Abstract: An image sensor includes a device wafer including a pixel array for capturing image data bonded to a carrier wafer. Signal lines are disposed adjacent to a side of the carrier wafer opposite the device wafer and a metal noise shielding layer is disposed beneath the pixel array within at least one of the device wafer or the carrier wafer to shield the pixel array from noise emanating from the signal lines. A through-silicon-via (“TSV”) extends through the carrier wafer and the metal noise shielding layer and extends into the device wafer to couple to circuitry within the device wafer. Further noising shielding may be provided by highly doping the carrier wafer and/or overlaying the bottom side of the carrier wafer with a low-K dielectric material.

Abstract: Bypass diodes for solar cells are described. In one embodiment, a bypass diode for a solar cell includes a substrate of the solar cell. A first conductive region is disposed above the substrate, the first conductive region of a first conductivity type. A second conductive region is disposed on the first conductive region, the second conductive region of a second conductivity type opposite the first conductivity type.

Abstract: The invention relates to a method for the production of solar cells which are contacted on both sides, which method is based on micro structuring of a wafer provided with a dielectric layer and doping of the microstructured regions. Subsequently, deposition of a metal-containing nucleation layer and also a galvanic reinforcement of the contactings is effected. The invention relates likewise to solar cells which can be produced in this way.

Abstract: A method for forming a nanostructure penetrating a layer and the device made thereof is disclosed. In one aspect, the device has a substrate, a layer present thereon, and a nanostructure penetrating the layer. The nanostructure defines a nanoscale passageway through which a molecule to be analyzed can pass through. The nanostructure has, in cross-sectional view, a substantially triangular shape. This shape is particularly achieved by growth of an epitaxial layer having crystal facets defining tilted sidewalls of the nanostructure. It is highly suitably for use for optical characterization of molecular structure, particularly with surface plasmon enhanced transmission spectroscopy.

Abstract: A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer.

Abstract: In general, the present invention discloses at least one trench isolation region formed in a semiconductor substrate to electrically and/or optically isolate at least one active region from another active region. The at least one trench isolation region comprises a bottom portion and first and second trench sidewalls. At least one trench sidewall is adjacent a doped region. The at least one sidewall adjacent a doped region has a higher impurity dopant concentration than impurity doped regions surrounding the at least one trench isolation region.

Abstract: An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer surrounding the cavity part and a wiring layer; a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer; and a second covering layer for closing the opening.

Abstract: The invention provides a semiconductor device module package structure and a series connection method thereof. The semiconductor device module package structure includes a wafer having a plurality through holes. A doped layer covers a top surface of the first electrode, and inner sidewalls extending to a bottom surface of the first electrode. At least two first electrodes are disposed adjacent to each other and on opposite sides of the through holes. A second electrode covers the doped layer and the through holes. At least two insulating layer patterns overlap with the first and second electrodes. A second electrode conductive pattern is disposed on the second electrode. The second electrode conductive pattern is disposed between the insulating layer patterns, electrically connecting to the second electrode.

Abstract: Disclosed is an integrated thin film photovoltaic device. The integrated thin film photovoltaic device includes: a substrate including trenches formed therein; a first semiconductor material layer formed on the substrate from a first basic line within each of the trenches through one side of each of the trenches to the projected surface of the substrate, which is adjacent to the one side; a second semiconductor material layer formed on a resultant substrate from a second basic line on the first semiconductor material layer within each of the trenches through the other side of each of the trenches to the projected surface of the resultant substrate, which is adjacent to the other side, so that a portion of the first semiconductor material layer and a portion of the second semiconductor material layer are overlapped with each other within each of the trenches.

Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

Abstract: An apparatus for detecting radiation of a plurality of wavelengths of the electromagnetic spectrum may be provided. The apparatus includes a substrate, a laser irradiated layer proximal to a first side of the substrate, and a microbolometer and at least one readout circuit proximal to a second side of the substrate in electrical communication with the laser irradiated layer. The substrate, laser irradiated layer, and the microbolometer are disposed and arranged such that radiation of a first wavelength is substantially detected by the laser irradiated layer, and radiation of a second wavelength is substantially detected by the microbolometer.

Abstract: Highly ordered anodic TiO2 nanotube arrays fabricated by electrochemical anodization and sensitized with dye to yield dye-sensitized TiO2 nanotube solar cells is described. With inorganic compound (such as TiCl4) treatment, in conjunction with oxygen plasma exposure under optimized conditions, dye-sensitized TiO2 nanotube solar cells produced using TiO2 nanotube arrays exhibited a pronounced power conversion efficiency.

Abstract: There are provided an adhesive film for a solar cell electrode providing a solar cell capable of reducing adverse effects on photovoltaic cells caused by heating or pressure and having sufficient solar cell characteristics, and a method for manufacturing a solar cell module using the same. The adhesive film for a solar cell electrode is an adhesive film used for electrical connection between photovoltaic cell surface electrodes and wiring members, wherein the adhesive film contains a crystalline epoxy resin, a curing agent and a film forming material.

Abstract: A thin film solar cell comprises a substrate, an inorganic layer disposed on the substrate and having a plurality of unevenness, a first electrode disposed on the inorganic layer and having a plurality of second unevenness, an absorbing layer disposed on the first electrode, and a second electrode disposed on the absorbing layer.

Abstract: A slit valve assembly is configured for attachment to a vacuum chamber module to seal a slot opening in a wall of the module in a closed position and to provide access through the slot opening in an open position. The valve assembly includes a rotatable shaft driven by a rotary actuator between an open rotational position and a closed rotational position. An elongated seal plate seals against the module wall over the slot opening in the closed rotational position of the shaft. At least one arm member connects the seal plate with the shaft. The arm member rotates with the shaft and is pivotally attached to the seal plate. The seal plate is biased to an articulated position relative to the arm member.

Abstract: Methods and apparatuses are provided for casting silicon for photovoltaic cells and other applications. With such methods and apparatuses, a cast body of monocrystalline silicon may be formed that is free of, or substantially free of, radially-distributed impurities and defects and having at least two dimensions that are each at least about 35 cm is provided.

Abstract: Provided are a sensor array substrate, a display device including the same, and a method of manufacturing the sensor array substrate. The sensor array substrate includes: a substrate; a plurality of pixel regions defined by intersections of gate wirings and data wirings on the substrate; and a plurality of first sensor units and a plurality of second sensor units which are formed in the pixel regions. The first sensor units sense light in an infrared wavelength range, the second sensor units sense light in a visible wavelength range, two first sensor units that are disposed adjacent to each other in a data wiring direction form a first group, and two second sensor units that are disposed adjacent to each other in the data wiring direction form a second group. The first and second groups are alternately arranged in the data wiring direction and a gate wiring direction.

Abstract: Apparatus and method for plasma deposition of thin film photovoltaic materials at microwave frequencies. The apparatus avoids deposition on windows or other microwave transmission elements that couple microwave energy to deposition species. The apparatus includes a microwave applicator with conduits passing therethrough that carry deposition species. The applicator transfers microwave energy to the deposition species to transform them to a reactive state conducive to formation of a thin film material. The conduits physically isolate deposition species that would react to form a thin film material at the point of microwave power transfer. The deposition species are separately energized and swept away from the point of power transfer to prevent thin film deposition. The invention allows for the ultrafast formation of silicon-containing amorphous semiconductors that exhibit high mobility, low porosity, little or no Staebler-Wronski degradation, and low defect concentration.

Abstract: Thermal management of film deposition processes. In one aspect, a deposition system includes a vacuum chamber defining an evacuated interior volume, a deposition source disposed within the interior volume, a substrate holder disposed within the interior volume and arranged to hold a substrate with a first surface of the substrate facing the deposition source and a second surface of the substrate disposed facing away from the deposition source, and a heat sink disposed to have a first side of the heat sink in radiative thermal contact with the second surface of the substrate held by the substrate holder, the first side of the heat sink comprising a collection of features having a longitudinal dimension that is four or more times larger than a lateral dimension between the features, the features thereby dimensioned and aligned to reflect, multiple times in succession, radiative thermal emissions of the second surface of the substrate.

Abstract: There is provided a wiring sheet (10) provided with a wiring (16) on an insulating base material (11) for electrically connecting a plurality of back electrode type solar cells (20), the wiring sheet (10) having a plurality of cell mounting portions (10a) provided with the back electrode type solar cells (20), the wiring sheet (10) being provided with an insulation layer (101) on a cell mounting side between adjacent cell mounting portions (10a). There is provided a wiring sheet (10) for a back electrode type solar cell, a solar cell with the wiring sheet, a solar cell module, and a method for fabricating the solar cell with the wiring sheet, that can reduce/prevent unwanted contact between the back electrode type solar cell (20) disposed on the wiring sheet (10) and the wiring (16) of the wiring sheet (10).

Abstract: Apparatus and method for plasma deposition of thin film photovoltaic materials at microwave frequencies. The apparatus avoids unintended deposition on windows or other microwave transmission elements that couple microwave energy to deposition species. The apparatus includes a microwave applicator with conduits passing therethrough that carry deposition species. The applicator transfers microwave energy to the deposition species to activate or energize them to a reactive state conducive to formation of a thin film material. The conduits physically isolate deposition species that would react or otherwise combine to form a thin film material at the point of microwave power transfer. The deposition species are separately energized and swept away from the point of power transfer to prevent thin film deposition. Suitable deposition species include precursors that contain silicon, germanium, fluorine, and/or hydrogen.

Abstract: CMOS pixel sensor cells with spacer transfer gates and methods of manufacture are provided herein. The method includes forming a middle gate structure on a gate dielectric. The method further includes forming insulation sidewalls on the middle gate structure. The method further includes forming spacer transfer gates on the gate dielectric on opposing sides of the middle gate, adjacent to the insulation sidewalls which isolate the middle gate structure from the spacer transfer gates. The method further includes forming a photo-diode region in electrical contact with one of the spacer transfer gates and a floating diffusion in electrical contact with another of the spacer transfer gates.

Abstract: The invention relates to a photovoltaic module comprising a first and a second cover layer, an arrangement situated between these of photovoltaic cells which are connected via cell connectors and also an edge seal of the cover layers which extends around the photovoltaic module. The module according to the invention thereby makes possible minimization of the mechanical stresses, e.g. due to different coefficients of thermal expansion, of the photovoltaic cells. Likewise, a method for production of the photovoltaic modules according to the invention is provided.

Abstract: A method of producing a dye solar cell photovoltaic device. The method comprises the steps of providing a transparent envelope, with at least a portion of the envelope having a curved profile; and forming a dye solar cell voltaic element by depositing a plurality of layers of film on an inside surface of the envelope and thereby defining a space within the photovoltaic element.

Abstract: A photosensor includes a substrate, a gate line, and a data line disposed on the substrate. A thin film transistor is connected to the gate line and the data line. A first photo-sensing member is disposed on the substrate, and a first electrode is connected to the thin film transistor and the first photo-sensing member. A second photo-sensing member is disposed on the first photo-sensing member, and a second electrode is connected to the first electrode and the second photo-sensing member.

Abstract: A manufacturing method for manufacturing a light-sensing structure is provided. The manufacturing method includes the steps as follows. (a) A circuit layer is formed on an upper surface of a first substrate, wherein the first substrate includes at least one light-sensing device and the circuit layer includes at least one device structure and at least one release feature that is made of metal and is formed on part of the light-sensing device and the device structure. (b) A first light-filtering layer is formed on part of the circuit layer. (c) The release feature is removed by a wet-etching process.

Abstract: Arrangements of diodes and heat spreaders for solar modules are described. For example, a solar module may include a backsheet with a low profile, surface-mount diode disposed above the backsheet. A pair of ribbon interconnects is coupled to the low profile, surface-mount diode and may penetrate the backsheet.

Abstract: According to one embodiment of the invention, a method for fabricating a MIM capacitor in a semiconductor die includes a step of depositing a first interconnect metal layer. The method further includes depositing a high-k dielectric layer comprising AlNX (aluminum nitride) on the first interconnect layer. The method further includes depositing a layer of MIM capacitor metal on the high-k dielectric layer. The method further includes etching the layer of MIM capacitor metal to form an upper electrode of the MIM capacitor. According to this exemplary embodiment, the first interconnect metal layer, the high-k dielectric layer, and the layer of MIM capacitor metal can be deposited in a PVD process chamber. The method further includes etching the high-k dielectric layer to form a MIM capacitor dielectric segment and etching the first interconnect metal layer to form a lower electrode of the MIM capacitor.

Abstract: An image sensor includes an epi-layer of a first conductivity type formed in a substrate, a photodiode formed in the epi-layer, and a first doping region of a second conductivity type formed under the photodiode to separate the first doping region from the photodiode.

Abstract: An apparatus and related process are provided for vapor deposition of a sublimated source material as a doped thin film on a photovoltaic (PV) module substrate. A receptacle is disposed within a vacuum head chamber and is configured for receipt of a source material supplied from a first feed tube. A second feed tube can provide a dopant material into the deposition head. A heated distribution manifold is disposed below the receptacle and includes a plurality of passages defined therethrough. The receptacle is indirectly heated by the distribution manifold to a degree sufficient to sublimate source material within the receptacle. A distribution plate is disposed below the distribution manifold and at a defined distance above a horizontal plane of a substrate conveyed through the apparatus to further distribute the sublimated source material passing through the distribution manifold onto the upper surface of the underlying substrate.

Abstract: An electrode for a photoelectric conversion device, a method of preparing the same and a photoelectric conversion device comprising the same. In one embodiment, an electrode for a photoelectric conversion device includes a transparent conductive layer, a metal electrode layer and a protection layer. The transparent conductive layer is formed on a substrate to have spacing regions formed at a set interval. The metal electrode layer is formed in a corresponding one of the spacing regions. The protection layer is formed on the transparent conductive layer and the metal electrode layer to coat the metal electrode layer. Accordingly, the shape of a protruded electrode is improved, thereby enhancing the reliability of products through a simple process.

Abstract: A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films.

Abstract: An apparatus, system, and method for a thermoelectric generator. In some embodiments, the thermoelectric generator comprises a first thermoelectric region and a second thermoelectric region, where the second thermoelectric region may be coupled to the first thermoelectric region by a first conductor. In some embodiments, a second conductor may be coupled to the first thermoelectric region and a third conductor may be coupled to the second thermoelectric region. In some embodiments, the first conductor may be in a first plane, the first thermoelectric region and the second thermoelectric region may be in a second plane, and the second conductor and the third conductor may be in a third plane.

Abstract: Disclosed herein is a semiconductor device including an element isolation region configured to be formed on a semiconductor substrate, wherein the element isolation region is formed of a multistep trench in which trenches having different diameters are stacked and diameter of an opening part of the lower trench is smaller than diameter of a bottom of the upper trench.

Abstract: A solar battery module (1) serving includes a first plate-like member (11) having translucency and serving as a light receiving face, a second plate-like member (12) having translucency, a solar battery (13), and a translucent sealing resin portion (14) provided for sealing the solar battery (13) between the first plate-like member (11) and the second plate-like member (12). The second plate-like member (12) has a lead-wire lead-out hole (12h) through which a lead wire (17) connected to the solar battery (13) is led out, and the translucent sealing resin portion (14) is formed extending between the lead wire (17) and the lead-wire lead-out hole (12h).

Abstract: An embodiment of a method of manufacturing a photoelectric conversion device according to the present invention includes specifying a spot having an abnormal physical property in a structure comprising a photoelectric conversion member, including a semiconductor layer, between a pair of first and second electrodes, and isolating the spot having an abnormal physical property through mechanical scribing.

Abstract: An apparatus and a method for manufacturing a CIGS solar cell are disclosed. The apparatus includes a buffer chamber, a first chamber, a second chamber and a mechanical device. The first chamber and the second chamber are located adjacent to the buffer chamber respectively. The mechanical device moves a substrate among the buffer chamber, the first chamber and the second chamber. The first chamber includes a deposition device for depositing a back electrode layer onto the substrate. The second chamber includes heat treatment device and for becoming a thin-film layer onto the back electrode layer.

Abstract: A method for producing a photosensitive integrated circuit including producing circuit control transistors, producing, above the control transistors, and between at least one upper electrode and at least one lower electrode, at least one photodiode, by amorphous silicon layers into which photons from incident electromagnetic radiation are absorbed, producing at least one passivation layer, between the lower electrode and the control transistors, and producing, between the control transistors and the external surface of the integrated circuit, a reflective layer capable of reflecting photons not absorbed by the amorphous silicon layers.

Abstract: A method of fabricating a solar cell with a connecting sheet includes a temporary fixing step of bonding at least a portion of a peripheral region of a back electrode type solar cell to a connecting sheet. A method of fabricating a solar cell module includes the step of sealing the solar cell with a connecting sheet obtained by the method on a transparent substrate by a sealing material. A solar cell with a connecting sheet has a first adhesive arranged between a back electrode type solar cell and a connecting sheet, and a second adhesive arranged at least a portion of a peripheral region of the back electrode type solar cell to bond a back electrode type solar cell with a connecting sheet. A solar cell module has the solar cell with a connecting sheet sealed on a transparent substrate by a sealing material.

Abstract: Disclosed is a method for handling a flexible substrate of solar cell. The method includes: providing a flexible substrate; performing static electricity removal and atmospheric pressure plasma cleaning with respect to the flexible substrate; forming a first electrode on the flexible substrate; forming a first conductive semiconductor layer, an intrinsic semiconductor layer and a second conductive semiconductor layer on the first electrode; and forming a second electrode on the second conductive semiconductor layer.

Abstract: Solar cells or photodetectors having one or more single-crystal shell layers conformally deposited on Ge nano-wires are provided. This approach can provide higher efficiency and/or reduced material cost compared to conventional planar approaches for multi-junction solar cells having the same thickness of active solar absorption materials. Shell layers deposited on the Ge nano-wires and including pn junctions can be grown such that they end up with single-crystal faceted tips, which can significantly improve optical collection efficiency and can improve the electron collection efficiency because of the high crystal quality.

Abstract: A method for forming, on a surface of a thinned-down semiconductor substrate, a contact connected to a metal track of an interconnect stack formed on the opposite surface of the thinned-down substrate, including the steps of: forming, on the side of a first surface of a substrate, an insulating region penetrating into the substrate and coated with a conductive region and with an insulating layer crossed by conductive vias, the vias connecting a metal track of the interconnect stack to the conductive region; gluing the external surface of the interconnect stack on a support and thinning down the substrate; etching the external surface of the thinned-down substrate and stopping on the insulating region; etching the insulating region and stopping on the conductive region; and filling the etched opening with a metal.

Abstract: A vacuum chamber structure includes a rotary feedthrough configured on a chamber wall to provide rotational drive to the interior of the structure. The rotary feedthrough includes a gearbox having a housing and a shaft rotationally supported by bearings contained within the housing. A motor is operably coupled to the gearbox housing to drive the shaft, which extends from the gearbox. A seal assembly is operably disposed between the gearbox housing and the chamber wall, with the shaft disposed through the seal assembly and extending through a bore in the chamber wall and into the interior of the structure. The shaft is rotationally supported with bearings only via the bearings in the gearbox housing.

Abstract: A method for forming a photodetector device includes forming an insulator layer on a substrate, forming a germanium (Ge) layer on the insulator layer and a portion of the substrate, forming a second insulator layer on the Ge layer, implanting n-type ions in the Ge layer, patterning the n-type Ge layer, forming a capping insulator layer on the second insulator layer and a portion of the first insulator layer, heating the device to crystallize the Ge layer resulting in an single crystalline n-type Ge layer, and forming electrodes electrically connected to the single crystalline n-type Ge layer.

Abstract: A lead foil loop formation tool includes a pair of rollers.

Abstract: An apparatus for fabricating thin film photovoltaic devices includes a deposition chamber for loading a pair of substrates. Two heater platens in a side-by-side configuration with a middle gap form intimate contact with the pair of substrates. Each heater platen has a second width and a second length respectively made smaller than the first width and the first length to allow the substrate to fully cover the heater platen for preventing formation of edge lip due to coating buildup in a peripheral edge region. The apparatus further includes a shield structure which covers both the middle gap and all outer peripheral side regions of the side-by-side configuration of the two heater platens for preventing coating buildup and guiding a downstream flow.

Abstract: A back-illuminated silicon photodetector has a layer of Al2O3 deposited on a silicon oxide surface that receives electromagnetic radiation to be detected. The Al2O3 layer has an antireflection coating deposited thereon. The Al2O3 layer provides a chemically resistant separation layer between the silicon oxide surface and the antireflection coating. The Al2O3 layer is thin enough that it is optically innocuous. Under deep ultraviolet radiation, the silicon oxide layer and the antireflection coating do not interact chemically. In one embodiment, the silicon photodetector has a delta-doped layer near (within a few nanometers of) the silicon oxide surface. The Al2O3 layer is expected to provide similar protection for doped layers fabricated using other methods, such as MBE, ion implantation and CVD deposition.

Abstract: A method for selectively depositing a thin film structure on a substrate. The method includes providing a process gas to a surface of the substrate and directing concentrated electromagnetic energy from a source of energy to at least a portion of the surface. The process gas is decomposed onto the substrate to form a selectively deposited thin film structure. A thin film device and apparatus for forming a selectively deposited thin film structure are also disclosed.

Abstract: This invention provides an etching composition comprising one or more onium salts selected from the group consisting of iodonium salts and sulfonium and an organic medium. Also provided is a method of making a photovoltaic cell that uses the etching composition to etch the anti-reflection coating and a photovoltaic cell made by this method.

Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.