Abstract: Electronic module comprising a protective casing defining an internal volume and an electronic board placed in the internal volume, the electronic module comprising: means, for detecting a predetermined environmental condition of the internal volume, means for generating a cool zone inside the internal volume, which means are arranged such that the cool zone is separated from the electronic board; a control unit that is linked to the means for detecting an environmental condition and to the means for generating a cool zone and arranged to trigger the means for generating a cool zone when the means for detecting a predetermined environmental condition in the internal volume detect an environmental condition that is liable to result in the moisture in the air contained in the internal volume condensing on the electronic board.

Abstract: A heat sink and power interconnect for a UV LED array are provided. A first circuit is disposed on a surface of a first substrate. A UV LED array is positioned thereon. A second substrate and second circuit are spaced apart from the first substrate and a first heat sink is positioned adjacent thereto. An aperture passes through each of the first substrate, the second substrate, and the heat sink. An electrical insulator lines the aperture with an electrically and thermally conductive liner positioned adjacent to the electrical insulator. A fastener is positioned in the aperture and electrically interconnects the first circuit and the second circuit through the electrically and thermally conductive liner and electrically communicates with an external power supply. The fastener carries one or more of a power or an electrical signal, and dissipates heat through the electrically and thermally conductive liner to the heat sink.

Abstract: Electrical connectors including superelastic components. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. A connector can include one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members may deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.

Abstract: The present disclosure discloses a process of processing a middle frame of a mobile phone, which includes: providing at least two metal components, each of the metal components defining a riveting groove; providing a metal middle plate having a riveting projection at edges thereof; correspondingly mounting each of the metal components on the edges of the metal middle plate to form a border frame surrounding the metal middle plate, respectively; the riveting projection being received in the riveting groove of the metal component, the riveting projection being in clearance fit with the riveting groove; and applying a force to the border frame to deform at least one of the riveting groove and the riveting projection, such that the riveting projection is latched in the riveting groove, and the border frame and the metal middle plate are connected to form the middle frame of the mobile phone.

Abstract: The present disclosure relates to conductive cooling of a small form-factor pluggable (SFP) transceiver. For example, an SFP transceiver assembly may include a cooling block and a thermally conductive pad having a thermally conductive material. The SFP transceiver assembly may include a spring finger that contacts the thermally conductive pad while the SFP transceiver is inserted into the SFP transceiver assembly to allow heat to be conducted from the SFP transceiver to the cooling block via the thermally conductive pad to conductively cool the SFP transceiver.

Abstract: A cooling apparatus for a power semiconductor includes a cooler having a cooling path so that a cooling medium flows therein, and an auxiliary cooling plate of a multi-layered structure joined to a surface of the cooler with which the power semiconductor comes into contact. A method of manufacturing the cooling apparatus includes providing an auxiliary cooling plate of a multi-layered structure, providing a cooler having a cooling path so that a cooling medium flows therein, and joining the auxiliary cooling plate to a surface of the cooler with which the power semiconductor comes into contact, wherein the providing a cooler and the joining the auxiliary cooling plate are performed together in the same brazing process, so that a manufacture of the cooler and the joining the auxiliary cooling plate are simultaneously performed.

Abstract: An insulated housing, in a cylindrical structure, includes an inner metal layer, an insulating layer and an outer metal coating. The insulating layer is positioned between the inner metal layer and the outer metal coating. In any end of the cylindrical structure, both a distance from the end of the inner metal layer to the end of the cylindrical structure and a distance from the end of the outer metal coating to the end of the cylindrical structure are not equal to zero, and the distance from the end of the inner metal layer to the end of the cylindrical structure is larger than the distance from an end of the outer metal coating to the end of the cylindrical structure. The inner metal layer is composed of one first metal cylinder and two second metal cylinders respectively disposed on the both ends of the first metal cylinder.

Abstract: Hot-pluggable optical modules for high-density optical signaling are provided. The modules comprise a dual-purpose heat spreader configured to function as a thermal component and including trenches accommodating optical infrastructure. The dual-purpose heat spreader includes a trench for routing optical fibers to and from a plurality of optical connectors, each disposed on a branch of the fiber harness assembly and configured to mate with a socket on a module board through an opening in the dual-purpose heat spreader.

Abstract: The present invention relates to a fixing apparatus for fixing one or more printed circuit boards to a housing wall having a frame part that comprises at least one locking means for fixing the frame part to the housing wall and at least one wedge body displaceably supported within the frame part, wherein the wedge body is displaceable into a position relative to the frame part in which a compressive force applied to the frame part by the wedge body deforms the outer frame wall at least regionally outwardly.

Abstract: A semiconductor baseplate is disclosed. Specific implementations of a baseplate may include a planar portion including a plurality of recesses therein, the planar portion may be made of a first material, and a plurality of pegs where each peg of the plurality of pegs may be configured to fit within each recess of the plurality of recesses, the plurality of pegs may be made of a second material, where the first material and the second material may be bonded together.

Abstract: Encapsulated stress mitigation layers and assemblies having the same are disclosed. An assembly that includes a first substrate, a second substrate, an encapsulating layer disposed between the first and second substrates, and a stress mitigation layer disposed in the encapsulating layer such that the stress mitigation layer is encapsulated within the encapsulating layer. The stress mitigation layer has a lower melting temperature relative to a higher melting temperature of the encapsulating layer. The assembly includes an intermetallic compound layer disposed between the first substrate and the encapsulating layer such that the encapsulating layer is separated from the first substrate by the intermetallic compound layer. The stress mitigation layer melts into a liquid when the assembly operates at a temperature above the low melting temperature of the stress mitigation layer and the encapsulating layer maintains the liquid of the stress mitigation layer within the assembly.

Abstract: An elastic heat-dissipation structure comprises a porous elastic member, a plurality of first thermal conductive members, and a plurality of second thermal conductive members. The first thermal conductive members and the second thermal conductive members are mixed in the porous elastic member. Each first thermal conductive member has a maximum width ranged from 5 ?m to 50 ?m, each second thermal conductive member has a maximum width ranged from 0 ?m to 5 ?m, and the thicknesses of each first thermal conductive member and each second thermal conductive member ranges from 0.3 nm to 30 nm. When the density of the elastic heat-dissipation structure is between 0.1 g/cm3 and 1.0 g/cm3, the contained percentages of the first thermal conductive members and the second thermal conductive members range from 0.01% to 20%. An electronic device containing the elastic heat-dissipation structure is also disclosed.

Abstract: A card-type storage device and a slot device, which are capable of preventing lowering of the reliability due to repeated insertion and removal of the storage device. A card medium includes card thermal contacts each having a contact surface which intersects with a thickness direction of the card medium. A first card upper guide surface restricts the position of the card medium in the thickness direction to a first position. An escape portion restricts the position of the card medium in the thickness direction to a different position from the first position. A second card upper guide surface links the first card upper guide surface and the escape portion.

Abstract: Disclosed herein is a ceramic circuit substrate for a power module obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively. Also disclosed herein are methods for manufacturing a ceramic circuit substrate for a power module.

Abstract: An electronic device includes a component, a resin film formed to the component, and a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component, wherein a first portion of each of the carbon nanotubes is covered with the resin film, the first portion has a first length which is greater than a thickness of the resin film, and an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin.

Abstract: Methods of manufacturing semiconductor packages. Implementations may include: providing a substrate with a first side, a second side, and a thickness; forming a plurality of pads on the first side of the substrate; and applying die attach material to the plurality of pads. The method may include bonding a wafer including a plurality of semiconductor die to the substrate at one or more die pads included in each die. The method may also include singulating the plurality of semiconductor die, overmolding the plurality of semiconductor die and the first side of the substrate with an overmold material, and removing the substrate to expose the plurality of pads and to form a plurality of semiconductor packages coupled together through the overmold material. The method also may include singulating the plurality of semiconductor packages to separate them.

Abstract: A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability.

Abstract: A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.

Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.

Abstract: The invention relates to a component carrier for an electronic device, the component carrier comprising at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, characterized in that the heat spreader layer forms at least an outside section of a casing of said electronic device. Also an electronic device that comprises at least one component carrier according to the invention, as well as a method to produce a respective component carrier are indicated.

Abstract: Methods of manufacturing semiconductor packages. Implementations may include: providing a substrate with a first side, a second side, and a thickness; forming a plurality of pads on the first side of the substrate; and applying die attach material to the plurality of pads. The method may include bonding a wafer including a plurality of semiconductor die to the substrate at one or more die pads included in each die. The method may also include singulating the plurality of semiconductor die, overmolding the plurality of semiconductor die and the first side of the substrate with an overmold material, and removing the substrate to expose the plurality of pads and to form a plurality of semiconductor packages coupled together through the overmold material. The method also may include singulating the plurality of semiconductor packages to separate them.

Abstract: A force detector includes a first substrate, a second substrate, a circuit board provided between the first substrate and the second substrate, and an element mounted on the circuit board and outputting a signal in response to an external force, wherein a hole is formed in the circuit board at a location where the element is placed, and a first convex part inserted into the hole and protruding toward the element is provided on the first substrate. Further, the element is placed within a periphery of the first convex part as seen from a direction perpendicular to the first substrate.

Abstract: A method for manufacturing a metallic nanospring includes preparing a nanotemplate having a nanopore and including a working electrode disposed on its one surface, preparing a first metal precursor mixture including ascorbic acid (C6H8O6), vanadium (IV) oxide sulfate (VOSO4.xH2O), and a metal precursor solution including a metal desired to be deposited, preparing a second metal precursor mixture by mixing the first metal precursor mixture with nitric acid (HNO3), depositing a metallic nanospring into the nanopore using electrodeposition by dipping the nanotemplate into the second metal precursor mixture and applying current between a counter electrode inserted into the second metal precursor mixture and the working electrode, and selectively removing the working electrode on the nanotemplate with the deposited metallic nanospring and the nanotemplate.

Abstract: An intake structure for an internal combustion engine of a vehicle comprises an intake passage member (25) internally defining an intake passage (40) having an air inlet (40A) and an air outlet (40B); and a PCU (14) provided in an engine room of the vehicle and provided with a cooling device for cooling the PCU (14). The intake passage member is provided in proximity of the onboard device for favorable heat transfer between the PCU and the intake passage member.

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip, an encapsulant covering at least portions of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The heat dissipation member has a thickness greater than that of the semiconductor chip.

Abstract: A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.

Abstract: System, methods, and other embodiments described herein relate to directing thermal energy within a photonic device. In one embodiment, the photonic device includes an optical component that is temperature sensitive and that provides a different response to light propagated within the optical component according to a present temperature of the optical component. The photonic device includes a heat source disposed at a separating distance from the optical component and that produces thermal energy within the photonic device. The photonic device includes a first thermal guide disposed proximate to the optical component and the heat source and spanning the separating distance. The first thermal guide concentrating the thermal energy from the heat source to the optical component.

Abstract: An intelligent power module and a manufacturing method thereof are provided. The intelligent power module includes a radiator, an insulating layer, a circuit wiring, a circuit component and a metal wire. At least part of a lower surface of the radiator is defined as a heat dissipating area, the heat dissipating area is provided with a heat dissipating corrugation, the insulating layer is provided to an upper surface of the radiator, the circuit wiring is provided to the insulating layer, and the circuit component is provided to the circuit wiring and is connected to the circuit wiring via the metal wire.

Abstract: An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.

Abstract: Provided is a circuit assembly including: a circuit board; a bus bar having a top face fixed to a bottom face of the circuit board; an electronic component disposed on a top face of the bus bar; a heat dissipation member disposed on a bottom face of the bus bar; a heat transfer member interposed between the bus bar and the heat dissipation member, to transfer heat of the bus bar to the heat dissipation member; and a screw extending through a stack of the circuit board and the bus bar, the screw screwed to the heat dissipation member, fixing the stack to the heat dissipation member; and a spacer interposed between the circuit board and the heat dissipation member, the spacer surrounding at least a portion of an outer circumference of a shaft portion of the screw, and maintaining a thickness of the heat transfer member substantially uniform.

Abstract: A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.

Abstract: An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.

Abstract: Over-molded IC package assemblies including an embedded voltage reference plane and/or heat spreader. In some embodiments, an over-molded package assembly includes a IC chip or die coupled to one or more metal distribution layer or package substrate. A molding compound encapsulates at least the IC chip and one or more conductive layers are embedded within the molding compound. The conductive layers may include an interior portion located over the IC chip and a peripheral portion located over the redistribution layers or package substrate. The interior portion may comprise one or more heat conductive features, which may physically contact a surface of the IC chip. In some further embodiments, the peripheral portion comprises one or more electrically conductive features, which may physically contact a surface of the package redistribution layers or package substrate to convey a reference voltage.

Abstract: The disclosure provides a retainer which is configured to be mounted on and fix heat dissipation module onto chip platform. The retainer includes pressing portion, first and second latching portions. The first latching portion includes flat portion and flexible curved portion, the flexible curved portion is connected between the pressing portion and the flat portion, long side of the flat portion is substantially perpendicular to a long side of the pressing portion. The second latching portion is connected to the pressing portion. A long side of the second latching portion is substantially perpendicular to the long side of the pressing portion. The first portion and the second latching portion are configured to be detachably engaged at two opposite sides of the chip platform so as to deform the flexible curved portion and utilize the flexible curved portion to enhance a pressing force applied to the heat dissipation module.

Abstract: A display device includes a light source, a reflection sheet, a display panel, and a supporting unit. The reflection sheet reflects light from the light source. The supporting unit supports the reflection sheet. The supporting unit has a first protruding portion that contacts with a first area of a rear facing surface of the reflection sheet within a predetermined distance from a center portion of the reflection sheet, a second protruding portion that contacts with a second area of the rear facing surface of the reflection sheet that is spaced apart from the first area and a third protruding portion that contacts with a third area of the rear facing surface of the reflection sheet that is spaced apart from the first and second areas, the third area being located between the first and second areas.

Abstract: A display device includes a display panel, a light source, a reflection sheet, and a supporting unit. The supporting unit has a first protruding portion that contacts with a first area of a rear facing surface of the reflection sheet, a second protruding portion that contacts with a second area of the rear facing surface, a third protruding portion that contacts with a third area of the rear facing surface and a fourth protruding portion that contacts with a fourth area of the rear facing surface. The first, second, third and fourth areas are spaced apart from a center portion of the reflection sheet. The first and second areas are spaced apart from each other in a first direction. The third and fourth areas are spaced apart from each other in a second direction that is perpendicular to the first direction.

Abstract: In accordance with an embodiment, a welding assembly is disclosed that allows for a laser assembly to be coupled into a socket of the same and held at a fixed position, e.g., by a mechanical grabber of a welding system. The mechanical grabber may then travel along one or more axis to bring the TOSA module into mechanical alignment with an opening of an associated optical subassembly housing. The welding assembly may further include an alignment member that provides one or more alignment contact surfaces configured to be brought directly into contact with a surface of the associated subassembly housing. When the one or more alignment contact surfaces are “flush” with the surface of the subassembly housing the emission face of the TOSA module is substantially parallel, and by extension, optically aligned with the opening of the associated subassembly housing.

Abstract: A device comprises a first chip comprising a first connection pad embedded in a first dielectric layer and a first bonding pad embedded in the first dielectric layer, wherein the first bonding pad comprises a first portion and a second portion, the second portion being in contact with the first connection pad and a second chip comprising a second bonding pad embedded in a second dielectric layer of the second chip, wherein the first chip and the second chip are face-to-face bonded together through the first bonding pad the second bonding pad.

Abstract: The power module in which a plurality of switching elements connected in series between a first and second power terminals and a circuit configured to connect connecting points thereof to an output terminal are formed, the power module includes: a heat sink to which the switching elements are contacted; a package configured to seal a perimeter of the plurality of switching elements and a part of each terminal so as to expose at least one portion of the heat sink; and a protruding portion for thickness control configured to regulate a thickness of a thermally-conductive material when contacting the heat sink to the cooling apparatus facing the cooling apparatus via the thermally-conductive material, wherein each terminal is exposed from opposite side surfaces of the package, the opposite side surfaces having a height different from a height of an exposed surface of the cooling apparatus of the package.

Abstract: A power converter may include a first and second housings, each of which houses switching elements connected in parallel. Each of the first and the second housings may be provided with a first surface and a second surface. The first and the second housings may be arranged face to face. In each of the first and the second housings, the switching elements may be aligned in an alignment direction which is parallel to both of the first and the second surfaces. An emitter terminal or a source terminal of parallel connection of the switching elements may extend from the second surface at a position equidistant from the switching elements positioned at both ends in the alignment direction among the plurality of switching elements. A collector terminal or a drain terminal of the parallel connection may be positioned adjacent to the emitter or the source terminal in the alignment direction.

Abstract: An illuminant with at least two LEDs mounted on mutually opposite sides of a support plate and a reflection surface formed as a concave mirror, in which concave mirror the LEDs are arranged, wherein a housing part of the illuminant made of a transparent housing material is provided, which housing part at the same time forms an in relation to the main propagation direction lateral external surface of the illuminant and supports a reflecting layer forming the reflection surface at an internal surface opposite to the external surface.

Abstract: Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz?3.6 ?m, and Sz/Sa?14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours.

Abstract: A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.

Abstract: A method of manufacturing a heat dissipating device includes steps of providing a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a collar portion, with the through hole formed on the fin body, with the collar portion extending from a periphery of the through hole and having a first U-shaped protruding ear, with the first U-shaped protruding ear having a first opening, with the heat pipe having a heat dissipating end and a heat absorbing end, and with the heat dissipating end opposite to the heat absorbing end; inserting the heat dissipating end into the through hole and the collar portion; and punching the collar portion to shrink the first opening of the first U-shaped protruding ear, such that the collar portion fixes the heat dissipating end in a tight-fitting manner.

Abstract: A circuit board includes a heat storage body, an insulating layer provided on the heat storage body, a wiring board provided on the insulating layer, and a heat generating component provided on the wiring board. The insulating layer is provided independently of the wiring board. The wiring board is provided with a heat transfer metal portion penetrating through the wiring board and facing the heat generating component. The insulating layer is provided with a heat transfer resin portion penetrating through the insulating layer and facing the heat transfer metal portion. The heat transfer resin portion and a part of the insulating layer are interposed between the heat transfer metal portion and the heat storage body.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface attached to the second surface of the electronic device.

Abstract: A display device comprises a light source, an optical member, a display panel, and a frame. The frame supports the display panel. The frame has a first protruding portion that contacts with an area of a rear facing surface of the optical member within a predetermined distance from a center portion of the optical member. The first protruding portion has an overall rectangular shape with a step part at at least one corner of the overall rectangular shape.

Abstract: The present disclosure relates to a closed type display apparatus. In an embodiment, the closed type display apparatus includes a front housing, a rear housing, and a closed space which is defined by the front housing and the rear housing and in which first and second circuit boards used in the display apparatus are disposed; wherein, a metal cover is formed as at least a portion of the rear housing, and a higher heating device of the first circuit board is disposed to be adjacent to the metal cover. The present disclosure also relates to a method of assembling a closed type display apparatus.