With Electrical Device Patents (Class 174/520)
  • Patent number: 8612012
    Abstract: Embodiments of the present invention relate to an implantable device housing assembly, for use in, for example, implantable prosthetic devices. In one aspect, the present invention provides a housing for an implantable device comprising a body portion and a sealing flange. The body portion includes a cavity in which electronic components are disposed on an open side thereof, and at least one feed-through which provides electrical connections between the electronic components and the exterior of the device. The feed-through includes interior and exterior connection points, which are accessible during assembly of the device from a first side of the device. The sealing flange operatively seals the cavity so as to form a sealed housing. A method of forming a sealed housing for an implantable device is also provided.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: December 17, 2013
    Assignee: Cochlear Limited
    Inventors: C. Roger Leigh, Mark Von Huben
  • Publication number: 20130327567
    Abstract: A locking portion (13) is provided to lock an open/close cover (15) to a fuse unit (5) or a cover main body (9) assembled to the fuse unit (5) in a state where the open/close cover (15) is closed. The open/close cover (15) is openably and closably connected to the cover main body (9), and includes first and second side walls (17, 19) respectively on both end sides in an orthogonal direction orthogonal to an opening/closing direction and extending in the opening/closing direction. The locking portion (13) includes a locking protrusion (21) provided in the first side wall (17) deformable in the orthogonal direction, and a mating locking protrusion (23) provided in the fuse unit (5) or the cover main body (9) and facing the first side wall (17).
    Type: Application
    Filed: February 21, 2012
    Publication date: December 12, 2013
    Inventors: Yusuke Matsumoto, Miyuki Fukunaga
  • Publication number: 20130327566
    Abstract: An electrical junction box includes an upper box section having an opened lower part, and a lower box section whose upper part is open and is mounted to the lower part of the upper box section, wherein the lower box section includes an abutment protrusion part which protrudes from an outer surface of the lower box section and has an abutment surface that abuts against an edge surface of the lower part of the upper box section when the lower box section is mounted to the upper box section. The abutment protrusion part includes an inclined surface at a place where the abutment protrusion part further extends outwards at least than an outer surface of the upper box section in a direction parallel with the abutment surface, the inclined surface connecting to the abutment surface and being inclined downwards from the abutment surface.
    Type: Application
    Filed: June 6, 2013
    Publication date: December 12, 2013
    Inventors: Masahiro MAKINO, Takanori KAWAI, Yoshiyuki ISHIHARA
  • Publication number: 20130327568
    Abstract: An electronic device housing internally defines a receiving space for accommodating a circuit board and electronic elements mounted on the circuit board, and has a thermal insulation layer provided on an inner surface thereof at a position corresponding to the circuit board. The thermal insulation layer provided on the inner surface of the electronic device housing not only suppresses and prevents flames produced by, for example, the spontaneous combustion of the electronic elements in the housing from spreading to and endangering the environment surrounding the electronic device, but also enables reduced product weight and manufacturing cost of the electronic device.
    Type: Application
    Filed: July 31, 2012
    Publication date: December 12, 2013
    Inventors: MING-HSIEN WANG, HSIENG-JAN WENG
  • Publication number: 20130329374
    Abstract: A pre-molded cavity 3D packaging module with layout is disclosed. The 3D packaging module includes a pre-molded cavity. A wall and a vertical plane of the pre-molded cavity form an inclined angle of more than 3°. An intersecting region between a bottom and a sidewall of the 3D packaging module has a curved profile to facilitate smooth circuit layout.
    Type: Application
    Filed: July 6, 2012
    Publication date: December 12, 2013
    Applicants: Keng-Hung Lin, CMSC, Inc.
    Inventors: Keng-Hung Lin, Ming-Lun Chang, Yu-Min Lin
  • Patent number: 8599576
    Abstract: Equipment and systems for protecting electronics against damage or upsets from electromagnetic pulse (HEMP or EMP), intentional electromagnetic interference (IEMI), and high power RF weapons are disclosed. This equipment can include a shielding arrangement includes a metallic enclosure having an interior volume defining a protected portion and an unprotected portion separated by an electromagnetically shielding barrier, and having a portal providing access to the protective portion and including an access opening, a shielding cover sized to cover the access opening, and an electromagnetically sealing gasket positioned around a perimeter of the access opening. The shielding arrangement also includes one or more filters positioned at least partially within the unprotected portion and along the electromagnetically shielding barrier to dampen electromagnetic signals and/or power signals outside a predetermined acceptable range.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: December 3, 2013
    Assignee: Emprimus, LLC
    Inventors: Frederick R. Faxvog, Greg Fuchs, Wallace Jensen, David Blake Jackson, Bill Volna, Gale Nordling, James Nicholas Ruehl
  • Publication number: 20130313017
    Abstract: A housing includes a substrate, a decorative layer disposed on one surface of the substrate, and a metallic decorative element disposed on the decorative layer. A portion of the decorative layer defines a corona layer; the corona layer contains polarized molecules. The metallic decorative element is bonded to the corona layer. An electronic device using the housing is also described.
    Type: Application
    Filed: March 21, 2013
    Publication date: November 28, 2013
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventor: YU-GUANG ZHU
  • Publication number: 20130313018
    Abstract: There is provided an electronic component enclosure. The electronic component enclosure includes: an upper enclosure and a lower enclosure. The upper enclosure includes: an upper plate portion; an upper sidewall portion extending from a periphery of the upper plate portion; and a hook member extending from the upper sidewall portion. The lower enclosure is engaged with the upper enclosure, and includes: a lower plate portion; a lower sidewall portion extending from a periphery of the lower plate portion; and a reception member extending from the lower sidewall portion and engaging with the hook member.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 28, 2013
    Applicant: Shinko Electric Industries Co., Ltd
    Inventor: Min Shong TAN
  • Publication number: 20130313016
    Abstract: An electrical panel including a housing configured to house one or more electrical components that are accessible from outside the housing. A shutter door assembly is coupled to the housing. The shutter door assembly comprises a compartment door and a barrier panel slidably coupled to the compartment door. The barrier panel is configured to be placed in a closed position that obstructs access to the one or more electrical components through the compartment door and an open position that provides access to the one or more electrical components through the compartment door.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 28, 2013
    Inventor: Anuraj Kumar
  • Patent number: 8582308
    Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: November 12, 2013
    Assignee: Denso Corporation
    Inventors: Keiichi Sugimoto, Mitsuru Nakagawa
  • Patent number: 8581099
    Abstract: A photovoltaic junction box includes a housing, a circuit board received in the housing, a plurality of metal brackets, and a plurality of bypass diodes. The plurality of metal brackets are secured to the circuit board, each of the plurality of metal brackets defines a receiving space receiving a spring sheet. The plurality of bypass diodes are respectively secured to the plurality of metal brackets and electrically connected to the circuit board. Each of a plurality of ribbons is clamped between the spring sheet and a corresponding metal bracket, and the ribbon directly and electrically contacts the corresponding metal bracket.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: November 12, 2013
    Assignee: Ampower Technology Co., Ltd.
    Inventors: Chih-Chan Ger, Yu-Hsiang Liao, Shang-Ting Chen, Yun-Bing Wang
  • Publication number: 20130292170
    Abstract: An electrical component cover may include a first portion and a second portion which are hingedly attached to one another and at least one projection extending from one of the first portion and the second portion. A locking member engages the at least one projection so as to hold the first portion and second portion together to cover an electrical component disposed in a void defined by the first portion and the second portion.
    Type: Application
    Filed: May 4, 2012
    Publication date: November 7, 2013
    Inventors: James J. Kaddas, David E. Miller
  • Patent number: 8575497
    Abstract: The invention concerns a control cabinet arrangement (1) with a control cabinet (2), a mounting plate (6) having a front face (14), a rear face (13) and an opening (8), in which the control cabinet (2) is arranged, a frame and a retainer device. The invention is based on the task of providing a simple assembly of a control cabinet arrangement. For this purpose, the retainer device comprises several bolts (16) abutting the rear face (13) of the mounting plate (6), at least one bolt (16) being displaced into a spacing on the rear face (13) of the mounting plate (6) by the interaction of the control cabinet (2) and the frame (7).
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: November 5, 2013
    Assignee: Danfoss A/S
    Inventor: Jerry Hultgreen
  • Patent number: 8575498
    Abstract: An electrical circuitry has a base element, a printed circuit board and a fastening apparatus for fastening the printed circuit board to the base element. The fastening apparatus retains the printed circuit board by virtue of the base element being present on a top side and underside of the printed circuit board. In this case, the base element acts upon the top side and underside of the printed circuit board at application points which are opposite one another at an offset with respect to one another while elastically deforming the printed circuit board.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: November 5, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Andre Lischeck, Juergen Stein
  • Publication number: 20130284482
    Abstract: An electrical fitting that comprises an integral cover plate and an electrical component, such as an outlet or a switch, the combined electrical component/cover plate being secured via screws through the cover plate into a wall box. Wires are secured to power wires coming from the wall box via quick-connectors or wirenuts.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Inventor: J. Moss
  • Publication number: 20130284513
    Abstract: A cable management system includes a cover adapted to attach to a wall. The cover has a first end and a second end. The first end of the cover has receptacles for electrical power and audio/video signals. A combination of the electrical cord and AV cables may extend from the second end of cover. The electrical cord extending from the second end has an electrical plug to couple to an electrical outlet; and the AV cables extending from the second end of the cover has signal plugs adapted to couple to their respective AV components such as a cable box, DVD player, and the like. The electrical cord and the AV cables may be substantially flat to minimize the overall height of the cover.
    Type: Application
    Filed: October 22, 2012
    Publication date: October 31, 2013
    Applicant: CLO SYSTEMS, LLC.
    Inventor: CLO Systems, LLC.
  • Patent number: 8570716
    Abstract: An electrical meter box contains an electrical circuit that connects to a consumption meter. The box has a removable front panel, a rear wall having punch-outs for wire access to the inside of the box and four side walls. A flange surrounds the outside of the four side walls of the box and is disposed behind the front panel a predetermined distance. The flange has holes for mounting the box to a structure. The flange can be taped to the structure or placed underneath a vapor barrier for moisture integrity.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: October 29, 2013
    Inventor: Tim Ward
  • Patent number: 8570734
    Abstract: A server assembly includes a server, a number of first air ducts, and a number of second air ducts. A number of intakes and outlets are defined in a top of a chassis of the server. Each of the first and second ducts includes a hollow main body, and a connecting portion extending from a bottom of the main body. A first opening is defined in an end of the main body of each of the first and second ducts. A second opening is defined in each of the connecting portions of each of the first and second ducts. Outside air flows through the first air ducts, thereby flowing into the chassis to be heated, thereby cooling the server. The heated air is expelled out of the chassis through the second air ducts.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: October 29, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Feng-Chi Yang
  • Patent number: 8570747
    Abstract: An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: October 29, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chao-Wen Cheng, Mark H Ruch, Mark S Tracy
  • Publication number: 20130272012
    Abstract: A junction box assembly for a light bar for splicing a light bar cable and a vehicle cable. A multipart housing forms a compartment and has at least two separable parts for accessing the compartment. The compartment is configured for receiving an end of the light bar cable and for receiving an end of the vehicle cable. The multipart housing is configured to mount externally and slidably to the underside of the light bar.
    Type: Application
    Filed: March 12, 2013
    Publication date: October 17, 2013
    Applicant: CODE 3, INC.
    Inventor: Mark Thibodeau
  • Patent number: 8558123
    Abstract: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: October 15, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroki Horiguchi, Yuji Kimura
  • Publication number: 20130264109
    Abstract: An electronic device has a vibrating element and a package accommodating the vibrating element. Moreover, the package has through-electrodes formed to penetrate a base substrate in its thickness direction and electrically connected with connection terminals, and electrically conductive adhesives (covering members) formed above the connection terminals so as to contain the through-electrodes.
    Type: Application
    Filed: April 5, 2013
    Publication date: October 10, 2013
    Applicant: Seiko Epson Corporation
    Inventor: Tomoyuki KAMAKURA
  • Publication number: 20130266283
    Abstract: A module adapted for use with a datacommunications equipment mounting structure includes: a generally upright divider panel; a cover panel disposed generally parallel to the divider panel, the cover panel and divider panel being spaced apart from each other to form a gap; and a plurality of telecommunications cables, each of the telecommunications cables comprising a plurality of telecommunications patch cords, the cables comprising bundled patch cords at a first end and unbundled patch cords at a second opposite end, the cables being positioned in the gap between the divider panel and cover panel. The bundled patch cords at the cable first end include first interconnection terminals, and the unbundled patch cords at the second end include second interconnection terminals. The first terminals are located at first edges of the divider and cover panels.
    Type: Application
    Filed: June 4, 2013
    Publication date: October 10, 2013
    Inventors: Matthew Baldassano, David Beihoff, Elyse Ge Hylander, Scott Keith, Ernest C. Pickens, Aaron Talmage Stout, Yinglin Yang, Timothy Anderson
  • Publication number: 20130265692
    Abstract: A dielectric insulation medium including a hydrofluoro monoether, the hydrofluoro monoether containing at least three carbon atoms. The insulation medium according has high insulation capabilities, in particular a high dielectric strength, and at the same time a low GWP. The invention further includes an insulation medium which is chemically and thermally stable also at temperatures above 140° C., which is non-toxic or has a low toxicity level, and which in addition is non-corrosive and non-explosive.
    Type: Application
    Filed: June 14, 2013
    Publication date: October 10, 2013
    Inventors: Navid Mahdizadeh, Thomas Alfred Paul, Judith Marold, Markus Bujotzek, Patrick Stoller, Max-Steffen Claessens, Per Skarby
  • Patent number: 8552292
    Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Jeff Qin, Charles R. Hill, Suriaprakash Narotamo, Levin Li, Spring Wu, Zhong Wang
  • Publication number: 20130258575
    Abstract: Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.
    Type: Application
    Filed: May 30, 2013
    Publication date: October 3, 2013
    Inventors: Fletcher R. Rothkopf, Phillip M. Hobson, Adam Mittleman, Anna-Katrina Shedletsky
  • Publication number: 20130240234
    Abstract: The invention relates to a case for an electronic device comprising: a hollow body which forms at least one receiving housing for an electronic device and which comprises an access opening to the housing surrounded by a peripheral edge outside the housing which has a truncated conical or truncated pyramidal shape converging on the opening, a cover for closure of the housing which comprises a peripheral flange, wherein the inner peripheral face has a truncated conical or truncated pyramidal shape complementary to the shape of the peripheral edge of the opening, the flange of the cover being designed to fit onto the peripheral edge of the opening and be held there by adhesion.
    Type: Application
    Filed: January 9, 2013
    Publication date: September 19, 2013
    Applicant: HIKOB
    Inventors: Guillaume ROCHE, Christophe Braillon, Antoine Fraboulet
  • Patent number: 8536465
    Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 17, 2013
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Kobayashi
  • Patent number: 8536453
    Abstract: A waterproof device for receiving an electronic device is disclosed. The waterproof device includes a housing including an outer surface. A receiving case including a body and covering portion extends from the body. The body is inside of the housing, and the covering portion abuts the outer surface of the housing. The body receives an object to be waterproofed. A cover is secured to the covering portion. A first installation washer is secured between the covering portion and the outer surface of the housing, the first installation washer seals a first gap between the housing and the covering portion. A second installation washer is secured to the cover and abuts each edges of the body, the second installation washer seals a second gap between the cover and the body.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: September 17, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Gang-Qiang Qin
  • Patent number: 8536466
    Abstract: According to one embodiment, a terminal box includes a box case placed on and fixed to a back film of a solar cell string and a terminal panel formed on the box case. The box case includes a case main body placed on and fixed to the back film of the solar cell string and a terminal panel fixing portion for placing and fixing the terminal panel above the case main body. An opening for passing an output lead wire through the terminal panel is formed continuously from the bottom face of the case main body to the top face of the terminal panel. One edge of the terminal panel is provided so as to protrude from the terminal panel fixing portion such that the tip of the output lead wire can be bent and latched on.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: September 17, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Akira Shimizu
  • Patent number: 8536467
    Abstract: A circuit substrate for connection is used as a connecting member for electrically connecting a stator disposed inside a casing and a plurality of electric cables disposed outside the casing. A circuit substrate for connection is supported by a connecting member attachment. The connecting member attachment is molded using a circuit substrate for connection and a receptacle as inserts. Then, the circuit substrate for connection is disposed to pass through a wall portion of the casing in a thickness direction of the wall portion. The connecting member attachment is fixed onto the casing. Thus, the electric cables may be connected to the outside of the casing with a low-priced connecting structure.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: September 17, 2013
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Toshihito Miyashita, Hiroshi Hioki, Masakazu Chikyu
  • Patent number: 8537565
    Abstract: An electronic control unit-mounting electric junction box having a versatile structure configured to accommodate both external and built-in electronic control units. The junction box includes an external upper case that forms the mounting space of an electronic control unit by means of a recessed containing section opening to the outer surface of a case, and a built-in upper case that internally forms the mounting space of an electronic control unit by raising outward the bottom wall of the recessed containing section in the external upper case are standardized in a basic section with the position of the bottom wall excluded, and a lower case and a conducting path that are combined with the external upper case and the built-in upper case are standardized.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: September 17, 2013
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Takashi Miyamoto
  • Patent number: 8537555
    Abstract: A heat-dissipating casing for a communication apparatus accommodates a circuit board having a power element and includes an insulating case, a lid coupled to the insulating case, and a thermally conductive metal member. The insulating case has a receiving space, a first opening, and a second opening. The first and second openings communicate with the receiving space. The thermally conductive metal member is fixed to the inside of the insulating case, seals the second opening, and dissipates heat generated by the power element. The heat-dissipating casing is effective in dissipating heat, characterized by its low weight and low production costs, and conducive to protection and dust prevention.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: September 17, 2013
    Assignee: Askey Computer Corp.
    Inventors: Hong-Chun Huang, Ta-Fei Chen, Ching-Feng Hsieh
  • Patent number: 8530742
    Abstract: A household appliance having at least one fascia panel. In an exemplary embodiment, the at least one fascia panel may include an electronics housing structured to house electronic components for operating the household appliance, and a cosmetic panel structured to be at least one of mounted and joined with the electronics housing. The cosmetic panel may include one or more interfaces cooperating with the electronic components for operating the dishwasher.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: September 10, 2013
    Assignee: BSH Home Appliances Corporation
    Inventors: David Hite, Michael Justis
  • Patent number: 8530758
    Abstract: A connector is disclosed. The connector includes a conductive housing. The conductive housing includes a wall region enclosing a space for receiving an adapter. The conductive housing also includes an annular end piece extending radially inward from a first end of the wall region and terminating the space. The annular end piece includes a flat annular surface, and a raised deformable annulus mounted on the flat annular surface. The raised deformable annulus is of a height such that an insertion of the adapter into the space deforms the raised deformable annulus to generate a physical contact connection between the flat annular surface and the adapter.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 10, 2013
    Assignee: National Instruments Corporation
    Inventors: Ron Jay Barnett, Gregory Stephen Gonzales
  • Patent number: 8530759
    Abstract: An electronic apparatus includes a case; a circuit board mounted in the case; and a connector. The connector includes at least two connection terminals electrically connected with the circuit board, and a base portion attached to the case. The base portion holds the at least two connection terminals. An electronic component is attached to the at least two connection terminals to electrically connect the at least two connection terminals with each other through the electronic component.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: September 10, 2013
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Katsumasa Hagiwara, Masao Fujimoto
  • Patent number: 8526179
    Abstract: A laptop computer user thermal isolation apparatus is provided for inhibiting the transfer of waste heat from internal heat generating components to a user. The thermal isolation apparatus includes a casing substantially enclosing the heat generating components, the casing including at least one panel having a sealed enclosed cavity disposed between the heat generating components and an outer surface of the casing.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: September 3, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mark S. Tracy, Britt C. Ashcraft, Jeffrey A. Lev, Paul N. Walker
  • Patent number: 8526171
    Abstract: This disclosure provides a supporting structure module and an electronic device using the same. The supporting structure module in the invention is used in the electronic device. The electronic device includes a first casing, a hinge, and a second casing rotatable relative to the first casing via the hinge. The supporting structure module includes a first supporting structure, and the first supporting structure includes a first bracket and a first hinge cover. The first bracket is fixed to and exposed from the first casing. The first hinge cover is connected with the first bracket by integral forming, and the first hinge cover is exposed from the first casing and covers a part of the hinge.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: September 3, 2013
    Assignee: Pegatron Corporation
    Inventors: Jiun-Lin Wu, Chia-Hsiang Hsiang, Ching-Hao Yu
  • Patent number: 8525046
    Abstract: According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of adhesive filled portions in the mounting region, which are separated by a division wall in order to correspond to the connection terminals of the circuit element, and through which the connection terminals are inserted, and a plurality of traces provided on the inner surface of the housing, one ends of the traces running through the adhesive filled portions, wherein the adhesive filled portions of the housing are filled with conductive adhesive which fix the circuit element to the mounting region, and wherein the connection terminals are electrically connected to the traces by the conductive adhesive.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: September 3, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takahiro Sugai
  • Publication number: 20130221292
    Abstract: A dielectric insulation medium including sulphur hexafluoride (SF6) and/or tetrafluoro methane (CF4), in a mixture with at least one further component being an at least partially fluorinated fluoroketone.
    Type: Application
    Filed: February 15, 2013
    Publication date: August 29, 2013
    Inventors: Mathias Ingold, Thomas Alfred Paul, Javier Mantilla, Oliver Cossalter, Judith Kessler, Navid Mahdizadeh
  • Patent number: 8519275
    Abstract: According to one embodiment, an electronic device includes a cable, a protrusion, and a recessed portion. The cable is routed along a surface of a wall in a housing. The protrusion protrudes on the surface of the wall, and includes a first protrusion and a second protrusion that elastically hold the cable. The recessed portion is formed on the surface between the first protrusion and the second protrusion. The cable is elastically held between the first protrusion and the second protrusion while at least part of the cable is fitted in the recessed portion.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: August 27, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seiji Hashimoto, Kohei Wada
  • Publication number: 20130213706
    Abstract: A terminal assembly comprises a terminal box including a divider extending in a front-to-rear direction of the terminal box and dividing the terminal box into a first chamber and a second chamber, the first chamber being larger than the second chamber and a terminal block mounted in the first chamber configured to have a plurality of contacts mounted onto the terminal block.
    Type: Application
    Filed: February 16, 2012
    Publication date: August 22, 2013
    Applicant: Hamilton Sundstrand Corporation
    Inventors: Seth E. Rosen, Lino S. Italia, John M. Beck, Darryl A. Colson
  • Patent number: 8513516
    Abstract: Photovoltaic devices including an insulating layer and an intra-laminate disk layer on a plurality of thin film layers are provided. A first conductive strip, defining a first lead, is positioned on the insulating layer and connected to a first bus bar. A second conductive strip is positioned on the insulating layer and connected to a second bus bar. An adhesive layer is over the device and defines an adhesive gap through which the first lead and the second lead extend. An encapsulating substrate is on the adhesive layer, and defines a connection aperture through which the first lead and the second lead extend. The intra-laminate disk layer is positioned under the adhesive gap defined by the adhesive layer and the connection aperture defined by the encapsulating substrate. Methods of manufacturing photovoltaic devices are also provided.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: August 20, 2013
    Assignee: Primestar Solar, Inc.
    Inventor: Troy Alan Berens
  • Patent number: 8502088
    Abstract: A server enclosure includes a housing, at least one cable, a partition board, and a sealing member. The partition board is securely received in the housing and defines a through hole through which the at least one cable passes. The sealing member plugs the through hole. The sealing member is made of elastic materials, and defines at least one elastic deformation portion through which the at least one cable passes and by which the at least one cable is clamped.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: August 6, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: An-Gang Liang, Zheng-Heng Sun
  • Publication number: 20130196526
    Abstract: An electrical connector including electrical terminals, and a housing. The housing includes a first housing member and a second housing member. The second housing member includes terminal receiving areas which house the electrical terminals. The second housing member includes projections into the terminal receiving areas to limit forward movement of the electrical terminals in the terminal receiving areas. The first housing member includes a plurality of projections respectively extending into each of the terminal receiving areas to limit rearward movement of the electrical terminals in the terminal receiving areas. The electrical terminals float in the terminal receiving areas between the projections of the first housing member and the projections of the second housing member.
    Type: Application
    Filed: January 29, 2013
    Publication date: August 1, 2013
    Applicant: FCI Americas Technology LLC
    Inventor: FCI Americas Technology LLC
  • Publication number: 20130192889
    Abstract: An electronic device having a slide cover slidably attached in an openable/closable manner to a device case, and conceals a recording paper ejection opening in the device case; a waterproof gasket provided on either one of the slide cover and the device case in a part positioned in periphery of the recording paper ejection opening, and arranged between the slide cover and the device case surrounding the recording paper ejection opening, when the slide cover conceals the recording paper ejection opening; and a guide member which does not come in contact with the waterproof gasket on another side of the slide cover and the device case with which the waterproof gasket meets face to face during a sliding motion of the slide cover, and the waterproof gasket presses on both sides between the slide cover and the device case when the sliding motion is completed.
    Type: Application
    Filed: January 29, 2013
    Publication date: August 1, 2013
    Applicant: CASIO COMPUTER CO., LTD.
    Inventor: Hiromasu Meguro
  • Patent number: 8498099
    Abstract: A landscape controller housing can be used to enclose the electronic components of a landscape lighting system or an irrigation system includes a face pack that is pivotably and removably mounted in an outer housing. The face pack can be installed in the outer housing in a normal upright position in which a pair of pivot pins are each received in a corresponding bearing slot and a pair of locking pins are each received in a corresponding lock recess. The face pack can be swung through a predetermined angle to release the locking pins from the lock recesses to allow the face pack to be removed from the outer housing by sliding the pivot pins out of the bearing slots and removing the locking pins from the lock recesses. The face pack can be inserted into the outer housing into a substantially horizontal service position by sliding both the pivot pins and the locking pins into the bearing slots.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: July 30, 2013
    Assignee: Hunter Industries, Inc.
    Inventor: Darrin I. Schmuckle
  • Patent number: 8490513
    Abstract: A cable gland and gasket ring assembly includes a gasket ring and a cable gland formed of a shell, a collar, a packing ring and a connection ring for securing a cable, or, a cable and a flexible conduit, to a junction box. The gasket ring is an annular member, having a first end face, a second end face opposing the first end face, a plurality of annular ribs concentrically arranged on the first end face and an annular convex portion located on the second end face. The connection ring has a stop flange segment, a first connection ring segment extended from one side of the stop flange for holding the gasket ring, an outer thread located on the first connection ring segment for fastening to a junction box, a recessed portion on the stop flange segment for receiving the annular convex portion of the gasket ring and a tapered inner surface located on the inside of the stop flange segment for stopping against a tapered outside surface of the packing ring.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: July 23, 2013
    Assignee: AVC Industrial Corp.
    Inventor: Jiun Wei Chiou
  • Patent number: 8492662
    Abstract: Arc resistant enclosures for dry-type transformers. More particularly, transformer enclosures having one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums, and methods for providing same.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: July 23, 2013
    Assignee: ABB Inc.
    Inventors: Robert C. Ballard, Nathan T. Sigman, Edgar A. Wimmer, Jr., Rafael Gutierrez, Jr.
  • Patent number: 8492661
    Abstract: A very small form factor consumer electronic product includes at least a single piece housing having an integral front and side walls that cooperate to form a cavity in cooperation with a front opening where an edge of the side walls define a rear opening and at least some of the edges have flanges. The consumer electronic product also includes an user input assembly having a size and shape in accordance with the front opening and a clip assembly having a size and shape in accordance with the rear opening and having an external user actionable clip, a plurality of internal hooking features, and a plurality of internal latching features. The clip assembly is secured by engaging at least some of the hooking features and the flanges on the edges of the housing and engaging the latching features and corresponding attachment features on the internal support plate.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: July 23, 2013
    Assignee: Apple Inc.
    Inventor: Eric S. Jol