Abstract: A solid-state image sensor and an image capture apparatus are provided that can realize image acquisition and distance measurement while restraining the circuit scale from increasing. The solid-state image sensor includes a plurality of pixels each including a sensor unit that generates a pulse with a frequency that is based on a reception frequency of a photon, and a counter that can operate in a first mode of counting the number of pulses of a signal generated by the sensor unit, and a second mode of counting the number of pulses of a predetermined signal that is based on an elapsed time from a timing at which light is emitted from a light emitting unit.

Abstract: A solid-state imaging device includes a first converter which converts an analog signal representing a pixel value to an upper bit of a digital signal, and a second converter which converts the analog signal to a lower bit of the digital signal. The second converter includes a first latch circuit which latches, as phase information, a plurality of clock signals having different phases upon conversion to the upper bit in the first converter, a conversion circuit which generates the lower bit of the digital signal by converting the phase information to a binary value, and an adder, and a second latch circuit which latches an addition result of the adder. The adder adds the binary value converted by the conversion circuit and a value latched by the second latch circuit.

Abstract: A pixel array has a plurality of output units arranged in matrix form and a plurality of A/D conversion units corresponds to the output units. Each of the output units outputs an electric signal based on incident electromagnetic waves. Each of the A/D conversion units converts the electric signal input from the corresponding output unit to a digital signal. A plurality of storage units corresponds to columns of the output units. Each of the storage units holds the corresponding digital signal. A first signal line is configured to supply a driving bias to at least one of the output units and the A/D conversion units. A second signal line is configured to transmit the digital signal from the A/D conversion units to the storage units. The output units are provided between the first signal line and the second signal line.

Abstract: Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Abstract: A lens assembly structures and methods are described with a glass surface facing user. The lens assembly may include a retention film on a rear surface of the glass layer with the front surface being free of a safety layer. The lens assembly may include a glass layer with a front surface to be engaged by a person and a rear surface and a retention film fixed to the rear surface and is transparent. A display generator may be fixed to the retention film. A spacing layer may be fixed on the retention film around the display generator. A mask may be fixed to a rear surface of the glass beneath the retention film. A support frame may engage the spacing layer and support the display generator with the glass layer being supported by the retention film and mechanically supported by both the display generator and the frame. The front surface may be free from a retention layer.

Abstract: An image sensor includes a pixel that includes a photoelectric conversion element converting an incident light to an electrical signal, a switch adjusting a capacitance of a floating diffusion (FD) node at which charges corresponding to the electrical signal are stored, and a readout circuit outputting an output voltage based on the FD node. An A/D converter may sample the output voltage transferred from the readout circuit through an output line respectively at a first time and a second time and generate a digital code based on a difference therebetween. A conversion gain controller may generate a conversion gain control signal by comparing the output voltage transferred from the readout circuit through the output line with a threshold voltage at a third time between the first and second times and provide the conversion gain control signal to the switch to set conversion gain of the pixel.

Abstract: In one example, an imaging device including a plurality of pixel circuits a first control line, a second control line, a first voltage supply line, a second voltage supply line, a first light-receiving element, and a diagnosis unit is disclosed. The pixel circuits each includes a first terminal, a second terminal, a third terminal, an accumulation unit, a first transistor, a second transistor, and an output unit. The first transistor is couples the third terminal to the accumulation unit on the basis of a voltage of the first terminal. The second transistor supplies a predetermined voltage to the accumulation unit on the basis of a voltage of the second terminal. The output unit to outputs a signal corresponding to a voltage in the accumulation unit.

Abstract: A control system for an image capture device. The control system includes an image sensor including sensor pixels including at least two sub-pixels respectively. First and second pluralities of the sensor sub-pixels capture first and second pixel data with a first and second exposure respectively. An image processor receives image data derived from a first set of the sensor sub-pixels including sub-pixels of the first and second pluralities of the sensor sub-pixels. On the basis of the image data, the image processor generates output data representing at least part of an output image. A focus controller receives focus data derived from a second set of the sensor sub-pixels including at least two of the first plurality of the sensor sub-pixels. On the basis of the focus data, the focus controller generates a control signal for adjusting a focus of the image capture device. Other examples relate to image sensors.

Abstract: A laser eye surgery system comprises subsystems which communicate with one another through low voltage differential signaling (LVDS). The laser eye surgery system may comprise a first subsystem interface, including an LVDS driver or transmitter coupled to and in communication with an LVDS receiver of a first subsystem of the laser eye surgery system. The first laser eye surgery subsystem itself may comprise an LVDS transmitter coupled to and in communication with an LVDS receiver to return data to the first subsystem. Further laser eye surgery subsystems may also include the same arrangement of drivers and receivers with respective subsystem interfaces. LVDS lowers power consumption and the risk of error in communication between laser eye surgery systems, leading to safer and more reliable surgical procedures performed.

Abstract: Image sensors and methods of operating the image sensors are provided. The image sensors may include a pixel configured to generate an image signal in response to light incident on the pixel. The pixel may include a charge collection circuit configured to collect charges, which are produced by the light incident on the pixel, during a sensing period and a floating diffusion region. The image sensor may further include a storage unit configured to store the charges and, during a transfer period after the sensing period, configured to transfer at least a portion of the charges to the floating diffusion region. An amount of charges that is transferred from the storage unit to the floating diffusion region may be controlled by a voltage level of a storage control signal that is applied to a storage control terminal of the storage unit.

Abstract: The present disclosure relates to a solid-state imaging element and electronic equipment that make it possible to sufficiently secure a time width of a pulse signal. In an AD converter for each unit pixel, a pulse generation circuit feeds back a delay signal obtained by delaying an output signal of the comparator to the comparator and arithmetically operates the output signal and the delay signal to generate a pulse signal. A latch circuit latches the pulse signal generated by the pulse generation circuit. The present disclosure can be applied to a solid-state imaging element of a stacked type and a back side illumination type.

Abstract: To a mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.

Abstract: The disclosure extends to methods, systems, and computer program products for widening dynamic range within an image in a light deficient environment.

Abstract: A solid-state imaging device includes a plurality of pixels in a two-dimensional array. Each pixel includes a photoelectric conversion element that converts incident light into electric charge, and a charge holding element that receives the electric charge from the photoelectric conversion element, and transfers the electric charge to a corresponding floating diffusion. The charge holding element further includes a plurality of electrodes.

Abstract: An image sensor includes a pixel array, and a first, second, and an intermediate memory-element. The memory-elements store, respectively, a first, second, and an intermediate exposure value. The pixel array includes pixel-subarrays each including a rescue pixel and a first, second, and third plurality of contiguous pixels. Each of the first plurality of pixels is connected to the first memory-element and spans diagonally-opposite corners of the pixel-subarray. Each of the second plurality of pixels is connected to the second memory-element and located on a first side of the first plurality of pixels. Each of the third plurality of pixels is connected to the second memory-element and located on a second side of the first plurality of pixels. The rescue-pixel is connected to the intermediate memory-element and is (i) located on one of the first side and the second side and/or (ii) adjacent to one of the first plurality of pixels.

Abstract: An image sensing device includes a plurality of pixels and a receiver configured to receive, from an outside, a trigger signal that gives a first timing and a second timing. Each of the plurality of pixels includes a photoelectric converter, a first charge holding portion configured to hold charges generated by the photoelectric converter, and a second charge holding portion configured to hold charges generated by the photoelectric converter. In each of the plurality of pixels, the charges whose accumulation is started in the photoelectric converter in accordance with the first timing are held by the first charge holding portion, and the charges whose accumulation is started in the photoelectric converter in accordance with the second timing are held by the second charge holding portion.

Abstract: The present technology relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic apparatus, the solid-state imaging device being capable of expanding the dynamic range without deteriorating the image quality. The solid-state imaging device includes a pixel array section having a plurality of unit pixels and a drive section. Each of the unit pixels includes a first photoelectric conversion section, a second photoelectric conversion section which is less sensitive than the first photoelectric conversion section, a charge storage section configured to store charges generated by the second photoelectric conversion section, a charge-voltage conversion section, a first transfer gate section configured to transfer charges from the first photoelectric conversion section, and a second transfer gate section configured to combine the potential of the charge-voltage conversion section with the potential of the charge storage section.

Abstract: The present invention relates to technical field of analog integrated circuit design. TDI function is better realized by CMOS image sensor and it improves scanning frequency of the CMOS-TDI image sensor and extends application range of TDI technique. To this end, the present invention proposes a technical solution of high scanning frequency CMOS-TDI image sensor. The pixels include a photodiode, an operational amplifier, integration capacitors C1 and C2 of the same capacitance, an offset voltage removing capacitor C3, and plural switches S1-S10. The anode of the photodiode is connected to a zero voltage ground wire, while the cathode thereof is connected to one end of the switch S9. The other end of the switch S9 is connected to a reference voltage Vref. The above pixels are cascaded and an output end of the last pixel is connected to a column-parallel ADC through a readout switch Read. The invention mainly applies to analog integration circuit design.

Abstract: A zoom lens (ZL) comprises, in order from an object: a first lens group (G1) having negative refractive power; an aperture stop (S); a second lens group (G2) having positive refractive power; a third lens group (G3) having negative refractive power; and a fourth lens group (G4) having positive refractive power. In this zoom lens (ZL), upon zooming from a wide angle end state to a telephoto end state, a distance between the aperture stop (S) and the first lens group (G1), a distance between the aperture stop (S) and the second lens group (G2), and a distance between the aperture stop (S) and the third lens group (G3) are changed and the aperture stop (S) is moved in an optical axis direction.

Abstract: An image pickup apparatus includes: a first sample hold circuit configured to sample-hold an image pickup signal; a second sample hold circuit configured to sample-hold a reference voltage signal; an output selection circuit configured to switchingly select one of the image pickup signal inputted from the first sample hold circuit and the reference voltage signal and output a selected signal as an image pickup output; and a timing generator configured to control a timing of the switching selection of the output selection circuit; wherein the timing generator decides the timing of the switching selection so that the reference voltage signal is transmitted in one pixel transmission period required for transmission of the image pickup signal of one pixel, and the reference voltage signal is transmitted once every time the image pickup signal of each of a plurality of pixels is transmitted.

Abstract: An imaging element has at least a photoelectric conversion section, a first transistor TR1, and a second transistor TR2, the photoelectric conversion section includes a photoelectric conversion layer, a first electrode, and a second electrode, the imaging element further has a first photoelectric conversion layer extension section, a third electrode, and a fourth electrode, the first transistor TR1 includes the second electrode that functions as one source/drain section, the third electrode that functions as a gate section, and the first photoelectric conversion layer extension section that functions as the other source/drain section, and the first transistor TR1 (TRrst) is provided adjacent to the photoelectric conversion section.

Abstract: A monitoring camera apparatus includes a main circuit board, a sensing circuit board, an adjusting mechanism and a spiral flexible board. The main circuit board includes an image processor. The sensing circuit board includes an image sensor. The adjusting mechanism is connected to the sensing circuit board for adjusting position of the sensing circuit board and/or a lens of the monitoring camera apparatus, so as to vary a rotary angle and an inclined angle of the sensing circuit board relative to the main circuit board. The spiral flexible board has a first end and a second end opposite to each other. The first end and the second end are respectively connected to the main circuit board and the sensing circuit board, so that image information acquired by the image sensor can be transmitted to the image processor via the spiral flexible board.

Abstract: The present invention relates to a method for designing a freeform surface reflective imaging system, comprising: selecting an initial system, wherein an FOV of the initial system is X0×Y0; selecting an FOV sequence as [X0, Y0], [X1, Y1], [X2, Y2], . . . , [Xn, Yn], while the FOV of the system to be designed is Xn×Yn, and X0<X1<X2< . . . <Xn, Y0<Y1<Y2< . . . <Yn; using point-by-point methods to construct all freeform surfaces of the initial system in the FOV of X1×Y1; setting the system obtained in the last step as a second initial system for system construction in the FOV of X2×Y2; repeating the last step to execute system construction in the order of the FOV sequence until the final FOV Xn×Yn is obtained.

Abstract: Image processor circuitry includes a memory storing a program of instructions, and processing circuitry configured to execute the program of instructions to receive input data from an image sensor and detect an operation mode of the image sensor based on the input data, provide configuration data determined in association with the operation mode of the image sensor, and process image data in the input data in accordance with the operation mode and the configuration data.

Abstract: An imaging device includes a pixel including a photoelectric converter, where the pixel captures first data in a first exposure period and captures second data in a second exposure period different from the first exposure period, the first exposure period and the second exposure period being included in a frame period. A sensitivity of the photoelectric converter in the first exposure period is different from a sensitivity of the photoelectric converter in the second exposure period, and the imaging device generates multiple-exposure image data including at least the first data and the second data.

Abstract: A vibrating device includes a dome-shaped cover, a cylindrical or substantially cylindrical vibrating body, and a piezoelectric element. The dome-shaped cover is disposed so as to include a detection field of an optical detector element, and the cylindrical or substantially cylindrical vibrating body is fixed to the cover. The piezoelectric element is fixed to the vibrating body and vibrates the cover via the vibrating body. The vibrating body includes a cylinder portion, a first connection portion connected to a first end portion of the cylinder portion, a first ring-shaped portion connected to the first connection portion at a position near the cover, a second connection portion connected to a second end portion of the cylinder portion, and a second ring-shaped portion connected to the second connection portion at a position opposite to a surface to which the cylinder portion is connected.

Abstract: A CMOS image sensor, and a method of operating a pixel array by a CMOS image sensor is provided. The CMOS image sensor includes a sensor, and a readout circuit. The sensor is configured to generate a first voltage signal and a first reset signal. The readout circuit is configured to perform a first readout operation by reading out the first reset signal and the first voltage signal simultaneously at a first predetermined time. After the first readout operation, the readout circuit turns on a plurality of switches to obtain a common-mode signal by making the first reset signal equal to the first voltage signal and re-perform a second readout operation by reading out the common-mode signal at a second predetermined time. The first predetermined time and the second predetermined time do not overlap each other.

Abstract: An organic photoelectronic device includes a first electrode and a second electrode facing each other, and first and second photoelectronic conversion layers between the first electrode and the second electrode. The first and second photoelectronic conversion layers include a p-type semiconductor and an n-type semiconductor. The first photoelectronic conversion layer has a first composition ratio (p1/n1) of the p-type semiconductor relative to the n-type semiconductor, the second photoelectronic conversion layer has a second composition ratio (p2/n2) of the p-type semiconductor relative to the n-type semiconductor, and the first composition ratio (p1/n1) is greater than the second composition ratio (p2/n2).

Abstract: This disclosure relates to a real-time video extensometer. Typically, the apparatus of the disclosure combines the image source, data processing and electrical output on to a single processing board in order to achieve high frequency images and low latency times on data flow. Further, the video processing engine processes the image on a pixel basis and updating the output the intermediate extension/strain result so that after receipt of the final image pixel, a final extension/strain value is achieved and immediately output for evaluation.

Abstract: The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal. A photoelectric conversion part that converts received light into a charge, and a holding part that holds a charge transferred from the photoelectric conversion part are provided, the photoelectric conversion part and the holding part are formed in a semiconductor substrate having a predetermined thickness, and the holding part is formed with a thickness that is half or less of the predetermined thickness. A charge capturing region that captures a charge is further provided on a light incident side of a region where the holding part is formed. A light shielding part that shields light is formed between the photoelectric conversion part and the charge capturing region. The present technology is applicable to an imaging device.

Abstract: The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal. A photoelectric conversion part that converts received light into a charge; a holding part that holds a charge transferred from the photoelectric conversion part; and a light shielding part that shields light between the photoelectric conversion part and the holding part are provided. The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. The present technology is applicable to an imaging device.

Abstract: An image sensor includes a photodiode disposed in a semiconductor material to generate image charge in response to incident light, and a first transfer gate is coupled to the photodiode to extract image charge from the photodiode in response to a first transfer signal. A first storage gate is coupled to the first transfer gate to receive the image charge from the first transfer gate, and a first output gate is coupled to the first storage gate to receive the image charge from the first storage gate. A first capacitor is coupled to the first output gate to store the image charge.

Abstract: An image sensor includes: a first readout circuit that reads out a first signal, being generated by an electric charge resulting from a photoelectric conversion, to a first signal line; a first holding circuit that holds a voltage based on an electric current from a power supply circuit; and a first electric current source that supplies the first signal line with an electric current generated by the voltage held in the first holding circuit, wherein: the first holding circuit holds the voltage based on the electric current from the power supply circuit when the first signal is not read out to the first signal line by the first readout circuit.

Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.

Abstract: Imaging systems providing high resolution, low light images with significant dynamic range are disclosed. The improvements to photo imaging sensors providing low costs and yet higher performance sensors may be obtained an enhanced photosensor generating a single color channel image per photosensor. The single color channel image contains luminence values corresponding to light focused onto the photosensor. The plurality of photosensors are constructed using Indium gallium nitride (InGaN) nanowire structures and nanopyrimid structures used in cells within an array of cells. Photosensors may be constructed as single color imaging devices as well as multi-color devices. The generation of various color channel images are controlled using metasurface filter structures as well as color filter layers setting a wavelength for absorbed light by controlling a concentration of indium gallium nitride (InGaN) within the color filter layers.

Abstract: Disclosed herein are techniques for digital imaging. A digital pixel image sensor includes a digitizer in each pixel of a plurality of pixels, where the digitizer digitizes analog output signals from a photodiode of the pixel using a comparator, a global reference ramp signal, and a clock counter. In some embodiments, the comparator includes a pre-charging circuit, rather than a constant biasing circuit, to reduce the power consumption of each pixel. In some embodiments, each pixel includes a digital or analog correlated double sampling (CDS) circuit to reduce noise and provide a higher dynamic range.

Abstract: The present invention provides an in-vehicle touch display device. The in-vehicle touch display device includes a backlight module, a touch display module, and a sealant. The touch display module is placed over the backlight module. The touch display module includes a touch screen, an upper polarizing film, a liquid crystal layer, and a lower polarizing film sequentially stacked on each other. The sealant joins the backlight module and the touch display module together. The sealant includes two protrusions protruding between the backlight module and the touch display module. An adhesive layer is positioned on a side surface of each protrusion facing the lower polarizing film.

Abstract: An imaging apparatus includes: an imager that has a plurality of pixels as defined herein, that includes a plurality of pixel rows including the plurality of pixels arranged in one direction, and that discharges charges of the photoelectric conversion element and the charge holder to a charge discharge region of the readout circuit as defined herein; and an imaging controller that performs a global reset drive, a global shutter drive, a first rolling readout drive, a rolling shutter drive and a second rolling readout drive as defined herein, and the imaging controller performs a first imaging control as defined herein.

Abstract: An image sensor is disclosed. The image sensor includes a substrate including an active region and a dummy region, a plurality of unit pixels on the active region, a transparent conductive layer on a first surface of the substrate, a light-blocking layer on the transparent conductive layer and electrically connected to the transparent conductive layer, the light-blocking layer having a grid structure adjacent light transmission regions, and a pad electrically connected to the light-blocking layer, on the dummy region.

Abstract: A light emitting diode includes a base layer, an electric contact layer, a semiconductor stack, and an insulation layer. The base layer has a maximum of a first width. The electric contact layer has a maximum of a second width and is disposed on the base layer. The semiconductor stack disposed on the electric contact layer has a maximum of a third width, and includes a first type semiconductor layer, a light emitting layer, and a second type semiconductor layer stacked in sequence, wherein a width of the first type semiconductor layer is smaller than the maximum of the third width. The insulation layer covers the sidewalls of the base layer, the electric contact layer, and the semiconductor stack. The maximum of the second width is greater than the maximum of the third width and the maximum of the second width is less than the maximum of the first width.

Abstract: A method of operating a camera system having an image sensor including a plurality of activatable image elements, wherein an active image element converts incoming radiation into readable image information, a radiation source including a plurality of activatable radiation elements, each active radiation element emitting electromagnetic radiation, and an integrated circuit coupled to the radiation source, the method including capturing at least one image, wherein during capturing of each single image different subsets of the image elements are successively each once activated and deactivated again after a predetermined exposure time, different subsets of the radiation elements are successively activated by the integrated circuit and deactivated again after a predetermined emission time, and each subset of the image elements is assigned a subset of the radiation elements activated with temporal overlap so that the active radiation elements emit radiation while the associated active image elements receive image

Abstract: A backside illuminated image sensor having a photodiode and a first transistor in a sensor region and located in a first substrate, with the first transistor electrically coupled to the photodiode. The image sensor has logic circuits formed in a second substrate. The second substrate is stacked on the first substrate and the logic circuits are coupled to the first transistor through bonding pads, the bonding pads disposed outside of the sensor region.

Abstract: Provided are an image sensor and an image processing device including the same. The image sensor includes: a pixel array including a plurality of pixels arranged in rows and columns and configured to generate pixel signals from the plurality of pixels, a time calculator configured to receive zoom information corresponding to digital zooming, and configured to calculate a row processing time available for processing the pixel signals from the plurality of pixels included in a single row based on the zoom information, a timing generator configured to generate at least one control signal based on the row processing time; and an Analog-to-Digital Converter (ADC) configured to generate pixel data by performing sampling on the pixel signals according to the at least one control signal.

Abstract: An image sensor includes: a first imaging region that captures an image of light entering through an optical system under a first imaging condition and generates a detection signal to perform focus detection of the optical system; and a second imaging region that captures an image of the light entering through the optical system under a second imaging condition other than the first imaging condition and generates an image signal.

Abstract: A control apparatus includes an angle control unit configured to change a tilt angle by tilting an imaging sensor, a first determination unit configured to determine a first area from among a plurality of areas in an image, an evaluation value acquisition unit configured to acquire a contrast evaluation value of each of second areas excluding the first area among the plurality of areas by changing the tilt angle through the angle control unit, and a second determination unit configured to determine the tilt angle for each area based on the contrast evaluation value acquired by the evaluation value acquisition unit, and determining the tilt angle of the image sensor based on the tilt angle determined for each area. The angle control unit tilts the image sensor so as to obtain the tilt angle determined by the second determination unit.

Abstract: A video processor includes: an image processing section including a front image enhancement processing section configured to perform first enhancement processing on a front image acquired from a front area in a subject by using an endoscope including an insertion portion which is inserted into the subject, and a side image enhancement processing section configured to perform second enhancement processing on a side image acquired from a side area located lateral to the front area by using the endoscope; and a control section configured to individually set an enhancement level of enhancement processing performed by the front image enhancement processing section and an enhancement level of enhancement processing performed by the side image enhancement processing section.

Abstract: A cable connection structure includes: a substrate including a first core wire connection electrode, a second core wire connection electrode, and a shield connection electrode; a single-wire cable including a first core wire, and an insulant; at least two coaxial cables each including a second core wire, an inner insulant, a shield, and an outer insulant, wherein the second core wire, the inner insulant, and the shield are exposed in a step-by-step manner at a distal end portion, and the second core wire and the shield are respectively connected to the second core wire connection electrode and the shield connection electrode; and a conductive member connecting exposed portions of the shields. The conductive member is disposed directly on an upper surface of the insulant, and connects the shields on the shield connection electrode and/or a position closer to a proximal end side than the shield connection electrode.

Abstract: A dual-band pixel includes a backside passivation layer, a corresponding input terminal coupled to the backside passivation layer, a first n-type layer covering the backside passivation layer, a p-type layer covering the first n-type layer, a second n-type layer within the p-type layer, and a pinning layer covering the second n-type layer. A first or second voltage is applied to the corresponding input terminal to operate the dual-band pixel in a visible or infrared (IR) mode. A depth camera assembly (DCA) may include a sensor pixel array comprising a plurality of dual-band pixels. The DCA may take visible or IR images in a time multiplexed manner using the sensor pixel array and determine depth information based on the captured IR images.

Abstract: An imaging control device includes a combiner configured to generate a combined image on the basis of a first image captured in a first exposure time and a second image captured in a second exposure time longer than the first exposure time and an exposure time controller configured to control at least one of the first exposure time and the second exposure time on the basis of a number of pixels of at least one of saturated pixels having pixels values equal to or larger than a predetermined value and black pixels having pixel values equal to or smaller than the predetermined value in the combined image and a value concerning a luminance value of the combined image.

Abstract: A pixel circuit is disclosed. The pixel circuit includes a photodiode (PD), a transmission circuit, a reset circuit, a signal storage circuit and a buffer circuit. The transmission circuit is coupled between the PD and an ordinary floating diffusion (FD) node. The reset circuit is coupled to the ordinary FD node. The signal storage circuit is coupled to the ordinary FD node. The buffer circuit is coupled to the signal storage circuit. The signal storage circuit may store a PD signal on a specific node having a reduced leakage path in comparison with the ordinary FD node during a holding phase of the pixel circuit, wherein the holding phase is a time interval starting from a first time point at which the PD signal is stored on the specific node and ending at a second time point at which the pixel circuit is selected for performing a read-out operation.