Shielded Patents (Class 174/350)
  • Publication number: 20110011638
    Abstract: The present invention comprises a shielding tape comprising at least one shielding layer, at least one separator layer, a first (inner) edge, and a second (outer) edge. The shielding tape further includes an indicator extending along at least a portion of the outer edge. The indicator is for identifying the outer edge when the outer edge overlaps the inner edge when the shielding tape is positioned onto a cable. Alternatively, both edges may have an indicator. The present invention makes it easy to locate the outer edge of the shielding tape for an installer wishing to remove at least some of the shielding tape before crimping or compressing a connector onto the end of a cable.
    Type: Application
    Filed: October 26, 2009
    Publication date: January 20, 2011
    Inventors: Paul Gemme, Leonard Visser
  • Publication number: 20110011639
    Abstract: A coaxial cable of the present invention comprises a center conductor, a dielectric surrounding the center conductor, a shielding tape surrounding the dielectric, a braided metal surrounding the shielding tape, and an outer jacket surrounding the braided metal. The shielding tape comprises: (i) a first shielding layer bonded to a first separating layer; (ii) a second shielding layer bonded to the first separating layer and a second separating layer; and (iii) a third shielding layer bonded to the second separating layer. The present invention eliminates the potential problem of the outer shielding structures separating and interfering with connector attachment. Furthermore, the use of three or more shielding layers in the shielding tape of the present invention improves the flex life of the shield tape by covering micro-cracks in the metal layers with additional shielding layers, thus reducing signal egress or ingress.
    Type: Application
    Filed: October 26, 2009
    Publication date: January 20, 2011
    Inventor: Leonard Visser
  • Patent number: 7869224
    Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: January 11, 2011
    Assignee: All Best Precision Technology Co., Ltd.
    Inventor: Haven Yang
  • Publication number: 20100326717
    Abstract: An electromagnetic interference preventing module is provided. The module includes a metal pad that is disposed on a circuit board. The metal pad includes a soldering portion and a grounding portion that are connected to each other. At least one fixing lug of a connector is soldered to the soldering portion. At least one protrusion of a grounding housing is in contact with the grounding portion, so as to electrically connect the connector with the grounding housing.
    Type: Application
    Filed: September 11, 2009
    Publication date: December 30, 2010
    Applicant: Quanta Computer Inc.
    Inventors: Wen-Cheng Lin, Mao-Chen Hsiao
  • Publication number: 20100319981
    Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating positioned on an electrical system having circuit components mounted thereon, the dielectric coating shaped to conform to a surface of the electrical system and having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the conductive coating and the contact pads. The dielectric coating and the conductive coating have a plurality of overlapping pathway openings formed therethrough to isolate a respective shielding area of the conformal structure over desired circuit components or groups of circuit components.
    Type: Application
    Filed: June 22, 2009
    Publication date: December 23, 2010
    Inventors: Christopher James Kapusta, Donald Paul Cunningham
  • Patent number: 7855897
    Abstract: An electronic device including a first portion, a second portion, and a circuit board is provided. The first portion has a first surface including a first conductive region. The second portion has a second surface including a second conductive region and a second nonconductive region. The second conductive region and the second nonconductive region are respectively in contact with a part of the first conductive region. The circuit board has a plurality of electronic components thereon, and the circuit board is disposed at one side of the first portion and the second portion.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: December 21, 2010
    Assignee: ASUSTeK Computer Inc.
    Inventors: Shi-Tan Lin, Shih-Jen Chuang, Chien-Hsu Hou, Hsiang-Li Yu, Pei-Chin Wang
  • Publication number: 20100314148
    Abstract: A flexible cable including an outer sheath having an inner surface, the inner surface forming a channel to receive at least one conductor and a support member. At least one conductor and support member are positioned within the channel to substantially resist deformation of the outer sheath.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 16, 2010
    Applicant: Southwire Company
    Inventors: Richard Temblador, John R. Carlson, Mark D. Dixon, Randy D. Kummer, Charles D. Mercier
  • Publication number: 20100314164
    Abstract: A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.
    Type: Application
    Filed: September 28, 2009
    Publication date: December 16, 2010
    Inventors: Chung-Lun WU, Fu-An Chu, Ja-Ee Li
  • Publication number: 20100307811
    Abstract: An electrical power cable includes a central support or a ground conductor surrounded by an insulating material layer. An inner grounded shield is disposed on the support or on the ground conductor. A plurality of insulated line conductors and a plurality of insulated neutral conductors are circumferentially disposed in an annular arrangement about an insulation layer on the inner shield. The plurality of line and neutral conductors are disposed in various alternating single, double or triple conductor groups. The total cross-sectional area of all of the line conductors or all of the neutral conductors is substantially equal to the total cross-sectional area of a single large conductor of equivalent ampere rating. An outer shield is disposed about the line and neutral conductors and covered by an outer insulating layer.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 9, 2010
    Applicant: ESSENTIAL SOUND PRODUCTS, INC.
    Inventor: Michael D. Griffin
  • Patent number: 7848114
    Abstract: An electronic ballast and ballast housing having an integral ground for a circuit board positioned within the housing. A ‘snap in’ capture means holds circuit board under flexion so as to press a circuit grounding means in electrical contact with an integral grounding device attached to the ballast housing and providing electrical continuity between the circuit grounding means and the ballast housing. The coupler includes a grounding tab with a fulcrum extension extending from the housing and holding a ground plane surface of the circuit board by means of serrated teeth. An alignment tab disposed on a housing wall receives an alignment slot disposed in the circuit board so as to provide proper alignment of the electrical contacts. The coupler includes an overhead extension that engages a jumper wire in the circuit of the circuit board.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: December 7, 2010
    Assignee: Universal Lighting Technologies, Inc.
    Inventors: James Van Pelt, David McCarty, J. C. Kelley
  • Publication number: 20100300744
    Abstract: A shielding article includes a first conductive layer and a second conductive layer spaced apart from the first conductive layer by a non-conductive polymeric layer defining a separation distance. The first conductive layer and the second conductive layer cooperatively provide a first shielding effectiveness. The first conductive layer, the second conductive layer, and the separation distance cooperatively provide a second shielding effectiveness that is greater than the first shielding effectiveness.
    Type: Application
    Filed: May 19, 2010
    Publication date: December 2, 2010
    Inventors: Walter R. Romanko, Jeffrey A. Lim, Sywong Ngin, Eugene P. Janulis, JR.
  • Publication number: 20100294557
    Abstract: Embodiments of the invention are directed to transmission cables, and particularly to twinax cables, for transmitting digital data and other information between components in a data processing environment. One embodiment of the invention is directed to an information transmission cable that comprises first and second signal carrying conductors of specified length, each of the signal carrying conductors being disposed to carry information signals and having a longitudinal axis. The embodiment further includes an insulating structure comprising an amount of specified dielectric insulation material, the insulating structure being positioned to surround the first and second signal carrying conductors along their respective lengths, and acting to maintain the first and second signal conductors in spaced apart parallel relationship with each other.
    Type: Application
    Filed: May 19, 2009
    Publication date: November 25, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Moises Cases, Jinwoo Choi, Bhyrav M. Mutnury
  • Publication number: 20100296817
    Abstract: Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.
    Type: Application
    Filed: December 2, 2009
    Publication date: November 25, 2010
    Applicant: FINISAR CORPORATION
    Inventors: Chris K. Togami, Gary Sasser, Frank Flens
  • Publication number: 20100288551
    Abstract: An electro magnetic (EM) wave shielding device includes at least one metal plate and an EM wave absorbing material configured on a lateral side of the metal plate. The lateral side of the metal plate configured with the EM wave absorbing material covers a test point region of a circuit board, thereby absorbing and shielding EM waves generated by the test point region.
    Type: Application
    Filed: June 12, 2009
    Publication date: November 18, 2010
    Applicant: Inventec Corporation
    Inventors: Yuan Ho Chen, Chun Ying Yang
  • Patent number: 7830672
    Abstract: An electromagnetic shielding carrying case comprising a front and middle panel hingedly connected to a rear panel. The front panel and middle panel further comprise respective electromagnetic shielding members with a card holding means affixed to each. The carrying case has a closed state wherein the continuous upstanding walls of the front and rear panels are brought into engagement with one another so as to form an enclosure around the middle panel, thus shielding contactless smartcards within from being powered up by an RFID reader. A releasable locking means affixed to a front portion of the rear panel temporarily holds front panel closed, and can be unlocked so that the front panel pivots open, creating the first open state of the carrying case wherein contactless smartcards can be inserted and removed from both card holding means. The middle panel can also be pivoted open to reveal a pocket within the rear panel that holds paper currency and the like.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: November 9, 2010
    Inventor: Michael William Kitchen
  • Publication number: 20100263924
    Abstract: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the exterior of a first conductive cylindrical component whose interior contains a portion of a millimeter-wave beam waveguide energy transmission system, the grooves comprising the electromagnetic portion of the seal and a second set of grooves is cut into the interior of the conductive housing enclosing the first conductive cylindrical component.
    Type: Application
    Filed: June 8, 2010
    Publication date: October 21, 2010
    Inventors: David Crouch, Vincent Giancola, Kenneth W. Brown
  • Patent number: 7817442
    Abstract: An input device of the invention includes a body formed with an accommodating part; an operation member having a basal end accommodated in the accommodating part and a distal end projected in a swinging operable manner to either side in a width direction and in a pushing operable manner from an neutral position; and an earth terminal for dissipating static electricity charged in the operation member. The input device is attachable to a circuit board. The earth terminal, being a metal plate insert molded in a wall, includes a contacting portion and first and second projections arranged near the operation member, and connecting parts exposed from the other end face of the body and solder connectable to respective earth patterns of the circuit board.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: October 19, 2010
    Assignee: Hosiden Corporation
    Inventor: Satoshi Yamanaka
  • Publication number: 20100258343
    Abstract: A flexible thin image-sensing module with anti-EMI function includes a flexible substrate unit, an electronic element unit, an anti-EMI unit, and a conductive structure. The electronic element unit has a plurality of electronic elements disposed on a top surface of the flexible substrate unit, and the electronic elements at least include an image sensor, a low dropout regulator and a backend IC. The anti-EMI unit is disposed on a bottom surface of the flexible substrate unit. The conductive structure passes through the flexible substrate unit and is electrically connected between the electronic element unit and the anti-EMI unit in order to guide electromagnetic waves generated by the electronic element unit to the anti-EMI unit.
    Type: Application
    Filed: June 9, 2009
    Publication date: October 14, 2010
    Inventor: Chi-Hsing Hsu
  • Publication number: 20100252300
    Abstract: This invention is directed to an electromagnetically shielded subsea power cable containing at least one conductor, an electromagnetic shielding layer wrapped around each conductor, an insulation layer wrapped around each electromagnetic shielding layer, and a metallic shielding layer wrapped around each insulation layer. The subsea power cable can be used to transport power from a power source to a power user located subsea or at an intermediate facility, such as a platform.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 7, 2010
    Applicant: OCEANEERING INTERNATIONAL, INC.
    Inventors: Peter J. Worman, Luciana Abib, Rosianita Balena, Sean Derrickson
  • Publication number: 20100253563
    Abstract: A method and system for capacitor based digital to analog converter design layout for high speed analog to digital converter are provided. The method includes arranging a plurality of metal plates to form the capacitor. Each of the plurality of metal plates includes a driven plate and a common plate. The method also includes generating a plurality of interconnects in the common plate and extending the driven plate over the plurality of interconnects. Further, the method includes shielding the common plate by the driven plate. The system includes an analog to digital converter. The analog to digital converter also includes capacitor based digital to analog converter and digital logic for controlling digital operations in the analog to digital converter. The capacitor based digital to analog converter includes a plurality of capacitors, and a comparator for comparing the analog output from the digital to analog converter with a ground potential.
    Type: Application
    Filed: March 23, 2010
    Publication date: October 7, 2010
    Applicant: Cosmic Circuits Private Limited
    Inventors: Venkatesh Teeka Srinivasa SHETTY, Govind Kulkarni, Srinivasan Chakravarthy, Sumeet Mathur
  • Publication number: 20100230153
    Abstract: The present invention has the object of providing a technology that can facilitate inexpensive shields of individual electronic components with good heat exchange efficiency, the electronic circuit board according to the present invention being provided with: a plurality of conductor parts in a standing state that can extend and contract on a ground pattern that surrounds an electronic component on the electronic circuit board, a conductive plate, and securing members for holding the plate such that the plurality of conductor parts contact the plate in a state in which the conductor parts contract from their natural length.
    Type: Application
    Filed: November 21, 2008
    Publication date: September 16, 2010
    Inventor: Kazuto Satou
  • Publication number: 20100224399
    Abstract: Disclosed is an electromagnetic wave shielding heat-radiation sheet allowing electricity and heat to be transferred from one side surface to the other side surface of the sheet, in which conductive protrusions formed by partially cutting a conductive layer laminated on an elastic support layer are bent toward the rear surface of the elastic support layer to pass through the elastic support layer and come in contact with the rear surface of the elastic support layer.
    Type: Application
    Filed: April 17, 2008
    Publication date: September 9, 2010
    Applicant: Nano Interface Technology
    Inventor: Jin-Ho Song
  • Publication number: 20100218987
    Abstract: Systems and methods for minimizing the transmission and reception of electromagnetic interference (“EMI”) are provided. A member having first and second sides and at least one edge can be formed to correspond to the interior of an enclosure. At least one aperture can penetrate the member from the first side to the second side, forming at least one internal edge. A conductive layer can be disposed on or about the first side, the second side, the at least one edge, and the at least one internal edge of the member, thereby encapsulating the member.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 2, 2010
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Mark S. Tracy, Jeffrey A. Lev, Paul N. Walker
  • Patent number: 7787255
    Abstract: A grounding apparatus (200) includes at least one conductive member (20), a sliding mechanism (30) and a flexible printed circuit board (40). The sliding mechanism is conductive and electrically connected to the conductive member. The flexible printed circuit board includes a conductive layer (421) and a grounding end (4231), the conductive layer and the grounding end are electrically connected to the sliding mechanism.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: August 31, 2010
    Assignee: Chi Mei Communication Systems, Inc.
    Inventors: Ching-Sen Tsai, Mei-Tsu Tsao, Cheng-Lung Chang
  • Patent number: 7779529
    Abstract: A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the device. The tensioner or other method is used to stretch the elastic material, thereby reducing the thickness of the elastic material. With the thickness of the elastic material reduced by the stretching, the device is inserted into a hole in a mating part. Then the tension on the elastic material is removed, allowing the elastic material to increase in thickness, so as to fill at least part of the gap between the device and the mating part. The coupling may act as an effective heat transfer device for transmitting (by conduction) heat produced by the heat-producing device, to the mating part, which may act as, or be thermally coupled to, a heat sink.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: August 24, 2010
    Assignee: Raytheon Company
    Inventors: Alfred Sorvino, Hilario Tejeda, Randy Thompson
  • Publication number: 20100210142
    Abstract: The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
    Type: Application
    Filed: February 18, 2009
    Publication date: August 19, 2010
    Applicant: Cinch Connectors, Inc.
    Inventors: James L. McGrath, David W. Mendenhall, Hecham K. Elkhatib, William J. MacKillop, Alan A. Raclawski
  • Publication number: 20100194588
    Abstract: A system for communicating with a slickline tool is disclosed. The system includes a closed-loop electrical circuit including a surface module, a forward path, a tool, and a return path. The forward path includes a slickline cable.
    Type: Application
    Filed: October 9, 2007
    Publication date: August 5, 2010
    Inventors: Clive D. Menezes, Billy C. Bankston
  • Publication number: 20100193236
    Abstract: A sheath provides protection against radiation, in particular from the electric field generated by electric cables (1, 2, 3) located inside the sheath, the sheath surrounding or being intended to surround at least a neutral cable (1), an earth cable (2) and a phase cable (3) which are all connected to the power grid. The sheath includes an outer layer (4) made from electrically insulating plastic which covers an inner layer (5) made from electrically conductive material, elements being provided to connect the layer of electrically conductive material to an electrical conductor (7) intended to be earthed. The conductor to be earthed takes the form of a wire, all or part of which is made from electrically conductive material that extends internally along the entire length of the sheath and which is in electrical contact, at least along part of the length thereof, with the inner layer of electrically conductive material.
    Type: Application
    Filed: September 22, 2008
    Publication date: August 5, 2010
    Applicant: RAYPONSE
    Inventor: Christian Aumoitte
  • Publication number: 20100187006
    Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.
    Type: Application
    Filed: January 27, 2010
    Publication date: July 29, 2010
    Inventors: Lex Kosowsky, Bhret Graydon, Djabbar Moustafaev, Shurui Shang, Robert Fleming
  • Patent number: 7764933
    Abstract: A spacer for use in a mobile device fills the space between a component assembly and a housing. The spacer includes a layer of compressible material for insertion between the component assembly and the housing. A plurality of compressible features are provided on a face of the layer. Upon insertion of the component assembly and assembly of the housing, the compressible features are compressed to fill a gap between the component assembly and the housing without over-compressing the main body of the spacer, allowing the body of the spacer to cushion any subsequent impact to the mobile device.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: July 27, 2010
    Assignee: Research In Motion Limited
    Inventors: Herrebertus Tempelman, Robert W. Phillips
  • Patent number: 7764513
    Abstract: Disclosed is a high frequency wave tuner module including a circuit board having an approximately rectangular shape, which is made of ceramic material and a shield cover to shield an interfering wave by covering a circuit part mounted on a board surface of the circuit board, and a position of the shield cover in a height direction with respect to the board surface is determined by fixing the shield cover to the board surface at four corner positions of the circuit board, and a position of the shield cover in a board surface direction with respect to the circuit board is determined by engaging at least two side walls of the shield cover which extend in a thickness direction of the circuit board, with end surfaces of the circuit board, which correspond to the two side walls.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: July 27, 2010
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Shozo Miyamoto, Makoto Abe
  • Publication number: 20100181106
    Abstract: An apparatus having a reduced reflection from its surface includes a dielectric material and a capacitive circuit analog sheet buried within the dielectric material and configured to produce a reflection that adds out of phase with a reflection from an incident side of the dielectric material. The capacitive circuit analog sheet comprises conductive patches configured to have high impedance for transverse magnetic (TM) polarization.
    Type: Application
    Filed: January 16, 2009
    Publication date: July 22, 2010
    Inventors: Thomas Peter Delfeld, Nicole L. Dehuff
  • Patent number: 7760515
    Abstract: An EMI shielding assembly includes a bracket and a resilient shield. The bracket includes a top wall, a bottom wall, and a pair of sidewalls connected between the top wall and the bottom wall. A first and second opening are defined at opposite sides of the bracket and surrounded by the walls. Two face-to-face L-shaped plates extend from the pair of sidewalls respectively at the second opening. The shield is mounted between the L-shaped plates and covering the second opening.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: July 20, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Zheng-Heng Sun
  • Patent number: 7755913
    Abstract: A disk drive cage comprises a bracket (3) and a shielding member (1). The bracket comprises a top wall (31) and a securing wall (32) parallel to the top wall. The securing wall defines a plurality of securing holes (321) therein. The shielding member comprises a shielding cover (20) and a bezel (10) attached to the shielding cover. The shielding cover defines a plurality of cross-shaped slots (23). Each cross-shaped slot comprises a first slot (231) and a second slot (232) crossing the first slot. A receiving area (236) is defined in a crossing portion formed by the first and second slots. The bezel comprises a plurality of securing posts (12) interferentially engaging with the plurality of cross-shaped slots, and a plurality of hooks (162) engaging with the securing holes of the securing wall of the bracket. Each securing post comprises a securing portion (124). The securing portion is larger in cross-section than the receiving area. The shielding member is mounted between the top wall and the securing wall.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: July 13, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co. Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Yu-Wei He
  • Publication number: 20100171406
    Abstract: To provide an electroconductive laminate which has a broad transmission/reflection band and which is excellent in electrical conductivity (electromagnetic wave shielding properties), visible light transmittance, visible light antireflection properties, near infrared shielding properties and moisture resistance, and an electromagnetic wave shield for a plasma display employing such a laminate. An electroconductive laminate 20 comprising a substrate 21 and an electroconductive film 22 formed on the substrate 21, wherein the electroconductive film 22 has a multilayer structure having a high refractive index layer (23a to 23e) and a metal layer (24a to 24d) alternately laminated in this order from the substrate side in a total number of 2n+1 layers (wherein n is an integer of from 1 to 12) and further having a hydrogenated carbon layer 25 at a position most removed from the substrate 21; the refractive index of the high refractive index layer (23a to 23e) is from 1.5 to 2.
    Type: Application
    Filed: March 18, 2010
    Publication date: July 8, 2010
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Masayuki Morino, Kazuya Takemoto, Hideaki Miyazawa, Michihisa Tomida, Tamotsu Morimoto, Yuichi Hino
  • Publication number: 20100163298
    Abstract: The present invention generally relates to an electromagnetically-countered power grid system with multiple wave sources and at least one counter unit, where each wave source irradiates harmful electromagnetic waves, while the counter unit emits counter electromagnetic waves and counters the harmful waves therewith. More particularly, the present invention relates to such electromagnetically-countered power grid systems and to various mechanisms for countering the harmful waves with the counter units, e.g., by matching configurations of the wave sources with those of such counter units and/or by matching wavefronts of the harmful waves with those of such counter waves. In addition, the present invention relates to such electromagnetically-countered power grid systems with multiple power transmission lines each operating as the counter unit of the rest of the transmission lines.
    Type: Application
    Filed: December 31, 2008
    Publication date: July 1, 2010
    Inventor: Youngtack Shim
  • Publication number: 20100163299
    Abstract: An electronic device and a high frequency circuit board thereof are disclosed. The high frequency circuit board includes a first dielectric layer, a first signal line formed on the first dielectric layer, a second dielectric layer overlaying the first dielectric layer and covering the first signal line, and a first EMI shielding layer overlaying the second dielectric layer. The first EMI shielding layer has a gap formed thereon. The gap is formed at a position corresponding to the position of the first signal line.
    Type: Application
    Filed: December 16, 2009
    Publication date: July 1, 2010
    Inventors: Hsu-Kuan Hsu, Ching-Jung Tsai, Shih-Nien Huang, Wei-Chih Chang
  • Publication number: 20100161019
    Abstract: A system and method for electrically shielding a physiological pathway from electrical noise is disclosed. The method includes the operation of implanting at least one signal microelectrode into a patient such that the signal microelectrode is proximate to the physiological pathway. An additional operation includes substantially enclosing the microelectrode and a section of the physiological pathway with an electrical shielding wrap. The electrical shielding wrap includes a plurality of holes that enable fluid communication of physiological fluids between an inside and outside of the wrap.
    Type: Application
    Filed: December 10, 2009
    Publication date: June 24, 2010
    Inventors: Gregory Arthur Clark, David J. Warren, Noah M. Ledbetter
  • Publication number: 20100149780
    Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.
    Type: Application
    Filed: May 7, 2009
    Publication date: June 17, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEN-JIA REN, XIAO-YAN QIN
  • Publication number: 20100147577
    Abstract: A method produces a conductive substrate wherein a metal fine particle layer is laminated onto at least one surface of a base in a network form. This method includes a step for treating the metal fine particle layer with an organic solvent; and a following step for treating the metal fine particle layer with an acid. Also disclosed is a conductive substrate produced by such a method. This method enables to produce a conductive substrate, which has transparency and high conductivity and is thus suitable for electromagnetic shielding films and the like, with high productivity.
    Type: Application
    Filed: March 23, 2007
    Publication date: June 17, 2010
    Applicant: Torqy Industries, Inc., a corporation of Japan
    Inventors: Shotaro Tanaka, Junpei Ohashi, Yasushi Takada
  • Patent number: 7738264
    Abstract: The present invention provides methods and devices for protecting electronic components of handheld electronic devices from electrostatic discharge. An electronic device in accordance with the present invention includes an enclosure having first and second housing portions, a mating edge connection between the first and second housing portions, an electronic component, and an electrically insulating frame. The electrically insulating frame is positioned within the enclosure and surrounds at least a portion of the electronic component thus providing an electrostatic discharge barrier between the mating edge connection and the electronic component.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: June 15, 2010
    Assignee: Lifescan Scotland Ltd.
    Inventors: Jim Christol, Wayne Kvenvold, Joseph A. McCluskey, Enrico Tresoldi
  • Patent number: 7738942
    Abstract: An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: June 15, 2010
    Assignee: Medtronic, Inc.
    Inventors: Michael L. Weiner, Victor R. Miller, Patrick R. Connelly, Jeffrey L. Helfer
  • Publication number: 20100142035
    Abstract: A front filter for improving quality of a display device by improving a shielding capability of the filter and a method of manufacturing the front filter. In one embodiment, the front filter includes a base substrate, a first shielding structure, and a second shielding structure. The first shielding structure includes a first lower insulating layer on the base substrate, a first conductive layer on the first lower insulating layer, and a first upper insulating layer on the first conductive layer. The second shielding structure includes a second lower insulating layer on the first upper insulating layer, a second conductive layer on the second lower insulating layer, and a second upper insulating layer on the second conductive layer. In the front filter, an edge of the first shielding structure is exposed to an outside of the second shielding structure.
    Type: Application
    Filed: December 2, 2009
    Publication date: June 10, 2010
    Inventor: Jae-Young Yeo
  • Patent number: 7733667
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: June 8, 2010
    Assignee: Harris Stratex Networks Operating Corporation
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Publication number: 20100134985
    Abstract: An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.
    Type: Application
    Filed: December 1, 2008
    Publication date: June 3, 2010
    Inventor: Chi-Hsing Hsu
  • Patent number: 7729125
    Abstract: A printed circuit board unit is configured so that, when a charged electrical circuit unit is electrically connected to the printed circuit board unit, first, the ground potential of the electrical circuit unit is dropped to the frame ground potential, and next, the ground potential of the electrical circuit unit is dropped to the ground potential of an electrical circuit on the printed circuit board unit.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: June 1, 2010
    Assignee: Fujitsu Limited
    Inventors: Hideo Araki, Naoya Yamazaki
  • Patent number: 7729131
    Abstract: Electronic devices can be provided with at least one first circuit component coupled to a first circuit board, at least one second circuit component coupled to a second circuit board, and a mating assembly coupled to the boards for holding them in a vertical stack. The first circuit components can face the second circuit components in the stack. One or more of the first circuit components can be horizontally offset from one or more of the second circuit components in the stack to reduce the thickness of the mated circuit boards. Portions of the circuit boards and the mating assembly can shield the circuit components of the stack from electromagnetic interference.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: June 1, 2010
    Assignee: Apple Inc.
    Inventors: Erik L. Wang, Louie Sangunietti
  • Patent number: 7719857
    Abstract: A structure of mounting a shield cover according to the present invention includes a shield cover having an insertion part which is inserted into a gap formed between a circuit substrate and a shield cover fastening part along the circuit substrate. The insertion part of the shield cover includes a convex part that is elastic and deformable, and the end of the insertion part and the shield cover fastening part come in contact with each other by the elasticity with the convex part being in contact with the circuit substrate as the fulcrum.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: May 18, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yuji Ogawa
  • Publication number: 20100101853
    Abstract: A tape can comprise a strip of dielectric material, with adhering patches of electrical conductive material. The patches can be substantially electrically isolated from one another. The strip can be disposed in a communication cable to provide a shield that is electrically discontinuous or has high resistance between opposite cable ends. Each patch can interact with electromagnetic radiation associated with electrical signals transmitting over the cable. The patches can collectively interact with the transmitting electrical signals in a cumulative or resonant manner to produce a spike in return loss at a particular frequency of the transmitting signals. The frequency location of the spike can depend upon the sizes of the patches, with size impacting manufacturability. The patches can be sized such that the spike falls within an operating frequency of the transmitting signal but is suppressed, so the cable meets return loss specifications while offering manufacturing advantage.
    Type: Application
    Filed: December 18, 2009
    Publication date: April 29, 2010
    Inventors: Christopher W. McNutt, James S. Tyler, Michael Klepper, Delton C. Smith, Jôrg-Hein Walling
  • Patent number: 7703349
    Abstract: A cable laying structure for a robot, which does not interfere with external devices in a periphery of a forearm. Camera and hand control cables and motor control cables are drawn into a robot mechanism through a connection panel of a base of a robot main body. While allowing the motor control cables to sequentially diverge, the control cables are arranged in a robot arm along an upper arm portion and guided to the forearm. The control cables are introduced into the forearm with a shield and a sheath removed. After reaching an end effector-mounting face, the control cables are connected to a camera and a hand. The forearm is formed of conductive material and grounded on the base of the robot main body to have the same electric potential as the base by using an earth cable, and therefore the forearm is utilized in replacement of the shield.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: April 27, 2010
    Assignee: Fanuc Ltd
    Inventors: Ryo Nihei, Toshihiko Inoue, Jun Ibayashi, Takatoshi Iwayama