Contact Probe Patents (Class 324/754.03)
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Publication number: 20140176172Abstract: An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Inventors: Kip Stevenson, Todd P. Albertson, David Shia, Kamil Salloum
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Patent number: 8760187Abstract: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.Type: GrantFiled: December 3, 2008Date of Patent: June 24, 2014Assignee: L-3 Communications Corp.Inventor: Eric D. Hobbs
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Patent number: 8760184Abstract: A measuring probe, particularly for a non-contacting vector network analysis system, having a housing and at least one coupling structure disposed on the housing and designed for coupling an HF signal from a signal line, such that at least one additional signal probe is disposed on the housing for coupling an electrical signal into the signal line.Type: GrantFiled: June 23, 2009Date of Patent: June 24, 2014Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KGInventors: Thomas Zelder, Bernd Geck
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Patent number: 8760183Abstract: A system and method for identifying opens among parallel connections on a circuit assembly such as a printed circuit board (PCB). In a learn phase performed on a known good circuit assembly, a group of parallel connected pins are excited with a first signal. A second signal, out-of-phase with the first signal, is applied to a second group of pins associated with the component. The amplitude and/or the phase of the second signal and the number and/or specific pins in the second group of pins are selected so that first and second signals coupled to a detector plate proximal to the component substantially offset. During a manufacturing test, signals of comparable amplitude and phase are applied to like pins on a like component of a circuit assembly under test. If the response signal coupled to a like detector plate is below a threshold, it is determined that each pin in the group of parallel connected pins is connected.Type: GrantFiled: November 13, 2009Date of Patent: June 24, 2014Assignee: Teradyne, Inc.Inventor: Anthony J. Suto
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Patent number: 8760185Abstract: An improved system for capacitive testing electrical connections in a low signal environment. The system includes features that increase sensitivity of a capacitive probe. One feature is a spacer positioned to allow the probe to be partially inserted into the component without contacting the pins. The spacer may be a collar on the probe that contacts the housing of the component, contacts the substrate of the circuit assembly, or both. In some other embodiments, the spacer may be a riser extending beyond the surface of the sense plate that contacts the component, a riser portion of the component, or a combination of both. The spacer improves sensitivity by establishing a small gap between a sense plate of the probe and pins under test without risk of damage to the pins. A second feature is a guard plate of the probe with reduced capacitance to a sense plate of the probe. Reducing capacitance also increases the sensitivity of the probe.Type: GrantFiled: December 22, 2009Date of Patent: June 24, 2014Inventor: Anthony J. Suto
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Publication number: 20140167801Abstract: A probe conducts testing of a circuit. The probe includes a base coupled to a substrate. The probe also includes a cantilever attached to the base at a first end, the cantilever deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate and to move between the second position and the first position based on movement of a compliant bump of the circuit, and a probe tip attached to the cantilever at the second end, the probe tip maintaining contact with the compliant bump of the circuit.Type: ApplicationFiled: December 19, 2012Publication date: June 19, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Audette, Dustin Fregeau, David L. Gardell, Grant W. Wagner
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Patent number: 8742783Abstract: A contactor is brought into contact with and separated from an electrode formed on a test target, and includes an elastic member that overlaps with a conductive member having a contact and which urges the contact in a pressing direction. The elastic member is fixed at a predetermined fixed position in a state projecting to the outside of a main body member and the conductive member is electrically connected from the outside of a housing of the main body member of the contactor.Type: GrantFiled: December 13, 2010Date of Patent: June 3, 2014Assignee: NGK Insulators, Ltd.Inventor: Kazuiku Miwa
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Publication number: 20140145740Abstract: A testing device comprises a first probe member, a second probe member, and an insulation member. The first probe member comprises a tip portion for contacting a device being tested. The second probe member also comprises a tip portion for contacting the device being tested. The insulation member is located at or can be moved to a location between the tip portions of the first and second probe members.Type: ApplicationFiled: November 27, 2013Publication date: May 29, 2014Applicant: STAR TECHNOLOGIES, INC.Inventors: CHOON LEONG LOU, HO YEH CHEN, HSIAO TING TSENG
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Patent number: 8736292Abstract: An automatic switching mechanism is controlled by a probe card independent from a tester without limitation of the number of control signals from the tester. A probe card and an inspection apparatus include probes to be brought into contact with electrodes of inspection targets and a power supply channel electrically connecting the probes to a tester. The automatic switching mechanism divides each of the power supply channels into a plurality of power supply wiring portions, which are respectively connected to the probes; and shuts off the power supply wiring responsive to electrical fluctuation such as overcurrent. An electrical fluctuation detection mechanism detects an electrical fluctuation due to a defective product among the inspection targets. A control mechanism, responsive to detection of an electrical fluctuation, shuts off the power supply wiring portion if the electrical fluctuation is caused by the automatic switching mechanism.Type: GrantFiled: May 27, 2010Date of Patent: May 27, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Tatsuo Ishigaki, Katsuji Hoshi, Akihisa Akahira
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Publication number: 20140132298Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.Type: ApplicationFiled: January 17, 2013Publication date: May 15, 2014Applicant: ADVANTEST AMERICA, INC.Inventors: Florent Cros, Lakshmi Namburi, Ting Hu
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Patent number: 8723546Abstract: The present invention is a set of layered probes that make electrical contact to a device under test. The layered probes are disposed within openings of at least one guide plate. The guide plate surrounds the probes via the openings. The layered probes have a base end, an opposing tip end and a shaft connecting the base end to the tip end. The base end can have a positioning device that extends away from the base end.Type: GrantFiled: March 2, 2010Date of Patent: May 13, 2014Assignee: MicroProbe, Inc.Inventor: January Kister
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Patent number: 8723545Abstract: A probe card facilitates a wiring connection, reducing working time and preventing a working error and includes a main circuit board having an opening in its center. A reinforcement member has a lower end coupled to that opening to prevent deforming the board. A sub-circuit board electrically connected to the main board is seated on an upper side of the reinforcement member. A space transformer is positioned on a lower portion of the opening of the main board. A plurality of wires have both ends inserted into through holes in the sub-circuit board and space transformer to electrically connect them. Probes are provided on a lower portion of the space transformer, each having one end in contact with the wire inserted into the through-hole of the space transformer and the other end in contact with a wafer to be tested.Type: GrantFiled: November 1, 2011Date of Patent: May 13, 2014Assignee: SDA Co., Ltd.Inventors: Duk Kyu Lee, Chang Min Im, Sang Bum Sim, Yun Kee Cho
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Patent number: 8704106Abstract: A method of manufacturing an electronic component includes forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.Type: GrantFiled: May 23, 2011Date of Patent: April 22, 2014Assignee: Fujitsu LimitedInventors: Masataka Mizukoshi, Yoshikatsu Ishizuki
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Patent number: 8704544Abstract: An apparatus, suitable for coupling a pads of integrated circuits on wafer to the pogo pins of a pogo tower in a test system without the need of a probe card, includes a body having a first surface and a second surface, the body having a substantially circular central portion, and a plurality of bendable arms extending outwardly from the central portion, each bendable arm having a connector tab disposed at the distal end thereof; a first plurality of contact terminals disposed on the second surface of the central portion of the body, the first plurality of contact terminals arranged in pattern to match the layout of pads on a wafer to be contacted; at least one contact terminal disposed on the first surface of the plurality of connector tabs; and a plurality of electrically conductive pathways disposed in the body such that each of the first plurality of contact terminals is electrically connected to a corresponding one of the contact terminals on the first surface of the connector tabs.Type: GrantFiled: March 10, 2011Date of Patent: April 22, 2014Assignee: Advanced Inquiry Systems, Inc.Inventor: Morgan T. Johnson
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Patent number: 8698515Abstract: A test apparatus is described that can be useful as test equipment in various applications, including for example testing a semiconductor device. The test apparatus has a circuit board, a probe card, and a card holder. The circuit board includes a contact layout that electrically connects with a probe card at one portion and electrically connects with a probe card holder at another portion. The probe card has probes for electrically contacting a device to be tested, and has a contact configuration that electrically connects with the circuit board. The apparatus allows for electrical signals to be sent to and from the probe card, through the probe card holder and circuit board, in testing a device such as for example a semiconductor device. The circuit board and probe card holder have an attachment structure, configured for example as a notch and catch finger attachment arrangement.Type: GrantFiled: August 16, 2011Date of Patent: April 15, 2014Assignee: Celadon Systems, Inc.Inventors: Bryan J. Root, William A. Funk
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Publication number: 20140091821Abstract: An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10?8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Inventors: David Shia, Todd P. Albertson, Kip P. Stevenson
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Patent number: 8686358Abstract: Methods and apparatus are provided herein for time-resolved analysis of the effect of a perturbation (e.g., a light or voltage pulse) on a sample. By operating in the time domain, the provided method enables sub-microsecond time-resolved measurement of transient, or time-varying, forces acting on a cantilever.Type: GrantFiled: September 14, 2011Date of Patent: April 1, 2014Assignee: University of Washington through its Center for CommercializationInventors: David Ginger, Rajiv Giridharagopal, David Moore, Glennis Rayermann, Obadiah Reid
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Patent number: 8680844Abstract: A force compensated probe for electrical measurement is provided and includes a support structure having a back plate and sidewalls, a probe for electrical measurement of an article and an elastic base disposed to supportively couple the probe to the back plate such that the probe normally protrudes away from the back plate beyond distal edges of the sidewalls, and, when the probe is applied to the article for the electrical measurement such that components of the support structure contact the article, a predefined load is consistently applied to the elastic base.Type: GrantFiled: December 1, 2010Date of Patent: March 25, 2014Assignee: General Electric CompanyInventors: Philip Frank Burnett, Daniel Lawrence Banowetz, Lisa Ann Hong
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Patent number: 8680880Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.Type: GrantFiled: December 14, 2009Date of Patent: March 25, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Hidehiro Kiyofuji, Tetsuya Iwabuchi, Toshiyuki Kudo, Seiji Kanazawa
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Publication number: 20140062517Abstract: In accordance with an embodiment, a probe card includes a substrate, a first probe and a second probe. The substrate includes a first area and a second area adjacent to the first area. In the first area a first opening is provided. The first probe is provided in the first area. An end of the first probe extends into the first opening. The second probe is provided in the second area.Type: ApplicationFiled: February 11, 2013Publication date: March 6, 2014Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Tamotsu HARADA
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Patent number: 8664969Abstract: Various embodiments are directed at an apparatus for implementing electrical connectivity for testing of a semiconductor device. The apparatus comprises a probe head which comprises an upper guide plate and a lower guide plate, wherein the upper guide plate defines a plurality of first apertures, and the lower guide plate defines a plurality of second apertures in some embodiments. The apparatus further comprises a plurality of probes, wherein each of the plurality of probes passes through one of the plurality of first apertures on the upper guide plate and one of the plurality of second apertures on the lower guide plate, and at least one of the plurality of probes defines a buckled form after the at least one of the plurality of probes is finally assembled in the apparatus. The apparatus further comprises a template member to guide the plurality of probes.Type: GrantFiled: September 10, 2010Date of Patent: March 4, 2014Assignee: Probelogic, Inc.Inventors: Krzysztof Dabrowiecki, Scott Clegg
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Publication number: 20140055155Abstract: A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.Type: ApplicationFiled: October 18, 2012Publication date: February 27, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Hsiung Li, Kuang-Kai Yen, Yi-Hsuan Liu, Hsieh-Hung Hsieh, Chewn-Pu Jou, Fu-Lung Hsueh
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Patent number: 8659312Abstract: A probe card has a thin film substrate having projection electrodes on a first surface facing the semiconductor wafer and at a position facing the pad electrodes, a non-contact electrode, and first electrodes provided a second surface opposite to the first surface; and a wiring substrate having second electrodes disposed at a side opposite to the semiconductor wafer in the thin film substrate and at a position facing the first electrodes. The wiring substrate and the thin film substrate form a first sealed space and the thin film substrate and the semiconductor wafer form a second sealed space. By reducing the pressure in the first and the second sealed space, the first and the second electrodes are brought into close contact with each other and the pad electrodes and the projection electrodes are brought into close contact with each other, and the pressure of each of the first and second sealed space can be independently adjusted.Type: GrantFiled: July 19, 2010Date of Patent: February 25, 2014Assignee: Panasonic CorporationInventors: Yoshirou Nakata, Naomi Miyake
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Patent number: 8659308Abstract: An apparatus and method for conducting electrical testing of probes is disclosed. Probes may also be tested for deflection and loading hysteresis.Type: GrantFiled: October 9, 2012Date of Patent: February 25, 2014Assignee: Rudolph Technolgies, Inc.Inventor: James Charles Andersen
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Publication number: 20140043054Abstract: A testing method (and the probes used) comprising providing one or more probes each comprising: a body portion which is substantially straight; an extended portion extending from the body portion and comprising at least two separate probe portions; and a tip portion at the opposite end of the extended portion; and contacting an object to be tested with the one or more probes.Type: ApplicationFiled: August 9, 2013Publication date: February 13, 2014Applicant: FormFactor, Inc.Inventor: January Kister
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Patent number: 8648615Abstract: A method of testing a multi-die integrated circuit (IC) can include testing an inter-die connection of the multi-die IC. The inter-die connection can include a micro-bump coupling a first die to a second die. The method can include detecting whether a fault occurs during testing of the inter-die connection. Responsive to detecting the fault, the multi-die integrated circuit can be designated as including a faulty inter-die connection. Also described is an integrated circuit that includes a first die, a second die on which the first die may be disposed, a plurality of inter-die connections coupling the first die to the second die, and a plurality of probe pads, where each probe pad is coupled to at least one of the inter-die connections.Type: GrantFiled: June 28, 2010Date of Patent: February 11, 2014Assignee: Xilinx, Inc.Inventor: Arifur Rahman
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Publication number: 20140035608Abstract: Adapters for electrostatic discharge probe tips are disclosed herein. An embodiment of the adapter includes an attachment device that is attachable to the tip of the probe. A first conductor is affixed to the attachment device so that the first conductor contacts the tip when the attachment device is attached to the tip of the probe. A second conductor extends between the first electrical conductor and a point external to the attachment device.Type: ApplicationFiled: August 2, 2012Publication date: February 6, 2014Applicant: Texas Instruments IncorporatedInventors: Robert Matthew Mertens, John Eric Kunz, JR.
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Patent number: 8643396Abstract: A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.Type: GrantFiled: May 31, 2011Date of Patent: February 4, 2014Assignee: Tektronix, Inc.Inventors: James E. Spinar, Richard R. Lynn
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Patent number: 8643394Abstract: In accordance with an embodiment, a probe card structure comprises a base board, a connection interposer over the base board, a substrate over the connection interposer, and a fixture over the substrate securing the substrate and the connection interposer to the base board. The connection interposer comprises interposer electrodes that provide an electrical connection between electrodes on the base board and first electrodes on the substrate.Type: GrantFiled: April 16, 2010Date of Patent: February 4, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventor: Yung-Hsin Kuo
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Patent number: 8638113Abstract: A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.Type: GrantFiled: May 4, 2010Date of Patent: January 28, 2014Assignee: FormFactor, Inc.Inventors: Douglas E. Crafts, Jyoti K. Bhardwaj
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Patent number: 8633720Abstract: High-frequency resonance method is used to measure magnetic parameters of magnetic thin film stacks that show magnetoresistance including MTJs and giant magnetoresistance spin valves. The thin film sample can be unpatterned. Probe tips are electrically connected to the surface of the film (or alternatively one probe tip can be punched into the thin film stack) and voltage measurements are taken while injecting high frequency oscillating current between them to cause a change in electrical resistance when one of the layers in the magnetic film stack changes direction. A measured resonance curve can be determined from voltages at different current frequencies. The damping, related to the width of the resonance curve peak, is determined through curve fitting. In embodiments of the invention a variable magnetic field is also applied to vary the resonance frequency and extract the magnetic anisotropy and/or magnetic saturation of the magnetic layers.Type: GrantFiled: June 21, 2011Date of Patent: January 21, 2014Assignee: Avalanche Technology Inc.Inventors: Ioan Tudosa, Yuchen Zhou, Jing Zhang, Rajiv Yadav Ranjan, Yiming Huai
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Publication number: 20140009181Abstract: A system and a method for capacitive testing a component (including a packaged component) are disclosed. An embodiment of a test head comprises a holding unit configured to pick-up, hold and release the component, an electrode configured to receive a capacitive signal from the component and a preamplifier configured to amplify the capacitive signal.Type: ApplicationFiled: July 9, 2012Publication date: January 9, 2014Applicant: INFINEON TECHNOLOGIES AGInventors: Ming Xue, Weng Yew Kok
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Patent number: 8614590Abstract: A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads.Type: GrantFiled: July 27, 2010Date of Patent: December 24, 2013Inventor: Charles A. Miller
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Publication number: 20130321015Abstract: An inspection apparatus includes an insulating substrate, a probe pin having a body portion secured to the insulating substrate, a tip portion connected to one end of the body portion and disposed on the back surface side of the insulating substrate, and a connection portion connected to the other end of the body portion and disposed on the front surface side of the insulating substrate, and a heat-radiating terminal in contact with the connection portion, wherein a current is applied through the heat-radiating terminal and the probe pin to an object to measured, and wherein the heat-radiating terminal discharges heat from the probe pin.Type: ApplicationFiled: March 1, 2013Publication date: December 5, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Akira OKADA, Hajime AKIYAMA, Kinya YAMASHITA
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Patent number: 8598902Abstract: A probe comprises: a membrane having a bump which contacts an input/output terminal of an IC device built into a semiconductor wafer under test; a pitch conversion board having a bottom surface on which a first terminal is provided and a top surface on which a second terminal connected to the first terminal is provided; a circuit board which is electrically connected to a test head and has a third terminal; a first anisotropic conductive rubber member having a first conductor part which electrically connects the bump of the membrane and the first terminal of the pitch conversion board; and a second anisotropic conductive rubber member having a second conductor part which electrically connects the second terminal of the pitch conversion board and the third terminal of the circuit board, and the second conductor parts are provided on the whole of the second anisotropic conductive rubber member.Type: GrantFiled: May 12, 2009Date of Patent: December 3, 2013Assignees: Advantest Corporation, Panasonic CorporationInventors: Yoshiharu Umemura, Kensuke Kato, Yoshirou Nakata, Naomi Miyake
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Patent number: 8598891Abstract: Detecting and/or mitigating the presence of particle contaminants in a MEMS device involves converting benign areas in which particles might become trapped undetectably by electric fields during test to field-free regions by extending otherwise non-functional conductive shield and gate layers and placing the same electrical potential on the conductive shield and gate layers. Particle contaminants can then be moved into detection locations remote from the potential trap areas and having particle detection structures by providing some mechanical disturbance.Type: GrantFiled: February 25, 2013Date of Patent: December 3, 2013Assignee: Analog Devices, Inc.Inventors: Vineet Kumar, William A. Clark, John A. Geen, Edward Wolfe, Steven Sherman
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Publication number: 20130314114Abstract: A probe apparatus may include a plurality of probe pins attached to a probe head portion. Each of the probe pins may be independently movable relative to the probe head portion.Type: ApplicationFiled: May 24, 2012Publication date: November 28, 2013Applicant: Texas Instruments IncorporatedInventor: Hiroshi Miyazaki
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Publication number: 20130314115Abstract: A wafer testing system and associated methods of use an manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.Type: ApplicationFiled: March 25, 2013Publication date: November 28, 2013Applicant: Advanced Inquiry Systems, Inc.Inventor: Advanced Inquiry Systems, Inc.
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Patent number: 8593167Abstract: A method of testing a semiconductor device includes a conductive foreign matter test step of measuring the resistance value between the first and second conductive patterns to determine whether conductive foreign matter is present between the first and second conductive patterns, a first open circuit test step of measuring the resistance value between two points on the first conductive pattern to determine whether there is an open circuit in the first conductive pattern, and a second open circuit test step of measuring the resistance value between two points on the second conductive pattern to determine whether there is an open circuit in the second conductive pattern. The measurement of the resistance value in each of the test steps is accomplished by pressing probes vertically against the first conductive pattern or the second conductive pattern or both.Type: GrantFiled: March 8, 2011Date of Patent: November 26, 2013Assignee: Mitsubishi Electric CorporationInventor: Atsushi Narazaki
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Publication number: 20130300445Abstract: A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property. In a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property. A first area for each respective first portion is different from a second area for each respective second portion.Type: ApplicationFiled: May 6, 2013Publication date: November 14, 2013Inventors: Walter H. Johnson, Jianou Shi, Lansheng Dong, Haijing Peng, Xianghua Liu, Jiazhou Jin, Zhuoxian Zhang, Nanchang Zhu
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Patent number: 8577123Abstract: A method, system and a computer program product for evaluating contact elements, the method includes: acquiring images of multiple groups of contact elements, wherein each group of contact element was expected to be contacted during a test by the same group of probes so as to form multiple probe marks; and evaluating at least one characteristic of a first contact element in response to a comparison between a number of potential probe marks that appear in the image of a first contact element and a number of potential probe marks that appear in an image of a second contact element.Type: GrantFiled: January 27, 2008Date of Patent: November 5, 2013Assignee: Camtek Ltd.Inventors: Roni Flieswasser, Michael Lev
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Publication number: 20130285690Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices.Type: ApplicationFiled: January 18, 2011Publication date: October 31, 2013Applicant: Advantest (Singapore) Pte LtdInventor: John Andberg
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Publication number: 20130285689Abstract: In a method for detecting working states of I/O pins of electronic components, a signal is transmitted between at least two of the I/O pins. A probe of an oscilloscope is connected to an I/O pin. A waveform of the signal through the I/O pin is detected. Charges are transmitted to the probe. A working state of the I/O pin is determined by detecting whether the waveform of the signal through the I/O pin is changed when the charges are transmitted to the probe.Type: ApplicationFiled: April 26, 2013Publication date: October 31, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.Inventor: REN-WEN HUANG
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Publication number: 20130278280Abstract: A voltage compensation assembly adapted for apparatus having a prober for contacting the electronic elements on a substrate is described. The voltage compensation assembly includes a controller connected to the prober and adapted for active voltage compensation, and a voltage measuring unit connected to the controller and for measuring a voltage on the substrate.Type: ApplicationFiled: June 20, 2013Publication date: October 24, 2013Inventor: Bernhard G. MUELLER
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Patent number: 8564284Abstract: A method of evaluating the condition of a laminated core of an electric machine including positioning a magnetic flux injection excitation yoke extending between a pair of teeth of the laminated core, and the excitation yoke being wound with an excitation winding defining an electrical circuit for producing a magnetic flux excitation. Power is supplied to an excitation winding wound around the yoke to produce a magnetic flux in the yoke and to form a magnetic circuit through the yoke and the laminated core. A characteristic of the electrical circuit of the excitation winding is measured to identify a fault in the magnetic circuit corresponding to an eddy current between individual laminations in the laminated core.Type: GrantFiled: February 11, 2011Date of Patent: October 22, 2013Assignee: Siemens Energy, Inc.Inventor: Vladimir Leonov
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Patent number: 8547127Abstract: There is provided a probe block comprising a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported, wherein the probe block is installed in a probe card for inspecting a semiconductor chip.Type: GrantFiled: February 22, 2010Date of Patent: October 1, 2013Assignee: Gigalane Co. LtdInventors: Yong Goo Lee, Maeng Youl Lee
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Patent number: 8513966Abstract: Embodiments of the invention describe forming a set of probes using semiconductor regions each including a plurality of vias. A first set of probe segments may be formed from a first set of vias on a first semiconductor region. A second set of probe segments may be formed from a second set of vias on a second semiconductor region and bonded to the first set of probe segments. At least one spring comprising a dielectric material may be formed to couple the first set of probe segments, while a set of metal tips disposed on the second set of probe segments.Type: GrantFiled: August 11, 2010Date of Patent: August 20, 2013Assignee: Intel CorporationInventors: Qing Ma, Roy E. Swart, Paul B. Fischer, Johanna M. Swan
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Patent number: 8513942Abstract: A probe head can comprise a substrate and electrically conductive structures extending from opposite surfaces of the substrate. The probe head can be made by forming frame structures each comprising a frame to which a row of the conductive structures is coupled. The frame structures can be placed in a stack. A compressible shim or a curable adhesive can be provided between adjacent frames in the stack to control a distance between the contact ends of the conductive structures in adjacent rows of the conductive structures. The frames can include cavities that form a mold while the frames are in the stack, and the substrate can be formed by introducing a moldable material into the mold. After the moldable material hardens, the frame can be removed, leaving the conductive structures embedded in the substrate.Type: GrantFiled: December 21, 2010Date of Patent: August 20, 2013Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gaetan L. Mathieu
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Patent number: 8513967Abstract: An exemplary manipulator of a robot includes a detecting bar including two detecting pins and a regulating mechanism for regulating the distance between the two detecting pins, a fastening seat supporting the detecting bar, a fixing device fixed to the fastening seat, a driving mechanism disposed on the fastening seat, and an adjusting element connecting the driving mechanism with the regulating mechanism of the detecting bar. Under a driving action of the driving mechanism on the adjusting element, the adjusting element rotates to cause the regulating mechanism of the detecting bar to regulate the distance between the two detecting pins.Type: GrantFiled: September 17, 2010Date of Patent: August 20, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shen-Chun Li, Hsien-Chuan Liang, Shou-Kuo Hsu
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Patent number: 8513968Abstract: An exemplary manipulator of a robot includes a fastening seat defining two guiding grooves, a driving mechanism disposed on the fastening seat, two transmitting plates respectively received in the two guiding grooves and cooperating with the driving mechanism, and two detecting bars each fixedly connecting with a corresponding transmitting plate. A detecting pin is fixed on each of the detecting bars. Under a driving action of the driving mechanism on the transmitting plates, the transmitting plates are activated to slide in the guiding grooves to cause the detecting bars to move close to or apart from each other, whereby a distance between the two detecting pins is automatically regulated.Type: GrantFiled: September 17, 2010Date of Patent: August 20, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shen-Chun Li, Hsien-Chuan Liang, Wen-Laing Tseng, Yu-Chang Pai, Shou-Kuo Hsu