Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.

Abstract: An optical filter has a substrate, a refractive index adjusting layer on the substrate, a characteristic improving layer having a stress adjustment function on the refractive index adjusting layer, and an optical multilayer film on the characteristic improving layer, wherein the refractive index adjusting layer is constituted by one to three layers, and the characteristic improving layer is a single-layer film whose physical film thickness is 600 nm or more. The optical filter whose substrate has small warpage and which has a good spectral characteristic is provided.

Abstract: The present disclosure relates to a solid-state imaging device, an image pickup apparatus, and an electronic device capable of stably supplying high-speed control signals and clock signals. In the area AD method in which analog-digital conversion of a pixel signal is performed for each ADC area corresponding to a pixel group including a plurality of pixels, a repeater element is regularly arranged in each area group unit including one or more ADC areas, to re-drive control signals for controlling a plurality of the ADC areas. The present disclosure is applicable to a solid-state imaging device.

Abstract: A zoom lens includes in order from an object side: a positive first lens unit not moving for zooming; a negative second lens unit moving for zooming; a negative third lens unit moving for zooming; an intermediate lens group including a lens unit and moving for zooming; and a rear lens group including a lens unit, a lens unit, closest to an object of the zoom lens, not moving for zooming, an aperture stop being placed on a side of the object to or in the rear lens group, a distances between each pair of adjacent lens units changes for zooming, and a distance between the second and third lens units at a wide angle end, a distance between the second and third lens units at a telephoto end, and a maximum distance between the second and third lens units in a certain zoom range are appropriately set.

Abstract: The present disclosure includes systems and methods for detecting and recognizing human gestures or activity in a group of 3D volumes using integral imaging. In exemplary embodiments, a camera array including multiple image capturing devices captures multiple images of a point-of-interest in a 3D scene. The multiple images can be used to reconstruct a group of 3D volumes of the point-of-interest using the images. The system detects spatiotemporal interest points (STIPs) in the group of 3D volumes and assigns descriptors to each of the plurality of STIPs. The descriptors are quantized into a number of visual words to create clusters of the group of 3D volumes. The system builds a histogram for each of the visual words. Each 3D volume is classified using the histogram of the plurality of visual words, implying the classification of a human gesture in each 3D volumes.

Abstract: An image sensor package includes a substrate, an image sensor chip disposed on the substrate, and an external force absorbing layer disposed between the substrate and the image sensor chip and having a first surface and a second surface opposite to the first surface. The image sensor package further includes an adhesive layer configured to bond the second surface of the external force absorbing layer to the substrate. The adhesive layer has a first modulus, and the external force absorbing layer has a second modulus different from the first modulus.

Abstract: A zoom lens includes lens units whose interval between adjacent units is changed during zooming, wherein the lens units consist of, in order from an object side, a positive first unit, an negative intermediate lens group including a unit, a positive (n?1)-th unit, and a positive n-th unit, wherein the first unit moves during zooming, wherein an interval between the (n?1)-th and n-th units is smaller at telephoto end than at wide angle end, wherein the n-th unit includes positive lenses LPL made of a material having proper Abbe number, wherein the n-th lens unit includes a positive lens LPH arranged on the image side of the lenses LPL and made of a material having proper refractive index and wherein a distance between lens surfaces on the most-object side and on the most-image side of the n-th lens unit, and back focus at the wide angle end are properly set.

Abstract: A testing method for splicing screens is provided. The method includes: outputting an image signal to a display screen, wherein the display screen includes a plurality of splicing screens, the image signal includes a plurality of testing sub pictures, the testing sub pictures are arranged correspondingly to the splicing screens so as to enable the splicing screens to display the corresponding testing sub pictures, and the testing sub pictures include testing contents; and testing the splicing screens through the testing contents, wherein the testing contents include a graduation signal, by which an accurate test is performed on the splicing screens.

Abstract: An image reading apparatus including an image reading chip for reading an image, wherein the image reading chip includes: a terminal; a pixel portion that outputs a pixel signal and includes a light-receiving element that receives and photoelectrically converts light from the image; an output circuit that can output a signal based on the pixel signal with one of a plurality of drive capabilities including a first drive capability and a second drive capability that is larger than the first drive capability; and an output selection circuit that, based on a signal input to the terminal, selects the drive capability of the output circuit.

Abstract: The present disclosure relates to a solid-state image sensor, an electronic apparatus and an imaging method by which specific processing other than normal processing can be sped up with reduced power consumption. The solid-state image sensor includes a pixel outputting a pixel signal used to construct an image and a logic circuit driving the pixel, and is configured of a stacked structure in which a first semiconductor substrate including a plurality of the pixels and a second semiconductor substrate including the logic circuit are joined together. In addition, among the plurality of pixels, a specific pixel is connected to the logic circuit independently of a normal pixel, the specific pixel being the pixel that outputs the pixel signal used in the specific processing other than imaging processing in which the image is imaged. The present technology can be applied to a stacked solid-state image sensor, for example.

Abstract: An endoscopy system includes: an image signal generating unit which is connected to one side of a cable, and which includes a signal transmission unit for converting an image signal of inner body according to a protocol for long distance transmission and transmit a converted image signal to thereby send the image signal through a cable; a signal processing unit which is connected to the other side of the cable, and which receives the converted image signal transmitted through the cable and converts the converted image signal into the image signal; a CPU for outputting a user interface for the image signal and an operation control signal according to a handling of the user interface of user; an image processing unit for overlapping the user interface on the image signal output from the signal processing unit and processing the image signal according to the operation control signal.

Abstract: A pixel includes: a photoelectric conversion unit; a charge holding unit; a transfer unit which transfers a charge of the photoelectric conversion unit to the charge holding unit in an on-state; and an overflow control unit which discharges a charge of the photoelectric conversion unit in an on-state. There is a period in which both the transfer unit and the overflow control unit are in an off-state and the photoelectric conversion unit and the charge holding unit respectively hold a charge of a different frame. In a first mode, a first potential barrier is formed, the first potential barrier being lower than a potential barrier formed between the photoelectric conversion unit and the charge holding unit by the transfer unit in an off-state. In a second mode, a second potential barrier that is even lower than the first potential barrier is formed.

Abstract: In a case made of resin and provided with a condensing lens through which light is transmitted, a circuit board on which a photoelectric element to be disposed at the focus position of the condensing lens is accommodated. The circuit board has a through hole through which the light having been transmitted through the condensing lens passes. Furthermore, the photoelectric element is mounted on the back face of the circuit board on the opposite side of the condensing lens and receives the light having passed through the through hole.

Abstract: There is provided a wearable device including an attachment unit, a motion sensor and a control unit. The attachment unit has a display and an imaging unit. The attachment unit is attachable to the user. The motion sensor is capable of detecting a spatial movement of the imaging unit. The control unit determines whether or not the imaging unit is in a predetermined resting state, based on an output of the motion sensor, and when the imaging unit is not in the predetermined resting state, limit a photographing operation of the imaging unit.

Abstract: An optoelectronic sensor (10) is provided for detecting object information from a monitored zone (12) having a light receiver (24); a reception optics (22) associated with the light receiver (24) for generating a light spot on the light receiver (24); and an evaluation unit (26) for generating the object information from a received signal of the light receiver (24). In this respect, a manipulation unit (30) is provided to vary the reception optics (22), the light receiver (24) and/or elements of the reception optics (22) such that the portion of the light spot that is incident on the light receiver (24) varies.

Abstract: An apparatus includes an array of pixels. At least a first pixel in the array of pixels includes a first detector to generate a first electrical signal in response to irradiation by incident radiation, a first transistor electrically coupled to the first detector, and at least one logic gate to implement a Boolean AND logic function. The logic gate includes a first input terminal to receive a first exposure signal, a second input terminal to receive a first reset signal, and an output terminal, electrically coupled to the first transistor, to output to the first transistor a first control signal to variably control a first variable exposure time of the first detector and to reset the first detector.

Abstract: An image sensor includes a pixel array, an analog-to-digital converter (ADC), and a test circuit. The pixel array includes a plurality of pixels arranged in rows and columns. Each pixel generates an analog signal based on incident light. The ADC converts the analog signal to a digital signal using a counter. The test circuit receives a test code in a test mode, generates a count clock signal based on the test code, tests a counting operation of the counter according to the count clock signal, and externally outputs a test result of the counter through a test terminal.

Abstract: An endoscope system includes an image forming section configured to arrange first and second images obtained by picking up images of first and second regions of a subject to be adjacent to each other to form an image of one frame, a light source section configured to emit illumination light based on a brightness evaluation of the image to the first and second regions, a brightness-range calculating section configured to detect minimum and maximum luminance values in the first and second images, and an image processing section configured to perform a luminance shift such that a minimum or maximum luminance value of an image, a luminance range of which is smaller than a predetermined luminance range, among the first and second images coincides with a predetermined luminance lower limit or upper limit value.

Abstract: In an image sensor, some pixels in an array contain a sampling circuit to sample the light intensity and a capacitor to store an analog value representing the intensity at that pixel. Alternatively, a group of pixel circuits will be equipped with such sampling and capacitor circuits. This allows simple redundancy-reducing computations with a relatively simple pixel architecture.

Abstract: Imaging systems and a method of generating an image. One example of an imaging system includes a detection subsystem including a focal plane array (FPA) coupled to a read-out integrated circuit (ROIC), the ROIC being configured to activate a portion of the FPA in a selected pattern during an integration period, an optical scanning subsystem including an optical source and a waveguide, the waveguide being configured to direct optical radiation generated by the optical source within a field of view of the detection subsystem and over an area of a scene, the portion of the FPA activated in the selected pattern corresponding to the area of the scene, and an adaptive polymer lens assembly positioned at an aperture of the imaging system shared by the detection subsystem and the optical scanning subsystem, the adaptive polymer lens assembly being configured to adjust an optical magnification of the scene.

Abstract: A sample-and-hold-circuit includes an amplifier transistor, a resistor connected between a source terminal of the amplifier and a voltage, a first switch connected in parallel with the resistor, and a second switch connected between a gate terminal of the amplifier transistor and the voltage. When the first switch is closed and the second switch is open, the amplifier transistor is in an inversion mode; and when the first switch is open and the second switch is closed, the amplifier transistor is in an accumulation mode.

Abstract: Provided is a head-mounted device that includes a housing, first imaging means, and second imaging means. The housing is to be mounted on the head of a user. The first and second imaging means are mounted on the housing to capture images from different angles of view. The head-mounted device receives an image captured by the first imaging means, detects an image portion corresponding to a body portion of the user from the received image, and estimates, based on information indicative of the detected image portion, a possible existence range of a predetermined part of the body of the user within an image captured by the second imaging means.

Abstract: An image pickup unit includes: an image pickup device on which an image pickup section is formed; a circuit board having a main surface on which a connection terminal electrically connected with the image pickup section is disposed; an intermediate wiring board including a substrate, an adhesive layer and a wiring pattern, in which a first electrode of the wiring pattern is electrically connected with the connection terminal; a cable having a core wire; and a holding substrate configured to hold the core wire with a second electrode and fixed to the intermediate wiring board by the adhesive layer in a state that the core wire and the second electrode are electrically connected by being in close contact.

Abstract: An imaging device (10) is configured by being provided with an image pickup element (40) where an imaging surface (41) having a concave surface facing an object side is formed, an imaging optical system (20) which forms an image on the imaging surface (41) in a range smaller than the imaging surface (41), and an oscillating drive section (30) which oscillating-drives the imaging optical system (20) so that a direction of an optical axis Z of the imaging optical system changes. The imaging element (40) captures a first formed by the imaging optical system (20) with a direction of the optical axis Z set to a first direction and a 2nd formed by the imaging optical system (20) with a direction of the optical axis Z set to a 2nd direction, in different regions in the imaging surfaces (41).

Abstract: It is possible to reduce resistance variations of a member connecting a through-silicon via to a line and improve wiring reliability. A hole through which the through-silicon via is to be stretched is created and an over-etching process is carried out on a wiring layer including the line. Then, by embedding copper in the hole, the through-silicon via made of the copper can be created. After the through-silicon via has been connected to the line made of aluminum through the member which is a connection area, the connection area is alloyed in a thermal treatment in order to electrically connect the through-silicon via to the line. Thus, it is possible to reduce variations of a resistance between the through-silicon via and the line and also improve wiring reliability as well. The present technology can be applied to a semiconductor device and a method for manufacturing the semiconductor device.

Abstract: An electronic device includes a display unit, a bezel portion, and a camera module disposed beneath the bezel portion and provided with a pair of flat surfaces facing each other, wherein the camera module includes a plurality of rim guides each including first and second flat surfaces facing each other, and first and second curved surfaces connecting the first and second flat surfaces, the plurality of rim guides being laminated with forming spaces apart from one another, a plurality of lens portions formed within the plurality of rim guides, respectively, and forming a specific focal length, and an image sensor overlapping the plurality of lens portions and generating an image using light that has passed through the plurality of lens portions.

Abstract: The present disclosure is directed to an image sensor including a pixel array of both range pixels and color pixels. Each range pixel (or range pixel area) may be associated with multiple adjacent color pixels, with each side of the range pixel immediately adjacent to at least two color pixels. The association between the range pixels and the color pixels may be dynamically configurable. The readings of a range pixel(s) and the associated color pixels may be integrated together in the generation of a 3D image.

Abstract: An image sensor includes an optical sensor layer including a plurality of light-sensitive cells configured to sense light to generate electrical signals, and a color filter array layer disposed on the optical sensor layer and including a plurality of color filters respectively facing the plurality of light-sensitive cells. Each of the plurality of color filters includes a nanostructure in which a first material having a first refractive index and a second material having a second refractive index higher than the first refractive index are arranged. The first material and the second material are alternatively positioned at an interval less than a central wavelength of a color of the color filter. Thus, a thin image sensor having good wavelength selectivity and suitable for obtaining high resolution images is provided.

Abstract: A terminal including a light emitting element and at least one sensor and a method of controlling the terminal are disclosed in the present specification. According to one embodiment of the present invention, the terminal includes a camera, a light emitting unit configured to include a plurality of light emitting elements and emit a light to a space corresponding to an image received via the camera, a first sensor configured to sense a pixel-based data, and a controller configured to control a light emitting element to emit a light to a space corresponding to a part of a plurality of the light emitting elements according to a predetermined time or an interval to extract depth information on a part of the image, the controller configured to control the first sensor to sense a pixel data in a manner of being activated according to a light emission time or an interval of the light emitting element.

Abstract: An image synthesis method for a mobile terminal and the mobile terminal are provided. The method includes: performing a phase focusing on an object to be photographed based on a preset pixel of a photosensitive element in the mobile terminal when a user photographs the object to be photographed with the mobile terminal; controlling the photosensitive element to generate a displacement at an initial location to replace the preset pixel by an original pixel, and obtaining a replaced pixel; collecting first photosensitive data of the object to be photographed based on the replaced pixel, and controlling the photosensitive element to return to the initial location; photographing the object to be photographed, and enabling the photosensitive element to collect second photosensitive data of the object to be photographed at the initial location; and synthesizing an image of the object to be photographed according to the first and second photosensitive data.

Abstract: Provided is an array substrate, a photomask, and a display device. The array substrate includes a substrate, a common electrode layer on which a plurality of first via holes are provided at predetermined positions, a passivation layer having a plurality of second via holes disposed concentrically with the first via holes, and a pixel electrode layer having a plurality of pixel electrodes. Areas of the first via holes are configured to gradually decrease in the direction from an output proximal end to an output distal end of a gate line.

Abstract: The present disclosure provides a display panel and a display device including the display panel. The display panel may include a bonding pad having a bonding pad body, a plurality of first bonding pad units, and a plurality of second bonding pad units; the plurality of first bonding pad units and the plurality of second bonding pad units being arranged on both sides of the bonding pad body; wherein the plurality of first bonding pad and the plurality of second bonding pad units are arranged alternately, to form a boundary with a concave and convex changing. By processing the bonding pad to forming the boundary with the concave and convex changing, an area of an overlap where a peripheral circuit is contacted the display panel may be increased, and an efficiency of a production yield of bonding process may be increased and a cost may be reduced.

Abstract: Periods in which first selection transistors of several pixel cells of a plurality of pixel cells are in an on state are overlapped, and periods in which second selection transistors of several other pixel cells of the plurality of pixel cells are in an on state are overlapped.

Abstract: The present technology relates to a signal processing apparatus, a control method, an image pickup element, and an electronic device which make it possible to suppress RTS noise. The signal processing apparatus of the present technology may include an amplifying transistor and a short-circuit unit. The amplifying transistor amplifies a signal input to a gate, and the short-circuit unit is capable of short-circuiting the gate of the amplifying transistor to a potential which reduces a gate-to-source voltage of the amplifying transistor. For example, it is determined whether the amplifying transistor is in a period of a non-operating state, and when the amplifying transistor is determined to be in the period of a non-operating state, the gate of the amplifying transistor may be short-circuited. The present technology can be applied, for example, to an image pickup element and an electronic device.

Abstract: An integrated circuit structure includes a semiconductor substrate, and a dielectric pad extending from a bottom surface of the semiconductor substrate up into the semiconductor substrate. A low-k dielectric layer is disposed underlying the semiconductor substrate. A first non-low-k dielectric layer is underlying the low-k dielectric layer. A metal pad is underlying the first non-low-k dielectric layer. A second non-low-k dielectric layer is underlying the metal pad. An opening extends from a top surface of the semiconductor substrate down to penetrate through the semiconductor substrate, the dielectric pad, and the low-k dielectric layer, wherein the opening lands on a top surface of the metal pad. A passivation layer includes a portion on a sidewall of the opening, wherein a portion of the passivation layer at a bottom of the opening is removed.

Abstract: A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.

Abstract: A multi-camera endoscope includes a the tip section comprising: a front looking camera and a front discrete illuminator to essentially illuminate the field of view of said front looking camera; a right side looking camera and a right discrete illuminator to essentially illuminate the field of view of said right side looking camera; a left side looking camera and a left discrete illuminator to essentially illuminate the field of view of said left side looking camera; and a multi-component cover configured to cover and seal said tip section such as to essentially prevent entry of fluids from the environment of said endoscope to inner parts of said tip section. The tip cover includes removable or repositionable window components which provide access to internal components of the tip for repair or removal, without removing the main tip cover.

Abstract: In an imaging element 28, a first light detecting layer 12 includes organic photoelectric conversion films 38a and 38b oriented in a prescribed axial direction so that it detects a polarized component of incident light which is directed parallel to the orientation axis. The first light detecting layer 12 also has an organic photoelectric conversion film oriented in another axial direction which is arranged in a prescribed pattern on a two-dimensional plane. A second light detecting layer 16 disposed under the first light detecting layer 12 includes photoelectric conversion elements 54a and 54b and detects a polarized component which has passed through the first light detecting layer 12 and which is directed perpendicularly to the orientation axis of the organic photoelectric conversion films 38a and 38b.

Abstract: A method for manufacturing a photoelectric converter includes a first step of preparing a semiconductor substrate including a metal oxide semiconductor (MOS) transistor, a second step of forming a plurality of interlayer insulating films above the semiconductor substrate, and a third step of forming a photoelectric conversion portion above the semiconductor substrate. The second step includes a step of forming a first film containing hydrogen. The third step includes a step of forming a first electrode, a step of forming a photoelectric conversion film, and a step of forming a second electrode. The method includes a step of performing heat treatment between the step of forming the first film and the step of forming the photoelectric conversion film.

Abstract: An imaging device includes: a pixel array section having an array of pixels, each of which has a photoelectric converting device and outputs an electric signal according to an input photon; a sense circuit section having a plurality of sensor circuits each of which makes binary decision on whether there is a photon input to a pixel in a predetermined period upon reception of the electric signal therefrom; and a decision result IC section which integrates decision results from the sense circuits, pixel by pixel or for each group of pixels, multiple times to generate imaged data with a gradation, the decision result IC section including a count circuit which performs a count process to integrate the decision results from the sense circuits, and a memory for storing a counting result for each pixel from the count circuit, the sense circuits sharing the count circuit for integrating the decision results.

Abstract: This disclosure relates to a real-time video extensometer. Typically, the apparatus of the disclosure combines the image source, data processing and electrical output on to a single processing board in order to achieve high frequency images and low latency times on data flow. Further, the video processing engine processes the image on a pixel basis and updating the output the intermediate extension/strain result so that after receipt of the final image pixel, a final extension/strain value is achieved and immediately output for evaluation.

Abstract: The present invention relates to a solid-state imaging apparatus including a first substrate having a plurality of photoelectric conversion units and a second substrate having a plurality of readout circuits. The first substrate is provided with a plurality of first conductive patterns that are electrically separated from one another and the second substrate is provided with a plurality of second conductive patterns that are electrically separated from one another. The first conductive patterns each include a first partial pattern extending in a first direction. The second conductive patterns each include a partial pattern extending in a second direction different from the first direction. The first partial pattern has a length extending in the first direction longer than a length thereof in the second direction.

Abstract: In time-delay-and-integrate (TDI) imaging, a charge-couple device (CCD) integrates and transfers charge across its columns. Unfortunately, the limited well depth of the CCD limits the dynamic range of the resulting image. Fortunately, TDI imaging can be implemented with a digital focal plane array (DFPA) that includes a detector, analog-to-digital converter (ADC), and counter in each pixel and transfer circuitry connected adjacent pixels. During each integration period in the TDI scan, each detector in the DFPA generates a photocurrent that the corresponding ADC turns into digital pulses, which the corresponding counter counts. Between integration periods, the DFPA transfers the counts from one column to the next, just like in a TDI CCD. The DFPA also non-destructively transfers some or all of the counts to a separate memory. A processor uses these counts to estimate photon flux and correct any rollovers caused by “saturation” of the counters.

Abstract: An image pickup apparatus includes an image forming optical system which includes an aperture stop and a plurality of lens components, and an image pickup section which is disposed on an image side of the image forming optical system, and has a light-receiving surface which is not flat and is curved to be concave toward the image forming optical system. The image forming optical system includes a first lens component having a negative refractive power, a second lens component having a positive refractive power, and a third lens component having a positive refractive power. A shape of the first lens component is a meniscus shape, and a shape of the third lens component is a biconvex shape, and the following conditional expressions (1) and (2) are satisfied: 0.7<|PS×Rimg|<1.5??(1), and 0.7<|?out 90/?img 90|<1.5??(2).

Abstract: An imaging lens includes a first lens group and a second lens group, arranged in this order from an object side to an image plane side. The first lens group includes a first lens having positive refractive power, a second lens, and a third lens. The second lens group includes a fourth lens, a fifth lens having negative refractive power, and a sixth lens having negative refractive power. The fourth lens has a convex surface facing the image plane side near an optical axis thereof. The fifth lens has a convex surface facing the object side near an optical axis thereof. The fifth lens has refractive power weaker than those of the fourth lens and the sixth lens. The fourth lens has a specific Abbe's number and the sixth lens has a specific focal length.

Abstract: A comparison circuit that includes an input sampling capacitor and an image sensor including the same are provided. The comparison circuit includes an amplifier configured to receive a pixel signal and a ramp signal to perform a correlated double sampling operation, a first pixel capacitor connected to the amplifier through a first floating node and configured to transmit the pixel signal, a first ramp capacitor connected to the amplifier through a second floating node and configured to transmit the ramp signal, a second pixel capacitor connected in parallel to the first pixel capacitor, and a second ramp capacitor connected in parallel to the first ramp capacitor, wherein the second pixel capacitor is formed between the first floating node and first peripheral routing lines, and the second ramp capacitor is formed between the second floating node and second peripheral routing lines.

Abstract: An optical image capturing system includes, along the optical axis in order from an object side to an image side, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens. At least one lens among the first to the sixth lenses has positive refractive force. The seventh lens can have negative refractive force, and both surfaces thereof are aspheric. At least a surface of the seventh lens has an inflection point. The lenses in the optical image capturing system which have refractive power include the first to the seventh lenses. The optical image capturing system can increase aperture value and improve the imaging quality for use in compact cameras.

Abstract: An image capturing device includes reference pixels arranged in rows and configured to output pixel signals forming address signals indicating the positions of the rows to which the reference pixels belong, and a vertical scanning circuit having control signal output units each provided corresponding to the rows and each configured to output a control signal for controlling effective pixels and reference pixels of a corresponding one of the rows.

Abstract: An image pickup device, an image pickup system, and a movable body that include a conductive line in which a potential changes in a direction opposite to a direction of a change in a potential of a control line used to perform a global electronic shutter operation.

Abstract: A power distribution network is disclosed. The power distribution can be applied to imaging arrays and other circuits that include a large number of conductors that must be driven such that the conductors are biased such that substantially the same current flows in each conductor. The power distribution network includes a plurality of bit lines and a first power connection network. Each bit line is connected to a different location on a first power bus, which is divided into a plurality of first conducting segments. Each first conducting segment is connected to a plurality of the bit lines. Each bit line includes a constant current source that causes a bias current to flow in the bit line and through the first power bus. The first power connection network includes a plurality of conducting paths that connect a corresponding one of the first conducting segments to a first power rail.