Abstract: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.

Abstract: A portable computer includes a first housing having a first wall defining a first opening and a surface surrounding the opening and having an inside periphery. A first component is removably received within the opening and defines a body with an outer periphery that is inset with respect to the inner periphery of the opening. A first locking member is removably attached within the opening. The first locking member defines an outer periphery extending along the inner periphery of the first opening of the housing. The first locking member also defines a second opening having an inner periphery that is inset with respect to the outer periphery of the first component body such that a portion of the first locking member overlies a first portion of the first component body. A second portion of the first component is exposed within the opening of the first locking member.

Abstract: The invention relates to alighting apparatus comprising a light emission unit (2) for emitting light (3) from an emission surface (4) in a main emission direction (6), and an outcoupling unit (7) for coupling the light out of the light emission unit. The outcoupling unit comprises a first surface (8) having a first central region (9) optically coupled to the emission surface and a first peripheral region (10) enclosing the first central region, and a second surface (11) opposite to the first surface. The peripheral regions can be structured, wherein the ratio of a) the area of the emission surface to b) the area of the first surface or the second surface is smaller than 0.5. This configuration can significantly decrease the likelihood of reabsorption of light by the emission surface, thereby increasing the efficiency of extracting light out of the lighting apparatus.

Abstract: A substrate transport apparatus comprises a substrate holder capable of holding a substrate, a link unit which extends/retracts the substrate holder, a driving unit which generates a driving force to operate the link unit, a guide bar provided to one of the substrate holder and the link unit; and a support unit which is provided to the other of the substrate holder and the link unit, and slidably supports the guide bar when the substrate holder moves by the operation of the link unit.

Abstract: A light emitting package includes a metal plate, a plurality of LED chips, a plurality of leads and a molding compound. The metal plate has a first surface and a second surface, and is bent into two chip mounting portions, wherein an inclination angle is between the chip mounting portions. The LED chips are mounted on the first surface and the second surface of the chip mounting portions. The leads are disposed adjacent to the metal plate and electrically connected to the LED chips. The molding compound encapsulates the LED chips and a part of the lead.

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by laser welding is provided with a monolithic connector body with a bore. A sidewall of the bore is provided with an inward annular projection angled toward a cable end of the bore. A sidewall of the inward annular projection and the sidewall of the bore form an annular laser groove open to a cable end of the bore. The annular laser groove is dimensioned with a taper at a connector end of the laser groove less than a thickness of a leading end of the outer conductor. The taper provides an annular material chamber between the leading end of the outer conductor, when seated in the laser groove, and the connector end of the laser groove.

Abstract: A method for the insertion of ferrite members onto pins acting as the contacts of an electrical filter connector. The ferrite members are oriented to a desired orientation by a known method. The ferrite members are preferably oriented in the vertical position for storage and are conveyed to a dynamic storage lock chamber equipped with a ferrite member stopping mechanism. A ferrite member distribution system incorporating a horizontally moving distribution plate individually releases the ferrite members from the lock chamber into the distribution system and inserts ferrite members onto the contacts according to a rate controlled by the operator.

Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier.

Abstract: A device includes a substrate (308) and a metallic layer (336) formed over the substrate (308) with a deposition process for which the metallic layer (336) is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer (336) is reduced relative to the pre-determinable as-deposited defect density of the same layer (336) or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate (308) is provided and a removable layer (330) is formed over the substrate (308). A metallic layer (336) is formed over the removable layer (330) and is patterned and etched to define a structure over the removable layer (330). The removable layer (330) is removed, and the metallic layer (336) is heated for a time beyond that necessary for bonding of a hermetic sealing cap (340) thereover.

Abstract: The present invention relates to a method and system for repairing and refurbishing a microplate reader of the Flipr type which has a water cooled argon laser light source. The old laser is removed and replaced with a high power (300 to 500 mW) air cooled solid state laser as a replacement place on its own support and focused and wired to replace the old laser. The new product operates at lower power consumption yet provides accurate measurements.

Abstract: A process for making a substantially planar micro-fluid ejection head is disclosed, and includes depositing a basic solution on a first surface of a device substrate. The first surface having the basic solution deposited thereon is contacted together with a surface of a support material for a duration ranging from about 1 minute to about 15 minutes, at a temperature ranging from about 20° C. to about 90° C. so that the first surface having the basic solution deposited thereon and the surface of the support material form a bond therebetween to hermetically seal the support material and the device substrate to one another. Both the substrate and the at least one surface of the support comprise silicon, and at least one of the device substrate and the at least one surface of the support material is substantially composed of silicon.

Abstract: A method for electrically connecting an offshore first electrical plant to a second electrical plant, the offshore first electrical plant being an offshore wind turbine generator, the method comprising providing a transition cable terminated at one end with a first connector part, the transition cable being connected or connectable at the other end to the offshore wind turbine generator above the water surface, and providing a cable terminated at one end with a second connector part and connected or connectable at the other end to the second electrical plant, the second connector part being adapted to mate with the first connector part to form a connector.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.

Abstract: A sputtering apparatus that includes at least a target presented as an inner surface of a confinement structure, the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage supporting the cathode and communicating with the target is preferably provided, and a cable bundle interacting with the cathode and linked to a cable bundle take up mechanism provides power and coolant to the cathode, magnetron, actuator and an anode of the sputtering apparatus.

Abstract: The present disclosure relates to an electronic apparatus (100) comprising a backplane (120) and methods of assembling and disassembling such an apparatus. The electronic apparatus (100) comprises a chassis (101) having plural walls and a circuit board (140) fastened to a wall of the chassis, a surface of the circuit board having a plurality of conductive pads (146). A backplane (120) is fastened in a received position in the chassis substantially perpendicular to the circuit board. The backplane has a connector (130) at an edge of the backplane, the connector comprising a plurality of sprung conductive elements (132,134) which extend outwards beyond the edge of the backplane to make electrical contact with respective conductive pads (146) on the circuit board.

Abstract: An exposure apparatus is equipped with a fine movement stage that can hold a liquid with a projection optical system when the stage is at a position facing an outgoing surface of the projection optical system, and a blade that comes into proximity within a predetermined distance of the fine movement stage when the fine movement stage is holding the liquid with the projection optical system, and moves along with the fine movement stage while maintaining the proximity state, and then holds the liquid with the projection optical system after the movement. Accordingly, a plurality of stages will not have to be placed right under the projection optical system interchangeably, which can suppress an increase in footprint of the exposure apparatus.

Abstract: Provided is an electricity collection and distribution ring excellent in durability and the easiness of manufacturing while the size thereof is reduced, and also provided is a method for manufacturing the electricity collection and distribution ring. The electricity collection and distribution ring (2) comprises: first to fourth bus rings (21 to 24) for collecting electricity from and distributing electricity to each of the phase coils (111, 112, 113) of a three-phase motor (1); a plurality of fixing members (3) disposed at a plurality of predetermined positions in a circumferential direction of the first to fourth bus rings (21 to 24) and mutually fixing the first to fourth bus rings (21 to 24); and a plurality of connection terminals (4) for connecting the first to fourth bus rings (21 to 24) and the lead-out lines of the respective phase coils (111, 112, 113).

Abstract: An internal engine component including a data collector assembly is provided. The data collector assembly includes a sensor for sensing a condition and for generating a signal corresponding to the condition and a digital to analog converter for converting the signal to a digital signal. The data collector assembly also includes a memory for storing data, a clock and a processor. A power source is electrically connected to the sensor, the analog to digital converter, the memory, the clock and the processor. During an engine test, the processor, sensor, digital to analog converter, clock and memory are substantially the only devices that draw electricity from the power source.

Abstract: According to some embodiments, a device having a pliant portion may be utilized to secure a circuit board.

Abstract: A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.

Abstract: A method of forming a non-linear path of at least a portion of at least one electrically conducting wire extending between a first location and a second location. The method includes the steps of forming a wire path template defining a non-linear path, winding said wire through said template such that said wire adopts said non-linear path, connecting the wire to a feedthrough member, wherein the feedthrough member is configured to provide an electrical connection through a wall of an implantable component implantable in a recipient along with the wire, and removing the wire from the template.

Abstract: There are provided a process of forming a recess groove having a depth shallower than and a width larger than the notch groove for fracturing at a portion of fracturing and splitting in the permanent magnet; a process of forming the notch groove for fracturing the permanent magnet in a groove bottom of the recess groove formed in the recess-groove forming process; and a process of fracturing and splitting the permanent magnet along the notch groove so as to obtain magnet pieces.

Abstract: A method of making a transparent touch-responsive capacitor apparatus includes providing a transparent substrate having a material layer formed over the transparent substrate; pattern-wise defining electrically connected first micro-wires over the transparent substrate in a plurality of first transparent conductor areas in the materials layer; pattern-wise defining electrically connected second micro-wires over the transparent substrate in a plurality of second transparent conductor areas spaced apart from the first transparent conductor areas in the material layer, the first micro-wires electrically connected to the second micro-wires; and wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires and the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area.

Abstract: A method of manufacturing a chip card, such as a dual interface card, is provided. The method generally includes collocating multiple card support sheets one onto the other, depositing a conductive adhesive onto contact pads on at least one of the sheets, positioning a dual interface module in a recess established in at least one of the sheets, and executing a lamination step.

Abstract: The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode.

Abstract: A process for producing an acoustic device having a phononic crystal structure comprising inclusions produced in a first medium distributed in a matrix of a second medium, to block propagation of acoustic waves within a bandgap frequency band, includes: defining geometric parameters of said inclusions, which have walls contacting said matrix, making at least one non-zero first wall angle, to the normal of the plane of said structure, said geometric parameters including said first wall angle; determining a function relating to variation in frequency position of said bandgap with said wall angle or relating to variation in width of said bandgap with said wall angle; determining said at least first angle, for a selected frequency position and/or selected width of the bandgap, from the function or functions determined beforehand; and producing said inclusions having at least said first wall angle in said matrix formed by said second medium.

Abstract: An image pickup unit according to the present invention includes: a lens frame that internally holds an image pickup optical system; and a backside illuminated image pickup device which has a light-receiving section that receives light entering the lens frame via the image pickup optical system and which is held inside the lens frame, wherein a claw portion of the lens frame abuts an opposing surface that opposes a light-entering surface of the image pickup device so as to define a position of the image pickup optical system in an optical axis direction L with respect to the light-receiving section using the opposing surface as a reference.

Abstract: A rectifier assembly and method are provided. The rectifier assembly includes an annular bus bar including an electrically conductive material, and an insulator ring receiving the annular bus bar. The insulator ring defines radially-extending resistor pockets and diode pockets therein. The rectifier assembly also includes resistors disposed in the resistor pockets and electrically connected with the annular bus bar, and diodes disposed in the diode pockets and electrically connected with the annular bus bar. The rectifier assembly also includes an outer housing receiving the annular bus bar and the insulator ring, such that the insulator ring is positioned radially between the annular bus bar and the outer housing.

Abstract: The invention concerns a timepiece including a case, formed by a middle part 5 closed by a back cover and by a crystal 9, said crystal 9 being supported on a bearing surface of the middle part 5, parallel to said back cover, said case forming a housing in which an electronic module 13 is placed; said timepiece further includes a display module fixed to the crystal 9, the electronic module 13 and the display module include an identical number of connection points so that electrical connection means can connect the connection points of the electronic module 13 to the connection points of the display module in pairs.

Abstract: The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state.

Abstract: A method of implementing use cases includes associating a use case with each of a plurality of devices capable of being used or accessed by a user. The method also includes providing a plurality of stackable blades, each providing a standard physical interface and being configured to implement a solution to the use case associated with each of the plurality of devices. The method further includes stacking the plurality of stackable blades to form an interconnected stack. Each of the plurality of stackable blades are coupled using the standard physical interface. The method also includes executing a first purpose corresponding to a first use case and executing a second purpose corresponding to a second use case. Embodiments provide an electronic ecosystem featuring ubiquitous connectivity in which a standard contact array in each component of the ecosystem assures interoperability between heterogeneous devices.

Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.

Abstract: A method of assembling a contact assembly for installation in a medical device, and more specifically, a header contact assembly for installation in an implantable medical device for achieving electrical contact with an in-line IPG lead for implanted electrodes, the assembly utilizing a contact structure such as a “toroidal spring in groove” device.

Abstract: A liquid crystal display device includes: a liquid crystal panel; a backlight unit under the liquid crystal panel, the backlight unit including a light emitting diode (LED) assembly supplying a light and a light guide plate transmitting the light from the LED assembly to the liquid crystal panel; a main frame surrounding the backlight unit, the main frame including a flat portion for supporting the LED assembly and a guide wall for guiding the LED assembly, the guide wall including at least one concave portion; and a light shielding tape on the guide wall and the LED assembly, the light shielding tape including at least one open portion corresponding to the at least one concave portion.

Abstract: A method for fabricating a dynamic random access memory (DRAM) capacitor stack is disclosed wherein the stack includes a first electrode, a dielectric layer, and a second electrode. The first electrode is formed from a conductive binary metal compound and the conductive binary metal compound is annealed in a reducing atmosphere to promote the formation of a desired crystal structure. The binary metal compound may be a metal oxide. Annealing the metal oxide (i.e. molybdenum oxide) in a reducing atmosphere may result in the formation of a first electrode material (i.e. MoO2) with a rutile-phase crystal structure. This facilitates the formation of the rutile-phase crystal structure when TiO2 is used as the dielectric layer. The rutile-phase of TiO2 has a higher k value than the other possible crystal structures of TiO2 resulting in improved performance of the DRAM capacitor.

Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.

Abstract: A method of manufacturing a load cell assembly and methods of folding a circuit device are disclosed. A flexible circuit body including a strip having at least one hinge is provided, with the strip being in a first position or an unfolded position. A plurality of strain gauges are attached to the strip, with the hinge disposed between the strain gauges. A jig is provided and the strip of the flexible circuit body is folded along the hinge utilizing the jig to define a second position or folded position of the strip.

Abstract: A vapor sensor is constructed from a single glass filament less than 2 millimeters in diameter and greater than 1 millimeters in length, the filament having a first end and a second end separated by a long axis and comprising electrodes at each end, coated with a resilient material, and a first layer of conducting particles embedded in the resilient material and forming a conducting path between ends of the filament.

Abstract: A deformable mirror includes a mirror substrate having a continuous reflective surface and a plurality of actuators connected to the mirror substrate at a plurality of coupling portions. In the deformable mirror, the mirror substrate has first regions and a second region thicker than the first regions and the first regions are formed around the coupling portions.

Abstract: A method of cooling a heat generating device includes positioning a base of an electronically conductive heat sink in thermal communication with a heat generating device, wherein the heat sink includes a plurality of fins extending in a longitudinal direction from a first end to a second end, and coupling the heat sink to ground. The method further includes emitting ions from a plurality of ion emitter elements disposed in a non-planar pattern along the first ends of the plurality of fins, wherein at least three ion emitter elements are equidistant from the first end of the nearest fin and are positioned in an arc having an axis that extends along the first end of the nearest fin.

Abstract: A method for installing multiple fiber optic cables in coiled tubing in oil and gas operations.

Abstract: A radiation detector module includes a radiation detector, power source and wireless communication elements all housed within a flame-proof enclosure. The enclosure has a portion through which wireless transmissions can pass. The radiation detector module may be suitable for use in a hazardous area containing a potentially explosive gas mixture.

Abstract: A method for installing multiple fiber optic cables in coiled tubing in oil and gas operations.

Abstract: A sensor having a metal housing that encloses a sensing device. An end of the housing is crimped, and an overmolding covers the crimped edge and extends from the crimped edge away from the housing.

Abstract: According to one embodiment, a light-emitting module includes a substrate, a cover, a frame body, and a resin layer. A light-emitting section including a light-emitting element is provided on the substrate. The cover has translucency and is opposed to the light-emitting section. The frame body is interposed between the substrate and the cover around the light-emitting section. The resin layer has translucency and is interposed between the light-emitting section and the cover while being set in contact with the light-emitting section and the cover.

Abstract: The invention relates to the use of a mixture comprising a hydrofluoroolefin and a fluoroketone, optionally associated with a dilution gas, as an electric insulating and/or electric arc extinguishing medium in a medium-voltage electrical device. It also relates to a medium-voltage electrical device in which electrical insulation and/or electric arc extinguishing is (are) provided by a mixture comprising a hydrofluoroolefin and a fluoroketone, optionally associated with a dilution gas.

Abstract: A spring system (74) links a pair of drive masses (30, 32) of a MEMS device (72). The spring system (74) includes stiff beams (76, 78, 80, 82) oriented to form a parallelogram arrangement (84). The beams are oriented diagonal to a drive direction (56) of the masses (30, 32). Diagonally opposing corners (86, 88) of the parallelogram arrangement (84) are coupled to the drive masses (30, 32). A spring (90) is coupled to a corner (94) and a spring (92) is coupled to a diagonally opposing corner (96) of the parallelogram arrangement. The springs (90, 92) are interconnected with a sense frame (34) surrounding the drive masses. The beams and side springs are stiff to substantially prevent in-phase motion (66) of the drive masses. However, rotationally compliant flexures (102, 104, 106, 108), allow the arrangement (84) to collapse and expand to enable anti-phase motion (60) of the drive masses.

Abstract: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

Abstract: A method of forming a piezoelectric actuator on a vibration plate to provide a driving force to each of a plurality of pressure chambers includes forming a lower electrode on the vibration plate, forming a piezoelectric layer on the lower electrode at a position corresponding to each of the pressure chambers, forming a supporting pad on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, forming an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad, and bonding the upper electrode to a driving circuit above the supporting pad to receive a voltage from the driving circuit.

Abstract: Method for producing a laminated ceramic electronic component including: forming a laminated body by layering and press-bonding a plurality of ceramic green sheets to become a protective layer and a plurality of the ceramic green sheets with metal paste printed thereon, forming an extended part by printing and drying a conductive paste for the extended part on the main face of the laminated body, forming a laminated ceramic element by cutting off the laminated body with the extended part formed and separating the laminated body into fragments, and forming a curled part by applying a conductive paste for the curled part on said end face of said laminated ceramic element. In the step of forming the laminated body, the laminated body is press-bonded so that the main face of the lead part of the laminated body is positioned lower than the main face of the function part.