Abstract: Embodiments relate to system and methods including a plurality of nonvolatile memory elements wherein sets of least two nonvolatile memory elements each share one select element for selecting one of the nonvolatile memory elements of a particular one of the sets of nonvolatile memory elements for a read operation or a program operation.

Abstract: A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process.

Abstract: A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process.

Abstract: A logic circuit is provided which can hold a switching state of the logic circuit even when a power supply potential is not supplied, has short start-up time of a logic block after the power is supplied, can operate with low power consumption, and can easily switch between a NAND circuit and a NOR circuit. Switching between a NAND circuit and a NOR circuit is achieved by switching a charge holding state at a node through a transistor including an oxide semiconductor. With the use of an oxide semiconductor material which is a wide bandgap semiconductor for the transistor, the off-state current of the transistor can be sufficiently reduced; thus, the state of charge held at the node can be non-volatile.

Abstract: A non-volatile memory cell with high bit density is disclosed. Embodiments include: providing a transistor having a wordline gate structure over a substrate, first and second floating gate structures proximate opposite sides of the wordline gate structure, and first and second diffusion regions in the substrate, wherein the wordline gate structure, the first floating gate structure, and the second floating gate structure are laterally between the first and second diffusion regions; and providing a capacitor having first, second, and third control gate structures over the substrate, a third floating gate structure between the first and second control gate structures, a fourth floating gate structure between the second and third control gate structures, and third and fourth diffusion regions in the substrate, wherein the first, second, and third control gate structures are laterally between the third and fourth diffusion regions.

Abstract: A memory device or electronic system may include a memory cell body extending from a substrate, a self-aligned floating gate separated from the memory cell body by a tunneling dielectric film, and a control gate separated from the self-aligned floating gate by a blocking dielectric film. The floating gate is flanked by the memory cell body and the control gate to form a memory cell, and the self-aligned floating gate is at least as thick as the control gate. Methods for building such a memory device are also disclosed.

Abstract: A resistor divider including two resistors, which is connected to a control gate of a P-channel non-volatile memory element, and two switch transistors connected in parallel to the two resistors are used to adjust the potential of the control gate so that a potential of a floating gate is set in the vicinity of a threshold of the memory element in writing. In the P-channel non-volatile memory element, because the potential of the floating gate is set in the vicinity of the threshold of the memory element, the electric field between a pinch-off point and a drain becomes stronger so that hot carriers are more likely to be generated. Consequently, the write characteristics are improved, and writing can be performed at a low voltage.

Abstract: A non-volatile memory including one or more EEPROM cell pairs. Each EEPROM cell pair includes three transistors and stores two data bits, effectively providing a 1.5 transistor EEPROM cell. An EEPROM cell pair includes a first non-volatile memory transistor connected to a first bit line, a second non-volatile memory transistor connected to a second bit line, and a source access transistor coupled to common source line. The source access transistor includes: a first diffusion region continuous with a source region of the first non-volatile memory transistor and a second diffusion region continuous with a source region of the second non-volatile memory transistor.

Abstract: A three-dimensional (3-D) nonvolatile memory device includes channel layers protruded from a substrate, word line structures configured to include word lines stacked over the substrate, first junctions and second junctions formed in the substrate between the word line structures adjacent to each other, source lines coupled to the first junctions, respectively, and well pickup lines coupled to the second junctions, respectively.

Abstract: A Flash memory device operable under a single-bit or multiple-bit serial protocol is provided with a capability to determine the address boundary condition of an application from the address field of an address boundary configurable (“ABC”) read command. Based on the identified address boundary condition, the Flash memory device may perform multiple sensing of the memory array as required by the ABC read command using optimal internal sense times for each sensing. The number of dummy bytes may be specified for the read command in advance by the user, based on the address boundary of the application and the desired frequency of operation of the Flash memory device. Therefore, Flash memory device read performance is improved both by minimizing the number of dummy bytes in the read command and by optimizing the internal sense times for the read operation.

Abstract: An apparatus is provided which includes an array of impurity ions disposed in an insulating region, a semiconductor region adjacent to the insulating region, an array of electrometers arranged to detect charge carriers in the semiconductor region and an array of sets of at least one control gate configured to apply an electric field to the insulating region and semiconductor region. Each control gate is operable to cause at least one charge carrier in the semiconducting material region to bind to the impurity ion without the at least one charge carrier leaving the semiconductor material region. The electrometers are operable to detect whether the at least one charge carrier is bound to the impurity ion.

Abstract: A capacitor-less memory cell, memory device, system and process of forming the capacitor-less memory cell includes forming the capacitor-less memory cell in an active area of a substantially physically isolated portion of a bulk semiconductor substrate. A pass transistor is formed on the active area for coupling with a word line. The capacitor-less memory cell further includes a read/write enable transistor vertically configured along at least one vertical side of the active area and operable during a reading of a logic state with the logic state being stored as charge in a floating body area of the active area, causing different determinable threshold voltages for the pass transistor.

Abstract: A nonvolatile semiconductor memory device includes a memory cell which stores data and which is capable of being rewritten electrically, a bit line which is connected electrically to one end of a current path of the memory cell, a control circuit which carries out a verify operation to check a write result after data is written to the memory cell, and a voltage setting circuit which sets a charging voltage for the bit line in a verify operation and a read operation and makes a charging voltage in a read operation higher than a charging voltage in a verify operation.

Abstract: A NAND flash memory chip includes a first partition that has smaller memory cells, with smaller charge storage elements, and a second partition that has larger memory cells, with larger charge storage elements, in the same memory array. Data is selected for storage in the first or second partition according to characteristics, or expected characteristics, of the data.

Abstract: Devices, systems, methods, and other embodiments associated with selectively accessing memory are described. In one embodiment, a method detects an indication indicative of whether to program fast access pages or slow access pages of a flash memory. In response to the detected indication, data is programmed from a volatile memory: (1) to the fast access pages of the flash memory while skipping the slow access pages, or (2) to the slow access pages while skipping the fast access pages.

Abstract: The performance of a semiconductor device including a nonvolatile memory is enhanced. Each of nonvolatile memory cells arranged over a silicon substrate includes: a first n-well; a second n-well formed in a place different from the place thereof; a selection transistor formed in the first n-well; and an electric charge storage portion having a floating gate electrode and a storage portion p-well. The floating gate electrode is so placed that it overlaps with part of the first n-well and the second n-well. The storage portion p-well is placed in the first n-well so that it partly overlaps with the floating gate electrode. In this nonvolatile memory cell, memory information is erased by applying positive voltage to the second n-well to discharge electrons in the floating gate electrode to the second n-well.

Abstract: Techniques are described for increasing a lifetime of a plurality of blocks of memory by equalizing a variation between the blocks. In operation, blocks to be written are allocated from a set of blocks having a lifetime factor below a threshold. The threshold is reset as required to resupply the set of blocks available for allocation.

Abstract: A reprogrammable memory, which can be, programmed a limited number of times. A plurality of one-time programmable elements are combined by a logic arrangement such that the output of that logic arrangement may be reprogrammed a limited number of times.

Abstract: An electronic circuit includes a floating gate transistor with a floating gate capacitor. The floating gate transistor can be programmed to be in an ON or an OFF state by charging the floating gate capacitor. The circuit further includes a deactivation capacitor adapted to store a charge sufficient for deactivating the floating gate transistor temporarily. The deactivation capacitor is connectable in series to the floating gate capacitor. A method for deactivating a floating gate transistor temporarily is provided, wherein the floating gate transistor includes a floating gate capacitor. A deactivation capacitor is charged with a charge sufficient for changing the state of the floating gate transistor temporarily. The deactivation capacitor is connected in series to the floating gate capacitor for deactivating the floating gate transistor.

Abstract: A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process.

Abstract: An embodiment of the present invention includes a non-volatile storage unit comprising a first and second N-diffusion well separated by a distance of P-substrate. A first isolation layer is formed upon the first and second N-diffusion wells and the P-substrate. A nano-pillar charge trap layer is formed upon the first isolation layer and includes conductive nano-pillars interspersed between non-conducting regions. The storage unit further includes a second isolation layer formed upon the nano-pillar charge trap layer; and at least one word line formed upon the second isolation layer and above a region of nano-pillar charge trap layer. The nano-pillar charge trap layer is operative to trap charge upon application of a threshold voltage. Subsequently, the charge trap layer may be read to determine any charge stored in the non-volatile storage unit, where presence or absence of stored charge in the charge trap layer corresponds to a bit value.

Abstract: Strings of memory cells having a string select gate configured to selectively couple ends of a string to a data line and a source line concurrently, memory devices incorporating such strings and methods for accessing and forming such strings are provided. For example, non-volatile memory devices are disclosed that utilize vertical structure NAND strings of serially-connected non-volatile memory cells. One such string including two or more serially-connected non-volatile memory cells where each end of the string shares a string select gate with the other end of the string is disclosed.

Abstract: The present disclosure provides a semiconductor device which includes a semiconductor substrate, a first gate structure disposed over the substrate, the first gate structure including a first gate electrode of a first conductivity type, a second gate structure disposed over the substrate and proximate the first gate structure, the second gate structure including a second gate electrode of a second conductivity type different from the first conductivity type, a first doped region of the first conductivity type disposed in the substrate, the first doped region including a first lightly doped region aligned with a side of the first gate structure, and a second doped region of the second conductivity type disposed in the substrate, the second doped region including a second lightly doped region aligned with a side of the second gate structure.

Abstract: Provided is an apparatus and method for storing data in a terminal are provided. The apparatus includes a processor for sending a first command to a memory to instruct storage of data in a Single-Level Cell (SLC) area of the memory if a function requiring high-speed storage of large amounts of data is selected; and the memory for storing received data in the SLC area regardless of a size of the data, upon receiving the first command from the processor.

Abstract: The invention relates to a flash memory cell having a FET transistor with a floating gate on a semiconductor-on-insulator (SOI) substrate composed of a thin film of semiconductor material separated from a base substrate by an insulating buried oxide (BOX) layer, The transistor has in the thin film, a channel, with two control gates, a front control gate located above the floating gate and separated from it by an inter-gate dielectric, and a back control gate located within the base substrate directly under the insulating (BOX) layer and separated from the channel by only the insulating (BOX) layer. The two control gates are designed to be used in combination to perform a cell programming operation. The invention also relates to a memory array made up of a plurality of memory cells according to the first aspect of the invention, which can be in an array of rows and columns, and a method of fabricating such memory cells and memory arrays.

Abstract: A method for erasing a memory array is provided. The memory array comprises a plurality of memory cell strings, and each of the memory cell strings comprises a plurality of memory cells connected to a plurality of word lines. The method for erasing the memory array includes the following steps. A first voltage is applied to a substrate of the memory array. A second voltage is applied to a word line of a selected memory cell, and a plurality of passing voltages are applied to other word lines. And, a third voltage and a fourth voltage are respectively applied to a first source/drain region and a second source/drain region of the selected memory cell, so that a band to band (BTB) hot hole injecting method is induced to erase the specific memory cell, wherein the third voltage is not equal to the fourth voltage.

Abstract: A semiconductor memory device performing high speed reading with a miniaturized sensing circuit is provided. A pre-charge voltage from a virtual potential VPRE? is provided to an odd bit line when an even bit line is selected, the pre-charge voltage is provided from a source voltage supply unit 230 to a shared odd source line SL_o, a ground potential is provided from the source voltage supply unit 230 to an even source line SL_e.

Abstract: In a multi-level memory cell, when data to be programmed arrives, the cell is programmed to the lowest-charge state in which any bit position that is being programmed or has already been programmed has the correct value, regardless of the value in that state of any bit position that has not yet been programmed and is not being programmed. The programming of other bit positions based on subsequently arriving data should not then require a transition to an impermissible lower energy state. Although this may result in a transient condition in which some bits have the wrong value, by the time programming is complete, all bits would be expected to have the correct value. A cell may contain any number of bits equal to or greater than two, and programming may be performed cyclically (e.g., from LSB to MSB), anticyclically (e.g., from MSB to LSB), or in any random order.

Abstract: An operating method for a memory unit is provided, wherein the memory unit includes a well region, a select gate, a first gate, a second gate, an oxide nitride spacer, a first diffusion region, and a second diffusion region. The operating method for the memory unit comprises the following steps. During a programming operation, a breakdown voltage is coupled to the second diffusion region through a first channel region formed under the select gate. A programming voltage is sequentially or simultaneously applied to the first gate and the second gate to rupture a first oxide layer and a second oxide layer, wherein the first oxide layer is disposed between the first gate and the well region, and the second oxide layer is disposed between the second gate and the well region.

Abstract: A driving method of a semiconductor device is provided. In a semiconductor device including a bit line, a selection line, a selection transistor, m (m is a natural number greater than or equal to 2) writing word lines, m reading word lines, a source line, and first to m-th memory cells, each memory cell includes a first transistor and a second transistor that holds charge accumulated in a capacitor. The second transistor includes a channel formed in an oxide semiconductor layer. In a driving method of a semiconductor device having the above structure, when writing to a memory cell is performed, the first transistor is turned on so that a first source terminal or a first drain terminal is set to a fixed potential; thus, a potential is stably written to the capacitor.

Abstract: An alternative electrical fuse structure, which may be similar to or identical with an insulated gate field effect transistor (“IGFET”) of advanced CMOS technology, can be very area efficient and programmable at relatively low voltages, e.g., programming voltages between 1.5 V and 2.5 V. A method is provided for programming an electrical fuse having the structure of an IGFET to permanently electrically isolate the drain of the IGFET from its source. In this way, the step of programming the IGFET fuse can increase a resistance between the source and the drain of the IGFET from a pre-programming value to a post-programming value by two or more orders of magnitude when any given gate-source voltage value and any given drain-source voltage value within normal operational ranges of the IGFET are applied thereto.

Abstract: The gate electrode of a metal oxide semiconductor field effect transistor (MOSFET) comprises a source side gate electrode and a drain side gate electrode that abut each other near the middle of the channel. In one embodiment, the source side gate electrode comprises a silicon oxide based gate dielectric and the drain side gate electrode comprises a high-k gate dielectric. The source side gate electrode provides high carrier mobility, while the drain side gate electrode provides good short channel effect and reduced gate leakage. In another embodiment, the source gate electrode and drain gate electrode comprises different high-k gate dielectric stacks and different gate conductor materials, wherein the source side gate electrode has a first work function a quarter band gap away from a band gap edge and the drain side gate electrode has a second work function near the band gap edge.

Abstract: A memory includes a first word line which is connected to a control gate electrode of a first memory cell, a second word line which is connected to a control gate electrode of a second memory cell, a potential transfer line which is connected to both of the first and second word lines, a first N-channel MOS transistor which is connected between the first word line and the potential transfer line, and a second N-channel MOS transistor which is connected between the second word line and the potential transfer line. A control circuit supplies a first potential with a plus value to a semiconductor substrate, and supplies a second potential with the plus value lower than the first potential to the potential transfer line, to turn the first N-channel MOS transistor on, and to turn the second N-channel MOS transistor off, in erasing data of the first memory cell.

Abstract: According to one embodiment, a semiconductor device comprises an active area extending in a first direction, a contact plug located on a first portion of the active area, and a transistor located on a second portion adjacent to the first portion of the active area in the first direction. A width of a top surface area of the first portion in a second direction perpendicular to the first direction is smaller than that of a top surface area of the second portion in the second direction.

Abstract: A plurality of non-volatile storage elements on a common active layer are offset from neighbor non-volatile storage elements. This offsetting of non-volatile storage elements helps reduce interference from neighbor non-volatile storage elements. A method of manufacture is also described for fabricating the offset non-volatile storage elements.

Abstract: A non-volatile semiconductor storage device according to an embodiment includes a memory cell array and a control circuit configured to execute a read operation. The control circuit refers to data of a reference memory cell which is adjacent to a selected memory cell and in which data is written after a data write operation on the selected memory cell. The control circuit applies a first read pass voltage to a non-selected word line adjacent to the selected word line, when the data of the reference memory cell is data causing the shift of the threshold voltage of the selected memory cell. The control circuit applies a second read pass voltage lower than the first read pass voltage to the non-selected word line, when the data of the reference memory cell is data not causing the shift of the threshold voltage of the selected memory cell.

Abstract: An object is to provide a semiconductor device with a novel structure in which stored data can be retained even when power is not supplied, and does not have a limitation on the number of times of writing operations. A semiconductor device includes a source-bit line, a first signal line, a second signal line, a word line, and a memory cell connected between the source-bit lines. The memory cell includes a first transistor, a second transistor, and a capacitor. The second transistor is formed including an oxide semiconductor material. A gate electrode of the first transistor, one of a source and drain electrodes, and one of electrodes of the capacitor are electrically connected to one another. The source-bit line and a source electrode of the first transistor are electrically connected to each other. Another source-bit line adjacent to the above source-bit line and a drain electrode of the first transistor are electrically connected to each other.

Abstract: A capacitor-less memory cell, memory device, system and process of forming the capacitor-less memory cell includes forming the memory cell in an active area of a substantially physically isolated portion of the bulk semiconductor substrate. A pass transistor is formed on the active area for coupling with a word line. The capacitor-less memory cell further includes a read/write enable transistor vertically configured along at least one vertical side of the active area and operable during a reading of a logic state with the logic state being stored as charge in a floating body area of the active area, causing different determinable threshold voltages for the pass transistor.

Abstract: A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has a maximum variation width of a threshold voltage for memorizing an information set larger than that of the second nonvolatile memory area. The first nonvolatile memory area can be prioritized to expedite a read speed of the memory information, and the second nonvolatile memory area can be prioritized to guarantee the number of times of rewrite operation of memory information.

Abstract: A method of decreasing the test time to determine data retention (e.g. leakage current) of a memory cell having a floating gate for the storage of charges thereon. The memory cell is characterized by the leakage current having a rate of leakage which is dependent upon the absolute value of the voltage of the floating gate. The memory cell is further characterized by a first erase voltage and a first programming voltage, applied during normal operation, and a first read current detected during normal operation. The method applies a voltage greater than the first erase voltage or greater than the first programming voltage, to over erase the floating gate. The memory cell including the floating gate is subject to a single high temperature bake. The memory cell is then tested for data retention of the floating gate based on the single high temperature bake.

Abstract: The disclosure relates to a device for supplying to at least one integrated circuit a high voltage for erasing and/or programming of a memory. The device includes at least one contact terminal linked to at least one contact terminal of the integrated circuit, a monitor for monitoring a data signal received by the integrated circuit and detecting in the data signal a write command of the memory, and a voltage supplier for applying the high voltage to a terminal of the integrated circuit when a write command of the memory has been detected by the monitor.

Abstract: Disclosed herein are 3D stacked memory devices having WL select gates. The 3D stacked memory device could have NAND strings. The WL select gates may be located adjacent to a word line hookup area of a word line plate. The word line plate may be driven by a word line plate driver and may have many word lines. The WL select gates may select individual word lines or groups of word lines. Therefore, smaller units that the entire block may be selected. This may reduce capacitive loading. The WL select gates may include thin film transistors. 3D decoding may be provided in a 3D stacked memory device using the WL select gates.

Abstract: Methods and apparatus for synchronizing a delay locked loop, such as delay locked loops used with NAND memories are disclosed. In at least one embodiment, one or both of a clock and the delay locked loop are stopped for energy savings. A synchronization start signal can be provided by the NAND memory or a controller to start the clock and/or delay locked loop, and to synchronize the delay locked loop to the clock before completing the read operation.

Abstract: A memory cell includes a selection transistor on a substrate and an antifuse on the substrate. The selection transistor includes a first gate connected to a read word line, a first gate insulation layer that insulates the first gate from the substrate, a first source region connected to a bit line, and a first drain region, an impurity concentration of the first drain region being lower than an impurity concentration of the first source region. The antifuse includes a first electrode connected to a program word line and a second electrode connected to the selection transistor.

Abstract: Embodiments of tunneling barriers and methods for same can embed modules exhibiting a monodispersion characteristic into a dielectric layer (e.g., between first and second layers forming a dielectric layer). In one embodiment, by embedding C60 molecules inbetween first and second insulating layers forming a dielectric layer, a field sensitive tunneling barrier can be implemented. In one embodiment, the tunneling barrier can be between a floating gate and a channel in a semiconductor structure. In one embodiment, a tunneling film can be used in nonvolatile memory applications where C60 provides accessible energy levels to prompt resonant tunneling through the dielectric layer upon voltage application.

Abstract: Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a first region and a second region. The apparatus may also include a body region disposed between the first region and the second region and capacitively coupled to a plurality of word lines, wherein each of the plurality of word lines is capacitively coupled to different portions of the body region.

Abstract: According to one embodiment, a semiconductor storage device includes a nonvolatile semiconductor memory and a controller. The nonvolatile semiconductor memory includes a firmware area capable of storing firmware used to execute either a normal mode or an autorun test mode and a user area capable of storing user data. The controller reads the firmware from the nonvolatile semiconductor memory and determines whether the firmware has been set in either the normal mode or the autorun test mode. The controller repeats erasing, writing, and reading in each block in the user area using a cell applied voltage higher than a voltage used in a normal mode, and enters a block where an error has occurred as a bad block.

Abstract: A method for manufacturing Flash memory devices includes forming a well region in a substrate, depositing a gate dielectric layer overlying the well region, and depositing a first polysilicon layer overlying the gate dielectric layer. The method also includes depositing a dielectric layer overlying the first polysilicon layer and depositing a second polysilicon layer overlying the dielectric layer to form a stack layer. The method simultaneously patterns the stack layer to form a first flash memory cell, which includes a first portion of the second polysilicon layer overlying a first portion of the dielectric layer overlying a first portion of first polysilicon layer and to form a select device, which includes a second portion of second polysilicon layer overlying a second portion of dielectric layer overlying a second portion of first polysilicon layer. The method further includes forming source/drain regions using ion implant.

Abstract: Techniques are described for increasing a lifetime of blocks of memory. In operation, respective life expectancy scores for each of the blocks are calculated based at least in part on a respective number of times each of the blocks is respectively erased, and further based at least in part on at least one other factor that affects the lifetime of the blocks. An order to write and recycle the blocks is determined, based at least in part on at least some of the respective lifetime expectancy scores. A total amount of the blocks that are erased and written is minimized while lifetime expectancy score variation between the blocks is equalized.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device includes a semiconductor layer having a channel, a first insulating film provided on the channel, a floating electrode provided on the first insulating film, a second insulating film provided on the floating electrode, and a gate electrode provided on the second insulating film, and changes its data memory state by injection of charges into the floating electrode.