Abstract: The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component.

Abstract: The invention relates to a backlighting device (14), particularly for head-up display. Said device includes: at least one light-emitting diode (16), emitting light beams; an optical system (20) for shaping light beams; and a light diffuser (22), receiving the shaped light beams and said diffuser also comprises a heat sink (18) formed of at least two parts including a base plate (50) and at least one strip (52) that is attached onto said base plate. The strip comprises at least one fold (90) for forming at least one cooling fin (80) and at least one area (60) intended for thermal contact with said base plate (50).

Abstract: A heat conductive sheet includes a heat dissipating sheet, a first heat insulating layer provided above the heat dissipating sheet, a first sheet provided above the first heat insulating layer, and a second sheet provided below the heat dissipating sheet. The first sheet includes a first protruding portion protruding from the heat dissipating sheet viewing from above. The second sheet includes a second protruding portion protruding from the heat dissipating sheet viewing from above. A thermal conductivity of the first heat insulating layer is lower than any of a thermal conductivity of the first sheet, a thermal conductivity of the second sheet, and a thermal conductivity of the heat dissipating sheet. The first protruding portion overlaps and the second protruding portion viewing from above.

Abstract: A semiconductor device includes a lead frame. One end portion of the lead frame is disposed outside a case, the other end portion of the lead frame is disposed over a front surface of an insulating board inside the case and near a semiconductor element, and the lead frame is formed in the case. Furthermore, the semiconductor device includes a temperature transducer disposed on a side of the other end portion of the lead frame opposite a laminated substrate and near a side portion of a semiconductor element. As a result, the temperature transducer is disposed near the side portion of the semiconductor element in the semiconductor device. Therefore, the temperature of the semiconductor element is properly detected. In addition, the length in the vertical direction of the case of the semiconductor device is reduced and miniaturization is realized.

Abstract: It is an object of the present invention to provide a semiconductor module that reduces an excessive stress on a sealed object due to the expansion and contraction of a sealing gel to thus improve the reliability. A semiconductor module according to the present invention includes: a semiconductor element bonded to a metal pattern on an insulating substrate contained in a case; a sealing gel sealing the insulating substrate and the semiconductor element within the case; and a sealing-gel-expansion suppressing plate disposed in the upper portion of the sealing gel to be at least partially in contact with the sealing gel. The sealing-gel-expansion suppressing plate includes a surface facing the sealing gel and inclined to the upper surface of the sealing gel.

Abstract: A semiconductor package includes a substrate, through-electrodes penetrating the substrate, first bumps spaced apart from each other in a first direction parallel to a top surface of the substrate and electrically connected to the through-electrodes, respectively, and at least one second bump disposed between the first bumps and electrically insulated from the through-electrodes. The first bumps and the at least one second bump constitute one row in the first direction. A level of a bottom surface of the at least one second bump from the top surface of the substrate is a substantially same as levels of bottom surfaces of the first bumps from the top surface of the substrate.

Abstract: A card-type storage device and a slot device, which are capable of preventing lowering of the reliability due to repeated insertion and removal of the storage device. A card medium includes card thermal contacts each having a contact surface which intersects with a thickness direction of the card medium. A first card upper guide surface restricts the position of the card medium in the thickness direction to a first position. An escape portion restricts the position of the card medium in the thickness direction to a different position from the first position. A second card upper guide surface links the first card upper guide surface and the escape portion.

Abstract: An electromagnetic interference (EMI) shielding apparatus includes a cage structure having an opening at a first end and a second end opposite to first end. The cage structure is configured to contain one or more electrical components that emit electromagnetic energy and a connector for the one or more electrical components. The first end is configured to receive a pluggable module that is to connect to the one or more electrical components. The EMI shielding apparatus further includes a filler assembly disposed in the opening. The filler assembly is biased to close the opening of the cage structure when a pluggable module is not inserted/plugged in the opening.

Abstract: A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.

Abstract: A foldable electronic device includes a upper housing, a lower housing, and at least one energy module which further included thermoelectric materials which may convert heat to electric power. The energy module may supply power to at least one of heat generating component in the portable electronic device. A heat remover composed of graphene may be in thermal contact with the at least one of the components. The heat remover may also disposed over a surface of the energy module and may be formed one or more heat conduction path depends on the position of the upper and lower housings.

Abstract: This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.

Abstract: An actuator includes a shape-memory alloy (SMA), a power supply that transmits electrical current, a heat source positioned proximate to the SMA, a heat sink positioned proximate to the SMA, and a control module. The control module causes the power supply to transmit the electrical current to the heat source in response to receiving a first signal, thereby causing the heat source to heat the SMA via induction heating. The control module also causes the power supply to cease transmitting the electrical current to the heat source in response to receiving a second signal, thereby causing the heat source to stop heating the SMA. The control module also causes the power supply to transmit the electrical current to the heat sink in response to receiving the second signal, thereby causing the heat sink to cool the SMA via magneto-thermal convection cooling.

Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.

Abstract: A system for managing heat transfer is provided by the present disclosure, which in one form includes a cavity having an inner wall portion, at least one heat-generating component disposed within the cavity, and a plurality of heat conducting members disposed adjacent one another. Each heat conducting member includes a resilient core and an outer shell wrapped around at least a portion of the resilient core. The outer shell is made of a material having a relatively high thermal conductivity, and the plurality of heat conducting members are positioned between the heat-generating component and the inner wall portion of the cavity.

Abstract: A method of manufacturing a semiconductor device, including preparing a heat-dissipating base, performing a first initial warping or a second initial warping of the heat-dissipating base, soldering a laminated substrate, including a circuit board provided on an insulating board, on the heat-dissipating base after the first or second initial warping, and soldering a semiconductor chip on the circuit board. The first initial warping includes performing shot peening on the rear surface of the heat-dissipating base to form a hardened layer, and subsequently plating the front and rear surfaces of the heat-dissipating base, including the hardened layer formed thereon, with a metal material. The second initial warping includes plating the front and rear surfaces of the heat-dissipating base with the metal material to form a plating layer, and subsequently performing the shot peening on the rear surface of the heat-dissipating base, including the plating layer formed thereon, with the metal material.

Abstract: In a configuration that a thermal grease is applied between a circuit board having an electronic component mounted thereon and a case body containing the board to thermally connect both by the thermal grease, the application has not been easy since the thermal grease is high in initial viscosity. A thermal grease is made of a material that has a viscosity not impeding applicability at the initial stage (before application), for example, a viscosity of about 50-400 (Pa·s), and that increases to about 600-3,000 (Pa·s) in viscosity after application.

Abstract: A method for fabricating a fan-out wafer level package includes disposing a first semiconductor chip on a dummy substrate, forming a mold substrate on the first semiconductor chip and the dummy substrate, removing the dummy substrate to expose the first semiconductor chip, disposing a second semiconductor chip on the exposed first semiconductor chip, forming an insulating layer on the second semiconductor chip, the first semiconductor chip, and the mold substrate, and forming a plurality of redistribution lines that electrically connects the first semiconductor chip and the second semiconductor chip through the insulating layer.

Abstract: A power supply is provided. The power supply device includes a power module and a capacitor. The power module includes inverting circuitry and is configured to deliver electrical power to an electric machine. The capacitor is disposed adjacent to the power module and is arranged to limit voltage variation at the inverting circuitry input due to ripple current. The inverting circuitry and the capacitor are surrounded by a monolithic non-metal casing that provides voltage isolation between the power module and the capacitor.

Abstract: The present invention relates to graphene and, more particularly, to a method for manufacturing a graphene electromagnetic wave blocking plate capable of blocking electromagnetic waves by using graphene, and a microwave oven using same. The present invention includes: a step of forming a first graphene layer and a second graphene layer above and below a catalytic metal layer; a step of attaching a supporting substrate onto the second graphene layer; a step of forming a pattern on at least either one of the first graphene layer or the catalytic metal layer; and a step of removing the supporting substrate.

Abstract: Air in a thermally insulated space, which has been expanded by heat resulting from heating treatment for curing a thermosetting potting material, is prevented from entering the potting material. A casing has a partition wall that partitions an opening into a heat-generating-electronic-component placement section, where a heat generating electronic component is placed, and an adjacent section that is adjacent to the heat-generating-electronic-component placement section, when a heat releasing member is fixed to the opening. The heat-generating-electronic-component placement section is filled with a thermosetting potting material for moisture prevention up to a height which allows at least the heat generating electronic component to be buried in the potting material. The adjacent section has in the casing a communicating portion that communicates with a position which is apart from the heat-generating-electronic-component placement section filled with the potting material.

Abstract: Disclosed is a housing for a portable handheld electronic device such as a cellphone. The device has a housing, having a left side and right side. The housing can be layered, such as in a sandwich configuration. The layers can be secured together via one or more fasteners that extend through at least front and rear plates of the housing.

Abstract: The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.

Abstract: Methods and systems for attaching a device to a substrate for operation of the device under variable conditions includes attaching a device to a substrate, disposing a removable material over a first portion of the device, positioning a second portion of the device adjacent to the substrate, operably attaching a retainer to the substrate adjacent to the device with a part of the retainer disposed over the removable material, and removing the removable material to form a gap between the device and the retainer so that the device is retained on the substrate, and wherein the gap allows the device to move freely relative to the retainer and the substrate in response to changes in temperature.

Abstract: An assembly for providing electromagnetic interference (EMI) shielding and for dissipating heat from electronic components. The assembly including: a metallic frame including a wall extending upwardly from a circuit board; an EMI shield having a top with holes and having sidewalls that surround the top, extend downwardly, and are attachable to the wall of the frame in a first latched position and in a second, un-latched position; a layer of thermally-conductive, viscous heat sink grease on the top of the EMI shield and filling holes in the top of the EMI shield, heat sink grease in the holes being in direct physical contact with the top surface of the at least one electronic component when the EMI shield is in the second, un-latched position; and a heat sink on top of and in direct physical contact with the heat sink grease on top of the EMI shield.

Abstract: A digital video camera, including a heat management system, which includes at least one inlet and at least one outlet in the housing to enable air to flow through the housing. The heat management system also includes a first heat sink thermally connected to an image sensor(s), and a second heat sink thermally connected to a data processing unit(s), and a centrifugal fan. The centrifugal fan is configured to draw air into the front of the fan in an axial direction and push air radially out in a sideways direction, whereby air travels through the inlet(s) over the first heat sink and then over the second heat sink to the outlet(s).

Abstract: A method of controlling corrosion in a subsea pipeline is disclosed which includes supplying a low dose inhibitor stream (LDHI) comprised of a quaternary amine and drying with a desiccant.

Abstract: A circuit substrate includes a core substrate having a cavity, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating resin layer and laminated on a first surface of the core substrate such that the insulating resin layer is covering a first surface of the metal block in the cavity, and a second build-up layer including an insulating resin layer and laminated on a second surface of the core substrate such that the insulating resin layer is covering a second surface of the metal block in the cavity. The second build-up layer includes via conductors connected to the second surface of the metal block and common lands connecting the via conductors in parallel.

Abstract: In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A? and 95B? within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.

Abstract: A device includes: a substrate; a heat-generating component which is mounted on a first surface of the substrate; a heat sink which is thermally coupled with the heat-generating component; and a frame which is attached on the first surface of the substrate. The heat sink includes a first fin extending in a direction away from the first surface, and the frame includes a second fin which is arranged on the frame, and the second fin extends in a direction away from the first surface. The first fin extends higher than bottom side of the second fin toward top side of second fin.

Abstract: Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.

Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.

Abstract: A system for cooling a heat producing device is provided. The system can include an air mover (110) wherein at least a portion of the discharge airflow (115) is directed radially outward. The system can also include a thermal conduit (120) and a thermal member (130). The thermal member can have a first surface (135), a second surface (140) and at least one integrally formed heat exchange surface (150). At least a portion of the heat exchange surface (150) can be at least partially disposed in the air mover discharge airflow (115). At least a portion of the first surface (135) can be disposed proximate the thermal conduit (120). At least a portion of the second surface (140) can be disposed proximate the air mover (110).

Abstract: A power-supply device including: a casing having a space therein and formed by metal stamping or having a thickness ranging from 0.3 to 3.0 mm; and a circuit board disposed inside the casing, wherein the casing includes a casing portion having an opening, and a cover portion disposed to cover the opening of the casing portion, the casing portion has a through hole formed at a position corresponding to a connector terminal connected to the circuit board, and a non-flat portion is provided to a region having a size greater than or equal to an outside diameter of a connector of an external connector line connected to the connector terminal in the casing portion.

Abstract: Radio frequency system (250) which includes a first and second sub-assembly (100, 200), each formed of a plurality of layers of conductive material (504, 508, 516) disposed on a substrate (102) and arranged in a stack. The stacked layers form signal processing components (108, 110) and at least one peripheral wall (104, 204) surrounding a walled area (118, 218) of each substrate. The second sub-assembly is positioned on the first sub-assembly with a first walled area of a first substrate aligned with a second walled area of a second substrate.

Abstract: Disclosed herein are a device having an embedded heat spreader and method for forming the same. A carrier substrate may comprise a carrier, an adhesive layer, a base film layer, and a seed layer. A patterned mask is formed with a heat spreader opening and via openings. Vias and a heat spreader may be formed in the pattern mask openings at the same time using a plating process and a die attached to the head spreader by a die attachment layer. A molding compound is applied over the die and heat spreader so that the heat spreader is disposed at the second side of the molded substrate. A first RDL may have a plurality of mounting pads and a plurality of conductive lines is formed on the molded substrate, the mounting pads may have a bond pitch greater than the bond pitch of the die contact pads.

Abstract: A semiconductor device has a first semiconductor die stacked over a second semiconductor die which is mounted to a temporary carrier. A plurality of bumps is formed over an active surface of the first semiconductor die around a perimeter of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. A plurality of conductive vias is formed through the encapsulant around the first and second semiconductor die. A portion of the encapsulant and a portion of a back surface of the first and second semiconductor die is removed. An interconnect structure is formed over the encapsulant and the back surface of the first or second semiconductor die. The interconnect structure is electrically connected to the conductive vias. The carrier is removed. A heat sink or shielding layer can be formed over the encapsulant and first semiconductor die.

Abstract: A housing arrangement of a power electronics device includes one power module or several identical power modules, each module with at least one part connected to a hazardous voltage, the arrangement further including a housing part having room for at least one power module. Each power module includes an enclosure part which essentially surrounds the power module and includes electrically insulating material. All the external connections of the power module are placed on one single wall of the enclosure part. The power modules and the enclosure part of the power modules are arranged such that when the power module is installed to the housing part the power module is electrically insulated from the housing part and external connections of the power module are directed to the front side of the housing part.

Abstract: A lithium ion battery pack includes a plurality of prismatic lithium polymer cells and one or more graphite heat spreaders. Each spreader has at least two major surfaces and is made of one of a sheet of a compressed mass of exfoliated graphite particles, a graphitized polyimide sheet, or combinations thereof.

Abstract: A microphone holder holds a microphone in which an upper surface and a lower surface of a step portion are formed on an outer surface of a housing, and the microphone holder includes: a holder which is formed in a cylindrical shape having openings on upper and lower sides and in which a plurality of through passages penetrating a wall of the cylindrical shaped body is provided; a sliding portion provided movably in a circumferential direction along the openings of the holder; a lock ring configured to cover the through passage formed to the holder, from an outer side by a lock plate extending from the sliding portion; and a contact member which is movably held in the through passage and can contact on an upper surface side of the step portion of the microphone.

Abstract: There is provided a power module semiconductor device allowing reduction in size and weight of a thin type SiC power module. The power module semiconductor device includes: a ceramic substrate; a first pattern of a first copper plate layer disposed on a surface of the ceramic substrate; a first semiconductor chip disposed on the first pattern; a first pillar connection electrode disposed on the first pattern; and an output terminal connected to the first pillar connection electrode.

Abstract: A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.

Abstract: Package substrates are provided. The package substrate may include a power line and a ground line on a first surface of a substrate body; a plurality of signal lines on the first surface between the power line and the ground line; and a lower ground pattern and a lower power pattern positioned on a second surface of the substrate body opposite to the first surface. The lower ground pattern may be disposed to be opposite to the power line and the lower power pattern may be disposed to be opposite to the ground line. Related semiconductor packages are also provided.

Abstract: A portable electronic device and a battery pack for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) in which at least one electronic component is disposed, and a battery pack including a heat conductor separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell.

Abstract: A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.

Abstract: A structure is provided for a PCU (power control unit) in which components secured inside a casing are electrically connected to electronic components on a circuit substrate by a connector, the structure being adapted to maintain the orientation of the circuit substrate to remove the circuit substrate from the casing or to mount the circuit substrate to the casing. Direction control pins are fitted into cover securing holes provided in the casing to secure a cover to the casing. A gripping jig includes grips for gripping the circuit substrate and guide holes into which the direction control pins are inserted. The direction of movement of the gripping jig is controlled by the direction control pins inserted into the guide holes.

Abstract: Disclosed herein are a variety of embodiments of a thermal interface material that may be used in a variety of systems and methods to improve heat transfer. One embodiment consistent with the present disclosure includes a heat dissipation system that includes a heat source and a heat sink. A thermal interface material may be at least partially disposed between the heat source and the heat sink. The thermal interface material may include a plurality of strands of thermally conductive material woven into a pattern. The thermal interface material may be configured to conform to the contact surfaces of the heat source and the heat sink to thereby increase transference of heat between the heat source and the heat sink.

Abstract: A sheet-like heat pipe for a heat-generating element, which is intended to make an electronic device more compact, more lightweight, and thinner, while also reducing costs, is provided. A sheet-like heat pipe (10) of the present invention includes a container (17) in which the peripheries of the sheet-like members (11, 12) disposed facing each other are bonded to form a cavity inside, and a working liquid which is enclosed in a cavity (15) of the container (17). At least one of the sheet-like members (11, 12) disposed facing each other is formed with protruding pieces (12A, 12B) which project outwards from the bonded part with the other sheet-like member and have a spring structure which causes the container (17) to elastically abut a heat-generating element (5) of an electronic device.

Abstract: A system and method for cooling electronic devices disposed with the inner volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The inner volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the module device, the heat sink having a body defining one or more second receiver members configured to receive the one or more first receiver members, the one or more second receiver members having a second part of the fastening system that couples with the first part of the fastening system.

Abstract: In one general embodiment, a system includes a first end having a plurality of first contacts configured for coupling with a circuit device, and a second end having a plurality of second contacts configured for coupling directly with a card edge of an electronic device. The system also includes a plurality of leads extending between the first and second contacts. A heat spreader plate extends along the leads between the first and second ends, the heat spreader plate having at least one of: a conducting pad extending beyond the first end and a conducting pad extending beyond the second end.