Abstract: A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

Abstract: A printed circuit board includes a first insulating layer; a pad formed on the first insulating layer; a second insulating layer covered on the first insulating layer having the pad thereon; and a via hole formed in the second insulating layer. The pad has a surface that is non-planar.

Abstract: Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.

Abstract: A welding system component includes a circuit board for the welding system component. An interface has a main riser portion with a fastener passageway formed therethrough. The interface has an extension portion with a terminal passageway formed therethrough. The extension portion is electrically connected to the circuit board with a terminal disposed in the terminal passageway. The extension portion is spaced away from a surface of the circuit board. A capacitor is electrically connected to the main riser portion with a fastener disposed in the fastener passageway.

Abstract: An X-ray detection apparatus including a case; a circuit board disposed in the case; a connection circuit unit disposed in the case, where the connection circuit unit is electrically connected with the circuit board and includes an integrated circuit (“IC”) chip; a detection panel configured to be inserted into and ejected from the case, where the detection panel is electrically connected to the connection circuit unit; and a contact support unit disposed in the case, wherein the contact support unit allows the connection circuit unit and the detection panel to contact each other by applying a force on the connection circuit unit.

Abstract: The present invention is a USB memory device comprising a chip-on-board (COB) package having a flash memory and a flash memory controller embedded within, a COB carrier for storing the COB package comprising a tray having a G-shaped block with a pair of side lock bumps, and a metal housing for inserting the COB carrier having a top surface, a bottom surface, a top rectangular cut out, a bottom rectangular cut out, a pair of ends, a pair of side cut outs, a pair of top rectangular openings and a pair of bottom rectangular openings. The COB package, the COB carrier and the metal housing are used to assemble the device by inserting the COB carrier from either of the pair of ends and sliding the COB carrier within the metal housing until the pair of side lock bumps interlocks with the pair of side cut outs.

Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.

Abstract: The invention relates to a circuit board having a light source for illumination purposes, having at least one LED electrically conductively connected to conductors of the circuit board, and the light thereof being converted into directed light by means of at least one mirror disposed on the circuit board, characterized in that the mirror is designed as a reflective coating printed onto the circuit board.

Abstract: A method of manufacturing a chip support board structure which includes the steps of forming a metal substrate structure, forming a photo resist pattern, etching the metal substrate structure to form a paddle, removing the photo resist pattern, pressing an insulation layer against the paddle, polishing the insulation layer, forming a circuit layer and forming a solder resist is disclosed. The metal substrate structure is formed by sandwiching a block layer with two metal substrate layers, multilayer. The metal substrate structure is etched under control to an effective depth such that each paddle thus formed has the same shape and depth. Therefore, the method of the present invention can be widely applied to the general mass production processes to effectively solve the problems in the prior arts due to depth differences, such offset, position mismatch and peeling off in the chip support board.

Abstract: An electric device for a vehicle includes: a circuit board having an attachment unit, which is attachable to a vehicular attachment unit, wherein an electric element for providing an electric circuit is mounted on the circuit board; and a shrinkage cover covering a surface of the electric element and a surface of the circuit board. The attachment unit of the circuit board is directly attachable to the vehicular attachment unit with a fastening element.

Abstract: A MEMS sensor comprises a vibrating sensing structure formed from a semiconductor substrate layer (50). The semiconductor substrate layer (50) is mounted on a pedestal comprising an electrically insulating substrate layer (52) bonded to the semiconductor substrate (50) to form a rectangular sensor chip. The pedestal further comprises an electrically insulating spacer layer (54) for mounting the sensor chip to a housing. The electrically insulating spacer layer (54) is octagonal. When the vibrating sensing structure is excited into a cos 2? vibration mode pair, the quadrature bias arising from any mode frequency split is not affected by changes in temperature as a result of the octagonal spacer layer (54).

Abstract: There is provided a power module production method that is capable of stably producing a power module with highly reliable properties, and so forth. The power module production method produces a power module 1 by stacking a cooler 5, an insulating resin sheet 4, a heat sink block 3, and a semiconductor chip 2, wherein a first insulating resin sheet 41, which forms a lower layer of the insulating resin sheet 4, is first bonded to the cooler 5 by thermal compression. Next, with a second insulating resin sheet 42, which forms an upper layer of the insulating resin sheet 4, interposed between the first insulating resin sheet 41 and the heat sink block 3, the second insulating resin sheet 42 is bonded to the first insulating resin sheet 41 by thermal compression, and the heat sink block 3 is bonded to the second insulating resin sheet 42 by thermal compression. The semiconductor chip 2 is then soldered onto the heat sink block 3.

Abstract: In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.

Abstract: Provided are an analytical device comprising a pair of hematocrit electrodes (first pair of electrodes) and a pair of glucose electrodes (second pair of electrodes) that allows a sample to sufficiently reach as far as the second pair of electrodes that are provided on a downstream side in a flow path, a method for manufacturing the analytical device, and a measuring apparatus using the analytical device.

Abstract: A system for removing a plurality of connectors from a circuit board includes two clamp plates. The system includes a divider plate coupled between the two clamp plates. The divider plate is configured to be positioned between adjacent rows of the plurality of connectors. The system further includes a tightening mechanism to tighten the clamp plates and the plurality of pin plates around the plurality of connectors. The system also includes an ejector coupled to the divider plate. The ejector includes a slot that corresponds to a projection on the divider plate, and the divider plate is configured to slide relative to the ejector.

Abstract: A system for removing connector pins from a circuit board includes two clamp plates. The system further includes a plurality of pin plates coupled between the clamp plates. The plurality of pin plates are configured to be positioned between adjacent rows of the connector pins. The system also includes an attachment block coupled between the clamp plates. The attachment block is configured with an inset that corresponds with a notch on each of the plurality of pin plates for linking vertical movement of the plurality of pin plates and the attachment block. The system includes a tightening mechanism to tighten the clamp plates and the plurality of pin plates around the connector pins.

Abstract: A method for forming a frame attachment interconnect between a substrate and a frame is disclosed. The method can include applying a composite material (e.g., epoxy-glass prepreg) to a surface of a substrate. The composite material can have one or more holes disposed to substantially align with a corresponding pad on the surface of the substrate. A metal disc is placed in each hole of the composite material on top of the corresponding pad. A frame member can be placed on top of the composite material and the metal discs. The frame member can have one or more pads disposed to substantially align with the metal discs. The substrate, composite material, metal discs and frame combination can be cured in a controlled atmosphere that can include a vacuum and a predetermined temperature to create discrete electrical connections between adjacent pads but with each encapsulated and electrically isolated.

Abstract: Systems and methods electrically connect a first electronic device or electrical component, having a external electrical connector, to a circuit board of a second electronic device. A low-cost, user-installable connection system isolates mechanical stresses imposed on the external electrical connector to within the user-installable connection system, thereby preventing the mechanical stresses from reaching the circuit board in the second electronic device. If the connection becomes faulty, only the low-cost, user-installable connection system must be replaced.

Abstract: A film actuator is disclosed. The actuator includes a frameless actuator film. The frameless actuator film includes at least one elastomeric dielectric film disposed between first and second electrodes, at least one adhesive applied on one side of the frameless actuator film. It can also include a second adhesive applied on an opposite side of the frameless actuator film. A method of making the actuator is disclosed. A configurable actuator element also is disclosed.

Abstract: Systems, methods and apparatuses for attaching devices to ends of a circuit board. An exemplary method includes removing or creating at least a portion of a sacrificial part of a circuit board based on a predefined pattern, inserting a holder device into a remaining portion of the sacrificial part of the circuit board, placing a device at a predefined location on the circuit board, wherein the device is at least partially supported by a portion of the holder device, attaching the device to the circuit board and removing the holder device and the sacrificial part of the circuit board.

Abstract: A printed circuit board electrorheological fluid valve and method with spaced, bonded, epoxy printed circuit board laminates defining flow channels therebetween. Electrodes are formed on opposite surfaces of the flow channels and surface pads on a laminate are electrically connected to the electrodes for applying a voltage thereto controlling the flow of electrorheological fluid in the flow channels.

Abstract: The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided.

Abstract: Methods and systems for manufacturing a swallowable sensor device are disclosed. Such a method includes mechanically coupling a plurality of internal components, wherein the plurality of internal components includes a printed circuit board having a plurality of projections extending radially outward. A cavity is filled with a potting material, and the mechanically coupled components are inserted into the cavity. The cavity may be pre-filled with the potting material, or may be filled after the mechanically coupled components have been inserted therein. A distal end of each projection abuts against a wall of the cavity thereby preventing the potting material from covering each distal end. The cavity is sealed with a cap causing the potting material to harden within the sealed cavity to form a housing of the swallowable sensor device, wherein the distal end of each projection is exposed to an external environment of the swallowable sensor device.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.

Abstract: Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly.

Abstract: A method for manufacturing a wiring board including, as steps executed in written order: a sub-core accommodation step of accommodating the ceramic sub-core in the sub-core accommodation space through the first-major-surface-side opening of the sub-core accommodation space; and a film formation and charging step of forming a lowest resin insulating layer of the first-major-surface-side wiring laminate by sticking a resin material to the core body and the ceramic sub-core from the first major surface side, and forming a groove-filling portion that is continuous with the lowest resin insulating layer by charging the resin material into a gap between the core body and the ceramic sub-core.

Abstract: A method of making a cavity substrate. The method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier, an adhesive and an electrical pad, wherein the adhesive bonds the stiffener to the sacrificial carrier; forming a careless build-up circuitry on the supporting board in contact with the bump and the stiffener; and removing the bump to form a cavity and expose the electrical pad from a closed end of the cavity; wherein the cavity is laterally covered and surrounded by the adhesive. A semiconductor device can be mounted on the cavity substrate and electrically connected to the electrical pad. The careless buildup circuitry provide signal routing for the semiconductor device while the built-in stiffener can provide adequate mechanical support for the careless build-up circuitry and the semiconductor device.

Abstract: Representative implementations of devices and techniques provide a printed circuit board (PCB) arranged to at least partly surround an electrical component having a plurality of non-coplanar outer surfaces. The PCB is arranged to fold at one or more predetermined boundaries.

Abstract: A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

Abstract: The present invention provides methods utilizing current nano-technological processes for fabricating a range of micro-devices with significantly expanded capabilities, unique functionalities at microscopic levels, enhanced degree of flexibilities, reduced costs and improved performance in the fields of bioscience and medicine. Such fabricated micro-devices have significant improvements in many areas over the existing, conventional methods, which include, but are not limited to reduced overall costs, early disease detection, targeted drug delivery, targeted disease treatment and reduced degree of invasiveness in treatment. Compared with existing, conventional approaches, the said inventive approach disclosed in this patent application is much more microscopic, sensitive, accurate, precise, flexible and effective.

Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.

Abstract: A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.

Abstract: A fiber optic sub-assembly includes a printed circuit and a TIR sub-assembly supported by the printed circuit board. The printed circuit board includes opposed first and second surfaces and has a printed circuit board height defined by the distance between the first and second surfaces. The TIR sub-assembly has a nominal height between lowermost and uppermost portions thereof The TIR sub-assembly is at least partially integrated into the printed circuit board so that an overall stack height of the printed circuit board and TIR sub-assembly is less than the sum of the printed circuit board height and nominal height of the TIR sub-assembly.

Abstract: A thin profile electronic ballast for a lighting device includes a metal casing, a circuit board, and a metal cover. The metal casing includes an entrance and a receptacle. The circuit board includes a plurality of electronic components. The circuit board is accommodated within the receptacle of the metal casing. The entrance of the metal casing is covered by the metal cover. The circuit board is disposed in a direction vertical to the metal cover.

Abstract: A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

Abstract: A vibration-proof material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. The content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less and the vibration-proof material has a Young's modulus at 23° C. of 6.0×105 Pa or less.

Abstract: A rework device in form of a flexible circuit is provided in order to repair a printed circuit assembly. The printed circuit assembly includes one or more through vias and interconnections. The flexible circuit includes a lead in portion and a tail portion. The flexible circuit also includes a first distended head portion proximal to the lead in portion and a second distended head portion proximal to the tail portion. Further, the second distended head portion is connected to the first distended head portion through a coverlay portion. The flexible circuit provided is adapted to be threaded through a through via to repair the printed circuit assembly.

Abstract: A method of manufacturing a digitizer includes forming a circuit layer that detects an input, forming a magnetic field shielding layer that contains disoriented magnetic powder, disposing an adhesive between the circuit layer and the magnetic field shielding layer, and hot pressing the circuit layer and the magnetic field shielding layer so as to orient the magnetic powder.

Abstract: An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend inwardly toward the printed circuit board. In some cases, the inward extending walls, the outer shell, and the printed circuit board define two or more internal pockets within the housing. The pockets may, in some cases, separate one region of the printed circuit board from another region of the printed circuit board. In some instances, the one or more inward extending walls may be configured to provide support to a back side of the printed circuit board, which may be particularly useful when a touch screen display is mounted on a front side of the printed circuit board.

Abstract: Certain embodiments of the present invention provide an optic over a light source, such as, but not limited to, an LED, whereby the optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED.

Abstract: A laser assembly and a method for manufacturing the same are provided according to embodiments of the present disclosure. The laser assembly (900) may comprise a first plate (903) having first projections (918, 928); a printed circuit board assembly (902) including a printed circuit board (912) having first openings (913, 915) and a laser module (100) thereon, and a second plate (901) having second projections (917, 927). The printed circuit board assembly (902) can be retained between the first plate (903) and the second plate (901) by the first projections (918, 928) and the second projections (917, 927). The laser assembly may further comprises a first pad (930) provided between the laser module (100) and the first plate (903) and/or a second pad (920) provided between the laser module (100) and the second plate (901).

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.

Abstract: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.

Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier.

Abstract: A device includes a substrate (308) and a metallic layer (336) formed over the substrate (308) with a deposition process for which the metallic layer (336) is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer (336) is reduced relative to the pre-determinable as-deposited defect density of the same layer (336) or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate (308) is provided and a removable layer (330) is formed over the substrate (308). A metallic layer (336) is formed over the removable layer (330) and is patterned and etched to define a structure over the removable layer (330). The removable layer (330) is removed, and the metallic layer (336) is heated for a time beyond that necessary for bonding of a hermetic sealing cap (340) thereover.

Abstract: Some implementations provide a substrate that includes several traces, a solder resist layer covering the several traces, and a testing pad coupled to a trace from the several traces. The testing pad is at least partially exposed and at least partially free of the solder resist layer when a chip is coupled to the substrate. In some implementations, the several traces have a pitch that is 100 microns (nm) or less. In some implementations, the substrate is a package substrate. In some implementations, the package substrate is a package substrate on which a thermal compression flip chip is mounted during an assembly process. In some implementations, the testing pad is free of a direct connection with a bonding component of the chip when the chip is coupled to the substrate. In some implementations, the bonding component is one of a solder ball.

Abstract: A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

Abstract: Disclosed herein is a method of manufacturing a stacked resonant coil, the method including: (A) forming circuit layers on a plurality of double-sided FCCLs, respectively, and then stacking the double-sided FCCLs respectively having the circuit layers formed thereon; (B) forming first and second conductive via holes in the stacked plurality of double-sided FCCLs, the first conductive via hole being for interlayer connection of the first ends respectively formed in the circuit layers and the second conductive via hole being for interlayer connection of the first electrode patterns respectively formed in the circuit layers; and (C) forming a wiring layer on an external layer of an uppermost double-sided FCCL in the staked plurality of double-sided FCCLs, the wiring layer electrically connecting the first ends and the first electrode patterns, thereby improving mass-productivity of products having uniform performances and excellent quality.

Abstract: An intravascular ultrasonic imaging catheter is provided with a flexible circuit electrically coupled to a transducer array mounted on the distal end of the catheter, a portion of the flexible circuit being helically wound about the catheter in order to enhance the flexibility of the circuit. The catheter may be a balloon catheter which is also provided with a stent mounted on the balloon, the stent carrying one or more drugs designed to be eluted or washed into a patient's blood stream after the stent has been delivered, by a the balloon catheter, into a target area within the patient's vascular system.