Abstract: The present disclosure provides a packaging method, including: providing a first semiconductor substrate; forming a bonding region on the first semiconductor substrate, wherein the bonding region of the first semiconductor substrate includes a first bonding metal layer and a second bonding metal layer; providing a second semiconductor substrate having a bonding region, wherein the bonding region of the second semiconductor substrate includes a third bonding layer; and bonding the first semiconductor substrate to the second semiconductor substrate by bringing the bonding region of the first semiconductor substrate in contact with the bonding region of the second semiconductor substrate; wherein the first and third bonding metal layers include copper (Cu), and the second bonding metal layer includes Tin (Sn). An associated packaging structure is also disclosed.

Abstract: Provided is a transfer printing substrate and a method for producing the same, in order to improve yield of picking up of the micro-components and further improve quality of image display. The transfer printing substrate includes a carrying substrate, a plurality of supporting structures, and a plurality of micro-components corresponding to the plurality of support structures in one-to-one correspondence, wherein each of the plurality of supporting structures includes a fixing part and a suspended supporting part, wherein an end of the fixing part is fixed on the carrying substrate, an end of the suspended supporting part is connected to the fixing part, the other end of the suspended supporting part supports a corresponding one of the plurality of micro-components, and a first moving space is provided between the suspended supporting part and the carrying substrate. The transfer printing substrate is used for transferring the micro-components.

Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.

Abstract: An electronic component and a mounting board for mounting of the same are provided. The electronic component includes a body including external electrodes disposed on surfaces of the body opposing each other in a first direction, respectively, and metal frames connected to the external electrodes, respectively. The metal frames include supports bonded to the external electrodes and mounting portions extending from lower ends of the supports in the first direction and are spaced apart from the body and the external electrodes. The supports include a lower support portion disposed on a lower side of the body and an upper support portion disposed on an upper side of the body, and the lower support portion has a thickness in a second direction perpendicular to the first direction relatively greater than a thickness of the upper support portion in the first direction.

Abstract: A magnetic sensor includes a magnetic field conversion unit, a magnetic field detection unit, and a magnetic film. The magnetic field conversion unit includes a yoke that receives an input magnetic field and generates an output magnetic field. The input magnetic field contains an input magnetic field component in a direction parallel to Z direction. The output magnetic field contains an output magnetic field component in a direction parallel to X direction. The magnetic field detection unit includes a magnetic detection element that receives the output magnetic field and generates a detection value corresponding to the output magnetic field component. The magnetic film absorbs part of magnetic flux resulting from a noise magnetic field, which is a magnetic field in a direction to which the magnetic detection element has sensitivity and which is other than the output magnetic field component.

Abstract: A tilt sensor includes: a pressure sensor disposed to be relatively movable with respect to a detection target object and configured to detect pressure of a fluid; and a tilt information detection unit configured to detect tilt information (for example, a tilt angle) of the detection target object according to an output of the pressure sensor and movement information of the pressure sensor.

Abstract: A flexible sensor for monitoring operating parameters, including pressure and temperature, of a flexible structure, such as a tire, provides electrodes and an active area that are formed of flexible materials. In particular, the active area may be formed from an elastomeric piezoresistive material, such as an ionic liquid-polymer. The flexible properties of the sensor allow it to be readily incorporated into the body of a tire during manufacture. This allows the operating parameters of the tire to be monitored, such as in real-time, while the tire is in operation. Furthermore, the sensor is formed of materials that allow the sensor to be formed using additive manufacturing techniques, such as 3D (three-dimensional) printing. As such, the sensor may be 3D printed together with another structure, such as a tire tread, so that the sensor is integrated therein.

Abstract: A manufacturing method for OLED display panel is disclosed, which first performs patterning on the encapsulation colloid of the encapsulant to divide encapsulation colloid into a plurality of target encapsulation areas, with each target encapsulation area corresponding to each OLED substrate unit, and a gap area outside of target encapsulation areas, performing disintegration treatment from the other side of encapsulation colloid on a portion of encapsulation colloid belonging to gap area so that the surface losing adhesiveness, then attaches encapsulation colloid to OLED substrate, and finally, obtains a plurality of OLED display panels by cutting. This method is simple to perform, reduces the size compatibility requirement of the laminator and avoids the use of extra manipulator and carrier fixture, which reduces the product cost incurred by fixture cleaning, transport, storage and other complex operations, and improves the product of the alignment accuracy, is good for automated production.

Abstract: The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound. The multilayer redistribution structure includes redistribution interconnects that connect the first device layer to package contacts on a bottom surface of the multilayer redistribution structure. Herein, the connections between the redistribution interconnects and the first device layer are solder-free. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.

Abstract: For example, an Electrostatically Formed Nanowire (EFN) may include a source region; at least one drain region; a wire region configured to drive a current between the source and drain regions via a conductive channel; a first lateral-gate area extending along a first surface of the wire region between the source and drain regions; a second lateral-gate area extending along a second surface of the wire region between the source and drain regions; and a sensing area in opening in a backside of a silicon substrate under the wire region and the first and second lateral-gate areas, the sensing area configured to, in reaction to a predefined substance, cause a change in a conductivity of the conductive channel.

Abstract: The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.

Abstract: The disclosed embodiments relate to an integrated circuit structure and methods of forming them in which photonic devices are formed on the back end of fabricating a CMOS semiconductor structure containing electronic devices. Doped regions associated with the photonic devices are formed using microwave annealing for dopant activation.

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

Abstract: A microphone unit in which a microphone body is built in a housing is provided. The microphone body detects a sound entering the housing via a sound hole of the housing. An optical detector that detects light entering the housing via the sound hole is disposed in the housing. Therefore, a detection can be made that the sound hole is blocked by monitoring a detection level of the optical detector, based on a change in the detection level of the optical detector.

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

Abstract: In some embodiments, a sensor includes a microelectromechanical system (MEMS) structure, a cover, and a bump stop. The MEMS structure is configured to move responsive to electromechanical stimuli. The cover is positioned on the MEMS structure. The cover is configured to mechanically protect the MEMS structure. The bump stop is disposed on a substrate and the bump stop is configured to stop the MEMS structure from moving beyond a certain point. The bump stop is further configured to stop the MEMS structure from making physical contact with the substrate. Moreover, the cover is configured to apply a force to the MEMS structure responsive to a voltage being applied to the cover.

Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound. The multilayer redistribution structure includes redistribution interconnects that connect the first device layer to package contacts on a bottom surface of the multilayer redistribution structure. Herein, the connections between the redistribution interconnects and the first device layer are solder-free. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.

Abstract: A method of sensing a pressure applied to a surface comprises monitoring an electrical signal generated by redistribution of mobile ions in a piezoionic layer under the surface. An externally applied local pressure at a portion of the layer induces redistribution of mobile ions in the piezoionic layer. It is determined that the surface is pressured based on detection of the electrical signal. A piezoionic sensor includes a sensing surface; a piezoionic layer disposed under the sensing surface such that an externally applied local pressure on a portion of the sensing surface causes detectable redistribution of mobile ions in the piezoionic layer; and electrodes in contact with the layer, configured to monitor electrical signal generated by the redistribution of mobile ions in the piezoionic layer.

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

Abstract: An array substrate includes: a plurality of sub-pixel units arranged in an array, in which every two adjacent rows of the sub-pixel units form one sub-pixel-unit group, and two gate lines that are configured to respectively provide gate signals for the two rows of the sub-pixel units are disposed between the two rows of the sub-pixel units; a plurality of touch driving electrodes, disposed between the sub-pixel-unit groups that are provided on the array substrate, and arranged in a row direction of the sub-pixel units; and a plurality of touch sensing electrodes, disposed on the array substrate, arranged in a column direction of the sub-pixel units, and insulated from the touch driving electrodes and the gate lines.

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

Abstract: A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity.

Abstract: Apparatus(es) and method(s) relate generally to via arrays on a substrate. In one such apparatus, the substrate has a conductive layer. First plated conductors are in a first region extending from a surface of the conductive layer. Second plated conductors are in a second region extending from the surface of the conductive layer. The first plated conductors and the second plated conductors are external to the first substrate. The first region is disposed at least partially within the second region. The first plated conductors are of a first height. The second plated conductors are of a second height greater than the first height. A second substrate is coupled to first ends of the first plated conductors. The second substrate has at least one electronic component coupled thereto. A die is coupled to second ends of the second plated conductors. The die is located over the at least one electronic component.

Abstract: The invention relates to a magnetic memory cell (30), comprising: a stack (31) including a magnetic layer section (34) between a conductive layer section (32) and a section (36) of a layer that is different from the conductive layer, the magnetic layer having a magnetisation (35) perpendicular to the plane of the layers; a metallisation section (42) on which the stack is placed; and first, second, third and fourth metallisation arms (44D to 44G), each arm having a median axis (45D to 45G), wherein, for each arm, a current flowing towards the stack in the direction of the median axis sees that portion of the stack which is closest the arm mostly on its left for the first and second arms (44E, 44G), and mostly on its right for the third and fourth arms (44D, 44F).

Abstract: A method of manufacturing a semiconductor structure includes receiving a substrate, receiving a heater, receiving an electrode, and receiving a sensing material. The substrate have a first surface, a second surface opposite to the first surface and a plurality of vias extending from the second surface toward the first surface and filled with a conductive or semiconductive material and a first oxide layer, the first oxide layer surrounding the conductive or semiconductive material in the plurality of vias, and a second oxide layer disposed over the first surface and the second surface. The heater is disposed within a membrane over the first surface of the substrate and electrically connected with the substrate. The electrode is over the heater and the membrane; and the sensing material covers a portion of the electrode.

Abstract: An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.

Abstract: An apparatus and method, the apparatus comprising: at least one electrode configured to provide an electrical connection to a channel of two dimensional material wherein the electrode comprises a conductive layer and plurality of nanostructures wherein at least some of the nanostructures comprise a conductive core and a coating of two dimensional material.

Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound. The multilayer redistribution structure includes redistribution interconnects that connect the first device layer to package contacts on a bottom surface of the multilayer redistribution structure. Herein, the connections between the redistribution interconnects and the first device layer are solder-free. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.

Abstract: Devices and methods for Terahertz (THz) sensing/detection, imaging, spectroscopy, and communication are provided. A graphene-based field effect transistor (FET) can have a quality factor of greater than 400 and a responsivity of at least 400 Volts per Watt. A FET sensor can include a substrate, a gate disposed on the substrate, an insulation layer disposed on the gate and the substrate, a source terminal and a drain terminal disposed on the substrate, and a graphene layer disposed on the insulation layer.

Abstract: A sound generator includes a housing with an acoustic cavity and including a mounting base and a separation plate extending from the mounting base to the outside of the housing; a speaker unit accommodated in the acoustic cavity and being mounted on the mounting base; a front cavity and a back cavity formed by acoustic cavity divided by the mounting base, the speaker unit and the separation plate; and at least one cavity extending from the mounting base and/or the separation plate. The cavity has at least a first through-hole for communicating the cavity with the front cavity and at least a second through-hole for communicating the cavity with the back cavity.

Abstract: A method for sensing presence of at least one specified chemical component in a patient's sample gas, associated with a disease (or medical condition), and for associating presence of the disease with presence of the specified chemical component concentration in an identified concentration range. Pattern matching is applied to identify one or more specified components that are present in the sample gas. Measured electrical parameter values (EPVs) for each nanosensor are modeled by constitutive relations dependent on a polynomial of powers of component concentrations. The EPV models are used to estimate component concentrations for the differently functionalized nanosensors. Estimated concentrations are averaged over the sensors to provide an overall concentration value for each surviving specified component. These overall concentration values are compared with concentration ranges associated, to estimate presence or absence of a disease or medical condition.

Abstract: The present invention provides capacitor-based fluid sensing units. The capacitor-based fluid sensing unit comprises a substrate, a first electrode configured on the substrate, a sensing layer configured on the first electrode, a second electrode configured on the sensing layer. More particularly, the second electrode is a porous electrode, while the sensing layer is made of a porous dielectric material and has a thickness between 50 nm and 5 mm. Permittivity of the sensing layer changes as fluid permeates from the second electrode to the sensing layer. The subsequent change in capacitance of the capacitor-based fluid sensing unit is used to determine the volume of the fluid.

Abstract: A vertical Hall element and method of fabricating are disclosed. The method includes forming a buried region having a first conductivity type in a substrate having a second conductivity type and implanting a dopant of the first conductivity type into a well region between the top surface of the substrate and the buried region. The buried region has a doping concentration increasing with an increasing depth from a top surface of the substrate and the well region has a doping concentration decreasing from the top surface of the substrate to the buried region. The method includes forming first through fifth contacts on the well region. First and second contacts define a conductive path and second and third contacts define another conductive path through the well region. The fourth contact is formed between first and second contacts and the fifth contact is formed between second and third contacts.

Abstract: To provide a solid-state light-receiving device for ultraviolet light which can measure the amount of irradiation with ultraviolet light harmful to the human body using a simplified structure and properly and accurately, which can be readily integrated with a sensor of a peripheral circuit, which is small, light-weight, and low-cost, and which is suitable for mobile or wearable purposes. One solution is a solid-state light-receiving device for ultraviolet light which is provided with a first photodiode (1), a second photodiode (2), and a differential circuit which receives respective signals based on outputs from these photodiodes, wherein a position of the maximum concentration of a semiconductor impurity is provided in each of the photodiodes (1,2) and in a semiconductor layer region formed on each photodiode, and an optically transparent layer having a different wavelength selectivity is provided on a light-receiving surface of each photodiode.

Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound. The multilayer redistribution structure includes redistribution interconnects that connect the first device layer to package contacts on a bottom surface of the multilayer redistribution structure. Herein, the connections between the redistribution interconnects and the first device layer are solder-free. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.

Abstract: A multi-layer solder-resist provides useful adhesion to a semiconductor device package substrate while allowing for increasingly small geometries of bond pads and spacings.

Abstract: A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed. Several separated portions of metallic material are provided such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes. At least one diffusion barrier layer including at least one non-metallic material is arranged on the cap layer and forms a diffusion barrier against an atmosphere outside the cavity at least around the release holes. Parts of the diffusion barrier layer are not covered by the portions of metallic material.

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

Abstract: The present invention provides a Hall element module for achieving miniaturization. A Hall element module includes a Hall element having an element surface and an element back surface, a terminal portion electrically connected to the Hall element and separated from the Hall element as viewed in a z direction, and a resin package covering at least one portion of each of the Hall element and the terminal. The resin package has a rectangular shape with four sides along the x direction and the y direction as viewed in the z direction. The terminal portion includes a terminal back surface facing the z direction and exposed from the resin package. An end edge of the terminal back surface includes a terminal back surface inclined portion opposed to the Hall element and inclined with respect to the x direction and the y direction as viewed in the z direction.

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.

Abstract: The present invention provides a fingerprint recognition module, including: a substrate, a fingerprint sensing die fixed on the substrate, an encapsulation layer covering the fingerprint sensing die and the substrate, the encapsulation layer having a composition plane, and an imprint layer, where the imprint layer is formed on the composition plane.

Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Abstract: A first MEMS motor and s second MEMS motor share a common back volume and a common support structure, and the common support structure is configured to support a first diaphragm and the first back plate, and the common support structure is also configured to support the second diaphragm and the second back plate. A channel passes through the common support structure and communicates with the exterior environment, the channel being of a first diameter, the channel being disposed beyond an outer periphery of each back plate. An opening extends through the silicon nitride layer, the opening having a second diameter, the second diameter being less than the first diameter, the channel communicating with the opening. The opening has a length that is orthogonal to second diameter, and the first back plate and the second back plate have a thickness, wherein the length is no greater than twice the thickness.

Abstract: A finger biometric sensor may include a lower conductive layer, an upper conductive layer, and a spacer between the lower and upper conductive layers to define an air gap therebetween. The finger biometric sensor may also include a finger biometric sensing integrated circuit (IC) above the upper conductive layer and capable of deflecting the upper conductive layer toward the lower conductive layer to change a capacitance thereof based upon pressure applied to the finger biometric sensing IC. A pressure sensing circuit may be coupled to the lower and upper conductive layers to sense the change in capacitance.

Abstract: A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a MEMS device in a MEMS area, where a first metal layer is connected to a first metal connect adjacent the MEMS area and a cap is over the MEMS area to vacuum seal the MEMS area. A first wafer portion is over and bonded to the first metal layer which connects the first metal connect to a first I/O port using metal routing. The first metal layer and the first wafer portion bond requires 10% less bonding area than a bond not including the first metal layer. The semiconductor arrangement including the first metal layer has increased conductivity and requires less processing than an arrangement that requires a dopant implant to connect a first metal connect to a first I/O port and has a better vacuum seal due to a reduction in outgassing.

Abstract: A semiconductive structure includes a first substrate comprising an interconnection layer and a first conductor protruding from the interconnection layer, a second substrate comprising a second conductor bonded with the first conductor, a first cavity between and sealed by the first substrate and the second substrate and the first cavity has a first cavity pressure, a second cavity between and sealed by the first substrate and the second substrate and the second cavity has a second cavity pressure, a first surface of the interconnection layer is a sidewall of the first cavity, wherein the first cavity pressure is less than the second cavity pressure.

Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).