Solid-state Image Sensor Patents (Class 348/294)
  • Patent number: 10991734
    Abstract: The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal. A photoelectric conversion part that converts received light into a charge, and a holding part that holds a charge transferred from the photoelectric conversion part are provided, the photoelectric conversion part and the holding part are formed in a semiconductor substrate having a predetermined thickness, and the holding part is formed with a thickness that is half or less of the predetermined thickness. A charge capturing region that captures a charge is further provided on a light incident side of a region where the holding part is formed. A light shielding part that shields light is formed between the photoelectric conversion part and the charge capturing region. The present technology is applicable to an imaging device.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: April 27, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yoshimichi Kumagai, Takashi Abe, Ryoto Yoshita, Ikuhiro Yamamura
  • Patent number: 10991753
    Abstract: The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal. A photoelectric conversion part that converts received light into a charge; a holding part that holds a charge transferred from the photoelectric conversion part; and a light shielding part that shields light between the photoelectric conversion part and the holding part are provided. The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. The present technology is applicable to an imaging device.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: April 27, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yoshimichi Kumagai, Takashi Abe, Ryoto Yoshita
  • Patent number: 10986290
    Abstract: An image sensor includes a photodiode disposed in a semiconductor material to generate image charge in response to incident light, and a first transfer gate is coupled to the photodiode to extract image charge from the photodiode in response to a first transfer signal. A first storage gate is coupled to the first transfer gate to receive the image charge from the first transfer gate, and a first output gate is coupled to the first storage gate to receive the image charge from the first storage gate. A first capacitor is coupled to the first output gate to store the image charge.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: April 20, 2021
    Assignee: OmniVision Technologies, Inc.
    Inventors: Sohei Manabe, Keiji Mabuchi
  • Patent number: 10964744
    Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: March 30, 2021
    Assignee: OmniVision Technologies, Inc.
    Inventors: Cheng Zhao, Chen-Wei Lu, Cunyu Yang, Ping-Hsu Chen, Zhiqiang Lin, Chengming Liu
  • Patent number: 10965892
    Abstract: An image sensor includes: a first readout circuit that reads out a first signal, being generated by an electric charge resulting from a photoelectric conversion, to a first signal line; a first holding circuit that holds a voltage based on an electric current from a power supply circuit; and a first electric current source that supplies the first signal line with an electric current generated by the voltage held in the first holding circuit, wherein: the first holding circuit holds the voltage based on the electric current from the power supply circuit when the first signal is not read out to the first signal line by the first readout circuit.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: March 30, 2021
    Assignee: NIKON CORPORATION
    Inventors: Wataru Funamizu, Masahiro Juen, Atsushi Komai
  • Patent number: 10965917
    Abstract: Imaging systems providing high resolution, low light images with significant dynamic range are disclosed. The improvements to photo imaging sensors providing low costs and yet higher performance sensors may be obtained an enhanced photosensor generating a single color channel image per photosensor. The single color channel image contains luminence values corresponding to light focused onto the photosensor. The plurality of photosensors are constructed using Indium gallium nitride (InGaN) nanowire structures and nanopyrimid structures used in cells within an array of cells. Photosensors may be constructed as single color imaging devices as well as multi-color devices. The generation of various color channel images are controlled using metasurface filter structures as well as color filter layers setting a wavelength for absorbed light by controlling a concentration of indium gallium nitride (InGaN) within the color filter layers.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: March 30, 2021
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Richmond Hicks, Nilesh V. Shah
  • Patent number: 10951849
    Abstract: Disclosed herein are techniques for digital imaging. A digital pixel image sensor includes a digitizer in each pixel of a plurality of pixels, where the digitizer digitizes analog output signals from a photodiode of the pixel using a comparator, a global reference ramp signal, and a clock counter. In some embodiments, the comparator includes a pre-charging circuit, rather than a constant biasing circuit, to reduce the power consumption of each pixel. In some embodiments, each pixel includes a digital or analog correlated double sampling (CDS) circuit to reduce noise and provide a higher dynamic range.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 16, 2021
    Assignee: Facebook Technologies, LLC
    Inventor: Xinqiao Liu
  • Patent number: 10948759
    Abstract: The present invention provides an in-vehicle touch display device. The in-vehicle touch display device includes a backlight module, a touch display module, and a sealant. The touch display module is placed over the backlight module. The touch display module includes a touch screen, an upper polarizing film, a liquid crystal layer, and a lower polarizing film sequentially stacked on each other. The sealant joins the backlight module and the touch display module together. The sealant includes two protrusions protruding between the backlight module and the touch display module. An adhesive layer is positioned on a side surface of each protrusion facing the lower polarizing film.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: March 16, 2021
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Zheng Zhou
  • Patent number: 10944925
    Abstract: An imaging apparatus includes: an imager that has a plurality of pixels as defined herein, that includes a plurality of pixel rows including the plurality of pixels arranged in one direction, and that discharges charges of the photoelectric conversion element and the charge holder to a charge discharge region of the readout circuit as defined herein; and an imaging controller that performs a global reset drive, a global shutter drive, a first rolling readout drive, a rolling shutter drive and a second rolling readout drive as defined herein, and the imaging controller performs a first imaging control as defined herein.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: March 9, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Hidekazu Kurahashi, Fuminori Irie, Yoshinori Furuta, Hitoshi Sakurabu, Tomonori Masuda
  • Patent number: 10944034
    Abstract: A light emitting diode includes a base layer, an electric contact layer, a semiconductor stack, and an insulation layer. The base layer has a maximum of a first width. The electric contact layer has a maximum of a second width and is disposed on the base layer. The semiconductor stack disposed on the electric contact layer has a maximum of a third width, and includes a first type semiconductor layer, a light emitting layer, and a second type semiconductor layer stacked in sequence, wherein a width of the first type semiconductor layer is smaller than the maximum of the third width. The insulation layer covers the sidewalls of the base layer, the electric contact layer, and the semiconductor stack. The maximum of the second width is greater than the maximum of the third width and the maximum of the second width is less than the maximum of the first width.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: March 9, 2021
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventor: Shiou-Yi Kuo
  • Patent number: 10944943
    Abstract: An image sensor is disclosed. The image sensor includes a substrate including an active region and a dummy region, a plurality of unit pixels on the active region, a transparent conductive layer on a first surface of the substrate, a light-blocking layer on the transparent conductive layer and electrically connected to the transparent conductive layer, the light-blocking layer having a grid structure adjacent light transmission regions, and a pad electrically connected to the light-blocking layer, on the dummy region.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: March 9, 2021
    Inventors: Sang-Hoon Kim, Byungjun Park
  • Patent number: 10939050
    Abstract: A method of operating a camera system having an image sensor including a plurality of activatable image elements, wherein an active image element converts incoming radiation into readable image information, a radiation source including a plurality of activatable radiation elements, each active radiation element emitting electromagnetic radiation, and an integrated circuit coupled to the radiation source, the method including capturing at least one image, wherein during capturing of each single image different subsets of the image elements are successively each once activated and deactivated again after a predetermined exposure time, different subsets of the radiation elements are successively activated by the integrated circuit and deactivated again after a predetermined emission time, and each subset of the image elements is assigned a subset of the radiation elements activated with temporal overlap so that the active radiation elements emit radiation while the associated active image elements receive image
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: March 2, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Thorsten Frank Baumheinrich, Mikko Perälä, Désirée Queren
  • Patent number: 10930699
    Abstract: A backside illuminated image sensor having a photodiode and a first transistor in a sensor region and located in a first substrate, with the first transistor electrically coupled to the photodiode. The image sensor has logic circuits formed in a second substrate. The second substrate is stacked on the first substrate and the logic circuits are coupled to the first transistor through bonding pads, the bonding pads disposed outside of the sensor region.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: February 23, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen, Jen-Cheng Liu
  • Patent number: 10931898
    Abstract: Provided are an image sensor and an image processing device including the same. The image sensor includes: a pixel array including a plurality of pixels arranged in rows and columns and configured to generate pixel signals from the plurality of pixels, a time calculator configured to receive zoom information corresponding to digital zooming, and configured to calculate a row processing time available for processing the pixel signals from the plurality of pixels included in a single row based on the zoom information, a timing generator configured to generate at least one control signal based on the row processing time; and an Analog-to-Digital Converter (ADC) configured to generate pixel data by performing sampling on the pixel signals according to the at least one control signal.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: February 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeok-jong Lee, Se-jun Kim
  • Patent number: 10924681
    Abstract: A control apparatus includes an angle control unit configured to change a tilt angle by tilting an imaging sensor, a first determination unit configured to determine a first area from among a plurality of areas in an image, an evaluation value acquisition unit configured to acquire a contrast evaluation value of each of second areas excluding the first area among the plurality of areas by changing the tilt angle through the angle control unit, and a second determination unit configured to determine the tilt angle for each area based on the contrast evaluation value acquired by the evaluation value acquisition unit, and determining the tilt angle of the image sensor based on the tilt angle determined for each area. The angle control unit tilts the image sensor so as to obtain the tilt angle determined by the second determination unit.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: February 16, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Natsuko Sato
  • Patent number: 10918265
    Abstract: A video processor includes: an image processing section including a front image enhancement processing section configured to perform first enhancement processing on a front image acquired from a front area in a subject by using an endoscope including an insertion portion which is inserted into the subject, and a side image enhancement processing section configured to perform second enhancement processing on a side image acquired from a side area located lateral to the front area by using the endoscope; and a control section configured to individually set an enhancement level of enhancement processing performed by the front image enhancement processing section and an enhancement level of enhancement processing performed by the side image enhancement processing section.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: February 16, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Takanori Watanabe, Jin Ito
  • Patent number: 10924697
    Abstract: An image sensor includes: a first imaging region that captures an image of light entering through an optical system under a first imaging condition and generates a detection signal to perform focus detection of the optical system; and a second imaging region that captures an image of the light entering through the optical system under a second imaging condition other than the first imaging condition and generates an image signal.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: February 16, 2021
    Assignee: NIKON CORPORATION
    Inventor: Hidefumi Ota
  • Patent number: 10912448
    Abstract: A cable connection structure includes: a substrate including a first core wire connection electrode, a second core wire connection electrode, and a shield connection electrode; a single-wire cable including a first core wire, and an insulant; at least two coaxial cables each including a second core wire, an inner insulant, a shield, and an outer insulant, wherein the second core wire, the inner insulant, and the shield are exposed in a step-by-step manner at a distal end portion, and the second core wire and the shield are respectively connected to the second core wire connection electrode and the shield connection electrode; and a conductive member connecting exposed portions of the shields. The conductive member is disposed directly on an upper surface of the insulant, and connects the shields on the shield connection electrode and/or a position closer to a proximal end side than the shield connection electrode.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: February 9, 2021
    Assignee: OLYMPUS CORPORATION
    Inventor: Masato Mikami
  • Patent number: 10917596
    Abstract: A pixel circuit is disclosed. The pixel circuit includes a photodiode (PD), a transmission circuit, a reset circuit, a signal storage circuit and a buffer circuit. The transmission circuit is coupled between the PD and an ordinary floating diffusion (FD) node. The reset circuit is coupled to the ordinary FD node. The signal storage circuit is coupled to the ordinary FD node. The buffer circuit is coupled to the signal storage circuit. The signal storage circuit may store a PD signal on a specific node having a reduced leakage path in comparison with the ordinary FD node during a holding phase of the pixel circuit, wherein the holding phase is a time interval starting from a first time point at which the PD signal is stored on the specific node and ending at a second time point at which the pixel circuit is selected for performing a read-out operation.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: February 9, 2021
    Assignee: Himax Imaging Limited
    Inventors: Hack soo Oh, Yu Hin Desmond Cheung, Kihong Kim
  • Patent number: 10917625
    Abstract: A dual-band pixel includes a backside passivation layer, a corresponding input terminal coupled to the backside passivation layer, a first n-type layer covering the backside passivation layer, a p-type layer covering the first n-type layer, a second n-type layer within the p-type layer, and a pinning layer covering the second n-type layer. A first or second voltage is applied to the corresponding input terminal to operate the dual-band pixel in a visible or infrared (IR) mode. A depth camera assembly (DCA) may include a sensor pixel array comprising a plurality of dual-band pixels. The DCA may take visible or IR images in a time multiplexed manner using the sensor pixel array and determine depth information based on the captured IR images.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: February 9, 2021
    Assignee: Facebook Technologies, LLC
    Inventor: Xinqiao Liu
  • Patent number: 10917590
    Abstract: An imaging control device includes a combiner configured to generate a combined image on the basis of a first image captured in a first exposure time and a second image captured in a second exposure time longer than the first exposure time and an exposure time controller configured to control at least one of the first exposure time and the second exposure time on the basis of a number of pixels of at least one of saturated pixels having pixels values equal to or larger than a predetermined value and black pixels having pixel values equal to or smaller than the predetermined value in the combined image and a value concerning a luminance value of the combined image.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: February 9, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventor: Fumihiko Hyuga
  • Patent number: 10909824
    Abstract: A pulsed image capturing system includes a pulse generation circuit, a dynamic vision sensor (DVS), and a DVS scanning and readout circuit. A global reset signal is transmitted to pixels of the DVS to set a reference illumination level for the pixels, and then a pulsed light pattern is generated. A global hold signal is transmitted to the pixels, after the pulsed light pattern is generated, to hold an illumination change event indicating a change with respect to the reference illumination level. A DVS scanning and readout operation is performed on event signals received from the pixels, after the global hold signal is transmitted to the pixels. A reflection of the pulsed light pattern is extracted from the DVS output after cleaning artifacts from the DVS output without additional image processing.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: February 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoel Yaffe, Nathan Henri Levy
  • Patent number: 10904465
    Abstract: This invention relates to a pixel circuit comprising a photo-sensor stage (10) comprising a photodiode (1) delivering a photoreceptor current (Iph), a comparison stage (30) configured for detecting a change in a signal voltage (Vph) derived from said photoreceptor current, a sample-and-hold circuit (50) connected to the converting stage (20) and to the comparison stage (30), said comparison stage (30) configured to output an input signal for the sample-and-hold circuit (50), and for emitting a sampling signal to a control terminal of the sample-and-hold circuit (50) when a change is detected in the signal voltage (Vph).
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: January 26, 2021
    Assignees: Prophesee, Consejo Superior de Investigaciones Cientificas
    Inventors: Thomas Finateu, Bernabe Linares Barranco, Teresa Serrano Gotarredona, Christoph Posch
  • Patent number: 10903197
    Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: January 26, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventor: Hartmut Rudmann
  • Patent number: 10904501
    Abstract: A projection system and a keystone correction method are provided. The projection system includes: a projector projecting an image to a projection zone; an image capturing device capturing a captured image including the projection zone; and a processor. The processor divides the captured image into multiple focusing zones, and controls a stepper motor to shift focusing on the focusing zones at edges to obtain a step of the stepper motor and a distance for each of the focusing zones with a maximum clarity value. The distance is a projection distance between a lens module and the focusing zone. The processor calculates an included angle between the direction of a light axis of the projector and the projection zone according to the distances of the focusing zones at the edges, and performs a warping operation on a projection image according to the included angle.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: January 26, 2021
    Assignee: Coretronic Corporation
    Inventors: Yu-Chi Wu, Pei-Yu Li
  • Patent number: 10891721
    Abstract: A method for reconstructing a hyperspectral image and a system therefor are provided. The method includes obtaining a dispersion model for dispersion created by a prism included in a camera, the prism including no coded aperture, and reconstructing a hyperspectral image corresponding to a captured image based on the dispersion model.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: January 12, 2021
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Min Hyuk Kim, Seung-Hwan Baek, Incheol Kim
  • Patent number: 10890482
    Abstract: A pixel circuit is provided. The pixel circuit may comprise a photodiode, a comparator circuit, a capacitor, a first switch circuit, a second switch circuit and a third switch circuit. The photodiode is arranged to accumulate charges in response to incident radiation, to generate a photodiode signal. The comparator circuit is arranged to generate an output signal according to a voltage level of a specific node within the pixel circuit during a read-out phase of the pixel circuit. The capacitor is coupled between a control voltage terminal of the pixel circuit and the specific node, the first switch circuit is coupled between the photodiode and the specific node, the second switch circuit is coupled between the specific node and an output terminal of the pixel circuit, and the third switch circuit is coupled between the output terminal and the comparator circuit.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: January 12, 2021
    Assignee: Himax Imaging Limited
    Inventor: Hack soo Oh
  • Patent number: 10880462
    Abstract: The size of the camera sensor devices allows a great number of applications such as medical applications. The image sensor itself is approximately the size of a cube of 1 mm3. Such devices are used for endoscopy in the medical field or to be integrated in alarm clock or a watch for surveillance purpose.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: December 29, 2020
    Assignee: AUDIO TECHNOLOGY SWITZERLAND S.A.
    Inventors: Patrick Camina, Loic Ray, Thierry Frank
  • Patent number: 10871582
    Abstract: The present disclosure relates to a detection panel, a manufacturing method thereof and a detection device. The detection panel comprises: a base substrate and a photoelectric conversion structure located on the base substrate, and a display structure located on a side of the photoelectric conversion structure facing away from the base substrate and electrically connected to the photoelectric conversion structure; wherein the photoelectric conversion structure is configured to convert an optical signal into an electrical signal, and the display structure is configured to perform image display according to the electrical signal.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: December 22, 2020
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Jing Li, Wenyu Zhang, Liangjie Li, Hao Dong, Da Xu
  • Patent number: 10872219
    Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: December 22, 2020
    Assignee: IDEX Biometrics ASA
    Inventor: Fred G. Benkley, III
  • Patent number: 10868995
    Abstract: An AD converter includes a comparator that compares a potential of a pixel signal line with a reference potential that is a potential of a ramp waveform changing with time, a counter that stops a counting operation in response to a change in an output of the comparator, and an all-bit latch unit that holds all bits of a count value subsequent to stopping the counting operation during the second count period. The counter sets an initial value for the counting operation during the first count period to be a negative value, and prior to the counting operation during the second count period, inverts all bits of the count value subsequent to stopping the counting operation during the first count period.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: December 15, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Takeo Ushinaga
  • Patent number: 10868069
    Abstract: Provided is a solid state imaging device including a pixel in which the pixel has a photoelectric conversion unit provided in a semiconductor substrate and a light guide having a bottom that emits an incident light to the photoelectric conversion unit. The photoelectric conversion unit includes a first semiconductor region of a first conductivity type provided at a first depth of the semiconductor substrate, and second and third semiconductor regions of a second conductivity type provided at a second depth located under the first depth of the semiconductor substrate and spaced apart from each other by a first region. Each of the second semiconductor region, the third semiconductor region, and the first region overlaps with a part of the first semiconductor region in a planar view. At least a part of the bottom and at least a part of the first region overlap with each other in the planar view.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: December 15, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Ginjiro Toyoguchi
  • Patent number: 10868051
    Abstract: An imaging device includes: a pixel including a photoelectric converter including a pixel electrode, a counter electrode, and a photoelectric conversion fila converting light into a charge, an amplification transistor a first gate of which is connected to the pixel electrode, a reset transistor one of second source and drain of which is connected to the pixel electrode, and a feedback transistor one of third source and drain of which is connected to the other of the second source and drain; and a first voltage supply circuit supplying a first voltage to the counter electrode. The reset transistor has such a characteristic that when a voltage equal to or higher than a clipping voltage is supplied between the second gate and the one of the second source and drain, the reset transistor is turned off. The clipping voltage is lower than the first voltage.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: December 15, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Junji Hirase, Masashi Murakami
  • Patent number: 10868994
    Abstract: An image sensor system includes a timing control circuit, an image sensor and a modulation circuit. The timing control circuit is arranged to determine if a coding condition is fit according to an input signal and generate a control signal when the coding condition is fit. The input signal has a signal value updated in response to each pulse of a clock signal. The image sensor is coupled to the timing control circuit, and includes a plurality of pixels. One of the plurality of pixels receives the control signal from the timing control circuit and outputs a sensing signal. The modulation circuit is coupled to the image sensor, and arranged to receive the sensing signal and generate an output signal according to the sensing signal.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Chih-Min Liu
  • Patent number: 10863155
    Abstract: An image capture device may detect and repair banding artifacts in a video. The image capture device may include an image sensor and an image processor. The image sensor may capture a frame that includes a sinusoidal light waveform banding artifact. The image processor may detect a sinusoidal light waveform in the frame. The image processor may perform a sinusoidal regression. The image processor may obtain an inverted gain map. The image processor may apply the inverted gain map to the frame. The image processor may output the frame.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: December 8, 2020
    Assignee: GoPro, Inc.
    Inventor: Romain Gounelle
  • Patent number: 10863127
    Abstract: Some embodiments provide a novel compressive-sensing image capture device and a method of using data captured by the compressive-sensing image capture device. The novel compressive-sensing image capture device includes an array of sensors for detecting electromagnetic radiation. Each sensor in the sensor array has an associated mask that blocks electromagnetic radiation from portions of the sensor. In some embodiments, an array of passive masks is used to block a particular set of areas of each sensor in the sensor array. In some embodiments, the image capture device also includes an array of lenses corresponding to the sensors of the sensor array such that each sensor receives light that passes through a different lens. Some embodiments of the invention provide a dynamic mask array. In some embodiments, a novel machine trained network is provided that processes image capture data captured by the compressive-sensing image capture device to predict solutions to problems.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: December 8, 2020
    Assignee: PERCEIVE CORPORATION
    Inventor: Ilyas Mohammed
  • Patent number: 10863057
    Abstract: A method of synchronizing images from multiple image sensors having different properties is described. The method comprises synchronizing a capture of a first image using a first image sensor and a capture of a second image using a second image sensor; and storing at least one of (a) the captured first image on an on-sensor memory of the first image sensor, or (b) the captured second image on an on-sensor memory of the second image sensor.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: December 8, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hamid Rahim Sheikh
  • Patent number: 10852184
    Abstract: A photoelectric conversion apparatus according to one aspect of the present invention includes a first substrate including a photoelectric conversion region and a surrounding region, and a second substrate including a circuit for processing a signal from the photoelectric conversion region, and overlapping the first substrate. In this case, the circuit for processing a signal from the photoelectric conversion region includes a first circuit and a second circuit with a higher drive frequency than that of the first circuit. In an orthogonal projection, the second circuit is only provided in the photoelectric conversion region.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: December 1, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Mineo Shimotsusa, Koichiro Iwata
  • Patent number: 10848692
    Abstract: An imaging apparatus includes an imager, an imaging controller and a display controller as defined herein, a time required for the first rolling readout drive is longer than a time required for each of the rolling reset drive, the rolling shutter drive and the second rolling readout drive, and in an imaging mode in which the imaging controller performs the first drive while continuously performing the second drive, the imaging controller sets a first start timing of the second drive performed first after a start of the first drive to be during an implementation period of the first rolling readout drive in the first drive, and synchronizes a second start timing of the rolling shutter drive performed first after the start of the first drive with the display update timing that comes first after an end of the first rolling readout drive.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 24, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Fuminori Irie, Tomonori Masuda, Hidekazu Kurahashi, Yoshinori Furuta, Hitoshi Sakurabu
  • Patent number: 10848701
    Abstract: An image sensing device includes: a first source ramp voltage generation circuit suitable for generating a first source ramp voltage that is adjusted a first voltage unit for each first period, a second source ramp voltage generation circuit suitable for generating a second source ramp voltage that is adjusted the first voltage unit for each first period and has a set voltage difference from the first source ramp voltage, and a ramp voltage generation circuit suitable for generating a ramp voltage that is adjusted a second voltage unit that is less than the first voltage unit for each second period that is shorter than the first period based on the first and second source ramp voltages and a plurality of first control signals.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: November 24, 2020
    Assignee: SK hynix Inc.
    Inventor: Tae-Gyu Kim
  • Patent number: 10840279
    Abstract: An image sensor may include a pixel array including a plurality of pixel blocks structured to convert light into electrical signals. Each of the plurality of pixel blocks may include a first light receiving circuit including a plurality of unit pixels which share a first floating diffusion; a second light receiving circuit arranged adjacent to the first light receiving circuit in a second direction, and including a plurality of unit pixels which share a second floating diffusion; a first driving circuit and a second driving circuit positioned between the first light receiving circuit and the second light receiving circuit, and aligned in a first direction crossing the second direction; and an intercoupling circuit configured to electrically couple the first floating diffusion, the second floating diffusion, the first driving circuit and the second driving circuit.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: November 17, 2020
    Assignee: SK hynix Inc.
    Inventor: Pyong-Su Kwag
  • Patent number: 10840467
    Abstract: An image pickup device includes: a first electrode film; an organic photoelectric conversion film; a second electrode film; and a metal wiring film electrically connected to the second electrode film, the first electrode film, the organic photoelectric conversion film, and the second electrode film all provided on a substrate in this order, and the metal wiring film coating an entire side of the organic photoelectric conversion film.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: November 17, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Yohei Hirose
  • Patent number: 10825852
    Abstract: According to one embodiment, an edge of the second opening is recessed further than an edge of the first opening away from a center of the first opening. The recess has an opening and a concave surface and is disposed in a region inward from the edge of the second opening. The opening has a circular configuration. The concave surface has a curvature.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: November 3, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Yasushi Itabashi
  • Patent number: 10818720
    Abstract: An image sensor includes a sensor portion and an ASIC portion bonded to the sensor portion. The sensor portion includes a first substrate having radiation-sensing pixels, a first interconnect structure, a first isolation layer, and a first dielectric layer. The ASIC portion includes a second substrate, a second isolation layer, and a second dielectric layer. The material compositions of the first and second isolation layers and the first and second dielectric layers are configured such that the first and second isolation layers may serve as barrier layers to prevent copper diffusion into oxide. The first and second isolation layers may also serve as etching-stop layers in the formation of the image sensor.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: October 27, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: U-Ting Chen, Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih-Pei Chou
  • Patent number: 10809428
    Abstract: An optical filter includes an absorption layer which increases a visible light transmittance while having a good near-infrared blocking characteristic, and which is excellent in not only adhesiveness with respect to a layer to be abutted, but also light resistance. The optical filter includes: an absorption layer containing a near-infrared absorbing dye containing a squarylium-based dye and a transparent resin; and an inorganic or organic material in contact with the absorption layer. The squarylium-based dye has a squarylium skeleton and condensed ring structures bonded thereto respectively on both sides thereof, the condensed ring structures each including a benzene ring and a nitrogen atom as an annular atom, each benzene ring having an urethane structure in the second position.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: October 20, 2020
    Assignee: AGC Inc.
    Inventors: Kazuhiko Shiono, Keigo Matsuura, Sayuri Higashitamori, Hiroki Hotaka
  • Patent number: 10805561
    Abstract: While realizing a broad dynamic range, the present technology relates to a solid-state image pickup device and control method therefor, and electronic apparatus aiming at enabling an influence of PLS to be suppressed. The solid-state image pickup device includes a pixel array unit in which a plurality of pixels are arrayed. A portion of pixels in the pixel array unit are a unit pixel at least having one photoelectric conversion element and over flow integration capacitor. Further, the solid-state image pickup device includes one AD converter for one or more unit pixels in the pixel array unit. The present technology is applicable to, for example, the solid-state image pickup.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: October 13, 2020
    Assignee: Sony Corporation
    Inventors: Masaki Sakakibara, Yasuhisa Tochigi
  • Patent number: 10805554
    Abstract: An imaging device includes a photoelectric converter including a pixel electrode, a counter electrode, and a photoelectric conversion layer between the pixel electrode and the counter electrode, the photoelectric conversion layer converting incident light into an electric charge; and a voltage application circuit that applies a first voltage between the pixel electrode and the counter electrode in a first frame and that applies a second voltage between the pixel electrode and the counter electrode in a second frame different from the first frame, the first voltage being a constant voltage, the second voltage being a pulse-shaped voltage.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: October 13, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tsutomu Kobayashi, Kazuko Nishimura, Yasuo Miyake, Sanshiro Shishido
  • Patent number: 10805560
    Abstract: Image quality can be improved. In a case where light is focused on the center of an opening, sensitivity can be decreased by extending any side of a light-shielding film to the center. Namely, in the case of adjusting the sensitivity to be decreased, there is no need to simultaneously change all the sides, but the adjusting may be achieved by moving only a specific side. Further, since each side is regarded as individual adjusting parameter, a complicated inside-angle-of-view distribution can be corrected. The present disclosure can be applied to, for example, a CMOS solid-state imaging device to be used in an imaging device such as a camera.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: October 13, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Masashi Nakata
  • Patent number: 10789450
    Abstract: An optical imaging device for imaging a biometric input object is disclosed. The optical sensor includes an array of sensing elements. The optical sensor is configured to read a subset of sensing elements in the array of sensing elements; analyze the reading of the subset of sensing element to determine if one or more sensing elements of the subset is saturated; alter an operating point of the optical imaging device; and image the input object.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: September 29, 2020
    Assignee: Synaptics Incorporated
    Inventors: Robert J. Gove, Alvin Jee
  • Patent number: 10782215
    Abstract: This disclosure relates to a real-time video extensometer. Typically, the apparatus of the disclosure combines the image source, data processing and electrical output on to a single processing board in order to achieve high frequency images and low latency times on data flow. Further, the video processing engine processes the image on a pixel basis and updating the output the intermediate extension/strain result so that after receipt of the final image pixel, a final extension/strain value is achieved and immediately output for evaluation.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: September 22, 2020
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Martin A. Peterson, Daniel Dina