Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

Abstract: A method of manufacturing a wafer level fan-out package includes preparing a base substrate having a protrusion, providing a chip on a surface of the base substrate adjacent to and spaced from the protrusion, forming an encapsulation layer on the base substrate to encapsulate the chip and the protrusion, removing the base substrate to expose a surface of the chip and to form a recess corresponding to the protrusion in the encapsulation layer, and providing a passive element in the recession. The method obviates a problem of displacement of the passive element by thermal expansion of the encapsulation layer while it is being formed because the passive element is incorporated into the package after the encapsulation layer is formed.

Abstract: A composite sheet includes a resin layer including a liquid crystal polymer as a main material and a first surface and a second surface facing away from each other, a conductor foil disposed on the first surface, and a powder layer including a powder of a liquid crystal polymer as a major component and located on an entirety of the second surface.

Abstract: Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.

Abstract: A package includes a plurality of dies, a wall structure, an encapsulant, and a redistribution structure. The wall structure surrounds at least one of the dies. The encapsulant encapsulates the dies and the wall structure. A first portion of the encapsulant penetrates through the wall structure. The redistribution structure is disposed on the encapsulant and is electrically connected to the dies and the wall structure.

Abstract: A semiconductor structure includes a first die; a first molding encapsulating the first die; a second die disposed over the first molding, and including a first surface, a second surface opposite to the first surface, and a sidewall between the first surface and the second surface; and a second molding disposed over the first molding and surrounding the second die, wherein the first surface of the second die faces the first molding, and the second die is at least partially covered by the second molding.

Abstract: A cable connection structure includes: a cable having a core and a jacket made of an insulating material to cover the core; and a substrate connected with the cable. The substrate includes: a base material made of an insulating material; an external connection electrode formed on a surface of the base material and connected with the core; and a via provided in the base material and having an end exposed from a mounting surface of the substrate on which the cable is mounted, the via being connected with the external connection electrode. The via is provided at least at one of both ends of a surface of the external connection electrode perpendicular to an axial direction of the cable, on a proximal end side of the cable.

Abstract: The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation.

Abstract: A key module for a mobile terminal, and which includes a key having a neck part and a head key pressed to enter an input to the mobile terminal; a circuit support configured to support a circuit board having a dome terminal to be pressed when the key head is pressed for entering the input to the terminal; and a waterproof member positioned between the key and the circuit support and configured to block a moisture penetration path along a hole in a case member of the mobile terminal into which the key module is inserted.

Abstract: An electric coupler includes a body, a first electrical path through the body having a first resistance to electric current within a first frequency range and a second electrical path through the body having a second resistance to electric current within a second frequency range.

Abstract: A welding column combination includes at least two metal welding columns and at least one insulator block. Each metal welding column has a first end and a second end opposite to the first end, wherein at least one of the metal welding columns has welding surfaces at the first end and the second end respectively. The at least one insulator block assembles the at least two metal welding columns as a unitary physical combination.

Abstract: A conductive element of a cable or a wire is formed of an improved aluminum-zirconium alloy. The aluminum-zirconium alloy further includes an inoculant. The aluminum-zirconium alloy exhibits excellent ultimate tensile strength values and resistance to heat. Bonding wires formed from an improved aluminum-zirconium alloy exhibiting certain ultimate tensile strength values, fatigue resistance and/or creep rates are also described. Methods of forming cables and wires are also further disclosed.

Abstract: An active device lid for a device base. The device lid includes a heatsink proximate to a circuit assembly and configured to remove heat generated by the device base, the circuit assembly configured to generate an operating signal voltage for the device base, and a connector configured to connect the circuit assembly to the device base, where the device base is configured to connect to a device mounting substrate on a substrate side of the device base, and where the circuit assembly is configured to be at least partially located on an opposing side of the device base, the opposing side opposing the substrate side.

Abstract: A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.

Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.

Abstract: A camera system including an objective, an objective holder carrying the objective, an image sensor and a printed circuit board. The printed circuit board and the image sensor are connected to one another in an electronically conductive manner, and the image sensor and the objective are arranged such that an image is n focus on the image sensor. The printed circuit board has a circuit layer made of an electrically insulating material and a printed circuit board substrate, wherein the printed circuit board substrate is manufactured from a material with a coefficient of thermal expansion aL which deviates by no more than 30% from the coefficient of thermal expansion of a material from which the objective holder is manufactured.

Abstract: A video card is disclosed. The video card includes a PCI card, an MXM connector and a LAN converter. The mobile PCI express module (“MXM”) connector is mounted on the PCI card and adapted to physically receive an MXM card having a GPU and to electronically receive a video signal from the GPU. The local area network video converter is mounted on the PCI card for receiving the video signal from the MXM connector and for converting the video signal to a signal suitable for transmission on a local area network (“LAN”) cable.

Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.

Abstract: One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.

Abstract: Provided is a flexible display apparatus in which flexibility is secured and reliability of products is improved, and a method of manufacturing the same. The flexible display apparatus includes a display panel including a flexible area and a non-flexible area and having one surface and the other surface opposite to the one surface; a protective film attached to the one surface of the display pane; a first adhesive layer interposed between the flexible area of the display panel and the protective film and configured to have a first storage modulus; and a second adhesive layer interposed between the non-flexible area of the display panel and the protective film and configured to have a second storage modulus.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A fieldbus coupler for coupling a local fieldbus network utilizing a first fieldbus protocol to a foreign field device or foreign fieldbus network through an interconnecting wired or wireless network transmission line that utilizes a second fieldbus protocol different from the first fieldbus protocol includes a first circuit configured to communicate over the local fieldbus network using the first fieldbus protocol, a second circuit configured to connect the fieldbus coupler with the interconnecting network transmission line and communicate over the interconnecting network transmission line using the second fieldbus protocol, and a third circuit configured to communicate with the first and second circuits and capable of transmitting data to and from the first and second circuits to enable communications between the local fieldbus network via the interconnecting network transmission line.

Abstract: A packaged module for a radio frequency wireless device has a substrate supporting a first wireless device component and a second wireless device component where the first wireless device component is between the second wireless device component and a first surface of the substrate. At least a first overhanging portion of the second wireless device component extends beyond at least a portion of the periphery of the first wireless device component.

Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.

Abstract: A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.

Abstract: A battery retention system is configured to facilitate insertion and removal of batteries from an electronic device. The electronic device includes a housing that defines a battery cavity for receiving a battery. The battery cavity has a floor. A floor contact extends from the floor. The floor contact is configured to provide a biasing force to push the battery away from the floor of the battery cavity. The housing has tabs extending into the battery cavity to hold the battery in the battery cavity against the biasing force of the floor contact. The battery cavity has a recess that allows the battery to move in a lateral direction along the floor to a position where the battery disengages from at least one of the tabs to allow at least a portion of the battery to be pushed out of the battery cavity by the biasing force of the floor contact.

Abstract: A movable member (30) provided in a housing (10) is formed with a cover (32) configured to cover inserting edges (45) on a tip of a circuit board (41) in an inserting direction into a board accommodation space (15) when the circuit board (41) is inserted into the board accommodation space (15) and a receiving surface (34) configured to move the movable member (30) integrally with the circuit board (41) to a back side of the board accommodation space (15) by being pushed by the circuit board (41). The movable member (30) and the circuit board (41) are formed with locks (38, 46) configured to move the movable member (30) integrally with the circuit board (41) in a withdrawing direction from the board accommodation space (15) by locking each other.

Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.

Abstract: Treated liquid crystal polymer powders have been subjected to surface treatment with plasma or ultra violet rays, a paste including the treated liquid crystal polymer powders and a dispersion medium, a liquid crystal polymer sheet comprising the treated liquid crystal polymer powders or the paste including the treated liquid crystal polymer powders and a dispersion medium into a sheet, a stack including the liquid crystal polymer sheet as a resin layer, and a method of manufacturing the treated liquid crystal polymer powders are provided by the present disclosure.

Abstract: A device communicating wirelessly using internal function components as antenna includes a case, and within the case a circuit board, a camera mechanism, and a wireless communication mechanism. The case includes an upper shell and a lower shell, the lower shell defining a slot is filled with an insulation strip. The camera mechanism and the wireless communication mechanism are arranged on the circuit board. The wireless communication mechanism faces the slot. The wireless communication mechanism and the camera mechanism cooperatively form an antenna. A wireless signal generated by the wireless communication mechanism is enhanced by the antenna and radiates outward from the slot.

Abstract: A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED (402) are disclosed. The method for transferring micro-LED (402) comprises: transferring at least one micro-LED (402) from an original substrate (406) to a support body (412); transferring the at least one micro-LED (402) from the support body (412) to a backup substrate (415); and transferring the at least one micro-LED (402) from the backup substrate (415) to a receiving substrate (417).

Abstract: Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.

Abstract: A semiconductor package is provided. The semiconductor package include a lower semiconductor package including a lower package substrate and a lower semiconductor chip mounted thereon, and an upper semiconductor package provided on the lower semiconductor package to include an upper package substrate and an upper semiconductor chip mounted thereon. The upper package substrate include an upper heat-dissipation pattern, the lower semiconductor chip include a first via connected to the upper heat-dissipation pattern through the lower semiconductor chip, and the first via may provide a pathway for dissipating heat generated in the lower semiconductor chip.

Abstract: In a flip chip type light-emitting diode, a light-emitting diode structure possesses one unique layer with properties of both thermal conduction and electrical isolation disposed on its second contact metal layer. A first dielectric layer covers the light-emitting diode structure. A first-level metal interconnect is divided into three blocks, which are disposed on the first dielectric layer and are respectively connected to a first contact metal layer, the second contact metal layer, and the insulated heat-transfer layer. A first bonding pad structure, a second bonding pad structure, and a heat-dissipating pad structure, forming a second-level interconnect metal layer, are disposed on a second dielectric layer and respectively connected to the blocks of the first-level metal interconnect.

Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

Abstract: A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.

Abstract: A mobile device with high-accuracy fingerprint identification includes a display panel, a transparent protection layer, and a fingerprint identification device. The transparent protection layer has one surface attached to the display panel. The fingerprint identification device is attached to the surface of the transparent protection layer for detecting a user fingerprint. The fingerprint identification device includes a flexible substrate, a fingerprint sensor, and a detector. The fingerprint sensor is disposed on the flexible substrate for sensing the user fingerprint to generate a fingerprint image. The detector is disposed on the flexible substrate and electrically connected to the fingerprint sensor for distinguishing a minute parasitic capacitance variation generated by the fingerprint sensor.

Abstract: A flexible device includes an electronic device having an electrode and a flexible interconnect layer formed on the electrode. The flexible interconnect layer includes a two-dimensional (2D) material and a conductive polymer to have high electric conductivity and flexibility. The flexible device includes a flexible interconnect layer of one or more layers, and in this case, includes a low-dielectric constant dielectric layer between the respective layers.

Abstract: A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.

Abstract: A gaming machine having an audio channel outputting game sound and an audio channel intaking microphone sound and outputting chat sound is coupled with a headset having earpieces and a microphone and a Bluetooth transceiver in the headset for sending and receiving the microphone and chat sounds. A radio receiver or wired connection in the headset receives the game sounds. Circuitry in the headset is connected between the transceiver and receiver for mixing the microphone, chat, and game sounds and feeding them all to the earpieces.

Abstract: A repairing method, manufacturing method, device and electronic apparatus of micro-LED are disclosed. The method for repairing micro-LED defects comprises: obtaining a micro-LED defect pattern on a receiving substrate; forming micro-LEDs (703b) corresponding to the defect pattern on a laser-transparent repair carrier substrate (707); aligning the micro-LEDs (703b) on the repair carrier substrate (707) with defect positions on the receiving substrate, and bringing the micro-LEDs (703b) into contact with pads at the defect positions; and irradiating the repair carrier substrate with a laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate (707).

Abstract: A light guide body rotates integrally with an operation knob, has an incident surface that is a concavely curved surface recessed to a side opposite to a light source side, and rotates about a rotation shaft located so as to intersect the incident surface of the light guide body. The incident surface of the light guide body is a concavely curved surface recessed toward the side opposite to the light source (toward a Z1 direction) on a cross-section taken along an X-Z plane.

Abstract: An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another.

Abstract: Electronic articles, antennae, and processes of producing electronic articles are disclosed. The electronic article includes a rigid substrate having a non-planar region and a sintered conductive ink positioned on the non-planar region. The antenna is a specific type of electronic article covered by the disclosure. Additionally or alternatively, the antenna has a light transmission of at least 85%. The process includes positioning a substrate having a non-planar region, applying a conductive ink to the non-planar region, and sintering the conductive ink on the non-planar region thereby producing the sintered conductive ink on the electronic article and/or producing an antenna having a light transmission of at least 80%.

Abstract: An LCD device includes: multiple data lines, scanning lines, pixel units and switching elements. First terminals of the switching elements are connected together for receiving a control signal. Second terminals of the switching elements are connected together for receiving a reference voltage signal. Third terminal of each switching element is connected to a corresponding data line. When the control signal is a first control signal, each switching element is turned off, grayscale voltage signals are applied on corresponding pixel units, and a normal image frame is displayed. When the control signal is a second control signal, each switching element is turned on, the reference voltage signal is applied on the pixel units, an inserted black frame is displayed. A simple and power-saving way for an inserted black frame is realized to solve the cross talk in 3D display or a serious image smear problem in low refresh rate.

Abstract: A circuit board includes an insulating layer including first and second insulator films, a first wiring layer embedded in the first insulator film and including pads and first wiring patterns exposed from the first insulator film, and a second wiring layer including second wiring patterns formed on the second insulator film and via wirings penetrating the insulating layer and electrically connecting the second wiring patterns to the first wiring layer. The first insulator film is made of a reinforcement-free resin that includes no reinforcing member. The second insulator film is made of a reinforcing member impregnated with a resin.