Abstract: A method for providing electrical connections to both sides of a touch sensor panel is disclosed. The method comprises forming conductive traces on a first surface of a base film, shaping the base film to form first and second attachment areas that include the conductive traces, forming a conductive shield over the conductive traces, wherein the shield is electrically coupled to one or more of the conductive traces, and folding the base film such that the conductive traces on the first and second attachment areas are positioned and aligned for attachment to pads on first and second sides of the touch sensor panel.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: Various circuit boards and stiffener frames and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a stiffener frame that has a surface adapted to engage a side of a circuit board. The surface includes a projection to protect a corner of the circuit board.

Abstract: A method for producing an LED lamp includes a lamp housing wherein at least one carrier circuit board equipped with LEDs is inserted into the lamp housing in such a way that at least a subregion of the lamp housing protrudes beyond the carrier circuit board with a projection, and the projection is at least partially deformed after insertion in such a way that the lamp housing is pressed with the carrier circuit board.

Abstract: Methods and structures provide an electrostatic discharge (ESD) indicator including an electric field sensitive material configured to undergo a specific color change in response to an electric field. An exposure of the structure to an ESD can be visually determined via the specific color change of the ESD indicator.

Abstract: Various circuit board lids and methods and using the same are disclosed. In one aspect, an apparatus is provided that includes a lid adapted to cover a semiconductor chip mounted on a circuit board. The lid has a top plate, a first support leg and a second support leg opposite the first support leg adapted to support the lid. The first and second support legs and the top plate define a recess to accommodate the semiconductor chip. The recess has a first opening and a second opening. At least one of the first and second openings extends from the first support leg to the second support leg.

Abstract: An apparatus and method wherein the apparatus comprises includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.

Abstract: A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.

Abstract: A lighting unit according to one embodiment includes a board, a support member, and a plurality of heat radiation fins. A light emitting element is disposed on a first surface of the board. The support member has an interior surface on which a second surface of the board that is opposite to the first surface is disposed to be in contact therewith to enable heat conduction from the board to the support member. The heat radiation fins are disposed on an exterior surface of the support member substantially parallel with each other and with a clearance between each other, and each having a flat shape that extends outwardly from the exterior surface.

Abstract: A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield. The wafer carrier may include an electrically conductive wafer plating jig base having a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size, a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an open center surrounded by a support, the cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base.

Abstract: A light emitting diode (LED) lamp includes a lamp housing formed of a pair of housing members connected to each other in a horizontal direction. A printed circuit board (PCB) is detachably connected to an inside of the lamp housing, and includes at least one LED mounted to one surface of the PCB. A power supply unit (PSU) is electrically connected with the PCB in the lamp housing to supply power to the PCB.

Abstract: A method for manufacturing a switchable particle-based display is provided, which includes steps of: providing a substrate having a grid structure thereon to define a plurality of cells; providing a template having a plurality of template ribs thereon to define a plurality of compartments corresponding to the plurality of cells; filling a plurality of display particles into the plurality of compartments on the template; transferring the plurality of display particles from the plurality of compartments on the template to the plurality of cells; and removing the template and mounting an opposite substrate over the substrate.

Abstract: Various embodiments concern an electrical interconnect of a head suspension. The electrical interconnect can comprise a spring metal layer and a dielectric layer having an aperture with a portion of the spring metal layer being exposed through the dielectric layer within the aperture. The electrical interconnect can further comprise a trace layer disposed on the dielectric layer and extending into the aperture to connect with the spring metal layer. Part of the spring metal layer within the aperture may not be covered by the trace layer. The exposure of the spring metal layer through the aperture can be due to the width of the trace layer being less than the width of the aperture and/or the exposure can be due to expected misregistration. A polymer covercoat can be applied over the aperture to protect the trace layer from corrosion.

Abstract: A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, second meshed metal sensing pads, and peripheral circuits is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows and second contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A transparent conductive layer including second transparent bridge lines and transparent contact pads is formed on the insulating layer located in the touch-sensing region of the substrate. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. Each transparent contact pad is electrically connected to the corresponding peripheral circuit through the second contact window.

Abstract: This disclosure provides systems, methods, and apparatus for high capacitance density metal-insulator-metal capacitors. In one aspect, an apparatus may include a first base metal layer on a first side of a substrate. A first polymer layer may be disposed on the first base metal layer and on the first side of the substrate. The first polymer layer may define a first plurality of vias though the first polymer layer, the first plurality of vias exposing portions of the first base metal layer. A first electrode layer may be disposed on the first polymer layer. The first electrode layer may contact the portions of the first base metal layer. A first dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the first dielectric layer. The first dielectric layer may electrically isolate the first electrode layer from the second electrode layer.

Abstract: A printed circuit board includes a substrate, at least one pad on the substrate, and permanent mold coatings capable of coating on the copper foil. Each pad includes a copper foil and a solder resist coating on the substrate and surrounding the copper foil. The copper foil defines an opening. The opening is coated with solder resist, whereby the permanent mold coatings form a recess corresponding to the opening when coated on the copper foil. A method for manufacturing a printed circuit board is also provided.

Abstract: This disclosure provides systems, methods and apparatus for interposers in compact three-dimensional (3-D) device packages. In one aspect, one or more methods of fabricating an interposer using an additive process are provided. The additive process can involve depositing flowable dielectric material around a plurality of metal interconnect posts after forming the plurality of metal interconnect posts on a carrier substrate. In another aspect, an interposer including through-glass vias and one or more passive devices is provided.

Abstract: Machine and insolation method for panels for turning a panel and successively insolating its first and second faces. According to the invention, this machine comprises at least one first insolation station (10), and a panel turner (30), having a first face and a second face, the latter comprising a prehension device (53, 54), configured to grip a panel (90), a displacement device, configured to displace the prehension device at least between the first and second insolation stations (10, 20), and a pivoting device, configured to pivot the prehension device (53, 54) and in this way have the panel (90) pivot about a pivoting axis (A) parallel to said panel (90), the turner (30) being configured so that it can grip the panel (90) by any one of its faces and release the panel (90) also by any one of its faces.

Abstract: In a resistance change memory (ReRAM) storing data by utilizing change in resistance of a resistance change element, a transistor T, interlayer insulating films, W plugs and the like are formed on a semiconductor substrate. Thereafter, a Pt film serving as a lower electrode of the resist change element is formed and a transition metal film (Ni film) is formed on the Pt film. After that, the surface of the transition metal film is oxidized to form a transition metal oxide film and a Pt film serving as an upper electrode is formed on the transition metal oxide film.

Abstract: A method of manufacturing a multilayer printed circuit board includes preparing a substrate having a first conductor circuit, forming on first circuit formed over substrate a film including cycloolefin resin such that an insulating layer including the resin is formed on substrate and first circuit, forming in insulating layer an opening exposing at least portion of first circuit, forming an electroless plating film covering surface of insulating layer including surface of insulating layer inside opening, forming on electroless film a plating resist layer having pattern exposing selected portions of electroless film, selected portions of electroless film including a second conductor circuit and a portion of electroless film covering opening, and forming an electrolytic plating film covering selected portions of electroless film such that a filled via conductor including an electrolytic material filling space in opening and that first circuit is connected to second circuit via conductor.

Abstract: An amplifying circuit for use in, for example, broadband transceivers is described. A bias filter is connected between an amplifying transistor and a power supply to block a wide range of frequencies associated with amplified RF input signals from reaching the power supply, while permitting DC power to reach the transistor.

Abstract: A motherboard mounting structure includes a first board having a first connector and a second board having a second connector electrically connected directly to the first connector of the first board. The second board includes an external terminal connectable to an external device. The external terminal is inserted (or extracted) through an external terminal insertion opening formed on an orthogonal surface of a mainframe orthogonal to a surface of the second board. A mounting board is provided and to which the first and second boards are attached. The second board is attached to the mounting board with the external terminal protruding from the external terminal insertion opening. The first and second boards are slidably attached in a prescribed direction to separate from the orthogonal surface of the mainframe.

Abstract: The present invention is an apparatus and method of manufacture for providing image capturing modules which can be embedded into thin displays (e.g., in laptop computers) while providing for improved image quality. In accordance with several embodiments, a webcam module embedded in a display has multiple positions. A first position (or a “rest” or “park” position) is the position of the webcam module when it is not in use. In this first position of the webcam module, it is in its most compact configuration, and lends itself to integration into a very thin display. In other positions, the webcam module has a more expanded configuration, thus leading to better image quality. Such an expanded configuration leads, amongst other things, to a larger depth of focus. In one embodiment, a stepped PCB is used to provide good image quality while maintaining a compact form factor as well as structural rigidity.

Abstract: During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for nicking the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

Abstract: A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract: A tool-less printed circuit board (PCB) bracket system for attaching an input/output (I/O) interface PCB to a bulkhead includes a main PCB and card assembly having a bracket mounted to the main PCB. One or more keyhole fasteners are attached to the main PCB for holding the bracket into a fixed position. The card bracket includes a release mechanism for releasably detaching the card bracket assembly from the keyhole fasteners without the use of tools for easily separation and servicing.

Abstract: A manufacturing method of electrical bridges, wherein a conductive pattern (2) from electroconductive material, such as metal foil, is applied over a substrate (1) made of electrically insulating material and the electroconductive material has at least one strip tongue (3) unattached to the substrate, one side of the tongue is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract: A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed.

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract: A battery cell interconnect and voltage sensing assembly and method are provided. The assembly includes a frame member having a rectangular ring-shaped peripheral wall with first, second, third and fourth wall portions. The frame member further includes a central plate portion. The assembly further includes an electrical interconnect member electrically that is coupled to an electrical terminal of a battery cell. The electrical interconnect member has a tab that extends through an aperture in the central plate portion. The assembly further includes a circuit board and an encapsulation portion that is bonded to and covers a side of the circuit board.

Abstract: A reconfigurable, scalable and flexible island-based network flow processor integrated circuit architecture includes a plurality of rectangular islands of identical shape and size. The islands are disposed in rows, and a configurable mesh command/push/pull data bus extends through all the islands. The integrated circuit includes first SerDes I/O blocks, an ingress MAC island that converts incoming symbols into packets, an ingress NBI island that analyzes packets and generates ingress packet descriptors, a microengine (ME) island that receives ingress packet descriptors and headers from the ingress NBI and analyzes the headers, a memory unit (MU) island that receives payloads from the ingress NBI and performs lookup operations and stores payloads, an egress NBI island that receives the header portions and the payload portions and egress descriptors and performs egress scheduling, and an egress MAC island that outputs packets to second SerDes I/O blocks.

Abstract: One embodiment of the present disclosure provides an apparatus comprising a flex circuit substrate having a core, a first solder mask and first traces disposed on the core on a first side of the flex circuit substrate, and a second solder mask and second traces disposed on the core on a second side of the flex circuit substrate. The first side is opposite to the second side. The apparatus further includes vias formed through the core to electrically couple the first traces to the second traces, and a stiffening structure coupled to the first side of the flex circuit substrate to increase structural rigidity of the flex circuit substrate. The stiffening structure provides structural support to allow attachment of an integrated circuit die to the first side of the flex circuit substrate.

Abstract: A method of fabricating a printed-wiring board, includes: forming a through-hole across a thickness of a printed-wiring board, the forming of the through-hole including forming a first opening part having a first diameter, forming a second opening part having a second diameter, and forming a third opening part provided between the first opening part and the second opening part, wherein the second diameter is larger than the first diameter, and the third opening part is formed in a tapered shape whose diameter decreases toward the first opening part from the second opening part.

Abstract: A manufacturing method of a package carrier is provided. A substrate having a first surface, a second surface, and an opening communicating the first and second surfaces opposite to each other is provided. A first adhesive layer is formed on the first surface of the substrate. The first adhesive layer and the substrate define a notch. A thermal-conductive element is configured in the notch and fixed into the notch via the first adhesive layer. A second adhesive layer and a metal layer located on the second adhesive layer are formed on the second surface of the substrate. The metal layer is connected to a bottom surface of the thermal-conductive element. The thermal-conductive element is located between the metal layer and the first adhesive layer. The first adhesive layer is removed to expose the first surface of the substrate.

Abstract: The disclosure relates generally to an electronics device having a first housing part connected with a second housing part. The second housing part includes a Printed Circuit Board (PCB) with electronics components, an electromagnetic shielding cover being mounted for electromagnetic shielding (ES) of the electronics components, the cover including a bottom or base wall spaced apart from the PCB and projecting walls contacting the PCB, the projecting walls being arranged to surround one or more of the electronics components. The device includes compressible members arranged between the cover and the first housing part, an engagement structure opposite the cover engaging and compressing the compressible member. In this manner the screws required for fixing the cover is reduced substantially, or eliminated.

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract: An apparatus for performing a Polymerase Chain Reaction (PCR) is disclosed. The apparatus comprises a PCR chamber for performing a Polymerase Chain Reaction and a printed circuit board (PCB) fluidic device. The PCR chamber is a fluidic chamber and is located in, or is part of, the printed circuit board (PCB) fluidic device. A method for manufacturing an apparatus for performing the Polymerase Chain Reaction and a method for performing the Polymerase Chain Reaction are further disclosed.

Abstract: An elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer.

Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Abstract: An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

Abstract: A lighting device comprises a solid state light emitter on a circuit board, and an optic held in place relative to the first circuit board, a voltage drop across the emitter at least 60 volts. A lighting device comprises a solid state light emitter on a first circuit board, an optic held in place relative to the first circuit board, and a non-isolated power supply. A lighting device comprises a solid state light emitter on a first circuit board, and a flame-rated optic held in place relative to the first circuit board. An optic, comprising a translucent region, a first dimension not larger than about 10 mm, a second dimension not larger than 15 mm. A flame-rated optic comprising a translucent region, structure configured to hold the optic in place relative to a circuit board. Methods of making lighting devices.

Abstract: The present invention provides for safe and reliable electronic circuitry that can be employed in ingestible compositions. The ingestible circuitry of the invention includes a solid support; a conductive element; and an electronic component. Each of the support, conductive element and electronic component are fabricated from an ingestible material. The ingestible circuitry finds use in a variety of different applications, including as components of ingestible identifiers, such as may be found in ingestible event markers, e.g., pharma-informatics enabled pharmaceutical compositions.

Abstract: A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

Abstract: A mobile wireless communications device may include a portable housing, a printed circuit board (PCB) carried by the portable housing, and at least one electronic component carried by PCB and extending upwardly therefrom. The mobile wireless communications device may also include a conformable, shape-retaining film being vacuum formed onto the at least one electronic component and may include a peripheral edge secured to the PCB and a body portion conforming to the at least one electronic component.

Abstract: Electrical connectors for attachment to electrical contacts of light emitting devices as well as light emitting device packages and lamp assemblies that use such connectors are provided. Further, methods for assembling light emitting device packages that use such connectors are provided. The electrical connector, for example, can have a plug housing with an electrically conductive socket engaging connection for engaging a socket. The electrical connector can also have an electrically conductive member extending from the plug housing and connected to the socket engaging connection. The electrically conductive member can have an end distal from the plug housing that forms a contact base configured to attach to an electrical contact on a light emitting device.

Abstract: A retention housing having a housing body is provided, the retention housing configured to be mounted to a substrate. At least one, such as a plurality of cables can be electrically connected to a respective surface of the substrate to which the retention housing is mounted. When the retention housing is mounted to the respective surface of the substrate, at least a portion of the at least one cable can be compressed between a ground element supported by the respective surface of the substrate and a corresponding upper wall of the housing body, such that the at least one cable is placed into electrical communication with a ground plane defined by the substrate.

Abstract: A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer.

Abstract: A circuit board having a board-to-board connector and a method of manufacturing the same are provided. The circuit board includes at least one of a recess and a hole having a connection portion exposed to be electrically connected to a connection portion of a connector header of another circuit board, a terminal on the circuit board, and a conduction line for connecting the terminal and the connection portion. Thereby, a cost and required space for a board-to-board connection can be reduced.

Abstract: A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.