Abstract: An electrical connector module for electrically connecting at least one connector to a printed circuit board of an electronic device includes at least one shielding jack having a top wall, two opposite side walls and at least one common wall. The walls of the shielding jack collectively define at least a slot therewithin for receiving the connectors and a front end and an opposite rear end. The slot is divided by the common wall. The side walls and the common wall have a plurality of press fit terminals extending toward the circuit board. The common wall has a plurality of offset latch arms engaged with different connectors. When the connectors are inserted to the slots, the offset latch arms respectively secure the connectors in the corresponding slots.

Abstract: A power electronics assembly for a magnetic resonance device includes a housing and at least one printed circuit board (PCB) arranged in the housing with at least one power electronics component to be cooled. The PCB has an at least one millimeter thick backside layer that may be made of copper. The power electronics assembly also includes a stabilizing cooling plate configured as part of the housing and/or the housing includes at least one coolant channel open on at least one side, so that the PCB mounted on the cooling plate comes into direct contact with coolant guided in the coolant channel in an area of the power electronics components with the backside layer.

Abstract: According to one embodiment, a semiconductor module includes a substrate, which has a first surface and a second surface opposite to the first surface, a controller device and a memory device formed on the first surface, and a metal plate bonded on the second surface. The metal plate is formed at least at a portion of the second surface corresponding to the controller device so that heat generated at the controller device conducts away from the memory device.

Abstract: A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.

Abstract: An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device.

Abstract: A semiconductor module has a first substrate and a second substrate placed opposite to the first substrate. A first semiconductor element is provided such that the high-heat main face of the first semiconductor faces the second substrate and is thermally connected to the second substrate via a wiring layer. A second semiconductor element is provided such that the high-heat main face of the second semiconductor faces the first substrate and is thermally connected to the first substrate via another wiring layer. The emitter electrode of the first semiconductor element and the collector electrode of the second semiconductor element are electrically connected to each other via a heat spreader.

Abstract: A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and electrically conductive legs, each of the legs attached to a respective one of the contact pads, and an encapsulating material formed around the substrate, the IC die, and a portion of the legs. A contact end of each of the legs is exposed, and one of the contact ends conducts a signal from a transistor in the IC die.

Abstract: A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.

Abstract: A protective enclosure for an electronic device can include a structural layer having a plurality of openings. The structural layer can provide rigidity to the protective enclosure. The protective enclosure can include a flexible cushion layer disposed over an outer surface of the structural layer. The flexible cushion layer can provide cushioning to the protective enclosure and can include a plurality of protrusions extending through the plurality of openings in the structural layer inward toward an interior of the protective enclosure. The plurality of protrusions can be configured to make contact with an electronic device when installed in the protective enclosure.

Abstract: A structurally compact connector that dissipates heat quickly and efficiently is disclosed. The connector includes a housing having a plug receiving space. An elastic member is positioned on the housing, and is displaceable outward from the housing. A protrusion is positioned on an inner surface of the elastic member and extends into the plug receiving space. A thermally conductive element is disposed on an outer surface of the elastic member and is contactable with a heat sink positioned outside of the housing.

Abstract: A card edge connector includes a connector including a target engagement part, a substrate that can be inserted into and removed from the connector, a fixing part fixed to the substrate, and a lock that secures the substrate to the connector. The lock includes a shaft fixed to the fixing part and configured to slide in the direction of insertion and removal of the substrate and rotate around an axis, an urging part that exerts force on the shaft and biasing the shaft toward the direction of the substrate, and an engagement part provided on the shaft, configured to engage the target engagement part.

Abstract: A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions.

Abstract: The present invention relates to a thermo/electrical conductor arrangement for multilayer printed circuit boards (PCBs). Using vias for the transport of heat from the interior of the PCB and for conducting high currents between the conducting layers have limitations. Via platings are very thin and vias filled with solder is an unreliable method as there is always a risk that the vias are not properly filled during the soldering process. The present invention overcomes this by inserting a pin of a current conductive material (such as copper) into the via so that the pin is brought into galvanic contact with the conducting layers in the PCB and where at least one end of the pin is freely protruding from the PCB thereby allowing the pin to conduct heat from the interior of the PCB to the protruding end of the pin for external cooling.

Abstract: A semiconductor chip includes a substrate, a circuit formed over the substrate, a plurality of conductive pads formed over the substrate, and a plurality of bump structures each formed over a corresponding one of the plurality of conductive pads. The plurality of conductive pads includes a first conductive pad having a first pad width and a second conductive pad having a second pad width larger than the first pad width. The first conductive pad is electrically coupled to the circuit, and the second conductive pad is positioned at a corner region of the semiconductor chip and is free from being electrically coupled to the circuit. The first conductive pad is positioned closer to a geometric center of the semiconductor chip than the second conductive pad.

Abstract: A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC.

Abstract: An energy storage device includes a first electrode (110, 510) including a first plurality of channels (111, 512) that contain a first electrolyte (150, 514) and a second electrode (120, 520) including a second plurality of channels (121, 522) that contain a second electrolyte (524). The first electrode has a first surface (115, 511) and the second electrode has a second surface (125, 521). At least one of the first and second electrodes is a porous silicon electrode, and at least one of the first and second surfaces comprises a passivating layer (535).

Abstract: The inventive subject matter provides a reflex tube or port that includes a circuit board and a speaker enclosure that incorporates such a reflex tube. The circuit board is mounted about the reflex tube and can be configured so as to form a resonance chamber with an interior wall of a speaker enclosure to form a resonance chamber. Such a reflex tube can also include one or more connections.

Abstract: The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 ?m or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 ?m or more.

Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).

Abstract: A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink.

Abstract: A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

Abstract: An electronic module includes a first semiconductor chip and a passive component, wherein the first semiconductor chip is arranged on a surface of the passive component.

Abstract: An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member. The heat dissipation unit is attached to one side of the heat generation unit, which side is distal from the circuit board. At least one latch section outward extends from an edge of the heat dissipation unit. The latch member is fixedly disposed on the circuit board and formed with at least one opening and at least one perforation. The latch section is correspondingly latched in the opening. An elastic member is fitted on the retainer member. The retainer member correspondingly passes through the perforation to fix the latch member on the circuit board.

Abstract: Thermal extraction architectures for heat-generating electronic devices such as cameras or lights are disclosed. An electronic device such as a camera head may include a housing, a printed circuit board (PCB) within the housing, and a thermal extraction element positioned between the housing and PCB to transfer heat from the PCB to the housing and external environment.

Abstract: The present invention is directed toward a terminal marker used to identify a terminal block. The terminal marker includes a front having a print surface, a back, sides, and flexible legs. The flexible legs can be positioned in a natural state for installation in the terminal block or a compressed state for obtaining a marking from a printer. In the natural state, the flexible legs extend at an angle with respect to the print surface of the terminal marker. In the compressed state, the flexible legs extend outward beyond of the sides of the terminal marker.

Abstract: A monitor has a rear panel formed by injection molding plastic around a metal cooling element. The monitor includes a display panel, control electronics, a module support, and a monitor housing. The housing includes a front frame, the cooling element and a rear panel frame. The cooling element has cooling ducts formed between cooling fins. The rear housing panel frame has fin extensions that extend the fins of the cooling element into the rear housing panel frame. The display panel attaches to one side of the module support, while the control electronics attach to the other side. The front frame and the rear panel frame screw together, and the display panel and control electronics are clamped between the front frame and the rear panel frame. The monitor can be attached to a vehicle by slipping a retaining member into a T-shaped duct formed between two fins on the cooling element.

Abstract: A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or the reinforcing fibers may include thermally-conductive particles such as nanodiamonds that increase the thermal conductivity of the substrate layer. Holes may be formed through the substrate layer for receiving and/or electrically connecting electronic components. The thermally-conductive particles are sized sufficiently small to allow the formation of the holes through the substrate layer using conventional equipment and processes such as drilling. The PWB may also include a protective coating that comprises thermally-conductive particles.

Abstract: A card connector that includes a housing that houses a card provided with a terminal member, a connecting terminal attached to the housing that connects with the terminal member of the card, a cover member connected to the housing and which forms a card housing space between the housing, a card connector attached to a substrate. The cover member includes a top panel part, a plurality of side panel parts established from the side edge of the top panel part, and a fixed side that extends from the bottom end edge of the side panel part. At least one of the fixed sides is connected to a heat transfer pad arranged on the substrate. The top panel part contacts the top surface of the card housed within the card housing space and is provided with a heat transfer improving part that improves heat transfer from the card to the top panel part.

Abstract: A luminaire includes two housing halves, movable relative to each other between an open and closed configuration. The bottom housing half includes disposed therein a substrate which itself carries at least one LED which transmits light through a window in the bottom housing half. A thermal bridge made of at least one layer of anisotropic thermally conductive graphite is in thermal contact with the substrate and the top housing half when the housing is in the closed configuration, but its disengaged from either the substrate or top housing half when the housing is in the open configuration.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device (1) in a thermally conductive manner. A fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3). One shut-off unit (9?, 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). To avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure-limiting valve (17, 28) is provided.

Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.

Abstract: Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.

Abstract: A new multifunctional, thermoelastic cellular structure is described. The new structure provides tunable thermal transport behaviors particularly important for thermal switching. In its simplest example embodiment of a single or unit cell, opposing bimetallic elements bend in response to temperature changes and, below a tunable switching temperature, are separated in an open or insulating position and, at and above the switching temperature, bend to come into contact in a closed or conducting position. Multiple cells are combined in different lattice arrays to create structures that are both switchable and load bearing. The cells can be switched by both temperature and other external fields.

Abstract: A frame module is adapted to be disposed in a housing of a computer for fixing first and second electronic devices. The computer includes a motherboard unit with a socket connector. The frame module includes a frame body having top and bottom surfaces adapted to be connected respectively to the first and electronic devices. An adaptor board includes a board body connected transversely to a rear edge of the frame body and having an edge connector adapted to be inserted into the socket connector, and first and second electrical connectors for electrical connection with the first and second electronic devices, respectively.

Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.

Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

Abstract: Systems and methods are described that provide multilevel inverters having a plurality of levels using a simplified topology. For single phase systems, embodiments provide a full-bridge topology using bidirectional switching interconnections.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: According to one aspect, a portable electronic device having a heat generating component, a thermal sensor, an energy storage device for powering the portable electronic device, a thermal element thermally coupled to the heat generating component, the energy storage device, and the thermal sensor. The thermal element is sized and shaped so that heat generated by the heat generating component flows through the thermal element towards the thermal sensor and interacts with the energy storage device. The thermal sensor is used to monitor a thermal profile for the thermal element, and the monitored thermal profile is compared with an expected thermal profile to determine if the integrity of the portable electronic device has been compromised.

Abstract: Embodiments are directed to an apparatus comprising a thermal block coupled to an electronic device, a thermal strap coupled to the thermal block, and retention hardware coupled to the thermal strap and configured to retain the thermal block within the thermal strap when the apparatus is exposed to at least one variable environmental condition.

Abstract: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.

Abstract: In an embodiment, heat sink system can comprise: an integrally formed plastic heat sink and a printed circuit board package, wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK. In another embodiment, hybrid heat sink system, comprising: an integrally formed plastic heat sink and an insert, wherein the plastic heat sink comprises a thermally conductive plastic, the plastic heat sink and the insert each having a cylindrical shape, and wherein the insert comprises a feature of lancing provisions, corrugations, embossing, holes, or a combination comprising at least one of the foregoing features.

Abstract: A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the resistive element. The heat spreader also includes one or more leg portion that extends from the body portion and are associated with the heat sink in a thermally conductive relationship.

Abstract: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Abstract: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.

Abstract: In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.

Abstract: In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board has a designated mounting surface of the board. The housing is also provided, which houses the printed circuit board and comprises a cooling member for cooling a first space formed between the mounting surface and an opposed surface in the housing. The opposed surface is opposed to the mounting surface. The cooling member is arranged at part of the opposed surface, the part of the opposed surface projects toward the semiconductor devices, and the opposed surface is opposed to the two or more types of different-shape components.

Abstract: A heat transfer system is provided by the present disclosure that includes, in one form, a structural member having an upper skin, a lower skin, and a foam core disposed between the upper skin and the lower skin. At least one heat conducting array extends through the foam core and between the upper skin and the lower skin, the heat conducting array defining at least one upper cap, at least one lower cap, and a wall portion extending between the upper cap and the lower cap, the upper cap being disposed proximate a heat source. A heat conducting spreader is disposed between the lower cap of the heat conducting array and the lower skin of the structural member.