Abstract: A method and system for evaluating the condition of a laminated core of an electric machine, and including a first yoke wound with a first winding and having a first pair of arms spanning between a first pair of teeth of the laminated core, and a second yoke wound with a second winding and having a second pair of arms spanning between a second pair of teeth. A power supply provides power to an electrical circuit defined by one of the first and second windings to produce a magnetic flux in the yoke corresponding to the one of the first and second windings and defining an excitation yoke. A monitoring module provides a measurement of a characteristic of an electrical circuit defined by the other one of the first and second windings to identify a fault corresponding to an eddy current between individual laminations in the laminated core.

Abstract: An electrical signal connector which may be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. The electrical signal connector has a probe unit in which a plurality of resin-made film probes, corresponding to one or more pads on a semiconductor chip to be tested, are supported in parallel on a plurality of support plates; a first probe holder of grid structure provided with a plurality of openings; and a second probe holder of the same configuration as that of the first probe holder, the second probe holder having projections at intersection points in the grid structure. The first and second probe holders are fastened to the circuit board with the projections of the second probe holder inserted in corresponding holes of the circuit board and the first probe holder being fastened to the circuit board with screws.

Abstract: A prober unit in which probes are brought into contact with to-be-tested semiconductor chips to establish electrical connection between the semiconductor chips and a test unit via the probes. A probe assembly and a plurality of wiring boards are prepared, the probe assembly being constituted by integrated regularly-arranged multiple probe groups including output terminals connected directly to the probes, and each of the wiring boards including wiring adhering to a surface of a non-conductive film; and an n-th row of an output terminal group of the probe assembly is brought into contact with a land group provided at an end of an n-th wiring board, and a wiring terminal provided at the other end of the n-th wiring board is connected to one of a wiring board of the test unit and a connector to establish electrical connection between the to-be-tested semiconductor chips and the test unit.

Abstract: Disclosed is a testing system, which includes a thin film transistor substrate. The thin film transistor substrate includes a plurality of thin film transistors and a plurality of connecting pads. Each of the thin film transistors includes a first electrode, a second electrode, and a third electrode. The thin film transistor substrate further includes a testing pad. One of the first electrode and the second electrode of each of the thin film transistors is electrically connected with one of the connecting pads. The third electrode and the other one of the first electrode and the second electrode of each of the thin film transistors are electrically connected with the testing pad. The testing system of the present invention is capable of decreasing the cost of the testing system and the complexity of disposed circuits.

Abstract: An electronic component contactor includes a plurality of contact pins, a housing that encases and determines positions of the plurality of contact pins, and a buffer member that buffers against the behavior of the contact pins. The contact pins each includes a base portion, a stretch portion that stretches from the base portion in an arc shape, a contact portion that is formed in the stretch portion, and a load receiving portion. The housing includes a support base in which a surface supporting the buffer member is formed to be flat. The buffer member is formed in a sheet-like shape. A portion of the buffer member that faces the load receiving portion is supported by the support base.

Abstract: An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

Abstract: Provided is an error measurement and correction device of a stage of a wafer prober. The error measurement and correction device includes a jig member, a vision module, a central processing unit, and an interface unit. The jig member is disposed on a chuck on the stage, and the vision module is disposed on an upper plate of the wafer prober disposed at a position facing the jig member to enable the camera of the vision module to acquire images of the patterns of the jig member and transmits the acquired images to the central processing unit. The central processing unit acquires images of the patterns of the jig member disposed on the chuck by using the vision module to extract reference position information, moves the stage at a unit interval of the pattern, acquires images of the patterns of the jig member again to extract measured position information, and generates and stores mapping data by calculating difference between the measured position information and the reference position information.

Abstract: A test pad structure may include a plurality of test pads and a plurality of connection leads. A plurality of the test pads may be sequentially arranged from a wiring pattern on a substrate and arranged in rows parallel with one another. The plurality of the test pads may include a first group of test pads having at least one pad and a second group of test pads having at least two pads. A plurality of the connection leads may extend from end portions of the wiring pattern to be connected to the plurality of test pads. A plurality of the connection leads may include at least one inner lead passing between the at least two pads of the second group of the test pads and arranged in a first row closest to the first group of the test pads. The at least one inner lead may be connected to at least one pad of the at least two pads of the second group of the test pads arranged in a second row next to the first row.

Abstract: A method of testing integrated circuits, including establishing at least a first physical communication channel between a test equipment and an integrated circuit under test by having at least a first probe of the test equipment contacting a corresponding physical contact terminal of the integrated circuit under test; having the test equipment and the integrated circuit under test exchange, over said first physical communication channel, at least two signals selected from the group including at least two test stimuli and at least two test response signals, wherein said at least two signals are exchanged by means of at least one modulated carrier wave modulated by the at least two signals.

Abstract: A MEMS probe adapted to contact a corresponding terminal of an integrated circuit, integrated on at least one chip of a semiconductor material wafer during a test phase of the wafer is provided. The probe includes a support structure comprising a first access terminal and a second access terminal; the support structure defines a conductive path between said first access terminal and said second access terminal. The probes further-includes a probe region connected to the support structure adapted to contact the corresponding terminal of the integrated circuit during the test phase for providing at least one test signal received from the first access terminal and the second access terminal to the integrated circuit through at least one portion of the conductive path, and/or providing at least one test signal generated by the integrated circuit to at least one between the first access terminal and the second access terminal trough at least one portion of the conductive path.

Abstract: A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement range and the second spring has a positive stiffness over the predefined displacement range. The first spring and second spring can be coupled so that the negative stiffness and positive stiffness substantially cancel to produce a net stiffness of the tip relative to the base over the predefined displacement range.

Abstract: An SCR module tester facilitates rapid testing of SCR modules by a series of tests that are tailored to detect faults without applying full power to the modules. The SCR tester includes a quick clamp connector that is able to securely and easily clamp SCR modules for both the F/A-18 A/D GCU and F/A-18-E/F GCU facilitating the rapid testing of SCR modules.

Abstract: A probe card includes a probe unit having multiple through holes arranged therein, multiple probe needles respectively press-fitted to the multiple through holes, a printed board having convex portions which presses down the probe needles located in predetermined positions, and a unit holder which supports the probe unit and the printed board.

Abstract: A vertically folded probe is provided that can provide improved scrub performance in cases where the probe height is limited. More specifically, such a probe includes a base and a tip, and an arm extending from the base to the tip as a single continuous member. The probe arm is vertically folded, such that it includes three or more vertical arm portions. The vertical arm portions have substantial vertical overlap, and are laterally displaced from each other. When such a probe is vertically brought down onto a device under test, the probe deforms. During probe deformation, at least two of the vertical arm portions come into contact with each other. Such contact between the arm portions can advantageously increase the lateral scrub motion at the probe tip, and can also advantageously reduce the probe inductance.

Abstract: A system for making high frequency measurements on a DUT includes a high frequency measurement instrument; a plurality of DUT probes; a first coaxial cable having a center conductor and a coaxial conductor for connection between the instrument and a first DUT probe; and a second coaxial cable having a center conductor and a coaxial conductor for connection between the instrument and a second DUT probe, at least one of the first and second cables being selectively shortable between the respective center conductor and coaxial conductor at a location near the respective DUT probe.

Abstract: An electrical connection confirmation system includes a cartridge type HDD 200 and a storage device main body 100 into which the cartridge type HDD 200 is inserted. The cartridge type HDD 200 includes a HDD connector 230 configured to comply with SATA standard, and having pins 210a to 210j and 210l to 210o that are internally shorted. The storage device main body 100 includes a main body connector 130 configured to comply with SATA standard, and having pins 110a to 110j and 110l to 110o provided in positions respectively opposite to the pins 210a to 210j and 210l to 210o. The electrical connection of the cartridge type HDD 200 to the storage device main body 100 is detected based on voltage states or electric current states of the specified pins 110d, 110g, and 110m.

Abstract: Risers including a plurality of high aspect ratio electrical conduits, as well as systems and methods of manufacture and/or use of the risers and/or the high aspect ratio electrical conduits. The systems and methods may include incorporation of the plurality of high aspect ratio electrical conduits within a substantially planar body that may include and/or be formed from a solid dielectric material. The plurality of electrical conduits may be configured to conduct a plurality of electric currents between a first surface of the body and a second, substantially opposed, surface of the body. The surfaces may include a plurality of contact pads configured to provide a robust and/or corrosion-resistant surface and/or to improve electrical contact between the riser and another device. The risers also may include a layered structure, wherein the layers are sequentially formed to increase a thickness of the riser and/or the aspect ratio of the electrical conduits.

Abstract: A method for aligning a probe relative to a supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.

Abstract: A test circuit includes two probes, a comparison circuit, a switch circuit, and an indication circuit. The probes are connected to an electronic component to be tested, and a low level signal is output if the electronic component is short-circuited. The comparison circuit outputs a comparison signal based on the shorting signal from the probes. The switch circuit outputs a switch signal based on the comparison signal from the comparison circuit. The indication circuit indicates that the electronic component is short-circuited or not short-circuited based on the switch signal fro m the switch circuit.

Abstract: The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle ? in a range of 0 to 180°.

Abstract: A manufacturing method for probe card according to the present invention includes following processes. A film is formed on the surface of a circuit board. A connecting terminal and joint member are formed by etching the film, and the surface of the joint member is polished. An inspection contacting structure is assembled. The inspection contacting structure is moved proximity to a circuit board. The lower surface of a contactor and joint member are attached so as to contact the front end of a probe penetrating and passing through the contactor to the connecting terminal.

Abstract: A resonant test probe for testing high-speed integrated circuit devices. The test probe includes a probe tip that makes electrical contact with a device under test to receive a test signal from the device, and an output circuit transmits the received test signal to a testing apparatus. The test probe also includes tuning circuitry coupled between the probe tip and the output circuit. The tuning circuitry is configured to tune a resonance frequency of the test probe to be substantially equal to an operating frequency of the device under test to enable the test probe to transmit the test signal to the device under test.

Abstract: A CIS test probe card with an optic assembly is disclosed. At least one embodiment relates to the optic assembly being located close to the CIS test probe card to collimate a light before it is projected through the CIS test probe card to the wafer. At least one embodiment relates to a change in the geometric configuration of the hole(s) and the probe(s) in the CIS test probe card. Small holes corresponding to the CIS chips in a one-on-one fashion can be implemented, such that each small hole is located over a corresponding CIS chip.

Abstract: Systems, devices, and methods for two-sided testing of electronic devices. These systems, devices, and methods may include the use of a test fixture that is configured to electrically connect a back side electrical pad of a device under test with an auxiliary pad that faces in a different direction than the back side electrical pad. Additionally or alternatively, these systems, devices, and methods also may include the use of a probe head that is configured to form an electrical connection with both the auxiliary pad and a front side electrical pad of the device under test. The systems, devices, and methods also may include providing a test signal to the device under test, receiving a resultant signal from the device under test, and/or analyzing the resultant signal.

Abstract: Electronic device structures such as structures containing antennas, cables, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a test system to perform conducted testing. The test system may include a vector network analyzer or other test unit that generates radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using a contact test probe that has at least signal and ground pins. The test probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.

Abstract: A contact probe having a substantially flat plate shape, used to connect different substrates and having a uniform plate thickness includes: a first contact portion which has a side surface curved in an arc shape and which makes contact with one substrate at the side surface thereof; a second contact portion which has a side surface curved in an arc shape and which makes contact with the other substrate at the side surface thereof; a connection portion which connects the first contact portion and the second contact portion; and an elastic portion which extends from the second contact portion, has a portion curved in an arc shape, and is elastically deformed by a load applied to the first contact portion and the second contact portion.

Abstract: A probe system for facilitating the inspection of a device under test. System incorporates a storage rack; a probe bar gantry assembly; a probe assembly configured to electrically mate the device under test; and a robot system for picking the probe assembly from the storage rack and deliver the probe assembly to the probe bar gantry. The robot system is also enabled to pick a probe assembly from the probe bar gantry and deliver the probe assembly to the storage rack. The probe assembly includes a clamping assembly for attaching the probe assembly to the probe bar gantry or the storage rack. The probe assembly may include an array of contact pins configured to mate with conductive pads on the device under test when the probe assembly is installed on the probe bar gantry assembly.

Abstract: Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices.

Abstract: A testing device suitable for a testing apparatus with light inspection of a display panel is provided, in which the testing device includes a main part and two contact parts. The testing device is fixed to the testing apparatus with light inspection by the main part. Two contact parts are respectively extended from two ends of the main part along a first direction, and each of the contact parts has a plurality of tips. The tips of each contact part have different heights. Besides, a testing apparatus is also provided. Therefore, the abovementioned testing device and the testing apparatus are able to drastically extend the user lifetime, improve the inspection accuracy and save cost.

Abstract: A probe assembly has insertion holes formed in a base layer provided on a circuit board. Probe pins are inserted into the insertion holes and fixed by a conductive adhesive filled in the insertion holes. The probe pins can be arranged with small pitch without mechanically electrically interfering with neighboring pins using the insertion holes. Furthermore, the base layer is formed of a semiconductor material to prevent a problem caused by a difference in the coefficient of thermal expansion between the base layer and a wafer. Moreover, coplanarity and alignment accuracy of the probe pins can be improved using aligning mask layers or aligning mask in a process of manufacturing the probe assembly. In addition, probe assembly manufacturing time can be reduced by using a pin array frame into which a large number of probe pins are temporarily inserted.

Abstract: Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.

Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.

Abstract: The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site.

Abstract: A method for testing a semiconductor wafer comprises providing a semiconductor wafer. The semiconductor wafer comprises a protruding annular rim, a first redistribution structure disposed on the front side of the semiconductor wafer, a second redistribution structure disposed on the rear side of the semiconductor wafer within the protruding annular rim and a plurality of vias extending from the front side to the rear side. A first probe is contacted to the first redistribution structure on the front side and a second probe is contacted to the second redistribution structure on the rear side. The first probe is in contact with the first redistribution structure and the second probe is in contact with the second redistribution structure at the same time.

Abstract: A three dimensional (3D) integrated circuit (IC) testing apparatus comprises a plurality of connection devices. When a device under test (DUT) such as an interposer or a 3D IC formed by a plurality of 3D dies operates in a testing mode, the 3D IC testing apparatus is coupled to the DUT via a variety of interface channels such as probes. The connection devices and a variety of through silicon vias (TSVs) in the DUT form a TSV chain so that a electrical characteristic test of the variety of TSVs can be tested all at once.

Abstract: A probe for testing electrical properties of test samples includes a body having a probe arm defining proximal and distal ends, the probe arm extending from the body at the proximal end of the probe arm, whereby a first axis is defined by the proximal and the distal ends. The probe arm defines a geometry allowing flexible movement of the probe arm along the first axis and along a second axis perpendicular to the first axis, and along a third axis orthogonal to a plane defined by the first axis and the second axis.

Abstract: An improved system for capacitive testing electrical connections in a low signal environment. The system includes features that increase sensitivity of a capacitive probe. One feature is a spacer positioned to allow the probe to be partially inserted into the component without contacting the pins. The spacer may be a collar on the probe that contacts the housing of the component, contacts the substrate of the circuit assembly, or both. In some other embodiments, the spacer may be a riser extending beyond the surface of the sense plate that contacts the component, a riser portion of the component, or a combination of both. The spacer improves sensitivity by establishing a small gap between a sense plate of the probe and pins under test without risk of damage to the pins. A second feature is a guard plate of the probe with reduced capacitance to a sense plate of the probe. Reducing capacitance also increases the sensitivity of the probe.

Abstract: A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.

Abstract: Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a capacitive coupling probe. The probe may have electrodes. The electrodes may be formed from patterned metal structures in a dielectric substrate. A test unit may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the electrodes. Complex impedance data, forward transfer coefficient data, or other data may be used to determine whether the structures are faulty. A fixture may be used to hold the capacitive coupling probe in place against the conductive electronic device structures during testing.

Abstract: A system and method uses a measurement control device and a measurement machine to measure pin voltages of electronic components installed in an electronic device. The measurement control device controls a mechanical arm of the measurement machine to move to the pins of the electronic components according to coordinates of the pins. A voltage probe installed on the end of the mechanical arm can measure voltages of the pins automatically.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A method of testing semiconductor devices, the method includes the steps of making a first set of electrical connections to a first set of devices to allow a first set of tests to be performed on that set of devices and concurrently making a second set of electrical connections to a second set of devices to allow a second set of tests to be performed on the second set of devices, wherein the first and second sets of tests are different, and concurrently performing the first set of tests on the first set of devices and the second set of tests on the second set of devices.

Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion.

Abstract: A probe card detecting apparatus includes a probe detecting chamber having a supporting body, a probe card positioned and mounted detachably via a first holder on the predetermined position of the supporting body, a first imaging device movably provided in the probe detecting chamber to detect needle tips of at least two probes of the probe card, a probe correction card positioned and mounted detachably via a second holder to the predetermined position of the supporting body, and a control device. Under the control of the control device, using the first imaging device, a difference between a horizontal position of needle tips of at least two probes and a horizontal position of at least two targets is detected as a correction value for performing a position alignment of the at least two probes with the at least two electrode pads of said semiconductor wafer.

Abstract: Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe.

Abstract: Systems and methods of testing semiconductor devices, the system including a tester configured to evaluate electrical characteristics of a semiconductor device provided on a wafer, and a probe unit configured to transfer electrical signals used to test the semiconductor device between the tester and the semiconductor device. The probe unit may include: a housing; a wafer supporting member disposed in the housing to support the wafer; a printed circuit board disposed on the housing to transfer the electrical signals from and to the tester, and a probe card disposed opposite the wafer supporting member, in the housing. The probe card may include probe pins to deliver the electrical signal from and to the semiconductor device. Each of the probe pins may include a probe tip configured to adjustably extend to contact the wafer.

Abstract: An electronic device for use with a probe head in automated test equipment includes first and second pluralities of semiconductor devices. The first plurality of semiconductor devices is arranged to form at least one driver arranged to couple to a device under test. The at least one driver is configured to transmit a signal to the at least one device under test. The second plurality of semiconductor devices is arranged to form at least one receiver arranged to couple to the device under test. The at least one receiver is configured to receive a signal from the at least one device under test. Each of the second plurality of semiconductor devices has a thickness less than about 300 ?m exclusive of any electrical interconnects. The at least one receiver is adapted to mount directly to the probe head.

Abstract: Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.

Abstract: Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.