Abstract: A multiphase composite system is made by binding hard particles, such as TiC particles, of various sizes with a mixture of titanium powder and aluminum, nickel, and titanium in a master alloy or as elemental materials to produce a composite system that has advantageous energy absorbing characteristics. The multiple phases of this composite system include an aggregate phase of hard particles bound with a matrix phase. The matrix phase has at least two phases with varying amounts of aluminum, nickel, and titanium. The matrix phase forms a bond with the hard particles and has varying degrees of hard and ductile phases. The composite system may be used alone or bonded to other materials such as bodies of titanium or ceramic in the manufacture of ballistic armor tiles.

Abstract: [Task] The chromium nitride ion-plating coating has a property that it is hard but is liable to peel off. Year by year, the required level of wear resistance and scuffing resistance becomes higher in a diesel engine. The property of a coating is improved to enhance the wear resistance and scuffing resistance and also to improve resistance against peeling off. [Means for Solution] (1) Composition is mainly composed of chromium, nitrogen, and carbon, and the concentration of carbon relative to the total concentration of the main components is from 4 to 8% by weight. (2) The crystal structure is that texture of the CrN (111) plane orientation is from 0.4 to 2.0 in terms of a CrN (111) structural coefficient. (3) Vickers hardness is from Hv 1600 to Hv 2000.

Abstract: A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.

Abstract: A metal laminate is made by first laying at least one first metal strip of at least one first metal having a thickness of 40 ?m to 750 ?m on at least one second metal strip of a second metal different from the first metal to form a multilayer stack having a total thickness between 2 mm and 15 mm. Then the first and second strips of the multilayer stack are bonded together by rolling. Finally a finished laminate is formed by reducing a thickness of the bonded-together first and second strips by rolling in at least one pass such that the one first metal strip has a thickness of 0.5 to 10 ?m.

Abstract: A workpiece has a glossy coating layer disposed thereon. A barrel plating device is electrified with an alternating current, which has a voltage between 1V and 100V, a current density between 0.02 A/dm2 and 50 A/dm2, and a frequency between 1 Hz to 60 KHz. The alternating current is rectified by a low ripple DC rectifier into a direct current whose ripple coefficient is between 0.3% and 26%. Thereby, a surface of the workpiece is electroplated with the glossy coating layer, which contributes to a glossy and even effect on the surface of the workpiece.

Abstract: Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.

Abstract: A lid for a crystal growth chamber crucible is constructed by forming arcuate sector-shaped portions and coupling them in abutting relationship, for example by welding, to form an annular profile fabricated lid. The arcuate sector-shaped portions may be formed and removed from a lid fabrication blank with less waste than when unitary annular lids are formed and removed from a similarly sized fabrication blank. For example, the sector-shaped portions may be arrayed in an undulating pattern on the fabrication sheet.

Abstract: Provided is a copper foil with a carrier capable of realizing wiring at line/space=15 ?m/15 ?m or less on a printed circuit board on which the copper foil is laminated. Further provided is a printed circuit board or a multilayer printed circuit board capable of realizing fine-pattern wiring at line/space=15 ?m/15 ?m or less using the copper foil. The copper foil is obtained by forming a release layer and a copper foil in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 ?m or more, and peeling off the copper foil from the carrier foil. The copper foil with a carrier is obtained by forming a release layer and a copper foil in this order on a carrier foil that is said copper foil, wherein a spacing between irregularities of ridges on a surface of the carrier foil on which the copper foil is formed is 25 ?m or more in a mean spacing Sm as defined in JIS-B-06012-1994.

Abstract: A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.

Abstract: A metal alloy for use in a wire included in an electrochemical cell is disclosed having an amorphous structure, microcrystalline grains, or grains that are sized less than about one micron. In various embodiments, the microcrystalline grains are not generally longitudinally oriented, are variably oriented, or are randomly oriented. In some embodiments, the microcrystalline grains lack uniform grain size or are variably sized. In some embodiments, the microcrystalline grains have an average grain size of less than or equal to 5 microns. In some embodiments, the metal alloy lacks long-range crystalline order among the microcrystalline grains. In some embodiments, the wire is used in a substrate used in the electrochemical cell. In some embodiments, the metal alloy is formed using a co-extrusion process comprising warming up the metallic alloy and applying pressure and simultaneously passing a core material through a die to obtain a composite structure.

Abstract: The present invention concerns a method for depositing mixed crystal layers with at least two different metals on a substrate by means of PVD methods. To provide a method of depositing mixed crystal layers with at least two different metals on a substrate by means of PVD methods, which gives mixed crystal layers which are as free as possible of macroparticles (droplets) and which have a proportion as high as possible of a desired crystalline phase and which are highly crystalline, it is proposed according to the invention that deposition of the mixed crystal layer is effected with simultaneous application of i) the cathode sputtering method of dual magnetron sputtering or high power impulse magnetron sputtering and ii) arc vapour deposition.

Abstract: A fastening mechanism includes a basic body made from a base metal, onto which at least one corrosion-resistant layer is applied. A further layer is applied at least partially onto the at least one corrosion-resistant layer. The further layer has a lower coefficient of friction than the at least one corrosion-resistant layer.

Abstract: The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.

Abstract: Provided are a laser-bonded component and a production method for same that ensure sufficient bonding strength using little laser energy and which cause little increase in surrounding temperature. A nickel layer, being a surface layer, is formed having sufficient thickness on the upper surface of a copper plate that is uppermost amongst at least two superposed copper plates, a laser is irradiated from above the nickel layer, a re-solidification section formed by fusing and alloying the copper in the copper plates and the nickel in the nickel layer is formed through to inside the bottommost copper plate, and the copper plates are bonded together. The re-solidification section having high breaking strength is formed by the alloying of the nickel and the copper. As a result, the copper plates can be bonded with a small welding surface area and little laser energy.

Abstract: A first material with a known maximum temperature of operation is coated with a second material on at Least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.

Abstract: In a process for friction stir welding together pieces of dissimilar material, a first piece of a second metal is overlaid onto a first piece of a first metal that is dissimilar from the second metal such that at least a portion of the first piece of second metal overlaps a portion of the first piece of first metal. A second piece of the first metal is placed in side-to-side relationship with the first piece of second metal and overlies another portion of the first piece of first metal. The relative arrangement between the second piece of first metal and the first piece of second metal define a joint line overlying the first piece of first metal. The first piece of first metal, the first piece of second metal, and the second piece of first metal are friction stir welded together along the joint line.

Abstract: A metal/composite joint. An illustrative embodiment of the metal/composite joint includes a metallic component, a composite component provided in engagement with the metallic component, an engagement region defining contact between the metallic component and the composite component and a plurality of attachment projections joining the metallic component and the composite component. The attachment projections may be non-uniformly distributed along the engagement region. A method of joining a metallic component and a composite component is also included.

Abstract: A method of manufacturing a workpiece with multiple metal layers is disclosed as including steps (a) providing a mold with at least a runner and a cavity, (b) providing in the cavity of the mold a first metal layer made of a first metal, the first metal layer having a surface which is roughened and/or includes an engagement structure, and (c) injecting a molten second metal onto the surface of the first metal layer to form a second metal layer on the first metal layer in which the second metal layer engages with the roughened surface of the first metal layer or with the engagement structure of the surface of the first metal layer, and the molten second metal enters the cavity of the mold at a speed of at least 70 meters per second (m/s).

Abstract: In one aspect, composite articles are described comprising multifunctional coatings. A composite article described herein, in some embodiments, comprises a substrate and a coating adhered to the substrate, the coating comprising an inner layer and an outer layer, the inner layer comprising a presintered metal or alloy and the outer layer comprising particles disposed in a metal or alloy matrix.

Abstract: Superalloy components are joined by mating a recess formed in one component with a corresponding projection formed in another component along a contact surface. The components are compressed along the contact surface and resistance heat welded to each other. Current is passed between the components at a selected flow rate and application time until localized melting occurs along the contact surface, and they are mutually affixed to each other. When repairing a damaged surface portion of a superalloy material component, the damaged portion is removed to form an excavated recess. A repair splice is formed, preferably of a same material with similar mechanical structural properties, having a mating projection with profile conforming to the corresponding recess profile. The splice and substrate are resistance heat welded under compression pressure until localized melting occurs along the contact surface, so that they are mutually affixed.

Abstract: A dielectric device comprises a substrate made of a metal and an oxide dielectric layer mounted on a surface of the substrate. The surface of the substrate has metal oxide regions distributed like islands, while the oxide dielectric layer is in close contact with the substrate through the metal oxide regions. Since adhesion is higher in an area where the substrate and the oxide dielectric layer are in close contact with each other through the metal oxide regions distributed like islands on the surface of the substrate, the adhesion between the substrate and oxide dielectric layer in the dielectric device is enhanced. As compared with a case where a rough surface is formed on a metal foil, the metal oxide region and the substrate are inhibited from forming a rough surface, whereby leakage characteristics can be kept from being deteriorated by the rough surface.

Abstract: A metal component for one or more of a fitting, a piece of furniture and a household appliance. The metal component includes a coating, at least in sections, the coating including one of a hardness-containing composite material and a ceramic-metal composite material.

Abstract: A combined welding and soldering process for a structural part and a structural part are provided. The combined welding and soldering process can achieve joints which are stable at high temperatures between the components. All contacts between the components can be joined to one another optionally in accordance with their loading.

Abstract: Hybrid repair plugs include an alloy core and a sintered preform shell at least partially surrounding the alloy core, wherein the sintered preform shell includes a mixture comprising a base alloy comprising about 30 weight percent to about 90 weight percent of the mixture and a second alloy including a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy.

Abstract: A composite metal ingot having two or more lengthwise alloy layers including adjacent first and second layers respectively formed of an aluminum-manganese alloy and an aluminum alloy of a different composition wherein the interface between the first and second layers is in the form of a substantially continuous metallurgical bond characterized by the presence of particles of one or more intermetallic compositions containing manganese from the first layer dispersed within a region of the second layer adjacent the interface, the first and second layers having been formed by applying the alloy for the second layer to a self-supporting surface of the first layer while the self-supporting surface is at a temperature between the solidus and liquidus temperatures of the first layer alloy.

Abstract: A coated glass includes a substrate, a first conductive layer, a metallic layer and a second conductive layer. The first conductive layer is deposited on the substrate. The metallic layer is deposited on the first conductive layer. The second conductive layer is deposited on the metallic layer. The first conductive layer and the second conductive layer are consisted of tin oxide, antimony oxide and zinc oxide, zinc oxide has a mole percentage in a range from about 30% to about 50%, antimony oxide has a mole percentage in a range from about 1% to about 5%, and the remaining is tin oxide.

Abstract: A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn—Ag—Bi—In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from ?40 to 150° C. has been suppressed.

Abstract: A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

Abstract: A household appliance including at least one fascia panel, wherein the at least one fascia panel includes a film having a metallic material that provides a metallic appearance to the at least one fascia panel. In an exemplary embodiment of the invention, the metallic material may include one of a stainless steel material and a brushed nickel material. Further, the fascia panel may be formed from at least one of plastic, wood, and metal.

Abstract: A flexible laminate composition and methods for manufacturing same are provided. The flexible laminate composition includes one or more discrete and separate layers of a radiopaque material wherein the radiopaque layer is applied via a solvent to a layer that is composed of a plastic material. The laminate composition can be formed into a radiopaque marker band that can be used with a medical device, such as a catheter, for radiographic imaging. The laminate composition as an alternative can also be utilized to form the catheter or other suitable medical device.

Abstract: This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers.

Abstract: A process of forming an ultrafine crystal layer in a workpiece constituted by a metallic material. The process includes: performing a machining operation on a surface of the workpiece, so as to impart a large local strain to the machined surface of the workpiece, where the machining operation causes the machined surface of the workpiece to be subjected to a plastic working that causes to have large local strain in the form of a true strain of at least one, such that the ultrafine crystal layer is formed in a surface layer portion of the workpiece that defines the machined surface of the workpiece. Also disclosed are a nanocrystal layer forming process, a machine component having the ultrafine crystal layer or the nanocrystal layer, and a machine component producing process of producing the machine component.

Abstract: A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer.

Abstract: A method for manufacturing a plate including multiple metal layers is provided. The method includes: disposing a semi-finished plate formed of a first metal in a mold, wherein a surface of the semi-finished plate is roughened; and injecting a second metal in liquid form onto the roughened surface of the semi-finished plate, so as to form a second metal layer on the semi-finished plate, wherein the second metal in liquid form covers and fills the roughened surface of the semi-finished plate. Not only does the multi-layer metal plate manufactured according to the method have the strength and elasticity of a composite metal, but also increase the joining, bonding or engagement strength between the first and second metal layers without laser welding.

Abstract: Disclosed are methods for treating metal substrates that include contacting the substrate with a pretreatment composition comprising a rare earth metal and a zirconyl compound. The present invention also relates to coated substrates produced thereby and further to substrates additionally coated with an electrophoretically applied coating composition.

Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

Abstract: The embodiments of bump and bump-on-trace (BOT) structures provide bumps with recess regions for reflowed solder to fill. The recess regions are placed in areas of the bumps where reflow solder is most likely to protrude. The recess regions reduce the risk of bump to trace shorting. As a result, yield can be improved.

Abstract: An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.

Abstract: Disclosed herein is an article comprising a plurality of domains fused together; wherein the domains comprise a core comprising a first metal; and a first layer disposed upon the core; the first layer comprising a second metal; the first metal being chemically different the second metal. Disclosed herein too is a method comprising rolling a sheet in a roll mill; the sheet comprising a first metal and having disposed upon each opposing face of the sheet a first layer that comprises a second metal; the second metal being chemically different from the first metal; cutting the sheet into a plurality of sheets; stacking the plurality of sheets; and rolling the stacked sheets in the roll mill to form a blank.

Abstract: Provided are a metal tape material improved in characteristics to be low in Young's modulus, low in yield stress and high in break elongation and a metal tape material for semiconductor packaging, such as a current-collection interconnector, comprising the same.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Abstract: A method of fabricating a component and a fabricated component are disclosed. The method includes depositing a material to a component and manipulating the material to form a boundary region and a filler region for desired properties. The component includes the boundary region and the filler region, thereby having the desired properties.

Abstract: Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Abstract: A metal inter-diffusion bonding method for forming hermetically sealed wafer-level packaging for MEMS devices. A stack of a first metal is provided on a surface of both a first wafer and a second wafer, the first metal being susceptible to oxidation in air; providing a layer of a second metal, having a melting point lower than that of the first metal, on an upper surface of each stack of the first metal, the layer of second metal being sufficiently thick to inhibit oxidation of the upper surface of the first metal; bringing the layer of the second metal on the first wafer into contact with the layer of second metal on the second wafer to form a bond interface; and applying a bonding pressure to the first and second wafers at a bonding temperature lower than the melting point of the second metal to initiate a bond, the bonding pressure being sufficient to deform the layers of the second metal at the bond interface.

Abstract: A machine component includes a body made of cast iron. The body may include a surface configured to be subject to cavitation-induced erosion. The component may also include a hardened covering on the surface of the body. The covering may have a crystal structure including martensite and between about 5% to about 40% austenite.

Abstract: A component assembly for use in living tissue comprises: a ceramic part; a metal part, e.g., a titanium metal; and a palladium (Pd) interlayer for bonding said ceramic part to the metal part. By applying sufficient heat to liquify a palladium-titanium interface, the Pd interlayer is used to braze the ceramic part to the titanium part to yield a hermetic seal.

Abstract: The present invention relates generally to methods for producing a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

Abstract: A method of manufacturing a hot-gas component with cooling channels and a hot gas component manufactured by the method is provided. Pre-sintered preform materials are used for the manufacturing of a hot-gas component with a cooling channel. The method initially involves providing a carrier substrate for the hot-gas component and then providing a sheet of pre-sintered preform material. The sheet is then arranged on the carrier substrate so as to form the cooling channel. The sheet and the carrier substrate are then brazed to manufacture the hot-gas component with the cooling channel.

Abstract: A foam mount of an aircraft window has a groove to receive an electro chromic window. The foam mount is painted by placing a blank in the groove to divide the foam mount into a first section designated to face the exterior of the aircraft and an opposite second section. The groove and the first section are coated with an electric conductive paint, and the second section is covered with a decorative paint. The conductive coating on the foam mount and the conductive coating of the electrodes of the electro chromic window provide an RF shielding to prevent electronic signals from personal electronic equipment from passing through the cabin and door windows of the aircraft. A mask is also provided to coat one section of the foam mount while covering the other section.

Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.