Abstract: A balloon catheter having a mesh affixed thereto. The mesh is formed having members extending longitudinally and circumferentially about the balloon into columns and rows respectively. Each member of the mesh has a resistance or impedance that changes as the member is deformed such that, when the member comprises a length (L) a measured resistance or impedance will be different than when the member comprise a length (L1) where L1 is greater than L.

Abstract: A method for fabricating a heat dissipation substrate is disclosed. The method includes the steps of: providing a substrate, wherein the substrate includes a metal layer, an insulation layer, and a first conductive layer, of which the insulation layer is positioned between the metal layer and the first conductive layer, and the metal layer is thicker than the first conductive layer; removing the partial metal layer for forming a metal bulk; providing an adhesive layer, wherein the adhesive layer includes an opening, and the opening is corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, wherein the hole is positioned under the metal bulk; forming a third conductive layer in the hole.

Abstract: A printed wiring board includes a core substrate having first and second surfaces, a first conductor formed on the first surface of the substrate, a second conductor formed on the second surface of the substrate, a first through-hole conductor formed through the substrate and connecting the first and second conductors, and a second through-hole conductor formed through the substrate and connecting the first and second conductors. The second through-hole conductor has a diameter which is greater than a diameter of the first through-hole conductor, the first through-hole conductor has a roughened inner wall forming an interior space, the second through-hole conductor has a roughened inner wall forming an interior space, and the roughened inner wall of the first through-hole conductor has an arithmetic average roughness which is set lower than an arithmetic average roughness of the roughened inner wall of the second through-hole conductor.

Abstract: A substrate for use in a laminated chip carrier (LCC) and a system in package (SiP) device having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can include thermoset and thermoplastic resin.

Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, an electronic component, a joint, a sealant, and a positioning member. The circuit board is provided in the housing, and includes a first surface and a first conductor on the first surface. The electronic component is located on the first surface of the circuit board, and includes a second surface facing the first surface and a second conductor on the second surface. The joint is located between the first surface and the second surface to electrically connect between the first conductor and the second conductor. The sealant is located at least between the first surface and the second surface. The sealant contains a reductant that reduces an oxide film and seals the joint. The positioning member positions the circuit board and the electronic component.

Abstract: A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.

Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers formed on the metal layer such that the metal layer is interposed between the insulation layers, forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on a second-surface side of the core substrate, forming a first conductor on a first surface of the core substrate, forming a second conductor on a second surface of the core substrate on the opposite side of the first surface of the core substrate, and filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed.

Abstract: A printed wiring board includes an interlayer insulation layer, first pads positioned to mount a semiconductor element and forming a first pad group on the insulation layer, second pads forming a second pad group on the insulation layer and positioned along a peripheral portion of the first group, a first solder-resist layer formed on the insulation layer and having first openings exposing the first pads, respectively, and second openings exposing the second pads, respectively, conductive posts formed on the second pads through the second openings of the first solder-resist layer, respectively, and a second solder-resist layer formed on the first solder-resist layer and having a third opening exposing the first pads and fourth openings exposing surfaces of the posts, respectively. The second openings have a diameter greater than a diameter of the posts, and the second solder-resist layer is filling gaps formed between the second openings and the posts.

Abstract: The portion of a board corresponding to the surrounding portion of a hole 4 formed through the board is arranged to include a patternless section 6 where a conductive film 5 is not provided.

Abstract: The preferred device (e.g. printed circuit board or PCB) includes a XLAUI bi-directional lane link (i.e. ¼ XLAUI channel) inserted onto the printed circuit board between a PHY integrated circuit and an Ethernet media access control (MAC) processor. This XLAUI bi-directional lane link replaces the electrical XFI channel in 10 Gb/s interconnects between integrated circuits on a PCB. The preferred methodology includes inserting a bi-directional 10 Gb/s XLAUI lane link onto a printed circuit board for use in 10 Gb/s interconnects between a PHY integrated circuit and a MAC processor.

Abstract: An electronic component includes: a substrate; a functional portion provided on the substrate; an interconnection line provided on the substrate and electrically connected to the functional portion; a metal wall provided on the substrate so as to surround the functional portion and the interconnection line; and a seal portion that contacts the metal wall and covers the functional portion and the interconnection line so as to define a cavity above the functional portion, the seal portion being made of liquid polymer.

Abstract: A miniaturized electromagnetic interference (EMI) shielding structure is disclosed, which includes a substrate and a plurality of chip modules disposed thereon. The substrate has a plurality of ground portions formed thereon. Each chip module includes: at least one chip unit disposed on the substrate and connected electrically thereto; at least one conductive bump disposed on the substrate adjacent to the chip unit and connected electrically to the corresponding ground portion; an encapsulation layer arranged on the substrate and covers the chip unit and the conductive bump; and an EMI shielding layer covering the encapsulation layer and electrically connected with an exposed surface of the conductive bump, to allow the EMI shielding layer be electrically connected to the ground portion. The disclosure of the present invention allows each chip module to have its own EMI shielding capability.

Abstract: A wiring board with a built-in electronic component includes a substrate having an accommodation portion, an electronic component having an electrode and accommodated in the accommodation portion of the substrate, a conductive layer having a planar conductive pattern formed over the electrode of the electronic component, and one or more via conductors connecting the planar conductive pattern of the conductive layer and the electrode of the electronic component. The electrode of the electronic component has a portion which faces the planar conductive pattern of the conductive layer and which has a plurality of outer edges facing outward with respect to a surface of the electronic component on which the portion of the electrode is formed, and the planar conductive pattern of the conductive layer has a portion positioned directly over one or more of the outer edges of the electrode of the electronic component.

Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Abstract: Magnetic field distribution and mutual capacitance control for transmission lines are provided. A first circuit board is fabricated by attaching a reference plane layer to a dielectric material layer, and attaching a first trace to the second surface of the dielectric material. A surface profile of the reference plane layer is modified to decrease a resistance of a return current signal path through the reference plane layer, to reduce a magnetic field coupling between the first trace and a second trace. A second circuit board is fabricated by attaching a reference plane layer to a dielectric material layer, attaching a trace to the dielectric material, and forming a solder mask layer on the dielectric material layer over the trace. An effective dielectric constant of the solder mask layer is modified to reduce or increase a mutual capacitance between the first trace and a second trace on the dielectric material.

Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.

Abstract: A flexible wiring structure includes a first and a second flexible wiring section divided with a relay section provided on one end side of an L-shaped section of a flexible wire having the L-shaped section. The first flexible wiring section includes a first raised surface and a first post-bend raised surface bent in a first bent section, which is a bent section of the L-shaped section, from the first raised surface. The second flexible wiring section includes a second raised surface and a second post-bend raised surface bent in a second bent section, which is a bent section of the L-shaped section and provided above the first bent section, from the second raised surface and parallel to the first post-bend raised surface. The second post-bend raised surface is folded back in a raised surface bending section provided on the second raised surface and overlaps the first post-bend raised surface.

Abstract: There is provided an apparatus and method for manufacturing a light emitting device package improved in terms of the reliability and process efficiency of a light emitting device. The apparatus includes a heating block including a recessed portion provided in an area in which a light emitting device package is disposed, and a protruding portion disposed within the recessed portion while corresponding to a recess formed in a lower surface of the light emitting device package; and a clamp disposed on a lead frame of the light emitting device package and fixing the lead frame and the light emitting device package to the heating block.

Abstract: According to one embodiment, an IC card includes an IC module and a substrate. The IC module includes a plurality of communication units, a storage unit, and a controller. The storage unit stores first data, and stores an access condition for the first data. The controller permits, when the access condition includes information which permits an access to the first data based on a reception command received via a first communication unit of the plurality of communication units, an access to the first data based on a first command received via the first communication unit, and does not permits an access to the first data based on a second command received via a second communication unit of the plurality of communication units.

Abstract: A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via; a surface of a through which the via passes comprises a conducting region surrounding a non-conducting region that is substantially centered around a point where the via intersects the surface; a smallest width dimension, e.g. diameter of the non-conducting region is greater than or equal to 4 times the diameter of the via; the via connects a conductive contact pad on one printed circuit board layer to a conductive contact pad on another printed circuit board layer, with the printed circuit board with the non-conducting region lying between the two connected layers; and the largest width dimension of the conductive contact pads on the surfaces of the printed circuit board layers connected by the via are less than the smallest width dimension of the non-conducting region.

Abstract: A printed wiring board comprises ground layers stacked via insulator(s); a first through hole; second through holes; and signal wirings each extending from the first through hole through the clearance between predetermined ones of the ground layers, disposed between predetermined second through holes of the second through holes. Each of first clearances in the ground layers neighboring layer in which the signal wiring is disposed has an outline that a distance between the first through hole and outline of the first clearance is minimum of the signal wiring. Each of second clearances in the ground layers not adjacent to the signal wiring has an outline formed outside a circle connecting each center of second through holes centering the first signal through hole, such that outline of second clearance does not contact with the second through holes.

Abstract: An optical device includes a waveguide slab, first and second input port couplers, and first and second output port couplers located over a planar optical substrate. The waveguide slab has a plane of symmetry. The first and second input port couplers extend from the waveguide slab and have an input coupler pair axis located about midway between the first and second input port couplers. The input coupler pair axis is offset at a nonzero first distance from the plane of symmetry. The first and second output port couplers extend from the waveguide slab and have an output coupler pair axis located about midway between the first and second output port couplers. The output coupler pair axis is offset at a different nonzero second distance from the plane of symmetry.

Abstract: A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.

Abstract: The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device includes a magnetoresistive stripe formed over an underlying, metallic layer that is patterned to produce electrically isolated conductive regions over a substrate, such as a silicon substrate. An insulating layer separates the patterned metallic layer from the magnetoresistive stripe. A plurality of conductive vias is formed to couple the isolated regions of the metallic layer to the magnetoresistive stripe. The conductive vias form local short circuits between the magnetoresistive stripe and the isolated regions of the metallic layer to alter the uniformity of a current flow therein, thereby improving the position and angular sensing accuracy of the magnetoresistive device.

Abstract: A method of manufacturing an input device includes a step of bonding a translucent first optical adhesive layer to one surface of a first transparent base so that a part of first lead electrodes is exposed to the outside; a step of disposing a FPC so that a predetermined gap is formed between the FPC and the first optical adhesive layer in plan view, and electrically connecting the FPC to the first lead electrodes exposed to one surface of the first transparent base; a step of bonding a surface member, which forms an input surface, to the first transparent base with the first optical adhesive layer interposed therebetween; and a step of sealing the exposed lead electrodes by injecting a resin into a space between the first transparent base and the surface member facing each other.

Abstract: The invention relates to a connector device for electrically connecting a conductor to a circuit board by means of the direct insertion of the connector device into a contact hole of the circuit board. The connector device comprises a fastening region for fastening the conductor to the connector device, a transfer region for transferring a current from the conductor to the circuit board and at least three insertion elements that can be inserted into the contact hole together. Each of the insertion elements extends from a common base body of the connector device and runs separately from the other insertion elements. The insertion elements can be elastically deformed independently of one another in relation to the base body and are configured such that when the insertion elements are inserted in the contact hole, a plug connection of the connector device to the circuit board can be provided.

Abstract: The present invention relates generally to electrochemical-electromagnetic integration for instructional compliance management with distributed systems, methods, devices incorporating an instructional game integrated with operations training and instruction execution within a compliance lifecycle in particularly, a connector assemblage using a metamaterial and an instructional game providing security training using an RFID ID card and a RFID reader integrating terahertz radiation where the connector assemblage is conformational to a dermal communication for reducing cyber stress improving depth perception skills.

Abstract: A lancet integrated test element tape includes a plurality of lancet integrated test elements. The lancet integrated test elements each include a lancet configured to form an incision in tissue and a test element configured to analyze body fluid from the incision in the tissue. A cartridge includes a supply compartment configured to store an unused section of the tape. The tape is folded within the supply compartment to limit damage to the lancet integrated test elements. The cartridge can further include a waste compartment in which a used section of the tape is stored. An indexing mechanism moves the tape between the supply and waste compartments.

Abstract: A method for mounting a second member on a first member, wherein a pad layer is provided on the first member, and wherein an annular aperture portion exposing the first member to the bottom and having at least one discontinuous portion is provided in a region of the pad layer for mounting the second member having a mount face, the annular aperture portion having the same outer shape as the mount face of the second member is disclosed. The method includes: filling the aperture portion with a solder paste layer; and disposing the mount face of the second member on the solder paste layer, and melting and cooling the solder paste layer to mount the second member on the first member.

Abstract: The invention relates to a protective device for an electronic component including at least one pin to be electrically connected to an electronic system. The device includes at least one flexible printed circuit including first and second opposite surfaces, a central portion including a through opening for receiving the pin, and flaps connected to the central portion. The printed circuit is made of two insulation layers and includes at least one first conducting track between the two insulating layers, connecting the pin to the electronic system, a second conducting track extending on the first surface, and a third conducting track extending on the second surface. The flaps are folded back at least partially onto each other in order to encapsulate the pin and to electrically connect the second and third conducting tracks.

Abstract: An apparatus and method are disclosed that may include a contact pin; and a plurality of loops of conductive wire, coated with insulation material, disposed in proximity to the contact pin, wherein along at least one portion of the conductive wire, at least one edge of the contact pin extends through the insulation material and thereby forms conductive electrical contact with the conductive wire.

Abstract: A method of manufacturing an electrically driven L.E.D. lamp assembly (20) comprises disposing an electrically insulative coating (24) on a thermally conductive substrate (22). A plurality of light emitting diodes (26) is secured to the coating (24). A coupling agent is disposed on a tape portion (48) of a foil tape (46), and the foil tape (46) is secured to the coating (24) with the coupling agent in predetermined spaced lengths (42) along the coating (24) to establish discrete and electrically conductive spaced lengths (42) with the light emitting diodes (26) disposed between the spaced lengths (42). Each light emitting diode (26) includes a pair of electrical leads (32) which are secured to the spaced lengths (42) to electrically interconnect the light emitting diodes (26).

Abstract: In a method for manufacturing active fixation helices for the stimulation and/or sensing of organs, an elongated helix precursor body is produced that has one or more electrical conductors surrounded by an insulating material. This helix precursor body is then shaped into a helix, material removed in predetermined places in order to expose the areas of the conductors which will be used as electrodes in the final product. The body is coated with an electrically conducting biocompatible coating which is subsequently partly removed in continuous loops from around the electrodes in order to electrically insulate them from each other and to ensure that the electrically active areas of the electrodes are of the correct dimensions.

Abstract: A light and heat resistant circuit board apparatus LHRPCB, comprising: at least one thermally conductive material (TCM) layer adapted to serve as a mechanical and thermal substrate for the LHRPCB; at least one layer of electrically isolating material (EIM) configurable on respective TCM layers, the at least one EIM layer being resistant to UV radiation; at least one electrically conducting layer (ECL) layer configurable above the at least one TCM layer and adapted to be patterned and to selectively conduct electrical current; at least one heat and UV radiation resistant bonding layer (HUVRBL) appliable between respective ECL, TCM, and EIM layers; and at least one electronic component mountable upon the at least one ECL layer, wherein the LHRPCB is adapted to be exposed to light and heat for an extended period.

Abstract: A method for producing a rigid magnetic circuit component for an electromagnetically operable valve includes: a) providing a base element made of a magnetic or a magnetizable material, b) complete first heat treatment of the base element, c) a local second heat treatment of the base element so as to form a subregion having a microstructure of martensite and residual austenite in the otherwise martensitic base element, and d) installing the finished processed base element as the magnetic circuit component in a magnetic circuit.

Abstract: A system and method for retrofitting conventional lighting fixtures using an angled mounting component and LED-based printed circuit board lighting fixtures is described. In some embodiments, the mounting component facilitates the attachment of LEDs to a conventional lighting fixture in order to provide various desirable angles of illumination, among other benefits.

Abstract: A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

Abstract: An electroless Cu layer is formed on each side of a packaging substrate containing a core, at least one front metal interconnect layer, and at least one backside metal interconnect layer. A photoresist is applied on both electroless Cu layers and lithographically patterned. First electrolytic Cu portions are formed on exposed surfaces of the electroless Cu layers, followed by formation of electrolytic Ni portions and second electrolytic Cu portions. The electrolytic Ni portions provide enhanced resistance to electromigration, while the second electrolytic Cu portions provide an adhesion layer for a solder mask and serves as an oxidation protection layer. Some of the first electrolytic Cu may be masked by lithographic means to block formation of electrolytic Ni portions and second electrolytic Cu portions thereupon as needed. Optionally, the electrolytic Ni portions may be formed directly on electroless Cu layers.

Abstract: Provided are an optical printed circuit board and a method for manufacturing the same. The optical printed circuit board includes a printed circuit board and an optical connecting module. The printed circuit board is provided with at least one or more inner layers, and a circuit pattern electrically connecting the inner layers. The optical connecting module is embedded in the printed circuit board and includes an optical transmitting portion, an optical receiving portion, and an optical waveguide connecting the optical transmitting portion and the optical receiving portion. The printed circuit board defines an align pattern region, such that tops of the optical transmitting portion and the optical receiving portion are formed lower than a surface of the printed circuit board.

Abstract: For mass production of anemometers for EGR systems with hot exhaust gas streams having temperatures up to 200° C. or 300° C., conductors and film resistors are placed onto a bed, and are covered on this bed, e.g. A sensor tip of the flow sensor of the anemometer is made of inorganic materials up to the housing cover. A cable is led into a housing and self-supporting electrical conductors are led through the housing cover. In the housing, leads of the cable are connected to the self-supporting electrical conductors. Using bed profiles passing through the cover, the film resistors are spaced from the housing sufficiently far that the film resistors and the housing are largely thermally decoupled. As an intermediate product, a measurement tip or a sensor bar as part of a sensor tip is made of purely inorganic components, in order to make the mass production efficient.

Abstract: A method for reducing EM radiation comprises at least one first resonance line disposed on one of electric surfaces, which is disposed at a side of a transmission line structure on one of the electric surface. The resonance line crosses over a slot of another electric surface. The slot is etched on a corresponding electric surface. In addition, the transmission line structure crosses over the slot of the electric surface. Then, the first resonance line connects the electric surface having the slot with another electric surface. It can adjust at least one of a length, a width and a shape of the first resonance line, to make an input impedance seen from a crossed point between the transmission line structure and the slot approximately 0.

Abstract: A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.

Abstract: This publication discloses a method for manufacturing a circuit-board structure.1. The structure comprises a conductor pattern (3) and at least one component (6), which is surrounded by an insulating-material layer (10), attached to it by means of a contact bump (5). According to the invention, the contact bumps (5) are made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5). After attaching, the component (6) is surrounded with an insulating-material layer (10).

Abstract: An opto-electric hybrid module capable of achieving the reduction in distance between an optical element and a core end portion to improve the efficiency of light coupling therebetween, and a method of manufacturing the same are provided. The opto-electric hybrid module includes an optical waveguide section, an electric circuit section, and a light-emitting element (7) and a light-receiving element (8) both mounted on the electric circuit section. The optical waveguide section includes an under cladding layer (1), a linear core (2) for an optical path, the core being formed on a surface of the under cladding layer (1), and an over cladding layer (3) formed on the surface of the under cladding layer (1) and covering the core (2). An electric circuit (4) is formed on a surface portion of the under cladding layer (1) except where the core (2) is formed.

Abstract: An LED light bar includes a plurality of LEDs and a circuit board supporting the LEDs. Solder points are formed on a bottom surface of the LEDs. An anti-solder layer is coated on the circuit board so as to create a plurality of discrete anti-solder pads. A first tenon which is formed on each of the LEDs locates in a void in a corresponding one of the anti-solder pads so as to position the LEDs precisely on the circuit board and maintain their positions.

Abstract: The present invention relates to methods of assembly, labeling and programming decoupled EM tags used in the tagging and tracking of items wherein the tags including a printable label portion and a decoupler portion which are combined after printing on the surface of and programming a programmable device associated with the label portion.

Abstract: The mobile wireless communications device includes a printed circuit board (PCB), wireless transceiver circuitry carried by the PCB and operating on a plurality of frequency bands, at least one antenna, and a multi-bandpass transmission line coupling the wireless transceiver circuitry to the at least one antenna. The multi-bandpass transmission line includes an electrically conductive trace on a surface of the PCB defining a transmission line signal path, and an electrically conductive layer on an opposite surface of the PCB and defining a ground plane. The electrically conductive layer has at least one set of slot rings therein and defining a plurality of slot ring resonators being electromagnetically coupled to the transmission line signal path and operable at the plurality of frequency bands.

Abstract: A multilayer ceramic component includes a stack containing ceramic layers and electrode layers interspersed among the ceramic layers. The electrode layers contain copper and define first and second internal electrodes. First and second external contacts are on different sides of the stack. The first and second external contacts contain copper and are substantially perpendicular to the ceramic layers and electrode layers. The first internal electrode is connected to the first external contact and the second internal electrode is connected to the second external contact. The first and second internal electrodes overlap each other at a plane intersecting the stack. In areas adjacent to boundaries between the first and second external contacts and the ceramic layers, the first and second external contacts are not oxidized and material making-up the ceramic layers is not diminished. A bonding strength of the external contacts to the stack exceeds 50N.

Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.