Abstract: Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

Abstract: An LED base plate enabling the LED to emit high luminance white light. The base plate has a reflective surface, and protrusions disposed on the reflective surface have top portions formed with curved surfaces. The protrusions have bottom widths of 2 to 4 micrometers and heights of 1.2 to 1.8 micrometers, with adjacent protrusions having spaces of 0.6 to 3 micrometers. An InGaN epitaxy layer is coated on the reflective surface of the base plate and emits ultraviolet of wavelength in the range of 380 to 410 nanometer when the InGaN epitaxy layer is electrified. Ultraviolet light reflected by the reflective surface of the base plate and the protrusions stimulates and mixes fluorescent compounds of zinc oxide and yttrium aluminum garnet to generate complementary light of ultraviolet light. High luminance white light scatteringly emitted is used for illumination.

Abstract: A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect.

Abstract: Disclosed herein is a printed circuit board including: an insulating layer including a stopper layer for trench formation disposed in an inner portion thereof and trenches formed to expose the stopper layer for trench formation; and circuit patterns formed in the trenches.

Abstract: Disclosed is a method for producing a substrate for mounting a light-emitting element, whereby a substrate for mounting a light-emitting element such that power can be supplied via a columnar metal body even if the side surfaces of the columnar metal body do not have pads can be produced by means of a low-cost and easy step that does not involve lamination of a metal foil, plating, or the like. Further disclosed are a substrate for mounting a light-emitting element and a light-emitting element package. The substrate for mounting a light-emitting element is provided with: at least two columnar metal bodies (14a-14c); at least two electrodes (10a-10b) that are provided on the rear surface side of the columnar metal bodies (14a-14c) so as to be conductive therewith; and an insulating layer (16) that exposes the upper surface of the columnar metal bodies (14a-14c). The sides of the columnar metal bodies do not have pads.

Abstract: A method for contacting a lighting device is provided, wherein the lighting device has a circuit board which is covered at least partly by a sealing compound layer; wherein the lighting device can be separated at a separating point into two lighting device sections and each of the lighting device sections has at least one electrical contact.

Abstract: A package substrate includes a core board, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core board. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded bump pads are located on an upper surface of the insulating layer.

Abstract: The electronic component mounting line includes a computing unit for calculating a print position of solder paste printed on board-side electrodes, an electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, a placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, a bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and a mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.

Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X2<X3?X1 where X1, X2 and X3 represent the diameters of the first, second and third portions.

Abstract: Ozone generator cells that include two thermally conductive plates that maintain contact between various layers of the cells in the absence of a bonding agent. The cells lack aluminum-containing materials in the discharge region of the cell.

Abstract: A single layer micromachined thermal and mechanical isolator may be bonded between a microelectromechanical system (MEMS) die and package. Small bond pads of the isolator are attached to the periphery of the die. The isolator material may be chosen to match that of the die, reducing CTE mismatch. Long thin isolation beams can be used to provide thermal isolation against external temperature changes, which may be conducted through the package. Weak and flexible beams can be used to tolerate large displacements with very little resistance. Thus, excessive stress or distortion to the package, from either CTE mismatch or external stress, may be absorbed by the isolator and will not be transmitted to the MEMS die. Beam rigidity may be designed to attenuate vibration of particular frequency range. The isolator can be readily inserted into an existing disc resonator gyroscope package in one thermal compression bond step.

Abstract: A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on said insulator polymer base layer; b) applying a layer of photoresist on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; c) activating said insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with said base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of said insulator polymer layer and selective etching said insulator layer and said top coating layer to obtain at least one via; and e) filling said via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes.

Abstract: In one aspect of the present invention, an electrode useable in an electrochemical cell includes an electrically conductive substrate, nanostructured current collectors in electrical contact with the conductive substrate, and nanoparticles of a ternary orthosilicate composite coated on the nanostructured current collectors. The ternary orthosilicate composite comprises Li2MnxFeyCozSiO4, where x+y+z=1.

Abstract: An ITO sensor design and method for making the same is optimized to minimize noise from an LCD. The design includes a two layer sensor design having a transmitter line (Tx) placed in a first layer and a receiver line (Rx) placed in a second layer in a diamond-shaped pattern. The diamond shape maximizes the sensitivity of the sensor.

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

Abstract: A wiring substrate includes a body including first and second surfaces, a trench having an opening on the first surface and including, a bottom surface, a side surface, and a slope surface that connects a peripheral part of the bottom surface to a one end part of the side surface and widens from the peripheral part to the one end part, the one end part being an end part opposite from the first surface, a hole including an end communicating with the bottom surface and another end being open on the second surface, a first layer filling at least a portion of the hole and including a top surface toward the trench, a second layer covering the top surface and formed on at least a portion of the trench except for a part of the side surface, and a third layer covering the second layer and filling the trench.

Abstract: An implantable medical device (IMD) may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, circuitry disposed within the LCP outer housing, and an electrical feedthrough extending from a first end proximate the circuitry to a second end proximate to the outer surface. The electrical feedthrough may define a major axis extending between the first end and the second end, wherein the electrical feedthrough comprises non-uniform width measured in a direction along a plane substantially orthogonal to the major axis.

Abstract: A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A system and method for monitoring system including a three dimensional embedded sensor coupled to an article, wherein the three dimensional embedded sensor is a direct write embedded sensor using a high temperature light emitting material. A camera system detects illumination signals from the embedded sensors. A processing section processes the illumination signals and determines gas/surface temperatures and strain data for the article.

Abstract: A mobile wireless communications device may include a portable housing, a dielectric substrate carried by the portable housing having a front side facing toward a user and a back side opposite the front side, and a ground plane carried by the dielectric substrate. The device may further include at least one circuit carried by the dielectric substrate, and an antenna carried by the dielectric substrate adjacent an end thereof and electrically connected to the at least one circuit. A ground patch may be adjacent the front side of the dielectric substrate that is electrically connected to the ground plane and spaced apart from and at least partially overlapping the antenna.

Abstract: A vehicle headlamp includes: a light-emitting module; a control circuit section for controlling a lighting of the light-emitting module; and a reflector including a reflecting face configured to reflect and collect light emitted from the light-emitting module. The control circuit section includes an opposing portion that is opposed to the reflecting face. The opposing portion is disposed at a position away from an optical path of light to be collected by the reflector.

Abstract: A configurable low noise amplifier circuit which is configurable between a first topology in which the low noise amplifier circuit includes a degeneration inductance stage whereby the low noise amplifier circuit operates as an inductively degenerated low noise amplifier, and a second topology in which the low noise amplifier circuit includes a common-gate low noise amplifier stage whereby the low noise amplifier circuit operates as a common-gate low noise amplifier. The second topology includes one or more internal input impedance matching components and the first topology does not include the one or more internal input impedance matching components.

Abstract: An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.

Abstract: A color filter suitable for being disposed on a substrate is provided. The color filter includes a plurality of pixel units separately disposed on the substrate so as to define a plurality of blank regions thereon.

Abstract: A foam mount of an aircraft window has a groove to receive an electro chromic window. The foam mount is painted by placing a blank in the groove to divide the foam mount into a first section designated to face the exterior of the aircraft and an opposite second section. The groove and the first section are coated with an electric conductive paint, and the second section is covered with a decorative paint. The conductive coating on the foam mount and the conductive coating of the electrodes of the electro chromic window provide an RF shielding to prevent electronic signals from personal electronic equipment from passing through the cabin and door windows of the aircraft. A mask is also provided to coat one section of the foam mount while covering the other section.

Abstract: In a multi-layer substrate including a core formed with a plurality of holes capable of containing an electronic part, a bottom insulating resin layer formed on a bottom surface of the core, a top insulating resin layer formed on a top surface of the core, a wiring layer selectively formed on an outer layer of the bottom insulating resin layer or top insulating resin layer, and an electronic part contained in the holes, both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain insulation between the electronic part or a conductor of the core and the wiring layer and which inherently undergoes small plastic deformation, so that the electronic part can be securely and sealed in the holes without using a particular adhesive.

Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element.

Abstract: A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.

Abstract: An integrated circuit integrator includes a first transconductance amplifier having a gain adjustable based upon a first control signal, and receives, as an input, a signal to be filtered, and generates, as an output, a corresponding amplified signal. The first transconductance amplifier includes an R-C output circuit to filter components from the amplified signal, and an output resistance being adjustable based upon a second control signal. A second transconductance amplifier is matched with the first transconductance amplifier, and has a gain adjustable based upon the first control signal, and a matched output resistance adjustable based upon the second control signal. A circuit is configured to force a reference current through the matched output resistance. An error correction circuit is coupled to the second transconductance amplifier and is configured to generate the second control signal so as to keep constant a voltage on an output of the second transconductance amplifier.

Abstract: A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.

Abstract: According to one embodiment, a circuit board includes a board main body, an electrode, a circuit plate and a connector. The board main body includes a first surface, a second surface located opposite to the first surface, a first side edge that extends between the first surface and the second surface, and a second side edge that extends between the first surface and the second surface and intersects the first side edge. The second side edge is provided with a fitting part. The electrode is provided on the first surface. The circuit plate is soldered to the electrode and has flexibility. The connector is attached to the board main body. A cable is inserted into the connector in a direction perpendicular to the first side edge.

Abstract: MEMS and fabrication techniques for positioning the center of mass of released structures in MEMS are provided. In an embodiment, a minor substrate is affixed to a member partially released from a first substrate and a through hole formed in the second substrate is accessed to complete release of the member.

Abstract: An optical system, an optical module and a method of manufacture thereof are provided. The optical module includes a top membrane and a bottom electrode. The top membrane includes a supporting layer, a first metal layer and an isolating layer with an opening. The first metal layer is disposed on lower surface of the supporting layer. The isolating layer is disposed on lower surface of the first metal layer. The bottom electrode, disposed below the top membrane, includes a second metal layer and a plurality of pillars. The pillars are disposed on upper surface of the second metal layer and below the isolating layer, wherein some of the pillars support the isolating layer. Wherein the pillars are used for preventing the top membrane from being pulled down to touch the second metal layer through the opening when a voltage is applied between the first and the second metal layers.

Abstract: Embodiments of the invention provide methods and apparatus for reducing steering effort in a vehicle. In one embodiment, a method for installing a steering-assist system onto a vehicle having an electrically powered steering system is provided. The method includes placing a controller between a torque sensor and an electronic control unit (ECU) disposed on the vehicle, coupling a primary signal line from the torque sensor to be in electrical communication with the controller, and coupling a secondary signal line to the controller to be in electrical communication with the ECU, wherein, when movement is detected by the torque sensor, the torque sensor provides a primary signal to the controller and the controller provides a secondary signal to the ECU, the secondary signal being different than the primary signal.

Abstract: A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.

Abstract: A first housing element is attached to an upper surface of a printed circuit board (PCB), and a second housing element is attached to a lower surface of the PCB. The first housing element receives a first electronic module, and includes a first signal wire that connects the first electronic module to a first trace on the PCB. The second housing element receives a second electronic module, which is vertically aligned with the first electronic module, and includes a second signal wire that connects the second electronic module to the first trace on the PCB. Alternately, a housing element attached to a PCB receives two or more electronic modules, and provides unique connections between the electronic modules and the PCB.

Abstract: A manufacturing method of a package carrier is provided. A substrate having a first surface, a second surface, and an opening communicating the first and second surfaces opposite to each other is provided. A first adhesive layer is formed on the first surface of the substrate. The first adhesive layer and the substrate define a notch. A thermal-conductive element is configured in the notch and fixed into the notch via the first adhesive layer. A second adhesive layer and a metal layer located on the second adhesive layer are formed on the second surface of the substrate. The metal layer is connected to a bottom surface of the thermal-conductive element. The thermal-conductive element is located between the metal layer and the first adhesive layer. The first adhesive layer is removed to expose the first surface of the substrate.

Abstract: A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.

Abstract: Provided is a method of manufacturing a wiring board, in which: a composite adhesive sheet 20 is attached to one of the surfaces of a support substrate 10, and a double-sided CCL 30 is attached to the other surface. Then, in an integrated state of the above components, a multilayer wiring structure including a conductive layer and a resin insulating layer is formed on a metal layer 33 of the double-sided CCL 30 by a known build-up method. A thermally foamable adhesive layer 22 of the composite adhesive sheet 20 is then heated, thereby thermally decomposing a thermal foaming agent to generate gas, and the support substrate 10 is separated from the remaining bonded body. Thereafter, a carrier foil layer 32b and a copper foil layer 32a of a carrier-foil coated copper foil 32 are mechanically peeled from each other at a boundary between both the layers, thereby obtaining a wiring board 1.

Abstract: A header connector assembly and a process of fabricating a header connector assembly is disclosed. The header connector assembly includes a header subassembly and a module. The header subassembly includes an outer housing and an inner housing, the inner housing having contacts and a circuit board, wherein the circuit board is attached to the header subassembly.

Abstract: A multi-media device and a method for manufacturing the multi-media device is described herein. The multi-media device includes a first and second substrate coupled to each other. Both the first and second substrates have a first side and a second side opposite to the first side. The multi-media device further includes a first camera coupled to the first side of the first substrate and a second camera coupled to the first side of the second substrate. The first camera includes a first lens housing, which houses one or more first lenses. The second camera includes a second lens housing, which houses one or more second lenses. The second substrate is coupled to the first substrate in a manner such that the one or more first lenses and the one or more second lenses receive light from opposite directions.

Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract: A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Abstract: A mechanism for protecting objects sensitive to electrostatic discharge (ESD) employs nested plates to direct the flow of ESD current to a targeted impedance. In one embodiment, an insulator plate is interposed between first and second electrically conductive plates. The insulator plate prevents any charge accumulating on the first plate from arcing to the second plate through the insulator plate. A target plate of electrically conductive material is interposed between the first and second plates over a hole in the insulator plate. The target plate, which is surrounded by an impedance layer of static dissipative material, includes a discharge portion that projects toward the second plate. ESD current flows in a path from the first plate, through the impedance layer, the target plate and again through the impedance layer, and to the second plate. The impedance layer provides a targeted impedance in the ESD current path.

Abstract: A case includes a case body and a cover member. The case body includes a bottom wall portion having a surface area which allows selective accommodation of a first substrate and a second substrate and an outer peripheral portion. The outer peripheral portion includes a front wall portion (a reference wall portion), a pair of left and right wall portions which come into abutment with lateral sides of the first and second substrates, and ribs (first restraint portions) configured to restrain the first substrate in cooperation with the front wall portion at a position where a reference side of the first substrate comes into abutment with the front wall portion. The case body includes a diaphragm (a second restraint portion) configured to restrain the second substrate in cooperation with the front wall portion at a position where a reference side of the second substrate comes into abutment with the front wall portion.

Abstract: A method of manufacturing an electrosurgical tool includes the initial step of coupling a proximal end of a substantially malleable elongate tube-like shaft to a distal end of a housing. A tub-like dielectric sheath is disposed on the tube-like shaft. The method also includes the steps of coupling a tube-like electrode having a first thermal conductivity K1 coaxially through the tube-like dielectric sheath and coupling a proximal end of the tube-like electrode to a source of suction to provide fluid communication between the tube-like electrode and the source of suction. The method also includes the steps of electrically connecting the tube-like electrode to a source of energy and coupling a thermally conductive member to the tube-like shaft. The thermally conductive member has a second thermal conductivity K2 that is less than K1 and is configured to impede the propagation of thermal energy proximally.

Abstract: An apparatus includes a printed circuit board including a connector footprint comprising a first footprint portion operative to receive a first connector portion and a second footprint portion operative to receive a second connector portion. The first footprint portion is compliant with a first communications link type and the first and second footprint portions are jointly compliant with a second communications link type. The printed circuit board includes first conductive traces coupled to the first footprint portion and a first device footprint. The first conductive traces are selectively configurable according to a selected one of the first and second communications link types. The printed circuit board includes a second conductive traces coupled to the second footprint portion and the first device footprint. In at least one embodiment of the apparatus, the first communications link type is AC-coupled and the second communications link type is DC-coupled.

Abstract: An apparatus includes a charge storage device. The charge storage device includes a first plate, a second plate, and a dielectric. The dielectric separates the first and the second plate. The first plate is configured to hold a first charge, and the second plate is configured to hold a second, opposite, charge. The charge storage device is housed in a product receptacle that is configured to charge the first plate and the second plate such that the charge storage device is able to generate an electrical current.