CMP (chemical mechanical planarization) retaining ring
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The evenly dashed broken lines on the CMP (chemical mechanical planarization) retaining ring depict portions of the retainer ring that form no part of the claimed design. The dot-dash broken lines illustrate boundaries of enlarged views that form no part of the claimed design.
Claims
The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.
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Type: Grant
Filed: Jun 14, 2023
Date of Patent: Jul 29, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Hyungjoo Lee (Suwon-si), Hyeondong Song (Suwon-si)
Primary Examiner: Sandra Snapp
Assistant Examiner: Anehita E. Oribabor
Application Number: 29/894,796