Abstract: The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. At least one rare earth element, or at least one element selected from the group consisting of Mg, Ca, Ti, Zr, Hf, Li, Na, K, Rb and Cs, or the combination of at least one rare earth element and at least one elemented selected from the above-specified group is incorporated in high-purity copper as a refining component in an amount of 0.1-100 ppm on a weight basis, and the high-purity copper is subsequently refined by zone melting. The very fine wire drawn from the so refined high-purity copper has the advantage that it can be employed in high-speed ball bonding of a semiconductor chip with a minimum chance of damaging the bonding pad on the chip by the ball forming at the tip of the wire.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: A process is disclosed for the preparation of metallic products from metal salts admixed with solvent wherein at least one of the metal salt and the solvent is easily reducible. The admixture is heated under hypercritical conditions of temperature and pressure to produce metallic products and a hypercritical fluid. The hypercritical fluid is subsequently removed from the reaction zone and the metallic product is collected. The metallic product includes pure metals selected from the group of silver, gold, platinum, palladium, ruthenium, rhodium, mercury, arsenic, rhenium, tellurium, iridium, osmium, and copper, and alloys and mixtures thereof. The metallic product ordinarily exists as finely divided powders which may be highly porous.

Abstract: Brazing alloys of copper-indium-titanium alloy can be used to braze ceramic to metal. Other elements such as gold, manganese, palladium, nickel, aluminum, tin singly or in combination can also be added.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: The disclosed electrode composition for a vacuum switch comprises copper, as a principal ingredient, a low melting point metal such as Bi, Pb, In, Li, Sn or any of their alloys, in a content not exceeding 20% by weight, a first additional metal such as Te, Sb, La, Mg or any of their alloys and a refractory metal such as Cr, Fe, Co, Ni, Ti, W or any of their alloys in a content less than 40% by weight.

Abstract: Conductive thick film pigment-coated surfaces which possess desirable conductivity and solderability characteristics are formed from an alloy comprising a mixture of a nonnoble conductive metal, a noble metal and at least one oxidizable material. The oxidizable material is present in the alloy in an amount in the range of from about 5% to about 25% by weight, the nonnoble metal in an amount in the range of from about 94% to about 60% by weight and the noble metal in an amount in the range of from about 1% to about 15% by weight of the alloy. The desired product is prepared by admixing a nonnoble metal, an oxidizable material and a noble metal, arc-melting the mixture to form an alloy, grinding the arc-melted alloy to a powdered form, admixing the powder with the carrier binder, depositing said admixture on an inert surface, firing the admixture and surface in an oxygen-containing atmosphere at a temperature in the range of from about 500.degree. to about 950.degree. C.

Abstract: A process for the formation of copper anodes useful in the electrorefining of copper. Molten partially refined copper is subjected to controlled cooling such that the impurities coalesce into larger agglomerations and in the resulting solid partially refined copper are found segregated at the boundaries of the copper crystals. These larger agglomerations are less susceptible to dissolution in the electrolyte and to deposition or entrainment at the cathode. The process allows the use of a less refined copper starting material to achieve a comparable final cathode copper product.

Abstract: A multicomponent alloy for targets employed in the sputter coating of gold layers, said alloy having 35% to 55%, preferably either 50% or 42%, non-aurous alloy components.

Abstract: Substantially completely deoxidized dispersion strengthened copper leads in incandescent electric lamps.

Abstract: A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.

Abstract: A disposable bed filter for removing particulate matter and/or reducing oxygen in a poured metal melt is located within a trough. The bed filter preferably comprises discrete layers of bed media located in a trough between entry and exit baffle plates. The layers of bed media include a layer of coarse media and a layer of fine media. The trough is preferably provided with a closeable lid to permit removal of the bed media and to compensate for buoyancy of the bed media if present. In its preferred use, the bed filter forms part of a process for making a metal alloy wherein the bed filter simultaneously reduces the oxygen content of the melt and filters particulate matter from the melt.