Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Ceiling heater for substrate processing apparatus
    Patent number: D980177
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 7, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Yuya Yoshimura, Takuto Shoji
  • Integrated circuit card
    Patent number: D980810
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: March 14, 2023
    Assignee: KIOXIA Corporation
    Inventors: Atsushi Kondo, Katsuyoshi Watanabe
  • Leadframe
    Patent number: D980811
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: March 14, 2023
    Assignee: DIODES INCORPORATED
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Power semiconductor module
    Patent number: D981354
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: March 21, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Kotaro Shibata, Hideki Sawada
  • Power semiconductor module
    Patent number: D981355
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: March 21, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Kotaro Shibata, Hideki Sawada
  • Semiconductor module
    Patent number: D981356
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: March 21, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Retaining ring for substrate
    Patent number: D981459
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: March 21, 2023
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Akazawa, Osamu Nabeya
  • Fuse
    Patent number: D981966
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: March 28, 2023
    Assignee: Dexerials Corporation
    Inventors: Koichi Mukai, Yoshihiro Yoneda
  • Elastic membrane for semiconductor wafer polishing apparatus
    Patent number: D981969
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: March 28, 2023
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Akazawa, Tomoko Owada, Osamu Nabeya, Makoto Fukushima, Yuichi Kato
  • Substrate mounting plate for substrate processing apparatus
    Patent number: D981970
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: March 28, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuaki Inada, Takeshi Yasui
  • Boat of substrate processing apparatus
    Patent number: D981971
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: March 28, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Daiki Taniguchi
  • Adiabatic plate for substrate processing appratus
    Patent number: D981972
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: March 28, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya Morita, Seiyo Nakashima, Satoru Murata
  • Separator of substrate processing apparatus
    Patent number: D982537
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: April 4, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya Morita, Seiyo Nakashima, Satoru Murata
  • Exhaust liner for reaction tube
    Patent number: D983151
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 11, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Satoru Murata
  • Semiconductor module
    Patent number: D983759
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: April 18, 2023
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Daiki Yoshida, Hiromichi Gohara, Shin Soyano
  • Light emitting diode
    Patent number: D984001
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: April 18, 2023
    Assignee: Shangyou Jiayi Lighting Product Co., Ltd.
    Inventor: Yaowen He
  • Circuit board
    Patent number: D984397
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: April 25, 2023
    Inventor: Yidong Cai
  • Electrostatic chuck for semiconductor manufacture
    Patent number: D984972
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: May 2, 2023
    Inventor: Quanyu Shi
  • Leadframe
    Patent number: D985518
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: May 9, 2023
    Assignee: DIODES INCORPORATED
    Inventors: Li-Ju Huang, Michael Yimin Zhang
  • Confinement plate for a substrate processing chamber
    Patent number: D986190
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: May 16, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Joseph Perry
  • Circuit board
    Patent number: D986191
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: May 16, 2023
    Inventor: Lincun Wen
  • Circuit board
    Patent number: D986192
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: May 16, 2023
    Inventor: Lincun Wen
  • Semiconductor device
    Patent number: D986840
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: May 23, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Toshifumi Ishida, Kensuke Takahashi
  • Elastic membrane
    Patent number: D989012
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: June 13, 2023
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Akazawa, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Tomoko Owada, Cheng Cheng, Yuichi Kato
  • Semiconductor device
    Patent number: D989013
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: June 13, 2023
    Assignee: DONG WOON ANATECH CO., LTD
    Inventors: Yu-Hwang Lee, Jung-Hyun Eum, Ho-Cheol Jang
  • Circuit board
    Patent number: D989014
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: June 13, 2023
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway
  • Microfluidic polymer chip interface bracket
    Patent number: D989342
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: June 13, 2023
    Assignee: UT-Battelle, LLC
    Inventors: Jacob W. McMurray, Kevin M. Cooley, Abbey L. Mcalister, Randy J. Parten
  • Semiconductor module
    Patent number: D990439
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: June 27, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Masahiro Nakatani, Tomoichiro Toyama
  • Gas flow control plate
    Patent number: D990441
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: June 27, 2023
    Assignee: ASM IP Holding B.V.
    Inventors: JeongHo Lee, JinHo Shin, DaeYoun Kim, Jaehyun Kim, TaeWoong Kim
  • Plasma torch electrode
    Patent number: D992517
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: July 18, 2023
    Assignee: Thermacut, K.S.
    Inventor: Tomas Kusak
  • Semiconductor module
    Patent number: D992519
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: July 18, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Masahiro Nakatani, Tomoichiro Toyama
  • Focus ring
    Patent number: D992614
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: July 18, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Yasuharu Sasaki, Yohei Uchida, Masato Takayama
  • Focus ring
    Patent number: D992615
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: July 18, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Yasuharu Sasaki, Yohei Uchida, Hikaru Abe, Tomoya Ujiie
  • Tape feeder
    Patent number: D993200
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: July 25, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Atuyuki Horie, Chikara Takata, Yoshinori Isobata
  • Semiconductor module
    Patent number: D993201
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: July 25, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Koshun Saito, Kota Ise
  • Microfluidic glass chip interface bracket
    Patent number: D993443
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: July 25, 2023
    Assignee: UT-Battelle, LLC
    Inventors: Jacob W. McMurray, Kevin M. Cooley, Abbey L. Mcalister, Randy J. Parten
  • Circuit board
    Patent number: D995456
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: August 15, 2023
    Assignee: FLEECE PERFORMANCE ENGINEERING, INC.
    Inventors: Brayden Fleece, Matthew Miller
  • Circuit board
    Patent number: D995457
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: August 15, 2023
    Assignee: FLEECE PERFORMANCE ENGINEERING, INC.
    Inventors: Brayden Fleece, Matthew Miller
  • Circulator
    Patent number: D997110
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: August 29, 2023
    Assignee: ZHEJIANG DONGYANG DONGCI CHENGJI ELECTRONICS CO., LTD.
    Inventors: Kun Guo, Xiaodan Sun
  • Collimator for use in a physical vapor deposition (PVD) chamber
    Patent number: D997111
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: August 29, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Lanlan Zhong, Kishor Kumar Kalathiparambil
  • Power semiconductor module
    Patent number: D994624
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: August 8, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Kenji Yamamoto, Yasunori Kutsuma
  • End effector for handling wafers
    Patent number: D997892
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: September 5, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Satoshi Aizawa, Tetsuya Marubayashi, Kiyoaki Yamada
  • Shadow ring lift plate
    Patent number: D997893
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: September 5, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Zubin Huang, Srinivas Tokur Mohana, Shreyas Patil Shanthaveeraswamy, Sandesh Yadamane, Jallepally Ravi, Harpreet Singh, Manjunatha Koppa
  • Shadow ring lift assembly
    Patent number: D997894
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: September 5, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Zubin Huang, Srinivas Tokur Mohana, Shreyas Patil Shanthaveeraswamy, Sandesh Yadamane, Jallepally Ravi, Harpreet Singh, Manjunatha Koppa
  • Flexible printed circuit board
    Patent number: D997895
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: September 5, 2023
    Inventor: Jiarui Zhu
  • Flexible printed circuit board
    Patent number: D997896
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: September 5, 2023
    Inventor: Jiarui Zhu
  • Flexible printed circuit board for game controllers
    Patent number: D997897
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: September 5, 2023
    Inventor: Jiarui Zhu
  • Collimator for use in a physical vapor deposition (PVD) chamber
    Patent number: D998575
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: September 12, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Lanlan Zhong, Kishor Kumar Kalathiparambil
  • Flexible printed circuit board
    Patent number: D998576
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: September 12, 2023
    Inventor: Jiarui Zhu
  • Printed circuit board
    Patent number: D999748
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: September 26, 2023
    Assignee: ACE TECHNOLOGIES CORPORATION
    Inventor: Nyambayar Jargalsaikhan