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Patents
Equipment For Production, Distribution, Or Transformation Of Energy Patents
Distribution, Modification Or Control Patents
Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
Susceptor ring
Patent number:
D1037186
Type:
Grant
Filed:
April 13, 2022
Date of Patent:
July 30, 2024
Assignee:
NuFlare Technology, Inc.
Inventors:
Yoshiaki Daigo, Yoshikazu Moriyama
Power semiconductor module
Patent number:
D1037187
Type:
Grant
Filed:
May 12, 2022
Date of Patent:
July 30, 2024
Assignee:
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Inventors:
Zhiqiang Niu, Bum-Seok Suh, Jong-Mu Lee, Jia-long Yuan, Junho Lee, Xiaorong Ge
Gas distribution plate
Patent number:
D1037778
Type:
Grant
Filed:
July 19, 2022
Date of Patent:
August 6, 2024
Assignee:
Applied Materials, Inc.
Inventors:
Ashutosh Agarwal, Eric J. Hoffmann, Dhritiman Subha Kashyap, Kartik Shah, Amit Rajendra Sherekar, Sanjeev Baluja
Cover ring for use in semiconductor processing chamber
Patent number:
D1038049
Type:
Grant
Filed:
November 18, 2020
Date of Patent:
August 6, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventors:
Abhishek Chowdhury, Harisha Sathyanarayana, Edwin C. Suarez, Siqing Lu, Nataraj Bhaskar Rao
Showerhead for semiconductor processing
Patent number:
D1038900
Type:
Grant
Filed:
September 30, 2021
Date of Patent:
August 13, 2024
Assignee:
Lam Research Corporation
Inventor:
Aaron Blake Miller
Collimator for a physical vapor deposition chamber
Patent number:
D1038901
Type:
Grant
Filed:
January 12, 2022
Date of Patent:
August 13, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventors:
Fuhong Zhang, Martin Lee Riker, Suhas Bangalore Umesh, Madan Kumar Shimoga Mylarappa
Mortarboard with electronic tube display
Patent number:
D1039243
Type:
Grant
Filed:
October 8, 2021
Date of Patent:
August 20, 2024
Inventor:
Mahdi Al-Husseini
Deposition ring for physical vapor deposition chamber
Patent number:
D1040304
Type:
Grant
Filed:
June 25, 2021
Date of Patent:
August 27, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventors:
David Gunther, Cheng-Hsiung Tsai, Kirankumar Neelasandra Savandaiah
Tubular reactor
Patent number:
D1042340
Type:
Grant
Filed:
March 14, 2022
Date of Patent:
September 17, 2024
Assignee:
KOKUSAI ELECTRIC CORPORATION
Inventor:
Yusaku Okajima
Sliding ring for an interlocking process kit for a substrate processing chamber
Patent number:
D1042373
Type:
Grant
Filed:
March 18, 2022
Date of Patent:
September 17, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventors:
Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
Support pipe for an interlocking process kit for a substrate processing chamber
Patent number:
D1042374
Type:
Grant
Filed:
March 18, 2022
Date of Patent:
September 17, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventors:
Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
Power semiconductor module
Patent number:
D1042375
Type:
Grant
Filed:
May 12, 2022
Date of Patent:
September 17, 2024
Assignee:
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Inventors:
Zhiqiang Niu, Bum-Seok Suh, Jong-Mu Lee, Jia-long Yuan, Junho Lee, Xiaorong Ge
Semiconductor module
Patent number:
D1042376
Type:
Grant
Filed:
August 24, 2022
Date of Patent:
September 17, 2024
Assignee:
ROHM CO., LTD.
Inventors:
Koshun Saito, Koki Nakano
Semiconductor device
Patent number:
D1043594
Type:
Grant
Filed:
April 26, 2023
Date of Patent:
September 24, 2024
Assignee:
ROHM CO., LTD.
Inventors:
Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
Semiconductor device
Patent number:
D1043595
Type:
Grant
Filed:
April 26, 2023
Date of Patent:
September 24, 2024
Assignee:
ROHM CO., LTD.
Inventors:
Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
Compliant ground block and testing system for testing integrated circuits
Patent number:
D1044751
Type:
Grant
Filed:
January 19, 2021
Date of Patent:
October 1, 2024
Assignee:
Johnstech International Corporation
Inventors:
Valts Treibergs, Pat Joyal, Leslie Fliegelman
Flexible printed circuit board for game controllers
Patent number:
D1044752
Type:
Grant
Filed:
April 8, 2023
Date of Patent:
October 1, 2024
Inventor:
Jiarui Zhu
Flexible printed circuit board for game controllers
Patent number:
D1044753
Type:
Grant
Filed:
April 8, 2023
Date of Patent:
October 1, 2024
Inventor:
Jiarui Zhu
Lamp wick
Patent number:
D1046206
Type:
Grant
Filed:
April 30, 2024
Date of Patent:
October 8, 2024
Inventor:
Xianming Li
Lamp wick
Patent number:
D1046267
Type:
Grant
Filed:
April 29, 2024
Date of Patent:
October 8, 2024
Inventor:
Xianming Li
Gripper for semiconductor wafer housing cassette
Patent number:
D1046798
Type:
Grant
Filed:
May 7, 2021
Date of Patent:
October 15, 2024
Assignee:
OMRON CORPORATION
Inventors:
Tomohiro Okada, Takahiro Inoue, Takeshi Maehiro
Semiconductor module
Patent number:
D1046799
Type:
Grant
Filed:
September 9, 2021
Date of Patent:
October 15, 2024
Assignee:
ASAHI KASEI MICRODEVICES CORPORATION
Inventors:
Osamu Shirata, Yusuke Hidaka
Semiconductor device
Patent number:
D1046800
Type:
Grant
Filed:
July 8, 2022
Date of Patent:
October 15, 2024
Assignee:
Mitsubishi Electric Corporation
Inventors:
Shuhei Yokoyama, Shogo Shibata
Semiconductor device
Patent number:
D1046801
Type:
Grant
Filed:
July 11, 2022
Date of Patent:
October 15, 2024
Assignee:
MITSUBISHI ELECTRIC CORPORATION
Inventors:
Shuhei Yokoyama, Shogo Shibata
Susceptor cover
Patent number:
D1047884
Type:
Grant
Filed:
April 13, 2022
Date of Patent:
October 22, 2024
Assignee:
NuFlare Technology, Inc.
Inventors:
Yoshiaki Daigo, Takuto Umetsu
Semiconductor package
Patent number:
D1049065
Type:
Grant
Filed:
July 12, 2021
Date of Patent:
October 29, 2024
Assignee:
JMJ KOREA CO., LTD.
Inventor:
Yun Hwa Choi
Base for a multi-chamber semiconductor
Patent number:
D1049066
Type:
Grant
Filed:
February 28, 2022
Date of Patent:
October 29, 2024
Assignee:
SYSKEY TECHNOLOGY CO., LTD.
Inventors:
Hsueh-Hsien Wu, Chih-Yuan Chan, Yi-Ting Lai
Ring for an anti-rotation process kit for a substrate processing chamber
Patent number:
D1049067
Type:
Grant
Filed:
April 4, 2022
Date of Patent:
October 29, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventors:
Rohan Vijay Rane, Xue Yang Chang, Timothy Joseph Franklin, Daniel Sang Byun
Circuit board for computer printers
Patent number:
D1050059
Type:
Grant
Filed:
September 28, 2022
Date of Patent:
November 5, 2024
Assignee:
SEIKO EPSON CORPORATION
Inventors:
Shuichi Nakano, Jun Sato, Yasuhiko Kosugi
Exhaust wall liner for semiconductor manufacturing apparatus
Patent number:
D1051081
Type:
Grant
Filed:
May 11, 2023
Date of Patent:
November 12, 2024
Assignee:
AP SYSTEMS INC.
Inventors:
Chang Min Kwon, Chang Kyo Kim
Circuit board
Patent number:
D1051082
Type:
Grant
Filed:
September 14, 2023
Date of Patent:
November 12, 2024
Assignee:
Japan Aviation Electronics Industry, Limited
Inventors:
Kenichi Nakazato, Takeshi Hosokawa
Single-slot tubular cathode
Patent number:
D1051838
Type:
Grant
Filed:
December 10, 2021
Date of Patent:
November 19, 2024
Assignee:
Applied Materials, Inc.
Inventors:
Bon-Woong Koo, Frank Sinclair, Alexandre Likhanskii, Svetlana Radovanov, Alexander Perel, Graham Wright, Jay T. Scheuer, Daniel Tieger, You Chia Li, Jay Johnson, Tseh-Jen Hsieh, Ronald Johnson
Semiconductor probe pin
Patent number:
D1051865
Type:
Grant
Filed:
October 28, 2022
Date of Patent:
November 19, 2024
Assignee:
POINT ENGINEERING CO., LTD.
Inventor:
Bum Mo Ahn
Circuit board
Patent number:
D1051866
Type:
Grant
Filed:
November 17, 2022
Date of Patent:
November 19, 2024
Assignee:
FLEECE PERFORMANCE ENGINEERING, INC.
Inventors:
Brayden Fleece, Jeffrey W. Everett, Matthew Miller
Confinement liner for a substrate processing chamber
Patent number:
D1051867
Type:
Grant
Filed:
January 17, 2023
Date of Patent:
November 19, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventor:
Joseph Perry
Circuit board
Patent number:
D1052544
Type:
Grant
Filed:
November 17, 2022
Date of Patent:
November 26, 2024
Assignee:
FLEECE PERFORMANCE ENGINEERING, INC.
Inventors:
Brayden Fleece, Jeffrey W. Everett, Matthew Miller
Semiconductor device
Patent number:
D1052545
Type:
Grant
Filed:
April 26, 2023
Date of Patent:
November 26, 2024
Assignee:
ROHM CO., LTD.
Inventors:
Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
Cover ring of top plate for semiconductor manufacturing apparatus
Patent number:
D1052546
Type:
Grant
Filed:
February 15, 2023
Date of Patent:
November 26, 2024
Assignee:
NuFlare Technology, Inc.
Inventors:
Takuto Umetsu, Masayoshi Yajima, Kunihiko Suzuki
Semiconductor wafer and susceptor heating
Patent number:
D1052547
Type:
Grant
Filed:
March 28, 2023
Date of Patent:
November 26, 2024
Assignee:
NuFlare Technology, Inc.
Inventors:
Kunihiko Suzuki, Takuto Umetsu
Gas diffuser
Patent number:
D1052548
Type:
Grant
Filed:
June 26, 2023
Date of Patent:
November 26, 2024
Assignee:
Applied Materials, Inc.
Inventors:
Devi Raghavee Veerappan, Xiaoxiong Yuan, Peiyu Zhang, Borui Xia, Chih-Hsun Hsu
Furnace for substrate processing apparatus
Patent number:
D1053156
Type:
Grant
Filed:
August 8, 2022
Date of Patent:
December 3, 2024
Assignee:
KOKUSAI ELECTRIC CORPORATION
Inventors:
Hideto Tateno, Takatomo Yamaguchi, Daiki Kimoto
Heat reflector for semiconductor manufacturing equipment
Patent number:
D1053157
Type:
Grant
Filed:
January 24, 2023
Date of Patent:
December 3, 2024
Assignee:
KOKUSAI ELECTRIC CORPORATION
Inventor:
Akihiro Sato
Sputter target for a physical vapor deposition chamber
Patent number:
D1053230
Type:
Grant
Filed:
May 19, 2022
Date of Patent:
December 3, 2024
Assignee:
APPLIED MATERIALS, INC.
Inventors:
Siew Kit Hoi, Jay Min Soh, Mengxue Wu, Palaniappan Chidambaram
Wafer support of semiconductor manufacturing apparatus
Patent number:
D1053830
Type:
Grant
Filed:
August 5, 2022
Date of Patent:
December 10, 2024
Assignee:
KOKUSAI ELECTRIC CORPORATION
Inventor:
Daiki Taniguchi
Carrier substrate for handling
Patent number:
D1054388
Type:
Grant
Filed:
April 15, 2022
Date of Patent:
December 17, 2024
Assignee:
SHIN-ETSU CHEMICAL CO., LTD.
Inventors:
Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
Semiconductor device
Patent number:
D1054389
Type:
Grant
Filed:
July 5, 2022
Date of Patent:
December 17, 2024
Assignee:
NEC Corporation
Inventors:
Tomohiro Yamaji, Kohei Matsuura
Semiconductor device
Patent number:
D1054390
Type:
Grant
Filed:
July 5, 2022
Date of Patent:
December 17, 2024
Assignee:
NEC Corporation
Inventors:
Tomohiro Yamaji, Kohei Matsuura
Circuit board
Patent number:
D1054391
Type:
Grant
Filed:
March 14, 2023
Date of Patent:
December 17, 2024
Assignee:
SHENZHEN FANTTIK TECHNOLOGY
Inventor:
Bo Du
Cellular module
Patent number:
D1054404
Type:
Grant
Filed:
December 22, 2021
Date of Patent:
December 17, 2024
Assignee:
KONTRON EUROPE GMBH
Inventor:
Annette Horn
Support ring for an interlocking process kit for a substrate processing chamber
Patent number:
D1055006
Type:
Grant
Filed:
March 18, 2022
Date of Patent:
December 24, 2024
Assignee:
Applied Materials, Inc.
Inventors:
Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
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