Solid-state Image Sensor Patents (Class 348/294)
  • Patent number: 10263021
    Abstract: Disclosed herein is an electronic device including an integrated circuit substrate, with a pixel array area within the integrated circuit substrate. A first deep trench isolation structure is formed in the integrated circuit substrate about a perimeter of the pixel array area. First, second, third, and fourth pixels are within the pixel array area and spaced apart from one another. A storage capacitor area is within the integrated circuit substrate and interior to the first deep trench isolation structure. A second deep trench isolation structure is formed in the integrated circuit substrate about a perimeter of the storage capacitor area. The second deep trench isolation structure may serve to electrically isolate the storage capacitor area from the first, second, third, and fourth pixels.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: April 16, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventor: Jeffrey M. Raynor
  • Patent number: 10261308
    Abstract: An endoscope includes, in a tip portion of an insertion unit: an image sensor having a photodetecting surface as defined herein; an imaging optical system as defined herein; a holding frame as defined herein; and a tip portion of a treatment tool channel as defined herein, and, in a cross section taken perpendicularly to the optical axis, a thickness, on a first axis that intersects the optical axis and a center of the treatment tool channel, of frame wall portions, located on two respective sides of the optical axis and intersecting the first axis, of at least a portion of the holding frame is smaller than a thickness, on a second axis that is perpendicular to the optical axis and the first axis, of frame wall portions, located on two respective sides of the optical axis and intersecting the second axis, of the at least portion of the holding frame.
    Type: Grant
    Filed: August 28, 2016
    Date of Patent: April 16, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Takashi Yashiro, Shuichi Ishii, Kazuaki Takahashi, Ryou Kitano, Issei Suzuki
  • Patent number: 10257422
    Abstract: The present disclosure relates to a solid-state image pickup element, an image pickup module and electronic equipment configured to avoid large scaling of an image pickup element caused by an improvement in functions thereof. The solid-state image pickup element is configured with a lamination of an image sensor substrate on which a plurality of pixels is arranged on a surface of a sensor, and a signal processing substrate in which signal processing of an image signal output from the image sensor substrate is executed. The signal processing substrate has an electronic blur correction processing unit, a first connection unit that connects with an optical blur correction processing unit, and a second connection unit that connects with a gyro sensor which detects a blur generated in an image. At least a part of signals passed between the gyro sensor and the optical blur correction processing unit passes through the signal processing substrate.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: April 9, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Shota Watanabe
  • Patent number: 10257451
    Abstract: Provided are a comparison device capable of achieving a small area by using one small sampling capacitor for an input terminal and improving linearity by using a fixed reference voltage and a CMOS image sensor using the same. The comparison device may include a comparator configured to compare a pixel signal inputted through a positive input terminal with a ramp signal, a first sampling capacitor configured to be provided between an input terminal of the ramp signal and the positive input terminal of the comparator, a sampling switch configured to be provided between an output terminal of the comparator and a negative input terminal of the comparator, and a second sampling capacitor configured to be provided between a ground terminal and the negative input terminal of the comparator.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: April 9, 2019
    Assignee: SK hynix Inc.
    Inventors: Gun-Hee Yun, Hyun-Mook Park
  • Patent number: 10257426
    Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Tae Lee, Joon Seo Yim, Je Suk Lee, Jae Yong Park, Jun-Woo Park, Su-Young Lee
  • Patent number: 10249660
    Abstract: In a pixel array within an integrated-circuit image sensor, a pixel (870) includes a photodetector (260) and floating diffusion (262) formed within a substrate. First (881) and second (883) gate elements are disposed adjacent one another over a region (885) of the substrate between the photodetector and the floating diffusion and coupled respectively to a row line (TGr) that extends in a row direction within the pixel array and a column line (TGc) that extends in a column direction within the pixel array.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: April 2, 2019
    Assignee: Rambus Inc.
    Inventors: Michael Guidash, Thomas Vogelsang
  • Patent number: 10250825
    Abstract: An apparatus includes a complementary metal oxide semiconductor (CMOS) image sensor, an infrared light generating circuit, and a processor circuit. The CMOS image sensor includes a plurality of picture elements, where light integration begins on all of the picture elements simultaneously in response to a first control signal. A duration, an intensity, or both a duration and an intensity of infrared illumination produced by the infrared light generating circuit is controlled by a second control signal. The processor circuit is enabled to generate the first control signal and the second control signal. A period of the infrared illumination is shorter than an integration period of the CMOS image sensor.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: April 2, 2019
    Assignee: Ambarella, Inc.
    Inventor: Luyi Sun
  • Patent number: 10250793
    Abstract: A focus adjustment device comprising: a first detector 221 which detects a focused state by a contrast detection system; second detectors 222a, 222b which detect a focused state by a phase difference detection system; and a control unit 21 which controls the first detector 221 and second detectors 222a, 222b so as to detect the focused state by the second detectors 222a, 222b when detecting the focused state by the first detector 221.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: April 2, 2019
    Assignee: NIKON CORPORATION
    Inventors: Hiroaki Takahara, Hiroyuki Tomita
  • Patent number: 10249672
    Abstract: An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: April 2, 2019
    Assignee: OLYMPUS CORPORATION
    Inventors: Noriyuki Fujimori, Takatoshi Igarashi, Kazuhiro Yoshida
  • Patent number: 10250816
    Abstract: Embodiments of the present application disclose various image capture control methods and apparatuses. One of the image capture control methods comprises: determining a first zone as an allowable image blur zone, the first zone being a part of a shooting scene; determining a first imaging region that corresponds to the allowable image blur zone in an image sensor; adjusting a first pixel density distribution of the first image sensor, to cause the first pixel density of the imaging region to be lower than a second pixel density of a second imaging region in the image sensor after being adjusted; and performing, by using the image sensor after being adjusted, image capture on the shooting scene.
    Type: Grant
    Filed: October 10, 2015
    Date of Patent: April 2, 2019
    Assignee: Beijing Zhigu Rui Tuo Tech Co., Ltd.
    Inventors: Kuifei Yu, Lin Du
  • Patent number: 10237500
    Abstract: The present technology relates to a solid-state imaging device that can improve imaging quality by reducing variation in the voltage of a charge retention unit, a method of driving the solid-state imaging device, and an electronic apparatus. A first photoelectric conversion unit generates and accumulates signal charge by receiving light that has entered a pixel, and photoelectrically converting the light. A first charge retention unit retains the generated signal charge. A first output transistor outputs the signal charge in the first charge retention unit as a pixel signal, when the pixel is selected by the first select transistor. A first voltage control transistor controls the voltage of the output end of the first output transistor. The present technology can be applied to pixels in solid-state imaging devices, for example.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: March 19, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Fumihiko Koga
  • Patent number: 10237505
    Abstract: A solid-state imaging device including: a pixel array unit in which a plurality of pixels outputting an analog pixel signal are arranged in a two-dimensional matrix form; a ramp signal generation unit configured to generate and output a ramp wave; a clock generation unit configured to generate and output multiphase clocks; and a signal-processing unit, wherein the signal-processing unit including: a plurality of analog-to-digital conversion circuits, and a plurality of repeater circuits, wherein each of the plurality of analog-to-digital conversion circuits includes: a comparison unit, and a latch unit, wherein each of the plurality of the analog-to-digital conversion circuits outputs the digital value according to the state of the phase held by each latch circuit, and wherein each of the plurality of the repeater circuits corresponding to the same set are arranged side by side, and the repeater circuits are connected in series.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: March 19, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Yusaku Koyama
  • Patent number: 10229946
    Abstract: An image sensor includes a pixel array including a first pixel row, in which a plurality of first pixels and a plurality of second pixels are alternately arranged, and a second pixel row, in which a plurality of second pixels and a plurality of third pixels are alternately arranged; first color separation elements configured to allow light having a second wavelength band, among incident light, to pass therethrough and travel in a downward direction, and to allow a mixture of light having a first wavelength band and light having a third wavelength band, among the incident light, to pass therethrough and travel in a lateral direction; and first color filters on at least a portion of the plurality of first pixels, the first color filters being configured to transmit only the light having the first wavelength band.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: March 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seokho Yun, Sookyoung Roh, Sunghyun Nam
  • Patent number: 10225441
    Abstract: According to one aspect, embodiments herein provide a TDI sensor comprising a plurality of light sensing elements arranged in a row, each configured to accumulate charge proportional to an intensity of light incident on it from a field of view, and means for improving the sampling resolution of the TDI sensor by electronically introducing phase shift between a first set of image data generated by the plurality of light sensing elements at a first phase and a second set of image data generated by the plurality of light sensing elements at a second phase, for reading out the first set of image data and the second set of image data from a light sensing element at an end of the row of light sensing elements, and for generating an image of the field of view based on the two sets of phase shifted image data.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: March 5, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Stephen P. Shaffer, Stephen M. Palik, Hector A. Quevedo
  • Patent number: 10225503
    Abstract: An image sensor includes: first pixels, each of which receives a pair of light fluxes and outputs a pair of first analog signals; an A/D conversion unit that converts each of pairs of first analog signals to a pair of first digital signals; a digital adder unit that generates digital sum signals each by adding together the pair of first digital signals among pairs of first digital signals; a first output unit that outputs pairs of first digital signals to an external recipient; and a second output unit that outputs the digital sum signals to an external recipient.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: March 5, 2019
    Assignee: NIKON CORPORATION
    Inventor: Yosuke Kusaka
  • Patent number: 10217783
    Abstract: An imaging system may include an image sensor die, which may be backside illuminated (BSI). A light shielding layer and a conductive layer may be formed in the image sensor die. First and second portions of the conductive layer may be electrically isolated, so that the second conductive portion may be coupled to other power supply signals through a bond pad region, while the light shield may be shorted to ground. Optionally, the first and second portions may both be coupled to ground. The light shield may also be shorted through the bond pad region in a continuous conductive layer. A through oxide via may be formed in the image sensor die to couple metal interconnect structures to the conductive layer. Color filter containment structures may be formed over active image sensor pixels on the image sensor die, which may be selectively etched to improve planarity.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: February 26, 2019
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Swarnal Borthakur, Ulrich Boettiger
  • Patent number: 10205897
    Abstract: A method of driving a unit pixel may include activating a transfer signal prior to an activation of a reset signal to boost a floating diffusion node of the unit pixel, during a first section of a photodiode reset period; and activating a reset signal using a hard reset, during a second section of the photodiode reset period.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: February 12, 2019
    Assignee: SK Hynix Inc.
    Inventors: JIn-Seon Kim, Woong-Hee Lee, Tae-Hoon Kim
  • Patent number: 10205904
    Abstract: An image sensor has a plurality of unit pixels each provided with a plurality of photoelectric conversion portions and a floating diffusion portion, and an analog-digital converter. The analog-digital converter is controlled to: convert a reset level of the floating diffusion portion by counting in a first or second direction to acquire a first noise signal, acquire a first optical signal by counting in the first direction an analog signal of a first photo charge accumulated in a first photoelectric conversion portion, acquire a second noise signal by counting in the second direction a potential that the floating diffusion portion has after the first optical signal is acquired, and acquire a second optical signal by counting in the first direction an analog signal of a second photo charge accumulated in a second photoelectric conversion portion.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: February 12, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hirokazu Kobayashi
  • Patent number: 10199414
    Abstract: The present technology relates to a semiconductor device and electronic equipment in which a semiconductor device that suppresses the occurrence of noise by a leakage of light can be provided. A semiconductor device is configured which includes a light-receiving element 34, an active element for signal processing, and a light shielding structure 40 which is between the light-receiving element 34 and the active element to cover the active element and is formed of wirings 45 and 46. The semiconductor device further includes a first substrate on which the light-receiving element is formed, a second substrate on which the active element is formed, and a wiring layer which has a light shielding structure by the wirings which is formed on the second substrate, and in which the second substrate can be bonded to the first substrate through the wiring layer.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: February 5, 2019
    Assignee: SONY CORPORATION
    Inventors: Shoji Kobayashi, Yoshiharu Kudoh, Takuya Sano
  • Patent number: 10191255
    Abstract: A four-element athermal lens includes four coaxially aligned lenses including a (i) first lens and, in order of increasing distance therefrom and on a same side thereof, (ii) a second lens, a third lens, and a fourth lens. The first lens and the second lens are positive lenses. The third and fourth lenses are negative lenses. The first lens, second lens, third lens, and fourth lens have equal respective refractive indices n1, n2, n3, and n4. A difference between (i) the maximum of n1, n2, n3, and n4 and (ii) the minimum of n1, n2, n3, and n4 being less than 0.05 in a free-space wavelength range. Refractive indices n1, n2, n3, and n4 have respective temperature dependences ? ? ? n 1 ? ? ? T , ? ? ? n 2 ? ? ? T , ? ? ? n 3 ? ? ? T , ? ? ? n 4 ? ? ? T .
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: January 29, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Tingyu Cheng, Jau-Jan Deng
  • Patent number: 10187599
    Abstract: A pixel signal readout device includes a unit pixel including a drive transistor and a reset transistor; and a column select transistor suitable for outputting a voltage applied to one terminal thereof, to a common terminal of the drive transistor and the reset transistor through the other terminal thereof, in response to a column select control signal applied to a gate terminal thereof.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: January 22, 2019
    Assignee: SK Hynix Inc.
    Inventor: Tae-Gyu Kim
  • Patent number: 10185125
    Abstract: A photographing optical lens system includes five lens elements which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The second lens element has positive refractive power. The third lens element has negative refractive power. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface thereof has at least one convex critical point in an off-axial region thereof, the object-side surface and the image-side surface thereof are aspheric.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: January 22, 2019
    Assignee: LARGAN Precision Co., Ltd.
    Inventors: Cheng-Chen Lin, Chun-Yen Chen, Yu-Tai Tseng, Hung-Shuo Chen, Wei-Yu Chen
  • Patent number: 10181485
    Abstract: The present disclosure relates to a solid-state image sensor, an electronic apparatus and an imaging method by which specific processing other than normal processing can be sped up with reduced power consumption. The solid-state image sensor includes a pixel outputting a pixel signal used to construct an image and a logic circuit driving the pixel, and is configured of a stacked structure in which a first semiconductor substrate including a plurality of the pixels and a second semiconductor substrate including the logic circuit are joined together. In addition, among the plurality of pixels, a specific pixel is connected to the logic circuit independently of a normal pixel, the specific pixel being the pixel that outputs the pixel signal used in the specific processing other than imaging processing in which the image is imaged. The present technology can be applied to a stacked solid-state image sensor, for example.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: January 15, 2019
    Assignee: Sony Corporation
    Inventors: Keiji Tatani, Tomoharu Ogita, Takashi Nagano
  • Patent number: 10170511
    Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: January 1, 2019
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Tzu-Wei Huang, Chi-Han Lin
  • Patent number: 10165215
    Abstract: The present invention concerns an imaging apparatus having a plurality of pixels, each of the pixels including: a first photoelectric converter; a first pixel memory; a first transfer unit configured to transfer charges from the first photoelectric converter to the first pixel memory; a second photoelectric converter; a second pixel memory; a second transfer unit configured to transfer charges from the second photoelectric converter to the second pixel memory; and a switch adapted to control an electric connection state between the first pixel memory and the second pixel memory, wherein the exposure time of the first photoelectric converter is longer than the exposure time of the second photoelectric converter.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: December 25, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventor: Aihiko Numata
  • Patent number: 10154223
    Abstract: The present technology relates to a comparator circuit, a solid-state imaging apparatus, and an electronic device which enable to improve a frame rate. A comparator compares an analog signal with a reference signal, an amplification stage amplifies output of a comparing unit and has different output change speeds in normal rotation and in reverse rotation, and a switch circuit fixes an input node or an output node of the amplification stage to a predetermined voltage in a predetermined period before a comparing operation by the comparator so that the amplification stage operates in a change direction having a higher output change speed. The present technology can be applied to a comparator circuit provided to an A/D converter of a CMOS image sensor.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: December 11, 2018
    Assignee: Sony Corporation
    Inventors: Koji Ogawa, Yusuke Oike
  • Patent number: 10147024
    Abstract: A method of interfacing an event based processing system with a frame based processing system is presented. The method includes converting multiple events into a frame. The events may be generated from an event sensor. The method also includes inputting the frame into the frame based processing system.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: December 4, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Xin Wang, William Howard Constable, Venkat Rangan, Manu Rastogi
  • Patent number: 10142570
    Abstract: An imaging device including at least one pixel, where each of the at least one pixels includes a photoelectric conversion layer having a first surface and a second surface being on a side opposite to the first surface; a first electrode located on the first surface; a second electrode located on the first surface, the second electrode being separated from the first electrode, a first voltage being applied to the second electrode; a third electrode located on the second surface, the third electrode opposing to the first electrode and the second electrode, a second voltage being applied to the third electrode; and an amplifier transistor having a gate electrically connected to the first electrode, where an absolute value of a difference between the first voltage and the second voltage is larger than an absolute value of a difference between the second voltage and a voltage of the first electrode.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: November 27, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takayoshi Yamada, Masayuki Takase, Tokuhiko Tamaki, Masashi Murakami
  • Patent number: 10134787
    Abstract: A photographing apparatus for preventing or reducing light leakage and an image sensor thereof are provided. The photographing apparatus includes an image sensor configured to include a plurality of pixels respectively having a Photo Diode and a Storage Diode for temporarily storing a charge accumulated in the Photo Diode and an image processor configured to perform an image processing operation by receiving the charge stored in the Storage Diode of each of the plurality of pixels. In addition, the image sensor has a structure where the Storage Diodes of the plurality of pixels are arrayed to be adjacent to each other. Accordingly, the photographing apparatus may prevent the light leakage from the adjacent pixel being flowed into a Storage Diode of each pixel.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: November 20, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae-joon Moon
  • Patent number: 10136092
    Abstract: A solid state image sensor includes a pixel array, as well as charge-to-voltage converters, reset gates, and amplifiers each shared by a plurality of pixels in the array. The voltage level of the reset gate power supply is set higher than the voltage level of the amplifier power supply. Additionally, charge overflowing from photodetectors in the pixels may be discarded into the charge-to-voltage converters. The image sensor may also include a row scanner configured such that, while scanning a row in the pixel array to read out signals therefrom, the row scanner resets the charge in the photodetectors of the pixels sharing a charge-to-voltage converter with pixels on the readout row. The charge reset is conducted simultaneously with or prior to reading out the signals from the pixels on the readout row.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: November 20, 2018
    Assignee: Sony Corporation
    Inventors: Takeshi Yanagita, Keiji Mabuchi, Hiroaki Ishiwata
  • Patent number: 10136091
    Abstract: At least one solid-state image pickup element includes a plurality of pixels that are arranged in a two-dimensional manner. Each of the plurality of pixels includes a plurality of photoelectric conversion units each including a pixel electrode, a photoelectric conversion layer disposed on the pixel electrode, and a counter electrode disposed such that the photoelectric conversion layer is sandwiched between the pixel electrode and the counter electrode. In one or more embodiments, each of the plurality of pixels also includes a microlens disposed on the plurality of photoelectric conversion units.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: November 20, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toshiaki Ono, Masatsugu Itahashi, Naoki Inatani, Yu Maehashi, Hidekazu Takahashi
  • Patent number: 10129494
    Abstract: An imaging device includes: a solid-state image sensor including: a plurality of pixels that are arranged in a two-dimensional array; and a signal processing device that processes an output signal from the solid-state image sensor. The imaging device generates a corrected image by: generating a correction signal based on a difference between a first temporary correction signal and a second temporary correction signal, the first temporary correction signal being obtained by directly applying a first voltage amplitude to a signal storage provided in each of the plurality of pixels, and the second temporary correction signal being obtained by applying, to the signal storage, a second voltage amplitude that is different from the first voltage amplitude; acquiring an image signal upon a photographing drive operation being performed by the solid-state image sensor; and applying the correction signal to the image signal.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: November 13, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Motonori Ishii, Yutaka Hirose, Shota Yamada
  • Patent number: 10120992
    Abstract: A mobile terminal including a main body; a receiver disposed on the main body; an infrared unit disposed on the main body at a first distance from the receiver in a first direction and configured to output infrared rays; an iris recognition sensor disposed on the main body at a second distance from the receiver in a second direction opposite the first direction and configured to receive infrared rays reflected from a subject; and a low power image sensor disposed on the main body at a third distance from the receiver in the second direction and having a focal point matching a focal point of the iris recognition sensor, wherein the third distance is greater than the second distance.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: November 6, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Hongjo Shim, Mihyun Park, Hyunok Lee
  • Patent number: 10115752
    Abstract: The present technology relates to a solid-state imaging device that can achieve a higher resolution while increasing sensitivity, and an electronic apparatus.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: October 30, 2018
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Kenji Azami, Yusuke Otake, Toshifumi Wakano
  • Patent number: 10106155
    Abstract: A vehicular camera includes a lens, an image processor configured to receive images from the lens, and a microcontroller containing flash memory. The microcontroller is connected to the image processor by a first bus through which command data is communicated to the image processor from the microcontroller. The command data includes application instructions to draw application data from a selected point in the flash memory. The microcontroller is connected to the image processor by a second bus through which application data is communicated to the image processor from the flash memory.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: October 23, 2018
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Yuesheng Lu, Joel S. Gibson, Duane W. Gebauer, Richard D. Shriner, Patrick A. Miller
  • Patent number: 10105120
    Abstract: A computer-implemented method of producing an augmented image of a spine of a patient is disclosed. The method involves: receiving a first ultrasonic volumetric dataset representing a three-dimensional depiction of anatomical features of the spine in a first volume; instantiating a three-dimensional atlas of at least two vertebrae according to the first ultrasonic volumetric dataset; and causing a display to display a rendering of the first ultrasonic volumetric dataset together with a rendering of the atlas. An apparatus for producing the augmented image of the spine of the patient is also disclosed.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: October 23, 2018
    Assignee: The University of British Columbia
    Inventors: Abtin Rasoulian, Robert Rohling, Purang Abolmaesumi, Mehran Pesteie
  • Patent number: 10104318
    Abstract: A pixel array within an integrated-circuit image sensor is exposed to light representative of a scene during a first frame interval and then oversampled a first number of times within the first frame interval to generate a corresponding first number of frames of image data from which a first output image may be constructed. One or more of the first number of frames of image data are evaluated to determine whether a range of luminances in the scene warrants adjustment of an oversampling factor from the first number to a second number, if so, the oversampling factor is adjusted such that the pixel array is oversampled the second number of times within a second frame interval to generate a corresponding second number of frames of image data from which a second output image may be constructed.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: October 16, 2018
    Assignee: Rambus Inc.
    Inventors: Craig M. Smith, Frank Armstrong, Jay Endsley, Thomas Vogelsang, James E. Harris, John Ladd, Michael Guidash
  • Patent number: 10096636
    Abstract: A light field imaging device includes an image sensor having a plurality of pixels arranged two-dimensionally therein; a microlens array formed over the image sensor, the microlens array having a plurality of microlenses arranged two-dimensionally therein; and a plurality of support structures formed between the image sensor and the microlens array for providing an air gap therebetween.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: October 9, 2018
    Assignee: SK Hynix Inc.
    Inventor: Jong Eun Kim
  • Patent number: 10091403
    Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: October 2, 2018
    Assignee: Sony Corporation
    Inventors: Eiichiro Dobashi, Shuichi Mochinaga
  • Patent number: 10078198
    Abstract: An imaging apparatus is provided, which includes an image sensor which includes a plurality of image pixels and a plurality of sensing pixels, and is configured to capture images through collection of light that is incident through a lens and the plurality of phase sensing pixels; and a processor configured to divide a region of interest of the image sensor into a plurality of sub-regions of interest, calculate disparity information of objects that correspond to the plurality of sub-regions of interest using at least one of the plurality of phase sensing pixels included in the plurality of sub-regions of interest, and determine a focal region in the region of interest on the basis of the disparity information. Accordingly, user convenience is increased.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: September 18, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong-won Lee, Kwon-jeong Kang, Byung-ho Kim, Woo-seok Choi, Il-do Kim
  • Patent number: 10079989
    Abstract: An image capturing device includes a pixel circuit, a programmable-gain amplifier, an analog-to-digital conversion circuit, and a control circuit. The pixel circuit outputs a photoreception signal. The programmable-gain amplifier amplifies the photoreception signal with a first gain. The analog-to-digital conversion circuit further amplifies the amplified signal that has been amplified by the programmable-gain amplifier, with a second gain by having a circuit configuration changeable by control, and digitally converts the resultant signal. The control circuit controls the analog-to-digital conversion circuit.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: September 18, 2018
    Assignee: Ricoh Company, Ltd.
    Inventors: Yuusuke Kudoh, Yuuya Miyoshi
  • Patent number: 10075660
    Abstract: An imaging device includes: a pixel array section having an array of pixels, each of which has a photoelectric converting device and outputs an electric signal according to an input photon; a sense circuit section having a plurality of sensor circuits each of which makes binary decision on whether there is a photon input to a pixel in a predetermined period upon reception of the electric signal therefrom; and a decision result IC section which integrates decision results from the sense circuits, pixel by pixel or for each group of pixels, multiple times to generate imaged data with a gradation, the decision result IC section including a count circuit which performs a count process to integrate the decision results from the sense circuits, and a memory for storing a counting result for each pixel from the count circuit, the sense circuits sharing the count circuit for integrating the decision results.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: September 11, 2018
    Assignee: SONY CORPORATION
    Inventor: Toshiyuki Nishihara
  • Patent number: 10070103
    Abstract: Provided is a solid-state imaging device including: a pixel section configured to include a plurality of pixels arranged in a matrix form, the plurality of pixels performing photoelectric conversion; column signal lines configured to transmit pixel signals output from the pixels in units of columns; an AD converting section configured to include a comparator that compares a reference signal serving as a ramp wave with the pixel signals transmitted via the column signal line and convert a reference level and a signal level of the pixel signals into digital signals independently based on a comparison result of the comparator; a switch configured to be connected with the column signal lines; and a control section configured to turn on the switch only during a certain period of time in a period of time in which the comparator is reset and cause the column signal lines to be short-circuited.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: September 4, 2018
    Assignee: Sony Corporation
    Inventor: Shizunori Matsumoto
  • Patent number: 10061039
    Abstract: An apparatus includes a plurality of first groups having same configurations and arranged in a row direction and a column direction, each of the first groups including a plurality of pixels for obtaining a radiation image and at least one detection section for detecting an amount of incident radiation, and a plurality of detection signal lines connected to the plurality of detection sections. Two of the plurality of first groups which are arranged in the column direction are shifted from each other in the row direction, and the detection sections included in the two groups are connected to different detection signal lines in the plurality of detection signal lines.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: August 28, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Jun Kawanabe, Minoru Watanabe, Keigo Yokoyama, Masato Ofuji, Kazuya Furumoto
  • Patent number: 10062727
    Abstract: Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: August 28, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Geoffrey P. McKnight, Brian K. Guenter, Andrew Keefe, Neel S. Joshi
  • Patent number: 10062358
    Abstract: An electronic device may be provided with an ambient light sensor. An analog-to-digital converter may be used to digitize ambient light measurements made with the ambient light sensor. Control circuitry in the electronic device may be used to adjust the brightness of a display and take other actions in the electronic device based on the digitized ambient light measurements. The analog-to-digital converter may be a hybrid analog-to-digital converter having a most-significant-bit analog-to-digital converter circuit branch based on an integrating analog-to-digital converter and a least-significant-bit analog-to-digital converter circuit branch based on a successive-approximation-register analog-to-digital converter. The most-significant-bit branch may produce an output based a reset count for an integrator that is reset a number of times during a measurement period. The least-significant-bit branch may produce an output by digitizing an output from the integrator upon termination of the measurement period.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 28, 2018
    Assignee: Apple Inc.
    Inventor: Dong Zheng
  • Patent number: 10057518
    Abstract: An imaging device comprises at least one unit pixel cell. Each of them comprises: a photoelectric conversion layer having a first and second surfaces; a pixel electrode and a shield electrode located on the first surface and separated from each other, a shield voltage being applied to the shield electrode; an upper electrode located on the second surface and opposing to the pixel electrode and the shield electrode, a counter voltage being applied to the upper electrode; a charge accumulation node electrically connected to the pixel electrode; and a charge detection circuit electrically connected to the charge accumulation node. An absolute value of a difference between the shield voltage and the counter voltage is larger than an absolute value of a difference between the counter voltage and a voltage of the pixel electrode.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: August 21, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takayoshi Yamada, Masayuki Takase, Tokuhiko Tamaki, Masashi Murakami
  • Patent number: 10057514
    Abstract: An image sensor includes n light receiving elements including first to n-th light receiving elements, each of the light receiving elements generating photoelectric conversion signals, n sequencers including first to n-th sequencers, each of the sequencers having both a sequencer input terminal to which a k-th horizontal control signal is input, and a sequencer output terminal from which a (k+1)-th horizontal control signal is output, and n switches including first to n-th switches, each of the switches having a switch input terminal to which a signal corresponding to the photoelectric conversion signal is input, a switch control terminal to which a k-th pixel control signal is input, and a switch output terminal which is electrically connected to the switch input terminal, wherein n is a natural number of 2 or more, and k is a natural number of 1 to n.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: August 21, 2018
    Assignee: OLYMPUS CORPORATION
    Inventor: Masato Osawa
  • Patent number: 10054719
    Abstract: A double-lens structure and a method for fabricating the same are provided. The double-lens structure includes a first lens structure formed of a color filter layer having a first refractive index and a second lens structure formed of a micro-lens material layer having a second refractive index and disposed on the first lens structure. The first refractive index of the color filter layer is different from the second refractive index of the micro-lens material layer. An incident light enters the second lens structure and then passes through the first lens structure. Further, a method for fabricating the double-lens structure is also provided.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: August 21, 2018
    Assignee: VisEra Technologies Company Limited
    Inventors: Han-Lin Wu, Yu-Kun Hsiao, Yueh-Ching Cheng
  • Patent number: 10051222
    Abstract: A solid-state imaging device includes a pixel array with unit pixels each having a photoelectric conversion device arranged in a matrix. Column signal lines are wired with respect to one column in the pixel arrangement and pixels are regularly connected to the column signal lines in accordance with rows in which pixels are positioned. A pixel signal reading unit has a column processing unit that reads pixel signals in units of plural pixels from the pixel array and performs column processing to read signals on a column basis, wherein the pixel signal reading unit includes a column input unit which can connect one or plural column signal lines arranged at a corresponding column to an input of one column processing unit through plural capacitors connected in parallel The column input unit has switches which can change a connection state between capacitors and column signal lines corresponding to the column.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: August 14, 2018
    Assignee: Sony Corporation
    Inventors: Masamichi Ito, Tsuyoshi Hara, Yoshiaki Inada