Abstract: Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0.1 or less % by weight. In the second composition, silver is present in the amount of 5% by weight or less and antimony is present in the amount of 5% by weight or less in addition to 0.1% by weight or less of germanium of silver. In the third composition, nickel and copper are included, preferably 0.2 or less % by weight or less of nickel and 1% by weight of copper. In the fourth composition, at least one selected from the group of 5 or less % by weight of silver, 5 or less % by weight of antimony, and 0.1 or less % by weight of germanium in addition to 0.2 or less % by weight of nickel and 1 or less % by weight of copper.

Abstract: Master alloy with 20-80% strontium, preferably 0.01-2.0% of aluminum and/or copper, and the balance essentially zinc plus impurities, and a method for preparing same and a method for modifying the microstructure of nonferrous alloys with said master alloy.

Abstract: A lead-free tin alloy for solder joints comprising up to 0.25% by weight of indium and a grain refiner which is an alloy consisting of, by weight, 2.5 to 10% aluminium, 1 to 5% magnesium and balance zinc. The alloys have improved mechanical properties, such as creep strength, and an improved thermal fatigue strength.

Abstract: Tin and zinc based shot for use as ammunition having a diameter of from 1.5 to 5.5 mm, containing, by weight, in addition to tin and the usual unavoidable contaminants, from 12 to 60% of zinc and from 0 to 5% of aluminum, but less than 0.1% of copper, less than 0.1% of iron, and less than 1% of lead.

Abstract: Refractory superalloys consist essentially of a primary constituent selected from the group consisting of iridium, rhodium, and a mixture thereof, and one or more additive elements selected from the group consisting of niobium, tantalum, hafnium, zirconium, uranium, vanadium, titanium and aluminum, and the superalloys having a microstructure containing an FCC-type crystalline structure phase and an L1.sub.2 -type crystalline structure phase are precipitated. Preferably the amount of additive element(s) is 2 to 22 atom %.

Abstract: A high lead solder exhibiting improved wettability to metal substrates, an advantageously controlled melting range, and excellent thermal fatigue properties. It comprises about 98-100% lead and a minor amount, typically about 0.0005-0.1 wt %, based on the total weight of the solder composition, of an alkali metal selected from the group consisting of Na, K, and Li. Additional embodiments additionally comprise an amount of a grain-size controlling additive, e.g., 0.001-0.5 wt % (based on the total weight of all the components in the solder composition) selected from the group consisting of Ce, Ba, La, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Y, Lu, Sc, Mg, Na, Se, Te, oxides thereof and mixtures thereof, in amount effective to control the Pb grain size; and 0-1 wt % of an element selected from the group consisting of Sn, In, Bi, Sb, Ag, Au, and Ga, and mixtures thereof.

Abstract: Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.

Abstract: Disclosed is a very light-weight, Mg and Be-based material which has the ability to reversibly store hydrogen with very good kinetics. This material is of the formula (M.sub.1-x A.sub.x) D.sub.y wherein M is Mg, Be or a combination of them; A is an element selected from the group consisting of Li, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Al, Y, Zr, Nb, Mo, In, Sn, O, Si, B, C and F; D is a metal selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Ir and Pt (preferably Pd); x is a number ranging from 0 to 0.3; and y is a number ranging from 0 to 0.15. This material is in the form of a powder of particles of the formula M.sub.1-x A.sub.x as defined hereinabove, having an average size ranging from 0.1 to 100 .mu.m, each particle consisting of nanocrystalline grains having an average size of 3 to 100 nm or having a nano-layered structure with a layer spacing of 3 to 100 nm. Some of these particles have clusters of metal D attached thereto, with an average size ranging from 2 to 200 nm.

Abstract: A lead-free solder alloy suitable for forming solder joints of a surface-mount integrated circuit device, such as a flip chip. The solder alloy has a sufficiently low liquidus temperature to achieve desirable reflow properties at temperatures of 240.degree. C. and less, and is therefore compatible with integrated circuit processes. The solder alloy has a sufficiently high solidus temperature to ensure that solder joints formed with the alloy exhibit suitable mechanical properties at application temperatures up to 150.degree. C. when mounting a component to a laminate substrate. The solder alloy generally contains, in weight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver, and about 0.5 to about 1.5% copper, the balance tin and incidental impurities.

Abstract: A copper based alloy consists essentially, by weight %, of 15 to 35% Zn, 7 to 14% Ni, 0.1 to 2% or less Mn, 0.01 to 0.5% Fe, 0.0005 to 0.1% P, at least one or two elements selected from the group consisting of 0.001 to 0.9% Si, 0.0003 to 0.02% Pb, and 0.0003 to 0.01% C, the total content of the selected at least two elements being limited to a range of 0.0006 to 0.9%, and the balance of Cu and inevitable impurities. The copper based alloy has excellent blankability as well as good corrosion resistance and high strength.

Abstract: A slide surface construction is formed of an aggregate of metal crystals on a surface of a slide member. The area rate A of pyramid-shaped metal crystals in the slide surface is in the range of A.gtoreq.40%, and the oxygen (O) content and/or the phosphorous (P) content in the aggregate is in a range of 0.gtoreq.0.2% by weight and P.gtoreq.0.04% by weight. The slide surface takes on an intricate aspect due to the presence of the large number of hexagonal pyramid-shaped metal crystals and hence, has a good oil retention. In addition, the wearing of the hexagonal pyramid-shaped metal crystals is inhibited by an increase in hardness caused by the oxygen contained, and therefore, the oil retention is maintained. Thus, the slide surface construction exhibits an excellent seizure resistance. In addition to oxygen (O) and/or phosphorous (P), the elements that may be added to the aggregate include hydrogen (H), carbon (C) and boron (B).

Abstract: Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220.degree. C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn--Ni, Sn--Cu and Sn--Cu--Ni intermetallic phases that provide resistance to grain growth during thermal cycling.

Abstract: The invention relates to a rapidly solidified silicon-based alloy, containing 2-40% by weight Al, 2-45% by weight Ti, 0-10% by weight of one or more of the elements V, Cr, Fe, Mn, Ni, Co, 0-1% by weight of one or more of the elements B, Sr and P, the rest, except for impurities, being silicon in an amount of at least 35% by weight. The invention further relates to a method for producing such alloys where a molten alloy is provided and is solidified at a rate of solidification of at least 10.sup.3 .degree. C./second. Consolidated products are produced from the silicon-based alloy by forming articles from powdered alloy and consolidating the formed articles.

Abstract: A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.

Abstract: Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.

Abstract: For a condensed matter system containing a guest interstitial species such as hydrogen or its isotopes dissolved in the condensed matter host lattice, the invention provides tuning of the molecular orbital degeneracy of the host lattice to enhance the anharmonicity of the dissolved guest sublattice to achieve a large anharmonic displacement amplitude and a correspondingly small distance of closest approach of the guest nuclei. The tuned electron molecular orbital topology of the host lattice creates an energy state giving rise to degenerate sublattice orbitals related to the second nearest neighbors of the guest bonding orbitals. Thus, it is the nuclei of the guest sublattice that are set in anharmonic motion as a result of the orbital topology. This promotion of second nearest neighbor bonding between sublattice nuclei leads to enhanced interaction between nuclei of the sublattice.

Abstract: Disclosed is a practical aluminum-based alloy containing 1 to 99 weight percent beryllium and improved methods for the investment casting of net shape aluminum-beryllium alloy parts.

Abstract: A light weight, high strength ternary or higher-order cast beryllium-aluminum alloy, including approximately 60 to 70 weight % beryllium, one or both of from approximately 0.5 to 4 weight % silicon and from 0.2 to 4.25 weight % silver, with the balance aluminum. Beryllium strengthening elements selected from the group consisting of copper, nickel, or cobalt may be present at from 0.1 to 2.0 weight % of the alloy to increase the alloy strength.

Abstract: A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniformly distributed and resist degradation on long-term aging. When added to commercial bulk or paste solders, the intermetallic particles reduce the lead content of solder joints by consuming volume in lead-tin solder, and improve the mechanical properties of the solder by inhibiting localized shear deformation and interfering with crack growth.

Abstract: A tin-base white metal bearing alloy essentially consists of, by weight, more than 3% and up to 15% Sb, more than 2% and up to 10% Ni, more than 0.001% and up to 1% Cr, up to 9% Cu, and balance of Sn and incidental impurities. Since Ni increases the strength at high temperature and the melting point, heat resistance and fatigue resistance as a tin-base white metal bearing alloy are improved. In this case, the strength will be further improved by containing at least one element of Cd, Be, Co and Mn whose amount or total amount is more than 0.1% and up to 5% by weight.

Abstract: A method of making twin roll cast clad material includes producing a composite material using a liner stock produced by drag casting techniques. The drag cast liner stock can be directly used in a twin roll continuous casting process without additional process steps such as heat treatment, surface cleaning and/or rolling. The drag cast liner stock can be applied to one or both of the surfaces of the twin roll cast material to produce a composite material that is useful in a cast form or can be adapted for reduction by rolling processes or the like. The twin roll cast cladding process can utilize aluminum alloy core and cladding materials to form a brazing sheet from the as-cast composite material.

Abstract: A method of a hardening a solid metal object consisting essentially of lead which has been swaged cold wrought, such as a bullet, and a hardened swaged wrought bullet are disclosed in which the bullet is formed from a lead or lead alloy blank by swaging the blank under high pressure in a forming die, heating the formed wrought bullet to a temperature near but less than the slump temperature of the metal, and then quenching the heated swaged wrought bullet in a liquid to rapidly reduce its temperature. The swaged wrought bullet as thus formed is seamless and has a hardness which exceeds at least 15 Brinell.

Abstract: An alloy of 3 to 9 weight percent boron with the balance molybdenum for use as a thermal spray coating for articles intended to be exposed to molten zinc.

Abstract: A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.

Abstract: A cast alloy article suitable for improving the combustion characteristics and efficiency of a liquid fuel is disclosed. This cast alloy article is chiefly characterized by having coarse and irregular surface contour of interspersed peaks, valleys and pores that provide for increased surface area for increased fluid contact and provide for increased turbulence in fluid flow. The article has interspersed dendritic areas of solid dendrites and interdendritic areas of solid metal that also provide maximum surface area contact and turbulence of fluid flow of a fluid that is passed over the surface thereof. This article is made by heating selected quantities of selected metals including copper, zinc, nickel and tin to a temperature of above about 2000.degree. F. but not in excess of 2400.degree. F. intermixing the heated metals, pouring the heated metals into sand mold of a particular mesh to accomplish a coarse and irregular contour with pores and retaining the poured body at a temperature between about 2000.

Abstract: A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<x<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).

Abstract: A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0% to about 10.5% by weight bismuth.

Abstract: An enhanced bonding design utilizing tin and copper to create tin alloy solders for use in the manufacturing of heat exchangers and other soldering applications. The tin alloy solders contain as primary constituent metals 3.0-15.0 wt. % copper and 79.0-97.0 wt. % tin, and containing as optional constituent metals 0.0-4.0 wt. % silver, 0.0-1.0 wt. % selenium and 0.0-1.0 wt. % bismuth. These solder alloys have lower toxicity levels and better corrosion resistance than the lead based alloy solders commonly employed. Also, because the application temperature range for these solder alloys is below the temperature where dezincification of copper/zinc base metal alloys occurs, joints on copper/zinc base metals subjected to cyclic loads are stronger when constructed using these tin alloy solders than when constructed of lead based alloy solders.

Abstract: A non-toxic alloy for soldering electronic components comprising 80% Sn, 5-14.5% In, 4.5-14.5% Bi and 0.5% Ag. The disclosed alloy has a fine microstructure. Particles of intermetallic compounds are finely dispersed throughout the matrix, thereby inhibiting grain growth. Accordingly, the alloy does not significantly coarsen after thermal aging.

Abstract: A light weight, high strength ternary or higher-order cast beryllium-aluminum alloy, including approximately 60 to 70 weight % beryllium, one or both of from approximately 0.5 to 4 weight % silicon and from 0.2 to 4.25 weight % silver, with the balance aluminum. Beryllium strengthening elements selected from the group consisting of copper, nickel, or cobalt may be present at from 0.1 to 0.75 weight % of the alloy to increase the alloy strength.

Abstract: A light weight, high strength quaternary or higher-order cast beryllium-aluminum alloy, including approximately 60 to 70 weight % beryllium, and from approximately 0.2 to 5 weight % germanium and from 0.2 to 4.25 weight % silver, with the balance aluminum. Beryllium strengthening elements selected from the group consisting of copper, nickel, or cobalt may be present at from 0.1 to 5.0 weight % of the alloy to increase the alloy strength.

Abstract: A high solidus temperature, high service temperature, high strength multi-component solder alloy having a major portion of Sn and effective amounts of Sb, Bi and Cu.

Abstract: A sucker rod coupling 10 having a high ultimate tensile strength, resistance to corrosion, and resistance to surface cracking arising out of a method of making the sucker rod coupling 10, which employs a five-step process of forming a coupling 10. First, a hollow cylindrical core 12 from a heat treatable steel is formed. Second, a thin coating 18 of metallic alloy is applied to the outer surface of the core 12. Third, the core 12 is heat treated. Fourth, threads 20 are partially cut in the inner surface of the core 12. Fifth, the threads 20 are cold worked to transform the partially cut threads 20 into finished threads 20 and to place the thread roots 22 in compression.

Abstract: A sucker rod coupling 10 having a high ultimate tensile strength, resistance to corrosion, and resistance to surface cracking arising out of a method of making the sucker rod coupling 10, which employs a five-step process of forming a coupling 10. First, a hollow cylindrical core 12 from a heat treatable steel is formed. Second, a thin coating 18 of metallic alloy is applied to the outer surface of the core 12. Third, the core 12 is heat treated. Fourth, threads 20 are partially cut in the inner surface of the core 12. Fifth, the threads 20 are cold worked to transform the partially cut threads 20 into finished threads 20 and to place the thread roots 22 in compression.

Abstract: The catalyst is provided for improving the performance of hydrocarbon fuels used in internal combustion engines. The catalyst is a based metal alloy catalyst including tin, antimony, lead, mercury and thallium in the following proportions by weight percent:Sb 18-20Pb 4.5-5.5Hg 12-14Tl 0.1-0.5and the balance consisting essentially of Sn. The catalyst operates at ambient temperatures and atmospheric pressure. The catalyst is intended to pretreat fuel before combustion and may be disposed in the fuel tank, fuel line or return fuel line.

Abstract: Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.

Abstract: A metallic melt is atomized using a high pressure atomizing gas wherein the temperature of the melt and the composition of the atomizing gas are selected such that the gas and melt react in the atomization spray zone to form a refractory or intermetallic compound in the as-atomized powder particles.A metallic melt is also atomized using a high pressure atomizing gas mixture gas wherein the temperature of the melt and the ratio of a reactive gas to a carrier gas are selected to form powder particles comprising a supersaturated solid solution of the atomic species of the reactive gas in the particles. The powder particles are then heat treated to precipitate dispersoids in-situ therein to form a dispersion strengthened material.

Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.

Abstract: Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.

Abstract: The present invention provides a hydrogen storage alloy electrode made of a pentanary or higher multi-component hydrogen storage alloy or a hydride thereof where the alloy comprises at least Zr, Mn, Cr, Ni, and M where M is one or more elements selected from V an Mo, and a major component of the alloy phase is C.sub.15 (MgCu.sub.2) type Laves phase. This hydrogen storage alloy electrode may be enhanced in its performance by subjecting the alloy after the production thereof to a homogenizing heat-treatment at a temperature of 900.degree. to 1300.degree. C. in vacuum or in an inert gaseous atmosphere.

Abstract: The present invention is directed to a method for producing a diaphragm for highly brittle metals used in loudspeakers, comprising a step of making a laminated plate by stacking a plate of superplastic material on a plate of highly brittle metal. The laminated plate is arranged on a mould, and the laminated plate is heated to a predetermined range of temperatures, determined according to the highly brittle metal. Subsequently, the laminated plate is deformed by pressuring the laminated plate in the mould, at the range of temperatures. Thus, a diaphragm can be formed from a plate of highly brittle metals, without causing brittle fracture or generating internal or surface defects.

Abstract: A process for obtaining lithium-based thin sheets, generally used for the production of negative plates for accumulators. The thin sheets are formed by adding magnesium to a bath of molten lithium, transforming the alloy into a solid product in a form suitable for rolling, and rolling the solid product obtained by passing it between steel cylinders a plurality of times at ambient temperature to obtain thin sheets.

Abstract: Jewelry is produced employing alloys of Fe, Co, Ni, Pd, Pt, Au, as well as --in smaller quantities--Cu, in conjunction with Al, Ga, In, Si, these alloys displaying the feature of being crystallized in the cubic structure of the type B2 or C1, designations as used in structure reports. These alloys, which display very decorative colors not found with other metals, or anywhere else in nature, are--per se--very brittle and subject to spontaneous disintegration in reactive media. For this reason, these materials are very difficult to form and cannot be used for the intended purpose. Their properties can be decisively improved by impressing upon the alloys a grain size of less than 50 .mu.m by hot-forming or by sintering, for example, or by some other process, and by selecting the composition of the alloy with the intent to keep the quantity of the transition metal component A at a value not lower than stochiometric value. The jewelry items may consist of one of these alloys, fully or partially.

Abstract: The invention relates to a material (504), having adjacent regions of differing strength and ductility, that has been formed by rapidly deforming a suitable base metal (501) having a banded structure, such as illustartively a previously cold worked low carbon steel alloy, in order to generate a high rate of change in the internal energy of the base metal. This energy change depressed the transformation temperatures of the base metal and induced an allotropic phase transformation to occur therein. Specifically, prior to being deformed, the base metal is maintained at a fairly low temperature, e.g. at or near room temperature. The tooling, preferably rolls, that is used to provide the deformation is maintained at a modestly elevated temperature.

Abstract: An intermetallic compound semiconductor thin film comprises a single crystalline deposition thin film made of a III-V group intermetallic compound having a stoichiometry composition ratio of 1:1. When forming the III-V group semiconductor thin film by an evaporation method, a substrate temperature is initially maintained at a high level while the evaporation source temperature is gradually raised, and when the intermetallic composition of the III-V group begins to deposit on the substrate, the substrate temperature is lowered while the evaporation source temperature is maintained at the same level as existed at the time when the intermetallic compound is deposited, and the deposition time is controlled.

Abstract: A magnetic refrigerant for magnetic refrigeration which comprises a sintered body containing at least one of rare earth elements selected from the group consisting of lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and yttrium and a balance consisting essentially of at least one of aluminum, nickel and cobalt.This invention provides sintered magnetic bodies which are suited for use as magnetic refrigerants, and also provides significant contribution to the performance improvement of magnetic refrigerators and to the materialization of regenerator-type magnetic refrigerants.

Abstract: The products of this invention are produced in an elongated casting vessel disposed in upright position to receive liquid metal for solidification within an electromagnetic field generating means disposed around the vessel along a portion of its length. The electromagnetic field generating means produces an upward lifting effect on liquid metal in the vessel together with a containment effect wherein the liquid metal is continuously urged upwardly into contact with the lower end of the solidifying product and maintained in a pressureless contact condition with respect to the walls of the casting vessel. In this way, voids and flaws are avoided and fully dense homogeneous products of uniform, small grain cross section result without wear on the casting vessel. The novel products of the invention are long metal bodies which are fully dense and of substantially uniform, fine grain cross section and constant composition throughout in each instance.

Abstract: A process is provided for increasing the strength of antimony-lead alloys by specially treating an alloy which contains an effective amount of arsenic in the alloy, the process comprising working the alloy, rapidly heat treating the alloy, which includes quenching, for a period of time sufficient to activate a strengthening mechanism in the alloy. The process is especially useful for the manufacture of battery grids on a continuous production line.

Abstract: New alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2 (where x ranges between 0 and 1 and preferably has a value of about 0.75) and CuIn.sub.y Ga.sub.(1-y) Se.sub.2 (where y ranges between 0 and 1 and preferably has a value of about 0.90) in the form of single crystals with enhanced structure perfection, which crystals are substantially free of fissures are disclosed. Processes are disclosed for preparing the new alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2. The process includes placing stoichiometric quantities of a Cu, Ag, In, and Se reaction mixture or stoichiometric quantities of a Cu, In, Ga, and Se reaction mixture in a refractory crucible in such a manner that the reaction mixture is surrounded by B.sub.2 O.sub.3, placing the thus loaded crucible in a chamber under a high pressure atmosphere of inert gas to confine the volatile Se to the crucible, and heating the reaction mixture to its melting point.

Abstract: Structural streaking defects in anodized aluminum architectural sheet products are substantially reduced or eliminated in 1XXX and 5XXX type aluminum alloys by including therein 0.01 to 0.08% of chromium or manganese, preferably both. It is preferred to combine such with continuously casting the ingot under high chill rate conditions such as employing low liquid metal head within the direct chill mold.