Shielded Patents (Class 174/350)
  • Publication number: 20090133922
    Abstract: A light transmitting conductive film formed by patterning a conductive metal part and a visible light transmitting part on a transparent support, wherein the conductive metal part is made up of mesh-forming thin lines of from 1 ?m to 40 ?m size and the mesh pattern continues for 3 m or longer. A method of producing a display filter wherein the end sections of at least two sides facing each other are in a mesh shape, which comprises using an electromagnetic wave shielding material (C), wherein a conductive layer (B) having the conductive parts being in the mesh shape of the geometric pattern is formed on one face of a polymer film (A) continuously in the machine direction of the polymer film (A), and cutting the mesh-like parts.
    Type: Application
    Filed: February 15, 2006
    Publication date: May 28, 2009
    Applicants: FUJIFILM Corporation, MITSUI CHEMICALS, INC.
    Inventors: Kentaro Okazaki, Akimitsu Morimoto, Tomoyuki Okamura, Toshihisa Kitagawa, Makoto Morohashi, Tomoaki Ito, Hiromi Minami
  • Publication number: 20090126984
    Abstract: An electromagnetic shielding film comprises a conductive portion and an opening portion, and a moire preventing part is formed in the opening portion. The moire preventing part may be formed approximately at the center of the opening portion, and may be formed on a line connecting intersections facing each other in the conductive portion in the mesh pattern. The moire preventing part may have a substantially circular planar shape or a polygonal planar shape (such as a quadrangular, pentagonal, hexagonal, or octagonal shape). Of course the moire preventing part may have an at least partially curved planar shape. The electromagnetic shielding film preferably satisfies the inequality 0.1Sa?Sb?5.0Sa, in which Sa is the area of the intersection of the conductive portion and Sb is the area of the moire preventing part.
    Type: Application
    Filed: May 7, 2008
    Publication date: May 21, 2009
    Applicant: FUJIFILM CORPORATION
    Inventors: Ryuji Saneto, Megumi Sekiguchi, Hiroshi Ishizuka
  • Publication number: 20090120681
    Abstract: An electromagnetic noise absorber to be attached around an electric cable to attenuate noise transmitted through the electric cable. The electromagnetic noise absorber comprises a strip-like base material and a plurality of ferrite pieces fixed to the strip-like base material. The plurality of ferrite pieces are formed by fixing a sheeted ferrite sintered body to the strip-like base material, and subsequently splitting the sheeted ferrite sintered body along split lines oblique with respect to a longitudinal direction of the strip-like base material. The electromagnetic noise absorber is wound around a circumference of the electric cable such that the split lines are parallel to an axial direction of the electric cable, thereby being attached in a spiral manner around the circumference of the electric cable.
    Type: Application
    Filed: November 10, 2008
    Publication date: May 14, 2009
    Applicant: Kitgawa Industries Co., Ltd.
    Inventor: Toru MATSUZAKI
  • Publication number: 20090114437
    Abstract: A shielding device configured to provide EMI and ESD protection includes an anti-ESD layer, a conductive layer, and an EMI blocking layer attached to each other in sequence. In addition, a supporting layer can be optionally attached to the EMI blocking layer to increase the strength of the shielding device.
    Type: Application
    Filed: August 18, 2008
    Publication date: May 7, 2009
    Inventors: Lung-Fai Tuen, Andy C.H. Chang
  • Publication number: 20090114440
    Abstract: There are provided a soft magnetic material in the form of particles for suppressing occurrence of electromagnetic interference which is capable of exhibiting the suppressing effect in a broad frequency range from a low frequency band to a high frequency band, as well as an electromagnetic interference suppressing sheet using the material. When a conductive magnetic filler prepared by mixing a conductive carbon with soft magnetic particles at a volume ratio of 3 to 10:50 to 70 is highly filled in a sheet material, there can be obtained an electromagnetic interference suppressing sheet which is suitable for high-density mounting to electronic equipments, has an excellent electromagnetic absorption in a near electromagnetic field, and is fully suppressed from undergoing electromagnetic reflection thereon.
    Type: Application
    Filed: January 18, 2007
    Publication date: May 7, 2009
    Inventors: Kazumi Yamamoto, Tetsuya Kimura
  • Patent number: 7518880
    Abstract: A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: April 14, 2009
    Assignee: Bi-Link
    Inventor: Frank J. Ziberna
  • Publication number: 20090084599
    Abstract: An EMI shielded display window for an electronic device is prepared by coating at least one surface of the window with an optically transparent shielding layer. The shielding layer is a coating or ink containing conductive nanoparticles applied to the window at a thickness of 10 microns or less. The coating can be optionally plated with a layer of copper, silver or nickel for improved performance.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 2, 2009
    Applicant: Parker Hannifin Corporation
    Inventors: Christopher L. Severance, Ronald McBride, Matthew Finley
  • Publication number: 20090071708
    Abstract: To reduce cross-talk between adjacent hot electrodes, the present invention provides a ground plane, which extends beneath each side of a MEMS mirror platform covering opposite edges of a hot electrode along each side thereof. The ground plane includes an overhang section extending between the mirror platform and the hot electrode forming a first gap between the hot electrode and the overhang section, and a second gap between the overhang section and the mirror platform. The method of the present invention enables highly accurate construction using lithographic patterning and deep reactive ion etching (DRIE).
    Type: Application
    Filed: August 1, 2008
    Publication date: March 19, 2009
    Inventors: John Michael Miller, Steven Harold Moffat
  • Patent number: 7501721
    Abstract: A reduced-noise switching power supply includes a conductive surface disposed transversely in an air space between a line filter system component and a switching system component. The conductive surface does not encase either the line filter system component or the switching system component.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: March 10, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rick Geveshausen, Rick Shaw
  • Publication number: 20090057002
    Abstract: A shield structure having a plurality of hollow columnar base members arranged with intervals therebetween along the periphery of a section to be shielded on a surface of a circuit board, and a shield cover with a peripheral wall having insertion pieces arranged along the edge thereof at positions corresponding to the positions where the base members are arranged. Each base member has a cut in at least a top surface thereof. The cut forms an elastically deformable tongue portion having a free end at a position where the corresponding insertion piece of the shield cover is inserted. The tongue portion is elastically deformed toward the inner space of the base member by an insertion force applied when the corresponding insertion piece of the shield cover is inserted into the cut at the free end.
    Type: Application
    Filed: November 18, 2008
    Publication date: March 5, 2009
    Inventor: Wataru Kakinoki
  • Publication number: 20090052153
    Abstract: An electromagnetic shielding structure that includes a conductive structure surrounding and accommodating a circuit or a circuit device arranged on a substrate. At least one feed through device is associated with the conductive structure and provides signals to the circuit or circuit device. The method includes forming a shielding structure so that the shielding structure at least one of is at least partially arranged within the substrate and surrounds the circuit or circuit device and associating at least one feed through device with the shielding structure.
    Type: Application
    Filed: August 24, 2007
    Publication date: February 26, 2009
    Inventors: Hanyi Ding, Kai D. Feng, Zhong-Xiang He, Xuefeng Liu
  • Patent number: 7492610
    Abstract: Disclosed is an apparatus for improving server electromagnetic shielding at high and low frequencies, including a metallic plate in fixed association with a surface of a server casing, the metallic plate defining a plurality of openings, and a substantially plastic shield including conductive metal fibers and defining a plurality of bosses extending from a boss surface of the plastic shield, the bosses configured to be insertable within the plurality of openings to allow the boss surface to be disposed adjacent to the metallic plate, each of the plurality of bosses defining a boss cavity that extends entirely through the plurality of bosses and the plastic shield.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: February 17, 2009
    Assignee: International Business Machines Corporation
    Inventor: Don A. Gilliland
  • Patent number: 7492603
    Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: February 17, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byong-su Seol, Hark-byeong Park, Hyung-geun Kim
  • Publication number: 20090038839
    Abstract: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.
    Type: Application
    Filed: May 10, 2006
    Publication date: February 12, 2009
    Applicants: TATSUTA SYSTEM ELECTRONICS Co., LTD, NIPPON MEKTRON, LTD
    Inventors: Kazuhiro Hashimoto, Syohei Morimoto, Yoshinori Kawakami, Kenji Kamino, Satoshi Ebihara, Hideaki Tanaka, Takahisa Akatsuka
  • Publication number: 20090025973
    Abstract: The device according to an exemplary embodiment of the present invention relates to an area of wireless communication and can be used for shielding from electromagnetic radiation. The electromagnetic screen with the big surface impedance contains a flat metal reflector substrate and two lattices of capacitor type that are shifted from each other on a share of the period in parallel and located above the reflector substrate. At least one of lateral edges of the lattices has an electric connection with an edge of the reflector substrate.
    Type: Application
    Filed: July 25, 2008
    Publication date: January 29, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yury Nikolaevich KAZANTSEV, Vladimir Nikolaevich APLETALIN, Vadim Anatolievich KALOSHIN
  • Publication number: 20090008146
    Abstract: A shield capable of attenuating wireless signals on demand has been created using a conductive member, such as a metal mesh or perforated metal sheet, which is either coupled to ground or subjected to an electron flow. A metal enshrouded signal isolation chamber was built and a wireless router was placed inside it. With the top of the chamber open, a plurality of conductive assemblies were evaluated by placing each conductive assembly on top of the open chamber, one at a time, and measuring the resulting signal attenuation.
    Type: Application
    Filed: March 17, 2008
    Publication date: January 8, 2009
    Inventor: Michael William Oleske
  • Publication number: 20090000816
    Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
    Type: Application
    Filed: December 7, 2007
    Publication date: January 1, 2009
    Applicant: RF MICRO DEVICES, INC.
    Inventors: David J. Hiner, Waite R. Warren, Jr., David Jandzinski
  • Publication number: 20090000815
    Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
    Type: Application
    Filed: December 7, 2007
    Publication date: January 1, 2009
    Applicant: RF MICRO DEVICES, INC.
    Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
  • Publication number: 20090000817
    Abstract: A current conductor for an electrical device including an electrically conducting central section having a first side and a second side. The central section is configured to receive at least one inserted electrical component. Two electrical conducting shield sections are each disposed on one of the first side and the side and configured to shield against an electric field. The shield sections cover the central section and the at least one inserted electrical component.
    Type: Application
    Filed: January 24, 2007
    Publication date: January 1, 2009
    Applicant: ABB Technology AG
    Inventors: Ole Granhaug, Jan-Henrik Kuhlefelt, Robert Espeseth, Thor Endre, Silvio Stangherlin, Gerhard Salge
  • Publication number: 20080314636
    Abstract: A multilayer shielded wire includes an inner conductor, a first conductor which covers the inner conductor through a first insulating layer, and a second conductor which covers the first conductor through a second insulating layer. A predetermined interlayer distance between the first conductor and the second conductor are set. A conductive portion is provided between the first conductor and the second conductor to electrically connect the first conductor to the second conductor.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 25, 2008
    Applicant: YAZAKI CORPORATION
    Inventor: Hiroyuki OGURA
  • Patent number: 7467457
    Abstract: A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the device. The tensioner or other method is used to stretch the elastic material, thereby reducing the thickness of the elastic material. With the thickness of the elastic material reduced by the stretching, the device is inserted into a hole in a mating part. Then the tension on the elastic material is removed, allowing the elastic material to increase in thickness, so as to fill at least part of the gap between the device and the mating part. The coupling may act as an effective heat transfer device for transmitting (by conduction) heat produced by the heat-producing device, to the mating part, which may act as, or be thermally coupled to, a heat sink.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: December 23, 2008
    Assignee: Raytheon Company
    Inventors: Alfred Sorvino, Hilario Tejeda, Randy Thompson
  • Publication number: 20080308316
    Abstract: This invention relates to an elbow connection (10) for an electric cable (6) with several wires (5). According to the invention, the connection (10) comprises a fluted central carrier (1) running longitudinally (L), made up of a flexible stem (2), comprising several substantially parallel recesses (4), and a strengthening rod (3), arranged at the core of the stem (2) and suitable for being bent.
    Type: Application
    Filed: October 10, 2006
    Publication date: December 18, 2008
    Applicant: HISPANO SUIZA
    Inventors: Eric Daniel Jose Ferragut, Daniel Henri Goury, Anthony Claude Bernard Lorand
  • Patent number: 7465882
    Abstract: Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: December 16, 2008
    Assignee: International Business Machines Corporation
    Inventors: Wiren D. Becker, Zhaoqing Chen, George Katopis
  • Patent number: 7466564
    Abstract: The invention provides a radio frequency unit including a box-shaped chassis into which an insulating board loaded with electronic components is housed, and two connectors attached to a front plate of the chassis with a space therebetween. A supporting member protruding into the chassis is provided in a position between the two connectors in the front plate. The supporting member has a flat plate portion that is bent at right angles from an end face of the front plate, and extends parallel to the insulating board, and a pair of tongue pieces that are formed so as to be bent towards the inside of the chassis from both side ends of the flat plate portion. The pair of tongue pieces are located in a cutout portion provided in the insulating board, and the tongue pieces are soldered to a grounding pattern provided in the insulating board.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: December 16, 2008
    Assignee: Alps Electric Co., Ltd.
    Inventors: Keiko Harada, Satoshi Yotsuguri
  • Publication number: 20080283290
    Abstract: The present invention relates to an article to which a characteristic of shielding electromagnetic waves is imparted, which comprises at least a sheet-like electromagnetic shielding structure, the sheet-like electromagnetic shielding structure comprising a thin layer-like substrate; and a fiber convex structure section having a characteristic of conducting or absorbing electromagnetic waves, in which the said fiber convex structure section is formed at least partially on the thin layer-like substrate in such a form that at least a part of a fiber thereof is positioned outward from the surface of the thin layer-like substrate. As the article including the sheet-like electromagnetic shielding structure, an electronic device, an electronic circuit board, garment, an architectural structure, a construction material, or a transport equipped with an engine is suitable.
    Type: Application
    Filed: April 30, 2007
    Publication date: November 20, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takuya NIINO, Shozo IMONO, Masanori SANO
  • Publication number: 20080245560
    Abstract: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the exterior of a first conductive cylindrical component whose interior contains a portion of a millimeter-wave beam waveguide energy transmission system, the grooves comprising the electromagnetic portion of the seal and a second set of grooves is cut into the interior of the conductive housing enclosing the first conductive cylindrical component.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Inventors: David Crouch, Vincent Giancola, Kenneth W. Brown
  • Publication number: 20080236883
    Abstract: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask.
    Type: Application
    Filed: June 11, 2008
    Publication date: October 2, 2008
    Applicant: International Business Machines Corporation
    Inventors: Roger Allen Booth, Matthew Stephen Doyle
  • Publication number: 20080230252
    Abstract: A printed micro coaxial cable has a first metal shield layer, a first insulative layer formed on the first metal shield layer, and a conductive layer printed on the first insulative layer. The conductive layer includes a plurality of conductive transmitters spaced from each other. Two conductive transmitters are defined as a transmission pair. A second insulative layer is formed on the conductive layer. A second metal shield layer is formed on the second insulative layer. The printed micro coaxial cable of the present invention is manufactured by means of printing, simplifying manufacture process and reducing cost.
    Type: Application
    Filed: June 15, 2007
    Publication date: September 25, 2008
    Inventor: Keh-Chang Cheng
  • Patent number: 7420742
    Abstract: Electromagnetic Interference (EMI) shields for a direct-view display having a direct-view display panel and an outer panel that provides an outer surface for the direct-view display. These EMI shields include a conductive mesh having an array of gaps therein. The conductive mesh is configured to shield at least some of the EMI that is emitted by the direct-view display panel. An optical redirecting structure is also included, that is configured to redirect at least some optical radiation that is emitted from the direct-view display panel that would strike the conductive mesh, through the gaps in the conductive mesh. The EMI shield is configured to mount between the direct-view display panel and the outer panel such that the optical redirecting structure is adjacent the direct-view display panel and the conductive mesh is remote from the direct-view display panel.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: September 2, 2008
    Assignee: Bright View Technologies, Inc.
    Inventors: Robert L. Wood, David L. Reed
  • Patent number: 7382631
    Abstract: The present invention relates to a circuit board mounting panel for electrical appliance, comprising: a base panel disposing a first printed circuit board and a second printed circuit board thereon; a first shield cover disposed on the base panel and mounting the first printed circuit board therein and formed with an opening part in a vertical direction to a surface of the first printed circuit board; and a second shield cover mounting the second printed circuit board therein and inserted into the first shield cover through the opening part and coupled to the base panel. Thus, the present invention provides an improved structure of a shield cover for a circuit board mounting panel for an electrical appliance, thereby minimizing a idle mold that may be produced while developing a circuitry or a PCB.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: June 3, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Jun Jung, Kyung-kyun Lee
  • Publication number: 20080115966
    Abstract: A bus for the high definition multimedia interface (HDMI) is disclosed. The bus comprises a plurality of transmission lines and two clad layers. The conductive lines comprise a plurality of mutually twisted conductor lines arranged in a flat shape. The clad layers are disposed on two opposite surfaces of the twisted conductor lines sandwiching the transmission lines in-between. Since the transmission line sets are arranged in a juxtaposed structure, the bus can be easily bent for routing and coupling to reduce the installation space, streamline the manufacturing process, and reduce the overall manufacturing cost. Furthermore, a continuous extended shield can be used to penetrate or surround a cord set comprised of a group of transmission. Furthermore, the transmission lines may be covered to shield the cord set to protect the signal from external electromagnetic wave interference between the cord sets during the high frequency transmission.
    Type: Application
    Filed: November 17, 2006
    Publication date: May 22, 2008
    Inventors: DIN-KOW SUN, CHUNG-HO HSIEH
  • Patent number: 7365992
    Abstract: An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. The electric shielding layer is inserted between the first electronic module and the second electronic module for ensuring electric insulation between the first electronic module and the second electronic module.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: April 29, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Young-Min Lee
  • Publication number: 20080093119
    Abstract: A disposable cover for electromagnetic treatment applicators prevents undesired exposure to potentially harmful radiation. The cover is a pouch-like structure having a back surface constructed from RF shielding material, such as metallized polyethylene, which back surface faces opposite, or away from, the treatment area. A portion of the cover which faces the treatment area is constructed from material transmissive to RF radiation from the applicator. Securing means, such as adhesive strips, or interlocking edges close an open end to secure the applicator inside the cover and to prevent RF radiation through the closed end. In use, an applicator is inserted within the cover and positioned over the area to be treated with the RF transmissive material overlying the treatment area.
    Type: Application
    Filed: November 14, 2005
    Publication date: April 24, 2008
    Inventors: Frank R. George, Robert T. Bryant, Michael F. Daly, Arthur A. Loya, Mary C. Ritz
  • Publication number: 20080083562
    Abstract: An integrated EMC gasket for an electrical enclosure includes an electrical housing substrate molded of a thermoplastic having a conductive network of fibers above a percolation limit of the fibers, and an EMC gasket insert molded into the electrical housing substrate, the gasket including a silicone foam core with a conductive fabric cover.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 10, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil, Paul A. Vermilyea
  • Patent number: 7355857
    Abstract: A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the receptacle cavity. The heat sink may have a groove in which the gasket is mounted and upon mounting the heat sink to the receptacle, the gasket surrounds the opening in the receptacle and provides a resilient shield to maintain a seal during movement of the heat sink due to insertion of the electronic module within the receptacle.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: April 8, 2008
    Assignee: Methode Electronics, Inc.
    Inventors: Alexandros Pirillis, Joseph R. Llorens
  • Publication number: 20080068867
    Abstract: An integrated circuit, in which the influence of parasitic capacitance between a semiconductor substrate and a resistor and between the semiconductor substrate and a capacitor can be inhibited, and a DC-DC converter provided with the integrated circuit. A shielding layer of an n-type semiconductor is formed between a p-type semiconductor substrate and a resistor formed thereon and between the semiconductor substrate and a capacitor formed thereon. A point BOOT is connected to the shielding layer, at which an electric potential changes in the same way as a change in the reference potential of a functional circuit carrying out a specified operation by using the resistor and the capacitor.
    Type: Application
    Filed: August 10, 2007
    Publication date: March 20, 2008
    Inventor: Kouhei Yamada
  • Patent number: 7345892
    Abstract: In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: March 18, 2008
    Assignees: NEC Corporation, Renesas Eastern Japan Semiconductor, Inc., Elpida Memory, Inc.
    Inventors: Masaharu Imazato, Atsushi Nakamura, Takayuki Watanabe, Kensuke Tsuneda, Mitsuaki Katagiri, Hiroya Shimizu, Tatsuya Nagata
  • Patent number: 7339795
    Abstract: A structure for fastening a circuit board on a case includes a strut which has one end coupled on the case and other end coupled on the circuit board, and a coupling member which has two distal ends with surfaces not parallel with each other. One distal end is coupled on the circuit board with the distal end surface in parallel with the other end surface of the strut, and the other distal end surface is parallel with a holding section of a fastening element which fastens the coupling member, the circuit board and the strut in this order, to make the circuit board in parallel with a mounting surface, which an electronic device may be held on, of the case. The circuit board is easy to be fastened even if the circuit board is not vertical to the molding direction of the fastening structure. Assembly costs also are lower.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: March 4, 2008
    Assignee: Lite-On Technology Corporation
    Inventor: Cheng-Hua Hsu
  • Publication number: 20080048646
    Abstract: A current measurement device using a Rogowski coil having a generally toroidal-shaped core with a first winding in one direction and a second winding forming a return loop. The coil is positioned within a two-piece electrostatic shield. A first piece of the electrostatic shield is a partially donut-shaped member having a U-shaped cross-section. The coil is positioned in the donut-shaped member and covered by an encapsulating material. The first piece includes a slit through the cross-section thereof to prevent an electrical loop around the perimeter thereof. The second piece of the electrostatic shield is flat and has a donut-shaped configuration. The second piece is configured with inside and outside peripheral edges such that only one or none of the inside/outside edges contact the first piece. The second piece also has a cross-sectional slit which is in registry with the slit in the first piece.
    Type: Application
    Filed: March 2, 2007
    Publication date: February 28, 2008
    Applicant: Schweitzer Engineering Laboratories, Inc.
    Inventors: Donovan E. Wilkerson, Veselin Skendzic, James R. Kesler
  • Publication number: 20080041622
    Abstract: A hybrid cable for electrical drives has at least one signal line, power lines for supplying a drive with electrical power, at least one additional line, an inner electrical shield in which the signal line configured as an electrical line is enclosed, the power line and the at least one additional line being located on a periphery of the inner electrical shield, an outer electrical shield which encloses the power line and the additional line, and at least two shield wires located between the outer shield and the inner shield thereby resulting in improved shielding and mechanical separation between the power lines and the additional lines.
    Type: Application
    Filed: June 26, 2007
    Publication date: February 21, 2008
    Inventors: Alexander Seufert, Peter Krautwald, Tanja Taupitz
  • Publication number: 20080029299
    Abstract: Disclosed is a cable device including a signal line portion electrically connecting an electronic circuit board having an electronic circuit operating at a clock signal having a high frequency with the other electronic circuit board. The cable device further includes a shield portion shielding the signal line portion having a plurality of through-holes located at intervals in the length direction of the signal line portion such that the shield portion includes a plurality of length portions differing in length from the signal line portion.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 7, 2008
    Applicant: Sony Corporation
    Inventor: Yoshiro Hakamada
  • Publication number: 20080029298
    Abstract: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask.
    Type: Application
    Filed: August 7, 2006
    Publication date: February 7, 2008
    Inventors: Roger Allen Booth, Matthew Stephen Doyle
  • Patent number: 7326861
    Abstract: The present invention insulates the source of noise efficiently by forming a thick noise insulating portion to the cover to tightly seal a drive unit which generates heat and noise and at the same time, increases the cooling effect of cooling fins by making the surface areas of the cooling fin ends that are away from the noise insulating portion wide by the amount equivalent to the surface area of the cooling fins decreased by the noise insulating portion provided, and obtains the shielding cover that is excellent in both cooling and noise insulation.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: February 5, 2008
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Tec Kabushiki Kaisha
    Inventor: Takahiro Kojima
  • Patent number: 7325294
    Abstract: A method of making electromagnetic wave shielded read and write wires is provided. The method includes forming a bottom insulation layer on a bottom shield layer formed on a substrate. Then, forming electrically conductive wire material into openings in a first forming layer to form first and second read wires and first and second write wires. Forming a top insulation layer on the bottom insulation layer and on the wires. Then, forming a second forming layer on the top insulation layer with first, second, third, fourth and fifth openings down to the top insulation layer. Ion milling portions of the top insulation layer exposed by the openings in the second forming layer down to the bottom shield layer, then removing the second forming layer. Then, forming nonmagnetic electrically conductive middle shield layers in the openings in electrical contact with the bottom shield layer and forming a top shield layer on top of the middle shield layer.
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: February 5, 2008
    Assignee: International Business Machines Corporation
    Inventor: Lin Zhou
  • Publication number: 20080011510
    Abstract: A hybrid plastic-metal faceplate having reduced EMI emissions for use with electric circuit card rack systems. The faceplate uses an electrically conductive thermoplastic front plate that is simpler to construct. The faceplate also includes a first metal element in electrically conducting contact with the front plate and a second metal element in electrically conducting contact with the front plate. The plastic-metal faceplates have an EMI shielding effectiveness of 20 dB or greater across the range of frequencies of 0 MHz to 1.0 GHz. The faceplate may be used in a variety of different applications, such as electric circuit card rack systems, to reduce EMI (electromagnetic interference) emissions from the electric circuit card system.
    Type: Application
    Filed: August 24, 2006
    Publication date: January 17, 2008
    Inventors: Zheng Tang, Liang Zheng, Hongliang Jiang
  • Patent number: 7310242
    Abstract: A distribution box for enclosing an electrical connection in an electrical wiring system includes a housing that is resistive to penetration by electromagnetic fields and a plurality of electrical conductors that form the electrical connection. A mirror plate is disposed within the housing and generates mirror currents to suppress electromagnetic fields generated by current flowing through the plurality of electrical conductors.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: December 18, 2007
    Inventors: Sergio Ramos, Eugene M. Steele, James P. Souther
  • Patent number: 7310243
    Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: December 18, 2007
    Assignee: International Business Machines Corporation
    Inventors: Don Alan Gilliland, Dennis James Wurth
  • Patent number: 7301109
    Abstract: A wear resistant EMI shield includes a metallic film or multiple metallic films, and a carbon-nanotube coating (14) formed on the metallic film or multiple metallic films. The metallic films may include nickel film (12), copper film (13) and NixCu1?x (x=0.62˜0.99) (15) alloy film. In a preferred embodiment, the structure of the wear resistant EMI shield is CNT/Ni/Cu/Ni/. The thickness of metallic film is in the range from 20 to 100 nm and the thickness of carbon-nanotube coating is in the range from 10 to 200 nm. The wear resistant EMI shield may apply to various substrate surfaces (10) of electronic equipment, such as the shell of computer, play-station, wireless equipment, mobile phones, automobiles, airplanes, commercial appliance and consumer products, etc. The wear resistant EMI shield has good wear resistance, EMI shield effect, thin thickness and lightweight.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: November 27, 2007
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ga-Lane Chen
  • Patent number: 7277300
    Abstract: A vent grid has parallel first electrically-conductive members and parallel second electrically-conductive members intersecting with the first electrically-conductive members. The intersection between the first and second electrically-conductive members is forced to have a larger cross-sectional area. The characteristic impedance thus increases. The electric current flowing through the first and second electrically-conductive members turns over at the boundary between the intersection and the first and second electrically-conductive members. The flow of the electric current is in this manner interrupted. Accordingly, the vent grid fails to induce electromagnetic wave. Moreover, the electrically-conductive piece is merely located at a corner of the opening. Decrease in the percentage of the opening is thus suppressed to the utmost per a unit area. A sufficient airflow can be established through the vent grid. Decrease in the cooling efficiency and performance can be suppressed.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: October 2, 2007
    Assignee: Fujitsu Limited
    Inventors: Shigeo Sakamoto, Kenji Nagase, Kazuaki Taya
  • Patent number: 7277301
    Abstract: An electronic device includes a circuit board (20) and a shielding cove (10). The circuit board includes a plurality of mounting holes (26), a first surface (22), a second surface (24) opposite to the first surface, and at least one electronic component (28). The shield includes a top wall (12), a pair of first sidewalls (14) and a pair of second sidewalls (16) opposite to the first sidewalls. The top wall, the first sidewalls and the second sidewalls cooperatively bound a receiving portion (18) for receiving the electronic component. At least one mounting portion (162) extends from each of the second sidewalls, corresponding to the mounting holes of the circuit board.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: October 2, 2007
    Assignee: Hon Hai Precision Industry Co., LTD.
    Inventor: Jen-Yu Liang