CMP (chemical mechanical planarization) retaining ring

- Samsung Electronics
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Description

FIG. 1 is a front perspective view of a CMP (chemical mechanical planarization) retaining ring showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a bottom rear perspective view thereof;

FIG. 9 is an enlarged view of the delineated portion 9 in FIG. 1;

FIG. 10 is an enlarged view of the delineated portion 10 in FIG. 2;

FIG. 11 is an enlarged view of the delineated portion 11 in FIG. 8;

FIG. 12 is a cross sectional view taken through the line 12-12′ of FIG. 6; and,

FIG. 13 is an enlarged view of the delineated portion 13 in FIG. 12.

The evenly dashed broken lines on the CMP (chemical mechanical planarization) retaining ring depict portions of the retainer ring that form no part of the claimed design. The dot-dash broken lines illustrate boundaries of enlarged views that form no part of the claimed design.

Claims

The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.

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Patent History
Patent number: D1086087
Type: Grant
Filed: Jun 14, 2023
Date of Patent: Jul 29, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Hyungjoo Lee (Suwon-si), Hyeondong Song (Suwon-si)
Primary Examiner: Sandra Snapp
Assistant Examiner: Anehita E. Oribabor
Application Number: 29/894,796