memory cell may also include a body region capacitively coupled to at least one word line and disposed between the first region and the second region and a decoupling resistor coupled to at least a portion of the body region.

Abstract: A synchronous type semiconductor storage device includes an array unit which includes a cell array and sense amplifiers. The synchronous type semiconductor storage device includes a read/write pulse generator which generates a read pulse signal and a write pulse signal according to a clock signal, the clock signal defining one cycle time of a read operation and a write operation with respect to the array unit as one cycle. The synchronous type semiconductor storage device includes a secondary amplifier which is activated according to the read pulse signal to read out data stored in the sense amplifiers through the read/write line. The synchronous type semiconductor storage device includes a write driver which is activated according to the write pulse signal to write data in the sense amplifiers through the read/write line.

Abstract: A semiconductor memory device includes a first plane and a second plane each configured to include a plurality of memory cells, and a data transfer circuit configured to transfer first data, stored in the memory cells of the first plane, to the second plane and transfer second data, stored in the memory cells of the second plane, to the first plane when a copyback operation is performed and to transfer the first data or the second data to an I/O circuit when a read operation is performed.

Abstract: Techniques to utilize a very low power state with a memory subsystem that includes one or more non-volatile memory devices and a volatile memory system. A memory controller is coupled with the one or more non-volatile memory devices and the volatile memory system. The memory controller comprising at least an embedded control agent and memory locations to store state information. The memory controller to selectively enable and disable the one or more non-volatile memory devices. The memory controller transfers the state information to the volatile memory system prior to entering a low power state. Control circuitry is coupled with the memory controller. The control circuitry to selectively enable and disable operation of the memory controller.

Abstract: Electronic equipment according to the present disclosure includes a writable non-volatile memory, a plurality of volatile memories, and a sequencer. The writable non-volatile memory stores an operation parameter group required to operate the electronic equipment. Respective addresses are assigned to the plurality of volatile memories. The plurality of volatile memories includes a specified volatile memory. The specified volatile memory stores a part of the operation parameters among the operation parameter group. The specified volatile memory is accessible by inputting an Enable signal. The sequencer can read and write the non-volatile memory when the Enable signal allows an operation parameter stored in the volatile memory to be written to the non-volatile memory.

Abstract: A first clock is received by a memory macro. In response to a first clock transition of the first clock, a first transition of a second clock and of a third clock is generated. A tracking transition of a tracking signal is caused by the second clock. Based on a later transition of a second clock transition of the first clock and the tracking transition of the tracking signal, a second transition of the third clock is generated. The third clock is for use by an input-output of the memory macro.

Abstract: A method for calibration of a memory controller may include determining if an unused memory location exists in memory. The method may include writing a first pattern to the unused memory location in response to a determination that the unused memory location exists. The method may include determining if a second pattern exists in the memory in response to a determination that the unused memory location does not exist. The method may include iteratively modifying a first delay of a first delay control module among a plurality of delay values. The method may include reading from a memory location including the first pattern or the second pattern for each iteration of modification of the first delay. The method may include modifying one or more second delays, each second delay associated with one of one or more second delay control modules, based on the results of reading from the memory location.

Abstract: A method includes over-programming thin film storage (TFS) memory cells on a semiconductor wafer with a first voltage that is higher than a highest voltage used to program the memory cells during normal operation of the memory cells. With the memory cells in an over-programmed state, the wafer is exposed to a first temperature above a product specification temperature for a period of time sufficient to induce redistribution of charge among storage elements in the memory cells.

Abstract: This description relates to a circuit including a bit line. The circuit further includes at least one memory bank. The at least one memory bank includes at least one memory cell, a first device configured to provide a current path between the bit line and the at least one memory cell when the at least one memory cell is activated, and a second device configured to reduce current leakage between the bit line and the at least one memory cell when the at least one memory cell is deactivated. The circuit further includes a tracking device configured to receive a mirror current substantially equal to a current along the current path, the tracking device configured to have a resistance substantially equal to a cumulative resistance of all memory cells of the at least one memory cell.

Abstract: A memory system is provided with a processor, a main memory, and a flash memory. Performance of the memory system is improved through achievement of speed-up and high data reliability. The memory system includes a nonvolatile memory device and a controller configured to drive a control program to control the nonvolatile memory device. The control program executes a second access operation for the nonvolatile memory device even before a first access operation to the nonvolatile memory device is completed.

Abstract: An integrated circuit, that may be a part of an electronic system, may include a first set of storage cells to store settings and a second set of storage cells to store alternate settings. At least one control cell may also be included in the integrated circuit. The at least one control cell may indicate whether to use the settings stored in the first set of storage cells, or the alternate settings stored in the second set of storage cells, to control one or more operating parameters of the integrated circuit. Methods for using the alternate setting are also described.

Abstract: A nonvolatile memory device includes a variable resistance memory element and a read circuit coupled to the variable resistance memory element at a first signal node and configured to provide a read current to the variable resistance memory element via the first signal node, to a provide a mirror current at a second signal node responsive to the cell current and to generate an output signal indicative of a state of the variable resistance memory element responsive to a voltage at the second signal node.

Abstract: A set of non-volatile storage elements are subjected to a programming process in order to store data. During the programming process, one or more verification operations are performed to determine whether the non-volatile storage elements have reached their target condition to store the appropriate data. Programming can be stopped when all non-volatile storage elements have reached their target level or when the number of non-volatile storage elements that have not reached their target level is less than a number or memory cells that can be corrected using an error correction process during a read operation (or other operation). The number of non-volatile storage elements that have not reached their target level can be estimated by counting the number of non-volatile storage elements that have not reached a condition that is different (e.g., lower) than the target level.

Abstract: A semiconductor device in which the power consumption of a register is low is provided. Further, a processing unit whose operation speed is high and whose power consumption is low is provided. In the semiconductor device, a register operating at high speed and a nonvolatile FILO (first-in-last-out) register capable of reading and writing data from/to the register are provided.

Abstract: The present invention relates to a semiconductor device, and more particularly, to a semiconductor memory device capable of supplying and measuring an electric current through a pad. The semiconductor device includes a memory cell, a data pad configured to receive data to be programmed into the memory cell or a write current to be supplied to the memory cell from an external device, and output data read out from the memory cell or a cell current flowing from the memory cell to the external device, and a path switching unit configured to set up a path so that the memory cell and the data pad are directly coupled when a test operation is performed.

Abstract: A semiconductor memory device and an operating method thereof are provided. The semiconductor memory device includes: a memory cell array including a plurality of memory cells; and a peripheral circuit programming first, second, third, and fourth memory cells connected to one word line and successively arranged, among the plurality of memory cells, wherein the peripheral circuit is configured to program the first and fourth memory cells in a first interval and program the second and third memory cells in a second interval. A semiconductor memory device having enhanced performance characteristics and an operating method thereof are provided.

Abstract: A semiconductor integrated circuit device that detects an operation error of an SRAM caused by a device variation fluctuating with time is provided. In the SRAM, a memory cell has a transfer MOS transistor whose gate is connected to a word line. At the time of a write test of the memory cell, a control circuit including a test/normal operation selection circuit and a word line driver circuit applies a third voltage to the word line in a preparation period before writing test data, thereafter a first voltage to the word line, and a second voltage to the word line at the end of writing. Due to this, the threshold voltage of the transfer MOS transistor, which fluctuates with time, can be controlled. Therefore, it is possible to enhance detection efficiency for a malfunctioning cell of the SRAM due to a temporal variation.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first N-doped region via a bit line and applying a second voltage potential to a second N-doped region via a source line. The method may also comprise applying a third voltage potential to a word line, wherein the word line is spaced apart from and capacitively coupled to a body region that is electrically floating and disposed between the first N-doped region and the second N-doped region. The method may further comprise applying a fourth voltage potential to a P-type substrate via a carrier injection line.

Abstract: A memory system includes a first storing area included in a volatile semiconductor memory, a second and a third storing area included in a nonvolatile semiconductor memory, a controller that allocates the storage area of the nonvolatile semiconductor memory to the second storing area and the third storing area in a logical block unit associated with one or more blocks. The second storing area is configured to be managed with a first management unit. The third storing area is configured to be managed with a second management unit, a size of the second management unit being larger than a size of the first management unit.

Abstract: A semiconductor memory device includes a memory cell unit including a plurality of memory cells coupled between a plurality of word lines and a plurality of bit lines, and configured to provide a read value in response to an activated word line, a reference value generating unit including a plurality of reference value generating cells coupled between the plurality of word lines and a reference bit line, and configured to provide a single reference value in response to the activated word line, and a sense circuit configured to provide a sense output signal based on the single reference value and the read value.

Abstract: A semiconductor device in which a nonvolatile memory can normally operate and power saving can be performed with a P-state function, and a driving method of the semiconductor device are provided. The semiconductor device includes: a first circuit configured to control a state including a driving voltage and a clock frequency of a processor core; a first memory circuit and a second memory circuit which store state data; a second circuit generating a power supply voltage and a third circuit generating a clock which are electrically connected to the first circuit; and the processor core electrically connected to the second circuit and the third circuit through a switch. The processor cores includes: a volatile memory; and a nonvolatile memory transmitting and receiving data to/from the first memory.

Abstract: A semiconductor device includes a memory core with a plurality of memory cells, an internal voltage generator and a low power entry circuit. The low power entry circuit receives a plurality of control signals which are provided to a command decoder, and generates a low power signal indicating a low power consumption mode where a refresh operation is prohibited. The internal voltage generator includes a detector and at least one of booster circuits. The internal voltage generator, coupled to the memory core via an internal power supply line, generates a boosted internal voltage based on an external voltage and supplies the boosted internal voltage to the memory core via the internal power supply line. The internal voltage generator stops supplying the boosted internal voltage to the internal power supply line in response to the low power signal while the external voltage is supplied to the semiconductor device.

Abstract: A data retention method that includes sampling a plurality of nonvolatile memory devices included in a data storage device to detect retention information for each of the nonvolatile memory devices in response to a request of a host and outputting, from the data storage device to the host, sampling data based on a result of the sampling, determining, at the host, whether to perform a retention operation on each of the nonvolatile memory devices based on the sampling data, and performing the retention operation on each of the nonvolatile memory devices based on a result of the determination.

Abstract: A non-volatile memory device includes a memory cell block programmed with data, a page buffer block configured to perform a program verification operation for verifying the data on a verification target memory cell as many times as a predetermined number, and temporarily store a plurality of verification result data obtained from every program verification operation, a comparison block configured to compare the multiple verification result data, which are temporarily stored in the page buffer block, with each other to produce a comparison result, and a control block configured to determine whether a program operation is performed again on the verification target memory cell based on the comparison result.

Abstract: A driver for a semiconductor memory includes: a selection controller configured to output a target charge current select signal and a bucket charge current select signal in response to an inputted memory cell address and a target charge current value and a bucket charge current value, which are to be applied to a memory cell of the memory cell address; a current supply unit configured to supply a target charge current to the memory cell of the memory cell address in response to the target charge current select signal; and a bucket charge current supply unit configured to supply a bucket charge current to the memory cell of the memory cell address, in order to pre-charge the memory cell of the memory cell address in response to the bucket charge current select signal.

Abstract: Exemplary embodiments for SRAM cells, new control units for SRAM systems, and embodiments of SRAM systems are described herein. An SRAM cell is configured to receive a first input voltage signal and a second input voltage signal with a different value from the first input voltage signal, and to maintain a first stored value signal and a second stored value signal. A control circuit is configured to receive a first input voltage signal and a second input voltage signal, and controlled by a sleep signal, a selection signal, and a data input signal, so that the output of the control circuit is data sensitive to the data input signal. An SRAM system comprises a plurality of SRAM cells, controlled the disclosed control circuit wherein an SRAM cell has two input voltage signals controlled by a data input signal and its complement signal respectively.

Abstract: A semiconductor memory device includes: a strobe clock generator configured to generate a strobe clock signal having a delay time controlled according to a plurality of test mode signals which are selectively enabled in response to a read signal or write signal; an internal address generator configured to latch an address in response to a first level of the strobe clock signal, and generate an internal address by decoding the address in response to a second level of the strobe clock signal; and an output enable signal generator configured to decode the internal address and generate output enable signals which are selectively enabled.

Abstract: A semiconductor memory device of the present invention includes a memory cell array with cell strings having word lines stacked on a substrate and a vertical channel layer formed through the word lines, a peripheral circuit configured to select one of the word lines and perform a program operation on the selected word line, and a control circuit configured to control the peripheral circuit to perform the program operation by applying a program voltage to a word line selected for the program operation, applying a ground voltage to a word line of which a program operation has been completed and applying a pass voltage to the other word lines.

Abstract: Some embodiments include apparatuses and methods having first conductive lines, second conductive lines, a memory array including memory cells, each of the memory cells coupled between one of the first conductive lines and one of the second conductive lines. At least one of such apparatuses and methods can include a module configured to cause a first current from a first current source and a second current from a second current source to flow through a selected memory cell among the memory cells during an operation of storing information in the selected memory cell. Other embodiments including additional apparatuses and methods are described.

Abstract: In one embodiment, the present disclosure includes a circuit comprising an amplifier having an input and an output, an offset detection circuit to detect an offset of the amplifier at the output of the amplifier, and an offset generation circuit having an input coupled to the offset detection circuit and an output coupled to the input of the amplifier to generate an offset at the input of the amplifier during an operational phase of the amplifier based on the detected offset. The generated offset cancels a least a portion of the offset of the amplifier. In one implementation, the amplifier is a sense amplifier in a memory.

Abstract: A memory system is disclosed. The system comprises a memory layer between a first layer and a second layer, wherein the first layer and the second layer are configured to apply an electrical bias to the memory layer. In some embodiments the memory layer comprises nanodots made of a material selected from the group consisting of peptides and amino acids.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes a memory cell array configured by plural memory cells each including a variable resistor and each provided between first and second lines. A control circuit applies to a memory cell through the first and second lines a writing voltage for writing data or a reading voltage for reading data. A sense amplifier circuit senses data retained in a memory cell based on a current flowing through the first line. In a data writing operation, the control circuit applies a writing voltage to each of n number of memory cells configuring one unit such that the memory cells may be supplied with different resistance values. In a data reading operation, the sense amplifier circuit compares level relationship of the resistance values of n number of memory cells configuring one unit and reads out n! patterns of data from the one unit.

Abstract: A memory apparatus includes: a plurality of memory cells which includes a first resistance change element; and a read-out circuit which determines the size of a resistance value of the first resistance change element by comparing the resistance state of a memory cell selected among the plurality of memory cells to the resistance state of a reference memory cell, wherein the reference memory cell includes a second resistance change element, a resistance value of the second resistance change element with respect to an applied voltage is smaller than that in a high resistance state of the first resistance change element, and the second resistance change element shows the same resistance change characteristic as the first resistance change element.

Abstract: A word line driver circuit for providing a suppressed word line voltage includes a switch configured to selectively load a word line to a suppressed word line voltage node and a word line charging circuit coupled between a high power supply node and the suppressed word line voltage node. The word line charging circuit includes a first transistor device responsive to a control pulse for charging the suppressed word line voltage node to a suppressed word line voltage and a second transistor device for maintaining the suppressed word line voltage.

Abstract: A static random access memory (SRAM) test apparatus includes an array of SRAM test cells. The test cells are configured according to a layout with NMOS and PMOS transistors coupleable as inverters and responsive to a first passing gate transistor. At least one of the NMOS and PMOS transistors of a test cell at a predetermined location in the array is coupled to a fixed voltage to force a logic state of an associated inverter. A switching signal coupled to the associated inverter through a second passing gate transistor produces a detectable test current through one of the NMOS and PMOS transistors of the associated inverter of said test cell and through one of the NMOS and PMOS transistors of an associated inverter of an adjacent series-connected test cell.

Abstract: A semiconductor memory device includes a bit line connected to a memory cell; an input/output line configured to input a data signal to the memory cell during a writing operation and to output a data signal stored in the memory cell during a reading operation; and a column select transistor including a first source/drain connected to the bit line and a second source/drain connected to the input/output line, wherein a resistance of the first source/drain is smaller than a resistance of the second source/drain.

Abstract: Separate microchannel voltage domains in a stacked memory architecture An embodiment of a memory device includes a memory stack including one or more coupled memory dies, wherein a first memory die of the memory stack includes multiple microchannels, and a logic chip coupled with the memory stack, the logic chip including a memory controller. Each of the microchannels includes a separate voltage domain, and a voltage level is controlled for each of the plurality of microchannels.

Abstract: A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate is provided, and an array of silicon studs is defined within the silicon substrate. An insulator layer is defined atop at least a portion of the silicon substrate, and between the silicon studs. A silicon-over-insulator layer is defined surrounding the silicon studs atop the insulator layer, and a capacitorless DRAM is formed within and above the silicon-over-insulator layer.

Abstract: During Magnetic Random Access Memory (MRAM) write operation with opposite electrical current direction through the Magnetic tunnel junction (MTJ), two different resistance of the MTJ can be stored at the MRAM cell as logic data “1” (data_1) and logic data “0” (data_0). The data_1 and data_0 can be read out by sensing the difference in resistance of the MTJ. However, due to the process uniformity, the distribution of resistance value for data_1 (R1) and the distribution of resistance value for data_0 (R0) can be overlapped. Those cells with the distribution of resistance value located in the overlapped region will produce a read error. An additional read and/or write cycle is added to the normal read or write operation to reduce read error rate. Multiple electrical reference current for read operation is added in order to widen the process window and manufacturing margin.

Abstract: An access buffer, such as page buffer, for writing to non-volatile memory, such as Flash, using a two-stage MLC (multi-level cell) operation is provided. The access buffer has a first latch for temporarily storing the data to be written. A second latch is provided for reading data from the memory as part of the two-stage write operation. The second latch has an inverter that participates in the latching function when reading from the memory. The same inverter is used to produce a complement of an input signal being written to the first latch with the result that a double ended input is used to write to the first latch.

Abstract: Integrated circuits may communicate with off-chip memory. Such types of integrated circuits may include memory interface circuitry that is used to interface with the off-chip memory. The memory interface circuitry may be calibrated using a procedure that includes read calibration, write leveling, read latency tuning, and write calibration. Read calibration may serve to ensure proper gating of data strobe signals and to center the data strobe signals with respect to read data signals. Write leveling ensures that the data strobe signals are aligned to system clock signals. Read latency tuning serves to adjust read latency to ensure optimum read performance. Write calibration may serve to center the data strobe signals with respect to write data signals. These calibration operations may be used to calibrate memory systems supporting a variety of memory communications protocols.

Abstract: Methods of programming two terminal memory cells are provided. A method includes: (a) reading information of a memory page including first, second, and nth memory cells, the information including first, second, and nth program pulse tuning instructions; (b) creating a first program pulse in accordance with the first program pulse tuning instructions to program the first memory cell; (c) locking the first memory cell from further programming pulses; (d) creating a second program pulse in accordance with the second program pulse tuning instructions to program the second memory cell; (e) locking the second memory cell from further programming pulses; and (f) creating an nth program pulse in accordance with the nth program pulse tuning instructions to program the nth memory cell.

Abstract: Command signal management methods and circuits in memory devices are disclosed. Command signals are selectively passed and blocked to enforce safe operating characteristics within a memory device. In at least one embodiment, a command signal management circuit is configured to selectively block a command signal while a memory device operation is being performed. In at least one other embodiment, one or more command blocking circuits are configured to selectively pass and block one or more command signals generated by a memory access device coupled to the memory device while a memory device operation is being performed in the memory device.

Abstract: A method of maintaining the data state of a semiconductor dynamic random access memory cell is provided, wherein the memory cell comprises a substrate being made of a material having a first conductivity type selected from p-type conductivity type and n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type; a second region having the second conductivity type, the second region being spaced apart from the first region; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region having the first conductivity type; and a gate positioned between the first and second regions and adjacent the body region.

Abstract: Some embodiments of the invention relate to a sense amplifier configured to determine the slope of a bitline charging voltage and to utilize the determined slope in combination with a voltage level sensing scheme to aid in reading data from a memory cell associated with the bitline. In particular, a sense amplifier circuit is configured to determine a slope of a bit line charging voltage and based upon the determined slope to adjust the slope of the bitline voltage (e.g., by adding a dynamic slope dependent current to a memory cell current configured to charge the bitline) provided to a sense amplifier. By adjusting the slope of the bitline voltage, the charging speed of memory cells in a low resistive state (e.g., having a high cell current and therefore a good SNR) can be increased.

Abstract: Methods and systems to provide bit cell write-assist, including equalization of voltages of Bit and Bit nodes of a bit cell prior to a write operation. Equalization may be performed with a pulse-controlled transistor to transfer charge between the storage nodes. Pulse width and/or amplitude may be configurable, such as to scale with voltage. Bit cell write-assist may include reduction of bit cell retention strength during equalization, which may be continued during a write operation. Write-assist may be provided to each of multiple bit cells when a write operation is directed to a subset of the bit cells, which may conserve power and/or area. A partially-decoded address may be used to provide write-assistance to multiple bit cells prior to a write operation. Write-assistance may permit writing of Bit and Bit with a voltage swing significantly lower than an operating voltage of the bit cell.

Abstract: A semiconductor integrated circuit includes a first chip and a second chip stacked together with the first chip. A first memory area is formed on the second chip, and a second memory area for repairing a failure of the first memory area is formed on the first chip.

Abstract: Subject matter disclosed herein relates to memory operations regarding encoding program bits to be programmed into a memory array.

Abstract: A method for performing a holding operation to a semiconductor memory array having rows and columns of memory cells, includes: applying an electrical signal to buried regions of the memory cells, wherein each of the memory cells comprises a floating body region defining at least a portion of a surface of the memory cell, the floating body region having a first conductivity type; and wherein the buried region of each memory cell is located within the memory cell and located adjacent to the floating body region, the buried region having a second conductivity type.