Abstract: The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate (2.1) in which the die (1) to be machined is anchored is controlled at all the points of its angular movement, allowing the interpolation of the movements of this work axis (CO) with those of an axis of rotation (BO) and with those of respective axes (X and Z), such that the machines has four axes of interpolation, which allows machining dies (1) with their inner or outer diameter rounded or non-rounded and with their transition between these diameters and the side faces constant or variable by means of a single grinding process.

Abstract: An apparatus for machining a spectacle lens by abrasion of material in the area of a joining surface to be formed is provided. The apparatus comprises a tool provided with a cutting end face whose axis of rotation is movable in a forward direction relative to a holding device and covers a reference plane. The holding device comprises a support surface, a contact surface aligned perpendicularly thereto and a stop edge. The support surface and the contact surface extend perpendicularly to the reference plane and the stop edge extends perpendicularly to the support surface and in parallel to the reference plane and has a distance from the reference plane which is variable. The support surface is interrupted such that the projecting end face of the tool can be moved along the interruption. When provided at its machining position the lens rests on the support surface, contacts the contact surface and abuts with its edge against the stop edge.

Abstract: The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.

Abstract: Methods of forming a capping layer on conductive lines in a semiconductor device may be characterized by the following operations: (a) providing a semiconductor substrate comprising a dielectric layer having (i) exposed conductive lines (e.g., copper lines) disposed therein, and (ii) an exposed barrier layer disposed thereon; and (b) depositing a capping layer material on at least the exposed conductive lines of the semiconductor substrate. In certain embodiments, the method may also involve removing at least a portion of a conductive layer (e.g., overburden) disposed over the barrier layer and conductive lines to expose the barrier layer.

Abstract: A polisher, a pressure plate (20) of the polisher, and a method of polishing are disclosed. The pressure plate (20) includes a main body, an air bag (50) mounted to one surface of the main body to adjust a pressure applied from the main body to a polishing object, and a pad (16b) having a ring shape, mounted along a circumference of the one surface of the main body.

Abstract: This invention provides an oil composition for cutting and grinding by minimum quantity lubrication system, characterized by comprising an ester oil with a kinematic viscosity of 0.5-20 mm2/s at 100° C., and an ester-based polymer with a kinematic viscosity exceeding 20 mm2/s at 100° C. and an average molecular weight of 5,000-10,000,000. The oil composition for cutting and grinding by minimum quantity lubrication system according to the invention can achieve an excellent balance between misting property and inhibition of floating mist and ensure that an adequate amount reaches the working section, for cutting and grinding by minimum quantity lubrication system.

Abstract: A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).

Abstract: An abrasive article with an array of independently gimballed abrasive members that are capable of selectively engaging with nanometer-scale and/or micrometer-scale height variations and micrometer-scale and/or millimeter-scale wavelengths of waviness, on the surfaces of substrates. Each abrasive member maintains a fluid bearing (air is the typical fluid) with the substrate. The spacing and pitch of the abrasive members can be adjusted to follow the topography of the substrate to remove a generally uniform layer of material; to engage with the peaks on the substrate to remove target wavelengths of waviness; and/or to remove debris and contamination from the surface of the substrate.

Abstract: A method of removing coating from a substrate may include contacting a portion of coating on a surface of a substrate to an acid.

Abstract: An edge grinding apparatus for sheets of glass includes a conveyance device coupled to a support structure, wherein the conveyance device includes a conveying position and a grinding position, a carriage support disposed adjacent the conveyor, and a grinding carriage slidingly coupled to the carriage support, the grinding carriage including at least one movable grinding head, wherein a glass sheet is carried by the conveyance device from the conveying position to the grinding position, the glass sheet secured to one of the conveyance device and a fixed table while in the grinding position, at least one edge of the glass sheet ground by the at least one moveable grinding head while in the grinding position.

Abstract: In one embodiment, the present invention provides a buffer brush. When rotating, the buffer brush acts as a centrifugal pump. The buffer brush contains a core having a first side and a second side and the brush extends racially from the surface of the core. The first and second sides have at least one opening configured to allow air to flow laterally through the core. Vents on the surface of the cure are configured to allow air flowing laterally through the core to also flow radially through the vents into the brush.

Abstract: A finishing machine comprises a motor mounted on a support frame and connected to a drive shaft and two or more finishing heads and an impeller fan driven by the drive shaft via a serpentine belt drive which rotates the finishing heads in opposite directions. The impeller fan impels dust from the grinding heads into a rear vacuum manifold and the support frame has rear wheels the height of which is adjustable by means of an hydraulic cylinder.

Abstract: The invention relates to a hard finish machine (1) for hard finishing of a workpiece (2), comprising at least two different hard finish tools (3, 4) which are arranged on a tool spindle (5), wherein the tool spindle (5) is arranged movable in the direction (Y) of its axis (6) on a tool carrier (7), wherein the tool carrier (7) is translational movable relatively to a machine bed (8) and wherein the hard finish machine furthermore comprises cooling lubricant supplying means (9) for the supply of cooling lubricant to the machining region between the workpiece (2) and the hard finish tool (2, 3).

Abstract: Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.

Abstract: The invention relates to a hard finish machine (1) for hard finishing of a workpiece (2), comprising at least two different hard finish tools (3, 4) which are arranged on a tool spindle (5), wherein the tool spindle (5) is arranged movable in the direction (Y) of its axis (6) on a tool carrier (7), wherein the tool carrier (7) is translational movable relatively to a machine bed (8) and wherein the hard finish machine furthermore comprises cooling lubricant supplying means (9) for the supply of cooling lubricant to the machining region between the workpiece (2) and the hard finish tool (2, 3).

Abstract: In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is then pressed against the front surface of the coating insulating film in a planarization unit and moved along the front surface of the coating insulating film, thereby planarizing the coating insulating film. The substrate is then heated to completely harden the coating insulating film. According to the present invention, the coating film can be planarized without using the CMP technology.

Abstract: A polishing pad may include a base and a plurality of polishing protrusions on a surface of the base. Each polishing protrusion may include a sidewall defining an opening in a surface of the polishing protrusion opposite the base. In addition, portions of the sidewall opposite the base may define a contact surface.

Abstract: This invention relates to a mobile floor levelling vehicle for levelling an undulating floor surface, which comprises a vehicle body with front and back displacement means for moving the vehicle body. To carry out the levelling operation the floor levelling vehicle comprises at least one grinding tool which is provided and driven to remove an amount of material from the floor, and at least one additional polishing device provided at a position behind the back displacement members in moving direction of the levelling vehicle.

Abstract: An apparatus for insertion between parallel press plates and cleaning the press plates is disclosed. The cleaning apparatus comprises an abrasive assembly and a linear motor. The abrasive assembly is attached to a first movable member of the linear motor and/or a second movable member of a linear motor. The linear motor is operated using an air pressure supply. As the cleaning apparatus is moved between the parallel press plates, unwanted residue is removed from the parallel press plates.

Abstract: There is disclosed a grinding apparatus for fabrication of a liquid crystal display device that is adaptive for improving the adsorption defect of a substrate onto a substrate stage. A grinding apparatus for fabrication of a liquid crystal display device disclosed in the present invention includes a plurality of substrate stage configured to make a linearly bi-directional movement; first and second grinding parts disposed in a series at an area to which the substrate stage moves; first to third aligning parts disposed at both ends of the first and second grinding parts and therebetween; and first and second cleaning parts disposed between the first and second grinding parts and the first and second aligning parts so as to clean the substrate stage.

Abstract: A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc to a standby position above the polishing pad, and a spraying mechanism (constructed, for example, from a washing water nozzle) that sprays liquid to the conditioning disc positioned at the standby position so as to wash or wet the conditioning disc.

Abstract: Methods of forming a capping layer on conductive lines in a semiconductor device may be characterized by the following operations: (a) providing a semiconductor substrate comprising a dielectric layer having (i) exposed conductive lines (e.g., copper lines) disposed therein, and (ii) an exposed barrier layer disposed thereon; and (b) depositing a capping layer material on at least the exposed conductive lines of the semiconductor substrate. In certain embodiments, the method may also involve removing at least a portion of a conductive layer (e.g., overburden) disposed over the barrier layer and conductive lines to expose the barrier layer.

Abstract: A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.

Abstract: An apparatus for removing scales from metal wires including: a liquid container tank 12 through which the metal wires 10 pass, mixing nozzles 14 disposed to allow the metal wirings to pass through the liquid container tank for injecting a high-pressure liquid toward the metal wires 10; a high-pressure pump 16 for feeding the high-pressure liquid to the mixing nozzles 14; and cyclone separators 20 which are slurry feeders for feeding a slurry of the liquid with which an abrasive scavenging agent is mixed to the mixing nozzles 14. The mixing nozzles 14 inject the slurry of the abrasive scavenging agent together with the high-pressure liquid so that the abrasive scavenging agent bombards the scales on the surfaces of the metal wires 10 to remove the scales.

Abstract: The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system.

Abstract: Embodiments of the present invention provide a polishing module configured to use in a polishing system. The polishing module comprises a base member, two polishing stations disposed on the base member, one load cup, and a carousel having three polishing heads.

Abstract: This polishing method and polishing apparatus include: a polishing characteristics measurement step in which electrochemical characteristics of a slurry in relation to a material to be polished are measured; and a preparation step in which the slurry is prepared based on the measured electrochemical characteristics, wherein, in the polishing characteristics measurement step, a slurry is supplied from a slurry supply apparatus 202, and using a sample polishing pad that is formed from the same material as the polishing pad and a sample material to be polished that is formed from the same material as the material to be polished, the electrochemical characteristics are measured both when the sample material to be polished is being polished by the sample polishing pad and when the sample material to be polished is not being polished by the sample polishing pad.

Abstract: A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.

Abstract: A chemical-mechanical polishing apparatus is provided that creates a uniform kinematical pattern on the surface of a wafer being polished. The apparatus may have a polishing pad comprising a polishing pad surface having a center point that lies within an axis of motion for the polishing pad and a plurality of grooves entrenched in the polishing pad surface and defining a pattern of shapes. The pattern has an axis of symmetry that is offset from the polishing pad surface center point. The apparatus may be operated in a manner such that the kinematics of the CMP process are uniform across the surface of the wafer.

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.

Abstract: Apparatus comprising, in use, a wide bandgap semiconductor, a conductor which is moveable relative to the semiconductor and means for applying a potential across the junction between a conductor and semiconductor to control the friction generated by the relative movement between the semiconductor and the conductor. A method of controlling friction between a wide bandgap semiconductor and conductor which are moveable relative to each other comprising applying a potential across the junction between the semiconductor and the conductor.

Abstract: When the remaining slurry and polishing residue are removed by cleaning with a cleaning liquid (preferably a cleaning liquid containing a surfactant), organic matter in the cleaning liquid containing a surfactant seeps into the interlayer insulating film 3. Therefore, the substrate is subsequently washed with an organic solvent or a solution containing an organic solvent, thus washing away the organic matter that has seeped into the interlayer insulating film 3. Although the interlayer insulating film 3 is subjected to a hydrophobic treatment, since the solvent used is an organic solvent, this solvent is able to seep into the interlayer insulating film 3, dissolve the organic matter, and wash the organic matter away without being affected by this hydrophobic treatment. Afterward, the substrate 1 is dried, and the organic solvent or solution containing an organic solvent that is adhering to the surface is removed.

Abstract: A polishing pad forms a planar surface on glass, semiconductors, dielectric material/metal composites and integrated circuits, as well as a polishing apparatus where it is difficult for the surface of the substrate to be scratched, the state of polishing can be accurately measured optically during polishing, and whether or not the entire surface of the workpiece is uniformly polished can be measured.

Abstract: A chemical-mechanical polishing system comprising: (a) ceria abrasive having an average particle size of about 180 nm or less and a positive zeta potential, (b) a polishing additive bearing a functional group with a pKa of about 3 to about 9, wherein the polishing additive is selected from the group consisting of arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, aminocarboxylic acids, cyclic monocarboxylic acids, unsaturated monocarboxylic acids, substituted phenols, sulfonamides, thiols, salts thereof, and combinations thereof, and (c) a liquid carrier, wherein the chemical-mechanical polishing system has a pH of about 4 to about 6.

Abstract: The present invention realizes a polishing apparatus capable of chamfering an end face of a large-sized substrate at a high precision for a table unit for mounting the substrate. A substrate is mounted on a table unit and is fixedly held in a predetermined reference state. A first polishing unit includes a polishing grind stone for polishing an end face of the substrate held on the table unit and substrate side edge portion supporting means for supporting the lower surface of a side edge portion of the substrate in the vicinity of the end face of the substrate to be polished by the polishing unit. The first polishing unit is moved together with the substrate side edge portion supporting means by a first polishing unit moving means along the end face of the substrate while the polishing grind stone is polishing the end face of the substrate.

Abstract: A retaining ring for CMP is disclosed. The retaining ring has a plurality of grooves. The grooves have rounded sidewalls. Because the sidewalls of the grooves of the retaining ring are rounded, the slurry is not apt to accumulate around them and the pad is less scratched. Accordingly, the micro-scratches on the wafer surface are reduced and the yield of the CMP step is increased. Its operational method and application system are also disclosed in this invention.

Abstract: In some embodiments, a method of controlling a width of an edge exclusion zone of a substrate is provided. The method includes determining a range of angles over which to rotate a polishing head; rotating the polishing head over the determined range of angles to achieve a preset width for an edge exclusion zone of the substrate; and polishing an edge of the substrate with the polishing head. Numerous other aspects are provided.

Abstract: The present invention provides a cleaning apparatus capable of removing foreign matters attached to a tip of a probe effectively without impairing the durability of the probe. The cleaning apparatus for the probe comprises a base plate having a rough surface and a surface layer formed to conform to and cover the rough surface for the purpose of providing a polishing surface for the probe and having lower hardness than hardness of the probe tip of the probe.

Abstract: The present invention is a floor grinder assembly for grinding a floor. The assembly includes first and second rails configured for being mounted spaced apart from and parallel to one another. A plurality of stands is configured for mounting the first and second rails above the floor. The stands have an adjustable length for adjusting a height position of the first and second rails such that the rails define a plane above the floor. A truss is configured to mount between the rails and to be movable along a length of the rails. A grinding assembly includes a grinding wheel and a motor driving the grinding wheel. The grinding assembly is configured for mounting to the truss and for being movable along a length of the truss.

Abstract: To provide a retainer ring by which an object to be polished can be uniformly polished, and deterioration thereof can be suppressed, and it does not take time to recycle, and a polishing machine having the retainer ring. The retainer ring 1 includes: a first annular portion 11 for surrounding an outer circumferential portion of the object to be polished and made of resin; and a second annular portion 12 provided on the first annular portion 11 and having a mechanical strength higher than that of the first annular portion 11. In rim portions of the first annular portion 11 and the second annular portion 12, a fixing portion 13 for fixing the first annular portion 11 and the second annular portion 12 with mechanical joining is provided. The first annular portion 11 protrudes beyond the fixing portion 13 toward the opposite side of the second annular portion 12.

Abstract: Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming asperities on the working surface with a polycrystalline diamond dresser, where the asperities have a height to distance ratio of from about 1:5 to about 5:1 and where the average asperity diameter is less than about 175 ?m.

Abstract: According to one example, a grinding plate for releasably mounting at least one grinding tool to a grinding machine, each grinding tool having a tool base with at least one grinding element mounted thereto, the grinding plate having least one pocket located proximate a periphery of the grinding plate, each pocket having an open end and being configured to releasably receive the at least one tool base via the open end, and a biasing element proximate the open end of the at least one pocket, the biasing element movable between an open position and a locked position and being biased to return to the locked position, wherein the tool base may be inserted and removed from the pocket when the biasing element is in the open position, and the pocket, tool base and biasing element are configured to restrict movement of the at least one tool base within the pocket when the tool base is received in the pocket and the biasing element is in the locked position.

Abstract: A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles and a nanoparticle binder. Free abrasive products, bonded abrasive products, and the particulate material also contain aggregates.

Abstract: A method for manufacturing a semiconductor device, including depositing an interconnect material including Cu or Cu alloy over an insulating film, and polishing the interconnect material by CMP with a polishing liquid, wherein the oxidation-reduction potential (ORP) of the polishing liquid is controlled so as to be in the range of 400 mV to 700 mV vs. Ag/AgCl.

Abstract: A semiconductor device manufacturing apparatus according to the present invention comprises a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by the head, and a polishing pad for polishing a polished surface of the semiconductor wafer. This apparatus presses the polished surface of the semiconductor wafer against the polishing pad together with the retainer ring to polish the semiconductor wafer. The retainer ring used in the present invention has a surface that is in contact with the polishing pad, which increases a contact area of the retainer ring against the polishing pad in accordance with wear of the retainer ring.

Abstract: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.

Abstract: The disclosure is directed to a system that processes chemical mechanical planarization (CMP) slurries to reduce or eliminate large particles in the slurries, which can scratch integrated circuit wafers without substantially altering a percentage of solids in the CMP slurry by weight. In particular, the system breaks up particles of a CMP slurry using an intensifier pump system and a fluid processing device. The techniques have proven much more effective than conventional filtering techniques in reducing or eliminating scratches to integrated circuit wafers when a processed CMP slurry is used in a CMP process.

Abstract: In order to provide a treatment apparatus for treating workpieces or groups of workpieces that are conveyed from an inlet to an outlet of the treatment apparatus, wherein the treatment apparatus comprises a plurality of treatment levels and with said treatment apparatus the workpieces to be treated are passed from level to level in a safe and controlled manner, it is proposed that the treatment apparatus comprises a housing and receiving chambers, which rotate relative to the housing, for receiving the workpieces or groups of workpieces, wherein the receiving chambers are disposed in at least two different chamber levels and an outlet opening in the housing is associated with a first chamber level, through which the workpieces or groups of workpieces travel first, and an inlet opening is associated with a second chamber level, through which the workpieces or groups of workpieces travel after the first chamber level, and wherein the treatment apparatus comprises at least one transfer apparatus, which moves the

Abstract: Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grinding unit grinding edges of short or long sides of the unit liquid crystal display panel in a normal mode and a second grinding unit grinding the edges of the short or long sides of the unit liquid crystal display panel that are not ground by the first grinding unit in the normal mode or grinding the edges of the long and short sides of the unit liquid crystal display panel in an emergency mode.

Abstract: Disclosed is a grinding table apparatus for a liquid crystal display panel and a grinder using the adapt to various sizes of unit liquid crystal display panels for grinding edges of the corresponding liquid crystal display panel by adjusting a variable moving distance of the grinding tables instead of replacing the previous grinding table. The present invention includes at least two grinding tables displaced in a direction making the grinding tables get farther from or closer to each other to adapt to the size of the unit liquid crystal display panel to grind edges of the unit liquid crystal display panel.