Power semiconductor device

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Description

FIG. 1 is a front, top, right side perspective view of a power semiconductor device showing our new design;

FIG. 2 is a front, bottom, left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a left side view thereof;

FIG. 8 is a right side view thereof; and,

FIG. 9 is an enlarged partial end view taken from line 9-9 in FIG. 5.

The broken lines in the drawings are for the purpose of illustrating portions of the power semiconductor device that form no part of the claimed design.

The dot-dot-dashed lines define the boundary lines and form no part of the claimed design.

Claims

The ornamental design for a power semiconductor device as shown and described.

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Patent History
Patent number: D1127747
Type: Grant
Filed: Aug 2, 2023
Date of Patent: May 26, 2026
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Keisuke Tada (Tokyo), Satoru Kozuka (Tokyo), Yoshimasa Takaku (Tokyo)
Primary Examiner: Sandra Snapp
Application Number: 29/909,209