Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Semiconductor module
    Patent number: D1015284
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: February 20, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Top plate for semiconductor manufacturaing equipment
    Patent number: D1016761
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 5, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Takuto Umetsu, Masayoshi Yajima, Kunihiko Suzuki
  • Flexible printed circuit board
    Patent number: D1016762
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 5, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Toshio Horiki, Yoshihiko Ishida
  • Nozzle holder of substrate processing apparatus
    Patent number: D1017561
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: March 12, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Hironori Shimada
  • Inner tube of reaction tube for semiconductor manufacturing equipment
    Patent number: D1019581
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Atsushi Hirano
  • Inner tube of reaction tube for semiconductor manufacturing equipment
    Patent number: D1019582
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Atsushi Hirano
  • Inner tube of reaction tube for semiconductor manufacturing equipment
    Patent number: D1019583
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Atsushi Hirano
  • Semiconductor module
    Patent number: D1021829
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Yoshihisa Tsukamoto, Akihiro Kimura
  • Semiconductor module
    Patent number: D1021830
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Power semiconductor module
    Patent number: D1021831
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Kenji Yamamoto, Yasunori Kutsuma
  • Elastic membrane
    Patent number: D1021832
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: April 9, 2024
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Akazawa, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Tomoko Owada, Cheng Cheng, Yuichi Kato
  • Tubular reactor
    Patent number: D1022904
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Tubular reactor
    Patent number: D1022905
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Tubular reactor
    Patent number: D1022906
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Tubular reactor
    Patent number: D1022907
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • LED chip
    Patent number: D1022930
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: April 16, 2024
    Assignee: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Senpeng Huang, Qiuxia Lin, Jian Liu
  • Integrated circuit
    Patent number: D1022931
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vignesh Kannan, Joshua M. Yu, Matthew David Smith, Jeffrey A. Nielsen, Kenneth Duda
  • Semiconductor module
    Patent number: D1022932
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 16, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Wafer support of semiconductor manufacturing apparatus
    Patent number: D1022933
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Gripper for wafer cassette
    Patent number: D1023984
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: April 23, 2024
    Assignee: OMRON CORPORATION
    Inventors: Tomohiro Okada, Takahiro Inoue
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1024149
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: April 23, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Luke Vianney Varkey, Xiangjin Xie
  • Printed circuit board for mouth guard
    Patent number: D1024986
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: April 30, 2024
    Assignee: IP Moat, Inc.
    Inventors: John Gabriel, Sarnab Bhattacharya
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1025935
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: May 7, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Luke Vianney Varkey, Xiangjin Xie
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1025936
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: May 7, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Luke Vianney Varkey, Xiangjin Xie
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1026054
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: May 7, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Luke Vianney Varkey, Xiangjin Xie, Kishor Kumar Kalathiparambil
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1026839
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: May 14, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Luke Vianney Varkey, Xiangjin Xie
  • Semiconductor deposition reactor ring
    Patent number: D1028913
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: May 28, 2024
    Assignee: ASM IP Holding B.V.
    Inventors: Rutvij Naik, Junwei Su, Wentao Wang, Chuqin Zhou, Xing Lin
  • External electrical stimulator
    Patent number: D1029775
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: June 4, 2024
    Assignee: GIMER MEDICAL CO., LTD.
    Inventors: Chen-Tun Wu, Chan-Yi Cheng, Jian-Hao Pan
  • Power semiconductor module
    Patent number: D1030686
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: June 11, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Yasunori Kutsuma, Kenji Yamamoto
  • Susceptor
    Patent number: D1030687
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: June 11, 2024
    Assignee: ASM IP Holding B.V.
    Inventors: Shujin Huang, Junwei Su, Wentao Wang, Xing Lin
  • Circuit board for an electrical connector
    Patent number: D1030688
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: June 11, 2024
    Inventor: Faraidoon Pundole
  • Semiconductor probe pin
    Patent number: D1030689
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: June 11, 2024
    Assignee: POINT ENGINEERING CO., LTD.
    Inventor: Bum Mo Ahn
  • Semiconductor module
    Patent number: D1031652
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: June 18, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Combined susceptor, support, and lift system
    Patent number: D1031676
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: June 18, 2024
    Assignee: ASM IP Holding B.V.
    Inventors: Peipei Gao, Wentao Wang, Xing Lin, Han Ye, Ion Hong Chao, Siyao Luan, Alexandros Demos, Fan Gao
  • Full phase module gate drive housing
    Patent number: D1031677
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: June 18, 2024
    Assignee: IP Transportation IP Holdings, LLC
    Inventors: Mark Murphy, Jain Raj Vettuvazhy Puthenpurayil, Rajendra Yammanuru, Douglas Garvin, Theodore Brown
  • Die plate assembly for probe head
    Patent number: D1031738
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: June 18, 2024
    Assignee: MPI CORPORATION
    Inventors: Chin-Yi Lin, Keng-Min Su, Che-Wei Lin, Hsin-Cheng Hung
  • Semiconductor module
    Patent number: D1032517
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: June 25, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Semiconductor module
    Patent number: D1033355
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: July 2, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Hideo Hara
  • Drive unit for running toy
    Patent number: D1033560
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: July 2, 2024
    Assignee: Asobism Co., Ltd.
    Inventors: Kota Nezu, Shigeo Itoi, Tomohisa Ote, Takehiro Okada
  • Measurement jig
    Patent number: D1034248
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: July 9, 2024
    Assignee: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Edge ring
    Patent number: D1034491
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: July 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Kin Pong Lo, Vladimir Nagorny, Wei Liu, Theresa Kramer Guarini, Bernard L. Hwang, Malcolm J. Bevan, Jacob Abraham, Swayambhu Prasad Behera
  • Housing for a full phase module gate drive
    Patent number: D1034492
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: July 9, 2024
    Assignee: Transportation IP Holdings, LLC
    Inventors: Mark Murphy, Jain Raj Vettuvazhy Puthenpurayil, Theodore Brown, Douglas Garvin
  • Chamber wall liner for a semiconductor manufacturing apparatus
    Patent number: D1034493
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: July 9, 2024
    Assignee: AP SYSTEMS INC.
    Inventors: Chang Min Kwon, Chang Kyo Kim
  • Semiconductor device
    Patent number: D1034494
    Type: Grant
    Filed: September 25, 2023
    Date of Patent: July 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Kohei Tanikawa, Kenji Hayashi
  • Measurement jig
    Patent number: D1035468
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: July 16, 2024
    Assignee: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Gas distribution plate for a semiconductor processing chamber
    Patent number: D1035598
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: July 16, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Mahesh Ramakrishna, Yury Shustrov
  • Gripper for wafer cassette
    Patent number: D1035599
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: July 16, 2024
    Assignee: OMRON CORPORATION
    Inventors: Tomohiro Okada, Takahiro Inoue
  • Semiconductor test fixture
    Patent number: D1035600
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: July 16, 2024
    Inventor: Karol Sue Smith
  • Gripper for wafer cassette
    Patent number: D1036399
    Type: Grant
    Filed: November 27, 2023
    Date of Patent: July 23, 2024
    Assignee: OMRON CORPORATION
    Inventors: Tomohiro Okada, Tamehide Shimada
  • Semiconductor module
    Patent number: D1037163
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: July 30, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Tsubasa Nakamura, Daiki Yoshida, Takahiro Koyama